WO2021032164A1

WO2021032164A1 - Display apparatus and backlight module

Info

Publication number: WO2021032164A1
Application number: PCT/CN2020/110269
Authority: WO
Inventors: 李富琳
Original assignee: 海信视像科技股份有限公司
Priority date: 2019-08-20
Filing date: 2020-08-20
Publication date: 2021-02-25
Also published as: CN210666266U

Abstract

A display apparatus and a backlight module. The backlight module comprises: a plurality of mutually assembled lamp panels (11) and reflection sheets (12), wherein there is a spacing (s) between two adjacent lamp panels (11); each of the lamp panels (11) comprises a circuit board (111), a plurality of mini light-emitting diodes (112) arranged on the circuit board (111), and a protective layer (113); the circuit board (111) comprises a central region (AA) and an edge region (BB); an orthographic projection of the protective layer (113) on the circuit board (111) is located in the central region (AA); and the reflection sheets (12) are arranged on the edge regions (BB) of the two adjacent lamp panels (11) and cover the spacing (s) between the two adjacent lamp panels (11). Some of the light from the mini light-emitting diodes (112) can be reflected onto the reflection sheet (12) between two lamp panels (11), such that the light can be emitted from the spacing (s) between the two lamp panels (11) in order to eliminate shadows generated in the spacing (s). When the reflection sheets (12) are arranged on the edge regions (BB), the set heights of the reflection sheets (12) can be reduced, so as to prevent the reflection sheets (12) from blocking the emission of the light from the mini light-emitting diodes (112).

Description

Display device and backlight module

Cross reference to related applications

This application claims the priority of a Chinese patent application filed with the Chinese Patent Office on August 20, 2019, the application number is 201921356391.5, and the application name is "a display device and backlight module", the entire content of which is incorporated into this application by reference in.

Technical field

The application relates to the field of display technology, and in particular to a display device and a backlight module.

Background technique

Mini Light Emitting Diode (Mini-LED for short) as a backlight has become a current research hotspot. It is different from the traditional liquid crystal display that adopts the side-in-light-guide plate backlight solution, which uses a huge amount of Mini-LED as the backlight source to The backlight field of the module can not only realize the lightness and thinness of the backlight, but also realize more refined dynamic control and improve the dynamic contrast of the liquid crystal display.

However, due to the limitation of the size of the processing equipment, the size of the Mini-LED light board cannot be made too large at this stage, generally below 400mm×200mm. When it is applied to a large-size display device, multiple light boards need to be spliced. Because the light panels have the nature of expansion and contraction, when the light panels are spliced, there will be a gap between the adjacent light panels. The existence of this gap makes the light of the backlight above the gap weaker than other areas, resulting in the joint position Partial shadows.

Summary of the invention

The present application provides a display device and a backlight module, which are used to eliminate local shadows at the joint positions of the lamp panels.

In a first aspect of the present application, a display device is provided, including: a backlight module and a display panel located on the light emitting side of the backlight module;

The backlight module includes a plurality of light panels spliced with each other, and there is a gap between two adjacent light panels;

The light board includes: a circuit board, a plurality of micro light emitting diodes arranged on the circuit board, and a protective layer covering all the micro light emitting diodes;

The circuit board includes a central area and an edge area surrounding the central area; the orthographic projection of the protective layer on the circuit board is located in the central area;

The backlight module further includes a reflective sheet, the reflective sheet and the micro light emitting diode are located on the same side of the circuit board, and the reflective sheet is arranged on the edge regions of two adjacent light boards and covers the same side. Adjacent to the gap between the two lamp panels.

In some embodiments of the present application, in the above-mentioned display device provided in the present application, the edge area of the circuit board facing the micro light emitting diode has a surface height smaller than that of the central area of the circuit board facing the micro light emitting diode. The surface height of one side of the diode, the edge area and the center area of the circuit board form a step shape.

In some embodiments of the present application, in the above-mentioned display device provided in the present application, the height difference between the center area and the edge area of the circuit board satisfies the following relationship:

0.1mm≤H≤0.3mm;

Wherein, H represents the height difference between the center area and the edge area of the circuit board.

In some embodiments of the present application, in the above-mentioned display device provided by the present application, the height of the surface of the reflective sheet facing the micro light emitting diode is less than or equal to that of the micro light emitting diode facing the circuit board. Surface height.

