CN204285130U - A kind of back light assembly, backlight module and liquid crystal module - Google Patents
A kind of back light assembly, backlight module and liquid crystal module Download PDFInfo
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- CN204285130U CN204285130U CN201420734854.8U CN201420734854U CN204285130U CN 204285130 U CN204285130 U CN 204285130U CN 201420734854 U CN201420734854 U CN 201420734854U CN 204285130 U CN204285130 U CN 204285130U
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Abstract
The utility model provides a kind of back light assembly, backlight module and liquid crystal module, this back light assembly comprises FPC and at least one luminescent device, FPC comprises substrate layer, substrate layer upper, lower surface is provided with circuit layer, the circuit being connected to luminescent device is provided with in circuit layer, at least one luminescent device is welded in the welding region of the circuit layer that substrate layer upper surface is arranged, the area shared by circuit in the circuit layer that substrate layer lower surface is arranged is not less than unappropriated area, FPC also comprises the through hole running through substrate layer and circuit layer, circuit in the circuit layer of through hole both sides is connected and conducting by through hole.The utility model, by above technical scheme, solves existing back light insufficient owing to dispelling the heat, and causes the problem that its using function, durability, reliability and service life reduce.By odt circuit Rotating fields and the area increasing circuit in circuit layer, improve radiating efficiency, promote its using function, durability, reliability and service life.
Description
Technical field
The utility model relates to back light model setting technology field, particularly relates to a kind of back light assembly, backlight module and liquid crystal module.
Background technology
Along with intelligent terminal popularize, application demand that is ultra-thin, highlighted, giant-screen constantly rises, and requires also more and more higher to backlight module quality, brightness etc., and therefore, the development promoting backlight module product confrontation backlight module future has very active influence.
At present, along with more and more higher to the requirement of backlight module brightness, the heat dissipation problem of back light assembly is by the key of backlight module performance quality after becoming.In back light assembly, the luminous power of LED is in fact not high, and its a big chunk energy all can be converted into heat energy, if the heat energy in LED can not spread out in time, can accelerate the aging of LED.Have experiment display, the working life of LED at temperature 25 DEG C be the 5-10 of 70 DEG C doubly, as can be seen here, the quality guarantee of dispelling the heat for backlight module is very important.
Utility model content
The utility model is supplied to a kind of back light assembly, backlight module and liquid crystal module, solves existing back light insufficient owing to dispelling the heat, and causes the problem that its using function, durability, reliability and service life reduce.
For solving the problems of the technologies described above, the utility model provides a kind of back light assembly, comprise FPC and at least one luminescent device, described FPC comprises substrate layer, described substrate layer upper, lower surface is provided with circuit layer, the circuit being connected to described luminescent device is provided with in described circuit layer, at least one luminescent device described is welded in the welding region of the circuit layer that described substrate layer upper surface is arranged, the area shared by circuit in the circuit layer that described substrate layer lower surface is arranged is not less than unappropriated area, described FPC also comprises the through hole running through described substrate layer and described circuit layer, circuit in the circuit layer of described through hole both sides is connected and conducting by described through hole.
In a kind of embodiment of the present utility model, the area shared by circuit in the circuit layer that described substrate layer lower surface is arranged is not less than 90% of the area of the circuit layer that described substrate layer lower surface is arranged.
In a kind of embodiment of the present utility model, the area shared by circuit in the circuit layer that described substrate layer upper surface is arranged is not less than unappropriated area.
In a kind of embodiment of the present utility model, the area shared by circuit in the circuit layer that described substrate layer upper surface is arranged is not less than 90% of the area of the circuit layer that described substrate layer upper surface is arranged.
In a kind of embodiment of the present utility model, described circuit layer is provided with protective layer.
In a kind of embodiment of the present utility model, except the region of described welding region is provided with smooth reflectance coating on the circuit layer that described substrate layer upper surface is arranged, the circuit layer that described substrate layer lower surface is arranged is provided with transparent mulch film.
In a kind of embodiment of the present utility model, the structure of described circuit layer comprises network structure, list structure, wavelike structure or alveolate texture.
In a kind of embodiment of the present utility model, described luminescent device is LED.
A kind of backlight module, comprise backlight module frame, light guide plate, reflector plate and blooming piece, also comprise above-mentioned back light assembly, described reflector plate is arranged in described backlight module frame, described light guide plate is arranged on described reflector plate, described back light assembly is arranged at the incidence surface of described light guide plate, and described blooming piece is arranged at the exiting surface of described light guide plate.
A kind of liquid crystal module, comprise liquid crystal panel, also comprise above-mentioned backlight module, described liquid crystal panel is arranged on described backlight module.
The beneficial effects of the utility model:
The utility model provides a kind of back light assembly, backlight module and liquid crystal module, by arranging odt circuit Rotating fields, and the area of circuit in increase circuit layer, increase the area of dissipation of back light assembly, not only increase the radiating efficiency of back light assembly, but also the using function of back light assembly, durability, reliability and service life are significantly enhanced.
Accompanying drawing explanation
The structural representation in the back light assembly front that Fig. 1 provides for the utility model one embodiment;
Fig. 2 is the sectional view at A-A place in Fig. 1;
The structural representation of the back light module backside that Fig. 3 provides for the utility model one embodiment.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the utility model embodiment, be clearly and completely described the technical scheme in the utility model embodiment, obviously, described embodiment is a part of embodiment in the utility model, instead of whole embodiments.Based on the embodiment in the utility model, those of ordinary skill in the art are not making the every other embodiment obtained under creative work prerequisite, all belong to the scope of the utility model protection.
By reference to the accompanying drawings the utility model is described in further detail below by detailed description of the invention.
As the structural representation of the back light assembly that Fig. 1 provides for the utility model one embodiment, as the sectional view that Fig. 2 is A-A place in Fig. 1, as Fig. 1, shown in 2, this back light assembly comprises FPC (Flexible Printed Circuit board, flexible print wiring board) 1 and at least one luminescent device 2, wherein, FPC1 comprises substrate layer 11, the upper surface (front) of substrate layer 11 is provided with circuit layer 12, lower surface (back side) is provided with circuit layer 13, its set-up mode can be circuit layer 12, 13 are pasted on substrate layer 11 respectively by two-sided colloid, circuit layer 12, the circuit being connected to luminescent device 2 is provided with in 13, this railway superstructures circuit structure of back light assembly, at least one welding region is provided with in circuit layer 12, so that at least one luminescent device 2 is welded in the welding region of the circuit layer 12 that substrate layer 11 upper surface is arranged, the area shared by circuit in the circuit layer 13 that substrate layer 11 lower surface is arranged is not less than its unappropriated area, FPC1 also comprises and runs through substrate layer 11 and circuit layer 12, the through hole 14 of 13, the circuit layer 12 of through hole 14 both sides, circuit in 13 is connected and conducting by through hole 14, thus form complete circuit structure.By arranging odt circuit Rotating fields, be arranged on odt circuit layer by circuit structure, and the area of circuit in increase circuit layer, thus increase the area of dissipation of back light assembly, not only increase the radiating efficiency of back light assembly, but also the using function of back light assembly, durability, reliability and service life are significantly enhanced.Wherein, substrate layer 11 can be any in polyimides, polyester, polysulfones or polytetrafluoroethylene (PTFE), and two-sided colloid is any in acrylic acid glue-line or epoxy glue layer, and this luminescent device 2 can be LED.
In technique scheme, owing to adding one deck circuit layer 13 at the lower surface of substrate layer 11, in order to improve the radiating efficiency of back light assembly, for the circuit in this circuit layer 13, design can be optimized to it, as the area shared by circuit can be improved, the area of circuit layer 13 shared by circuit is made to be not less than its unappropriated area, namely ensure that this circuit at least takies the half of the area of circuit layer 13, thus improve the area of dissipation of back light assembly, preferably, in order to circuit layer 13 can be made full use of, area shared by circuit is not less than 90% of the area of circuit layer 13, such as, can by the length of extension wire or the wire diameter increasing circuit, circuit is enable substantially to be paved with whole circuit layer 13, this circuit can adopt prolong pressure copper or cathode copper in any.