In some embodiments of the present application, in the above-mentioned display device provided in the present application, the orthographic projection of the protective layer on the circuit board coincides with the central area of the circuit board.

In some embodiments of the present application, in the above-mentioned display device provided in the present application, the width of the protective layer on the side close to the circuit board is larger than the width on the side far from the circuit board.

In some embodiments of the present application, in the above-mentioned display device provided by the present application, the maximum width between the edge of the circuit board and the protective layer on the same side is smaller than the edge of the circuit board and the nearest micro The width between the LEDs;

The width of the edge area of the circuit board is smaller than the maximum width between the edge of the circuit board and the protective layer on the same side.

In some embodiments of the present application, in the above-mentioned display device provided in the present application, the width of the edge area of the circuit board is greater than or equal to 1 mm.

In a second aspect of the present application, a backlight module is provided, including: a plurality of light panels spliced with each other, and there is a gap between two adjacent light panels;

The backlight module further includes a reflective sheet, the reflective sheet and the micro light emitting diode are located on the same side of the circuit board, and the reflective sheet is arranged in the edge area of the two adjacent light boards and covers the same side. Adjacent to the gap between the two lamp panels.

In some embodiments of the present application, in the above-mentioned backlight module provided in the present application, the edge area of the circuit board facing the micro light-emitting diode has a surface height lower than that of the central area of the circuit board facing the The surface height of one side of the micro light emitting diode, the edge area and the center area of the circuit board form a step shape.

The beneficial effects of this application are as follows:

The display device and the backlight module provided by the present application include: a plurality of light boards spliced with each other, and there is a gap between two adjacent light boards; the light board includes: a circuit board, a plurality of micro Light-emitting diodes and a protective layer covering all miniature light-emitting diodes; the circuit board includes a central area and an edge area surrounding the central area; the orthographic projection of the protective layer on the circuit board is located in the central area; the backlight module also includes a reflective sheet, a reflective sheet and The micro light emitting diodes are located on the same side of the circuit board, and the reflective sheet is arranged on the edge area of two adjacent light boards and covers the gap between the two adjacent light boards. The light exit side of the lamp panel will be provided with an optical film. Part of the light emitted by the micro LED will be transmitted by the optical film, and part of the light will be reflected by the optical film to the reflector between the two lamp panels. One side of the diaphragm is reflected, so that light will be emitted to the side of the optical diaphragm at the gap between the two lamp plates, thereby eliminating the dark shadow generated at the gap. The protective layer is arranged in the center area of the circuit board, and the edge area of the circuit board is not covered by the protective layer, so when the reflector is arranged on the edge area, the installation height of the reflector can be reduced, and the reflector will not block the micro LED It avoids the problem of low seam brightness caused by setting the reflector too high to block the light from the micro light emitting diode.

Description of the drawings

In order to explain the technical solutions of the embodiments of the present application more clearly, the following will briefly introduce the drawings needed in the embodiments of the present application. Obviously, the drawings described below are only some embodiments of the present application. For those of ordinary skill in the art, without creative work, other drawings can be obtained based on these drawings.

1 is a schematic diagram of a cross-sectional structure of a display device provided by an embodiment of the application;

FIG. 2 is a schematic diagram of a top view structure of a spliced light panel provided by an embodiment of the application;

Fig. 3 is a schematic cross-sectional structure diagram of the spliced lamp panel along the II' direction in Fig. 2;

4 is a schematic diagram of a top view structure of a light board provided by an embodiment of the application;

FIG. 5 is a schematic diagram of the light path of the backlight module provided by an embodiment of the application;

FIG. 6 is one of the schematic cross-sectional structure diagrams of the light board provided by the embodiment of the application;

FIG. 7 is one of the schematic cross-sectional structure diagrams of the spliced lamp panel provided by the embodiment of the application;

FIG. 8 is the second schematic diagram of the cross-sectional structure of the light board provided by the embodiment of the application;

9 is the second schematic diagram of the cross-sectional structure of the spliced lamp panel provided by the embodiment of the application;

10 is the third schematic diagram of the cross-sectional structure of the light board provided by the embodiment of the application;

11 is the fourth schematic diagram of the cross-sectional structure of the light board provided by the embodiment of the application;

12 is a schematic cross-sectional structure diagram of a backlight module provided by an embodiment of the application.

detailed description

In order to make the purpose, technical solutions, and advantages of the application more clear, the application will be further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the application, rather than all of them. Based on the embodiments in this application, all other embodiments obtained by a person of ordinary skill in the art without creative work shall fall within the protection scope of this application.