In technique scheme, mainly be optimized design for the circuit in circuit layer 13, further, circuit in the circuit layer 12 that can arrange for substrate layer 11 upper surface equally carries out similar optimal design, as the area shared by circuit can be improved, the area of circuit layer 12 shared by circuit is made to be not less than its unappropriated area, namely ensure that this circuit at least takies the half of the area of circuit layer 12, thus improve the area of dissipation of back light assembly, preferably, in order to circuit layer 13 can be made full use of, area shared by circuit is not less than 90% of the area of circuit layer 12, such as, can by the length of extension wire or the wire diameter increasing circuit, circuit is enable substantially to be paved with whole circuit layer 12, this circuit can adopt prolong pressure copper or cathode copper in any.
In the present embodiment, in order to protection circuit layer 12, 13, at circuit layer 12, protective layer is provided with on 13, wherein, owing to being welded with luminescent device 2 on circuit layer 12, therefore the protective layer that circuit layer 12 is arranged except the region of welding region is smooth reflectance coating 15, in the whole entry of backlight module of light that this smooth reflectance coating 15 can make luminescent device 2 send, thus improve the utilization rate of light, its color is including, but not limited to white, silver color or black, and be nontransparent, namely ensure that light, at this smooth reflectance coating 15 place, mirror-reflection occurs, make light when this smooth reflectance coating 15 of directive, refraction can not be there is and produce printing opacity, but all direct reflection enters in backlight module, welding resistance effect can also be played, prevent from FPC not needing the position of welding soldered, this smooth reflectance coating 15 can be connected by heat-curable glue with circuit layer 12.Circuit layer 13 is provided with cover layer 16, thus protects FPC better, this cover layer 16 also plays welding resistance effect, and it is including, but not limited to transparent mulch film, smooth reflectance coating, and this cover layer 16 can be connected by heat-curable glue with circuit layer 13.
In the present embodiment, as the structural representation of the back light module backside that Fig. 3 provides for the utility model one embodiment, as shown in Figure 3, this circuit layer 13 can be homogeneous texture, and its structure can be any in network structure, list structure, wavelike structure or alveolate texture.
The utility model also provides a kind of backlight module, comprise backlight module frame, light guide plate, reflector plate and blooming piece, also comprise above-mentioned back light assembly, reflector plate is arranged in backlight module frame, light guide plate is arranged on reflector plate, back light assembly is arranged at the incidence surface of light guide plate, and blooming piece is arranged at the exiting surface of light guide plate.
The present invention also provides a kind of liquid crystal module, comprises liquid crystal panel, also comprises above-mentioned backlight module, is arranged on backlight module by liquid crystal panel.
Above content is in conjunction with concrete preferred embodiment further detailed description of the utility model, can not assert that concrete enforcement of the present utility model is confined to these explanations.For the utility model person of an ordinary skill in the technical field, without departing from the concept of the premise utility, some simple deduction or replace can also be made, all should be considered as belonging to protection domain of the present utility model.
Claims (10)
1. a back light assembly, comprise FPC and at least one luminescent device, it is characterized in that, described FPC comprises substrate layer, described substrate layer upper, lower surface is provided with circuit layer, the circuit being connected to described luminescent device is provided with in described circuit layer, at least one luminescent device described is welded in the welding region of the circuit layer that described substrate layer upper surface is arranged, the area shared by circuit in the circuit layer that described substrate layer lower surface is arranged is not less than unappropriated area, described FPC also comprises the through hole running through described substrate layer and described circuit layer, circuit in the circuit layer of described through hole both sides is connected and conducting by described through hole.
2. back light assembly according to claim 1, is characterized in that, the area shared by circuit in the circuit layer that described substrate layer lower surface is arranged is not less than 90% of the area of the circuit layer that described substrate layer lower surface is arranged.
3. back light assembly according to claim 1, is characterized in that, the area shared by circuit in the circuit layer that described substrate layer upper surface is arranged is not less than unappropriated area.
4. back light assembly according to claim 3, is characterized in that, the area shared by circuit in the circuit layer that described substrate layer upper surface is arranged is not less than 90% of the area of the circuit layer that described substrate layer upper surface is arranged.