The display device and the backlight module provided by the specific embodiments of the present application will be described in detail below with reference to the accompanying drawings.

In the first aspect of the embodiments of the present application, a display device is provided. As shown in FIG. 1, the display device includes a backlight module 100 and a display panel 200 located on the light emitting side of the backlight module 100. The display device provided by the embodiment of the present application may be a display device such as a liquid crystal panel, a liquid crystal display, and a liquid crystal television, or may be a mobile terminal such as a mobile phone, a tablet computer, and a smart photo album.

In order to realize the lightness and thinness of the backlight module, realize more refined area dimming, and improve the dynamic contrast of the liquid crystal display, as shown in FIG. 2 a schematic top view of the backlight module 100, the above-mentioned backlight module provided by the embodiment of the application The group 100 may include a plurality of light panels 11 spliced with each other, and there is a gap s between two adjacent light panels 11. FIG. 3 is a schematic cross-sectional structure diagram of the backlight module along the II' direction in FIG. 2. As shown in FIG. 3, the light board 11 provided by the embodiment of the present application includes: a circuit board 111, a plurality of micro light emitting devices arranged on the circuit board 111 The diode 112, and the protective layer 113 covering all the miniature light emitting 112 diodes. The circuit board 111 includes a central area AA and an edge area BB surrounding the central area. The top view structure of the circuit board is shown in FIG. 4. The orthographic projection of the protective layer 113 on the circuit board 111 is located in the central area AA.

As shown in FIGS. 2 and 3, the backlight module provided by the embodiment of the present application further includes: a reflective sheet 12, the reflective sheet 12 and the micro light emitting diode 112 are located on the same side of the circuit board 111, and the reflective sheet 12 is arranged on two adjacent ones. The edge area BB of the light board 11 covers the gap s between two adjacent light boards.

Due to the nature of expansion and contraction of the light panels, it is necessary to leave a gap between two adjacent light panels when splicing the light panels, and a dark shadow will appear at the gap position. In the embodiment of the present application, a reflective sheet 12 is provided at the gap s between two adjacent light boards 11. In specific implementation, an optical film is provided on the light exit side of the light board 11, as shown in the light path diagram in FIG. 5 , Part of the light emitted by the micro light emitting diode 112 will be transmitted by the optical film, and a part of the light will be reflected by the optical film to the reflection sheet 12 between the two lamp plates 11, and then reflected by the reflection sheet 12 to the optical film side again, In this way, light is emitted from the gap s between the two lamp plates 11 to one side of the optical film, thereby eliminating the dark shadow generated at the gap s.

In the above-mentioned backlight module provided by the embodiments of the present application, the protective layer 113 is arranged in the central area AA of the circuit board 111, and the edge area BB of the circuit board does not cover the protective layer 113, so the reflective sheet 12 is arranged in the edge area BB When it is installed, the installation height of the reflective sheet 12 can be reduced. The reflective sheet 12 will not block the light emitted by the micro light-emitting diode 112, so as to prevent the reflective sheet 12 from being set too high to block the light from the micro light-emitting diode 112, resulting in low seam brightness. problem.

The protective layer 113 covering each micro-light-emitting diode 112 can play a role in the packaging and protection of the micro-light-emitting diode. The protective layer 113 can be coated on the surface of the micro-light-emitting diode 112 by using a colloidal material. It is made of materials such as silica gel or epoxy resin, which is not limited here. Since the material used for the protective layer 113 is generally a colloidal material, after coating the colloidal material, the side surface of the protective layer 113 cannot be guaranteed to be a completely vertical surface. In a general manufacturing process, as shown in FIG. 6, the fluid The width of the bottom of the material will be greater than the width of the top after being cured due to gravity, so that the side surface of the protective layer 113 forms a slope, and the top edge forms a smooth arc surface. As shown in Figure 6, the maximum width l2 between the edge of the circuit board 111 and the protective layer 113 on the same side can be set to be smaller than the width l3 between the edge of the circuit board 111 and the nearest micro light emitting diode 112; at the same time, the circuit board The width l1 of the edge area BB of 111 is smaller than the maximum width l2 between the edge of the circuit board 111 and the protective layer on the same side, that is, it satisfies l1<l2<l3. If the side surface of the protective layer 113 is set as a vertical surface as shown in FIG. 2, the width l1 of the edge area BB of the circuit board 111 is equal to the maximum width l2 between the edge of the circuit board 111 and the protective layer on the same side.

When a plurality of light boards as shown in FIG. 6 are spliced together, the structure shown in FIG. 7 is formed, and the reflective sheet 12 is provided on the edge area BB of the circuit board 111 of two adjacent light boards to cover the micro light emitting The side surface of the protective layer of the diode 112 is inclined, which can reduce the probability that the reflector is installed on the protective layer and prevent the reflector from scratching the protective layer 113 and damaging the micro light emitting diode 112 inside the protective layer.

In another practicable manner, as shown in FIG. 8, the surface of the edge area BB of the circuit board 111 facing the micro light emitting diode 112 is smaller than the surface of the central area AA of the circuit board 111 facing the micro light emitting diode 112. Height, the edge area BB of the circuit board 111 and the central area AA form a step shape. When multiple light boards are spliced together, as shown in FIG. 9, the reflector sheet 12 can be arranged on the edge area BB of the circuit board 11 of two adjacent light boards, and the reflector sheet covers the space between the two light boards.的 gap s. By setting the edge of the circuit board 111 of the light board in a step shape, the installation height of the reflective sheet 12 can be reduced, so that the reflective sheet 12 can be sunk below the micro light emitting diode 112, so that the reflective sheet 12 will not interfere with the micro light emitting diode. The light emitted by 112 is blocked, which can make the light of the micro LED 112 arranged close to the edge smoothly exit out, avoiding the problem of low seam brightness caused by the reflection sheet 12 being set too high to block the light from the micro LED 112.

In a specific implementation, the thickness of the reflective sheet 12 can be set at about 200 μm. Accordingly, the height difference between the central area AA and the edge area BB of the circuit board 111, that is, the height of the step formed by the central area and the edge area of the circuit board, can be set Between 0.1mm～0.3mm. Since the circuit board used by the miniature light-emitting diode can be a printed circuit board (Printed Circuit Board, PCB for short), and the substrate of the PCB can be made of glass, glass fiber epoxy FR4 material, BT resin material, etc., the thickness of the substrate is limited. Therefore, it is not advisable to set the height of the above-mentioned steps too large. Considering that the thickness of the reflective sheet 12 is about 200 μm, the height of the above-mentioned steps can be set between 0.1 mm and 0.3 mm.

The size of the micro light emitting diode 112 is generally less than 300 μm; light is emitted from the top and sides thereof. Therefore, reducing the surface height of the reflective sheet 12 can prevent the reflective sheet 12 from blocking the light from the micro light emitting diode 112. In practical applications, the height of the surface of the reflective sheet 12 facing the micro light emitting diode 112 can be less than or equal to the height of the surface of the micro light emitting diode facing the circuit board 111 through the arrangement shown in FIG. The shading problem of the reflective sheet 12.

The protective layer 113 covering each micro-light-emitting diode 112 can play a role in the packaging and protection of the micro-light-emitting diode. The protective layer 113 can be coated on the surface of the micro-light-emitting diode 112 by using a colloidal material. It is made of materials such as silica gel or epoxy resin, which is not limited here. Since the material used for the protective layer 113 is generally a colloidal material, after coating the colloidal material, the side of the protective layer 113 cannot be guaranteed to be a completely vertical surface. In the general manufacturing process, the fluid material is solidified due to gravity. The width of the bottom part will be greater than the width of the top part, so that the side surface of the protective layer 113 is inclined. As shown in FIG. 10 and FIG. 11, in the embodiment of the present application, the width of the protective layer 113 on the side close to the circuit board 111 is larger than the width on the side away from the circuit board 111. The cross section of the protective layer 113 in the light board shown in FIG. 8 is trapezoidal, and the cross section of the protective layer 113 in the circuit board shown in FIG. 10 is trapezoidal and the top corners of the trapezoid are rounded. It can be seen from Fig. 10 and Fig. 11 that the side surface of the protective layer 113 is an inclined surface. In order to ensure that the protective layer 113 can cover all the micro light emitting diodes 112 on the circuit board without covering the edge area BB of the circuit board 111, an exposed central area AA can be set above the circuit board 111 while shielding the edge area during actual production. The mask of BB, the protective material is coated in the range of the central area AA, and the mask is removed after the production is completed, so that the orthographic projection of the protective layer 113 on the circuit board 111 coincides with the central area AA of the circuit board 111. That is, the protective layer 113 can completely cover the central area AA of the circuit board 111 and protect the micro light emitting diode 112 located in the central area.