5. the back light assembly according to any one of claim 1-4, is characterized in that, described circuit layer is provided with protective layer.
6. back light assembly according to claim 5, is characterized in that, except the region of described welding region is provided with smooth reflectance coating on the circuit layer that described substrate layer upper surface is arranged, the circuit layer that described substrate layer lower surface is arranged is provided with cover layer.
7. the back light assembly according to any one of claim 1-4, is characterized in that, the structure of described circuit layer comprises network structure, list structure, wavelike structure or alveolate texture.
8. the back light assembly according to any one of claim 1-4, is characterized in that, described luminescent device is LED.
9. a backlight module, comprise backlight module frame, light guide plate, reflector plate and blooming piece, it is characterized in that, also comprise the back light assembly as described in any one of claim 1-8, described reflector plate is arranged in described backlight module frame, described light guide plate is arranged on described reflector plate, and described back light assembly is arranged at the incidence surface of described light guide plate, and described blooming piece is arranged at the exiting surface of described light guide plate.
10. a liquid crystal module, comprises liquid crystal panel, it is characterized in that, also comprises backlight module as claimed in claim 9, and described liquid crystal panel is arranged on described backlight module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420734854.8U CN204285130U (en) | 2014-11-27 | 2014-11-27 | A kind of back light assembly, backlight module and liquid crystal module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420734854.8U CN204285130U (en) | 2014-11-27 | 2014-11-27 | A kind of back light assembly, backlight module and liquid crystal module |
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| Publication Number | Publication Date |
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| CN204285130U true CN204285130U (en) | 2015-04-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201420734854.8U Active CN204285130U (en) | 2014-11-27 | 2014-11-27 | A kind of back light assembly, backlight module and liquid crystal module |
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| CN (1) | CN204285130U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106200113A (en) * | 2015-06-01 | 2016-12-07 | 扬升照明股份有限公司 | Backlight module |
| CN107102477A (en) * | 2017-06-13 | 2017-08-29 | 厦门天马微电子有限公司 | LED light bar, backlight module and display device |
| CN108591974A (en) * | 2018-04-24 | 2018-09-28 | 武汉华星光电技术有限公司 | Drive substrate, preparation method and Minitype LED array emitting backlight module |
| CN109656057A (en) * | 2017-10-11 | 2019-04-19 | 群创光电股份有限公司 | Backlight module and display equipment comprising it |
| US10512159B2 (en) | 2018-04-24 | 2019-12-17 | Wuhan China Star Optoelectronics Technology Co., Ltd. | Driving substrate, manufacturing process, and micro-LED array light-emitting backlight module |
-
2014
- 2014-11-27 CN CN201420734854.8U patent/CN204285130U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106200113A (en) * | 2015-06-01 | 2016-12-07 | 扬升照明股份有限公司 | Backlight module |
| CN107102477A (en) * | 2017-06-13 | 2017-08-29 | 厦门天马微电子有限公司 | LED light bar, backlight module and display device |
| CN107102477B (en) * | 2017-06-13 | 2020-06-19 | 厦门天马微电子有限公司 | LED lamp strip, backlight unit and display device |
| CN109656057A (en) * | 2017-10-11 | 2019-04-19 | 群创光电股份有限公司 | Backlight module and display equipment comprising it |
| CN108591974A (en) * | 2018-04-24 | 2018-09-28 | 武汉华星光电技术有限公司 | Drive substrate, preparation method and Minitype LED array emitting backlight module |
| US10512159B2 (en) | 2018-04-24 | 2019-12-17 | Wuhan China Star Optoelectronics Technology Co., Ltd. | Driving substrate, manufacturing process, and micro-LED array light-emitting backlight module |
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Legal Events
| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20160506 Address after: 241000 Anhui Province, Wuhu City Economic and Technological Development Zone, a road north (plant branch company) Patentee after: Wuhu de Ge optoelectronics Co., Ltd. Address before: 518108. E building, Shiyan Industrial Street, Fukang mountain area, Shiyan City, Shenzhen, Guangdong, Baoan District Patentee before: Shenzhen Techaser Technologies Co., Ltd. |