In the specific implementation, in order to reduce the processing difficulty and protect the effective installation of various components, as shown in Figures 10 and 11, the maximum width l2 between the edge of the circuit board 111 and the protective layer 113 on the same side can be set to be smaller than that of the circuit board 111. At the same time, the width l1 of the edge area BB of the circuit board 111 is smaller than the maximum width l2 between the edge of the circuit board 111 and the protective layer on the same side, that is, l1<l2< l3. If the side of the protective layer 113 is set as a vertical surface as shown in FIG. 8, the width l1 of the edge area BB of the circuit board 111 is equal to the maximum width l2 between the edge of the circuit board 111 and the protective layer on the same side.

The reflector sheet 12 located in the joint area of two adjacent lamp boards is arranged on the edge area BB of the circuit board of the two adjacent lamp boards, so the edge area BB of the circuit board supports the reflector sheet 12 to protect the reflection The sheet 12 may be, in the embodiment of the present application, the width of the edge area BB of the circuit board 111 is set to be greater than or equal to 1 mm.

The above-mentioned backlight module provided by the embodiment of the present application, as shown in FIG. 12, further includes: a back plate 13, a sealant 14 arranged around the back plate 13, and the back plate 13 and the sealant 14 form an accommodating space, which are mutually spliced The light board is arranged in the accommodating space. A reflective sheet 12 is provided at the gap s between two adjacent light boards. In specific implementation, an optical film 15 is provided on the light-emitting side of the light board, and part of the light emitted by the micro light emitting diode 112 is covered by the optical film. Transmission, a part of it will be reflected by the optical film to the reflective sheet 12 between the two lamp panels 11, and then reflected by the reflective sheet 12 to the side of the optical film again, so that it is located at the gap s between the two lamp panels 11 Light will be emitted to one side of the optical film, which can eliminate the dark shadow generated at the gap s. The protective layer 113 is arranged in the central area AA of the circuit board 111, and the edge area BB of the circuit board does not cover the protective layer 113, so when the reflective sheet 12 is arranged on the edge area BB, the installation height of the reflective sheet 12 can be reduced. The reflective sheet 12 does not block the light emitted by the micro LED 112, and avoids the problem of low seam brightness caused by the reflective sheet 12 being set too high to block the light from the micro LED 112.

In the second aspect of the embodiments of the present application, a structure of a backlight module is provided as shown in FIG. 12, which includes: a plurality of mutually spliced light panels, and there is a gap s between two adjacent light panels; wherein the light panel includes: a circuit A board 111, a plurality of micro light emitting diodes 112 arranged on the circuit board 111, and a protective layer 113 covering all the micro light emitting diodes 112; the circuit board 111 includes a central area AA and an edge area BB surrounding the central area AA; the protective layer 113 is The orthographic projection of the circuit board 111 is located in the central area AA. As shown in FIG. 10, the backlight module further includes a reflective sheet 12, which is located on the same side of the circuit board 111 as the micro light-emitting diode 112. The reflective sheet 12 is arranged on the edge area BB of two adjacent light boards and covers the phase The gap s between two adjacent light boards.

In another possible implementation manner, as shown in FIG. 9, the edge area BB of the circuit board 111 facing the micro light emitting diode 112 has a lower surface height than the central area AA of the circuit board 111 facing the micro light emitting diode 112. The surface height, the edge area BB of the circuit board 111 and the central area AA form a step shape.

The above-mentioned backlight module provided by the embodiments of the present application solves the problem in principle similar to the above-mentioned display device. Therefore, the implementation of the backlight module can refer to the implementation of the above-mentioned display device, and the repetition will not be repeated.

The display device and the backlight module provided by the embodiments of the present application include: a plurality of mutually spliced light boards, and there is a gap between two adjacent light boards; the light board includes: a circuit board, a plurality of micro Light-emitting diodes and a protective layer covering all miniature light-emitting diodes; the circuit board includes a central area and an edge area surrounding the central area; the orthographic projection of the protective layer on the circuit board is located in the central area; the backlight module also includes a reflective sheet, a reflective sheet and The micro light emitting diodes are located on the same side of the circuit board, and the reflective sheet is arranged on the edge area of two adjacent light boards and covers the gap between the two adjacent light boards. The light exit side of the lamp panel will be provided with an optical film. Part of the light emitted by the micro LED will be transmitted by the optical film, and part of the light will be reflected by the optical film to the reflector between the two lamp panels. One side of the diaphragm is reflected, so that light will be emitted to the side of the optical diaphragm at the gap between the two lamp plates, thereby eliminating the dark shadow generated at the gap. The protective layer is arranged in the center area of the circuit board, and the edge area of the circuit board is not covered by the protective layer, so when the reflector is arranged on the edge area, the installation height of the reflector can be reduced, and the reflector will not block the micro LED It avoids the problem of low seam brightness caused by setting the reflector too high to block the light from the micro light emitting diode.

Although the preferred embodiments of the present application have been described, those skilled in the art can make additional changes and modifications to these embodiments once they learn the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications falling within the scope of the present application.

Obviously, those skilled in the art can make various changes and modifications to the application without departing from the spirit and scope of the application. In this way, if these modifications and variations of this application fall within the scope of the claims of this application and their equivalent technologies, this application also intends to include these modifications and variations.

Claims

A display device, characterized by comprising: a backlight module and a display panel on the light-emitting side of the backlight module;

The backlight module includes a plurality of light panels spliced with each other, and there is a gap between two adjacent light panels;

The light board includes: a circuit board, a plurality of micro light emitting diodes arranged on the circuit board, and a protective layer covering all the micro light emitting diodes;

The circuit board includes a central area and an edge area surrounding the central area; the orthographic projection of the protective layer on the circuit board is located in the central area;

The backlight module further includes a reflective sheet, the reflective sheet and the micro light emitting diode are located on the same side of the circuit board, and the reflective sheet is arranged on the edge regions of two adjacent light boards and covers the same side. Adjacent to the gap between the two lamp panels.
7. The display device of claim 1, wherein the edge area of the circuit board has a surface height that faces the micro light emitting diodes is smaller than a surface of the center area of the circuit board that faces the micro light emitting diodes. Height, the edge area and the center area of the circuit board form a step shape.
3. The display device of claim 2, wherein the height difference between the center area and the edge area of the circuit board satisfies the following relationship:

0.1mm≤H≤0.3mm;

Wherein, H represents the height difference between the center area and the edge area of the circuit board.
3. The display device of claim 3, wherein the height of the surface of the reflective sheet facing the micro light emitting diode is less than or equal to the height of the surface of the micro light emitting diode facing the circuit board.
The display device of claim 1, wherein the orthographic projection of the protective layer on the circuit board coincides with the central area of the circuit board.
The display device of claim 5, wherein the width of the protective layer on the side close to the circuit board is larger than the width on the side far from the circuit board.
The display device according to claim 6, wherein the maximum width between the edge of the circuit board and the protective layer on the same side is smaller than the maximum width between the edge of the circuit board and the nearest micro light emitting diode. width;

The width of the edge area of the circuit board is smaller than the maximum width between the edge of the circuit board and the protective layer on the same side.
8. The display device of claim 7, wherein the width of the edge area of the circuit board is greater than or equal to 1 mm.
A backlight module, characterized by comprising: a plurality of mutually spliced lamp panels, and there is a gap between two adjacent lamp panels;

The light board includes: a circuit board, a plurality of micro light emitting diodes arranged on the circuit board, and a protective layer covering all the micro light emitting diodes;

The circuit board includes a central area and an edge area surrounding the central area; the orthographic projection of the protective layer on the circuit board is located in the central area;

The backlight module further includes a reflective sheet, the reflective sheet and the micro light emitting diode are located on the same side of the circuit board, and the reflective sheet is arranged in the edge area of the two adjacent light boards and covers the same side. Adjacent to the gap between the two lamp panels.
The backlight module according to claim 9, wherein the edge area of the circuit board faces the side of the micro light emitting diodes, and the height of the surface is lower than the central area of the circuit board faces the side of the micro light emitting diodes. The edge area and the center area of the circuit board form a step shape.