CN208606015U - A kind of backlight module and display module - Google Patents
A kind of backlight module and display module Download PDFInfo
- Publication number
- CN208606015U CN208606015U CN201821349884.1U CN201821349884U CN208606015U CN 208606015 U CN208606015 U CN 208606015U CN 201821349884 U CN201821349884 U CN 201821349884U CN 208606015 U CN208606015 U CN 208606015U
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- China
- Prior art keywords
- edge sealing
- sealing adhesive
- wiring board
- light
- conversion film
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model discloses a kind of backlight module and display module, backlight module includes wiring board, Mini LED light, light conversion film and edge sealing adhesive, and the Mini LED light is set on the wiring board;The light conversion film is set on the wiring board and the covering Mini LED light;The edge sealing adhesive is set to the wiring board outer rim and around the light conversion film.Since edge sealing adhesive is set to wiring board outer rim and surround light conversion film, the light of surrounding can be absorbed or be reflected by edge sealing adhesive, be avoided from surrounding light leakage.
Description
Technical field
The utility model relates to a kind of field of display technology, more specifically to a kind of backlight module and display module.
Background technique
Mini LED is between traditional LED and Micro LED, therefore for existing manufacturer, many existing systems
Journey and equipment can continue use, so without introducing too many new equipment.Especially by the soft base of Mini LED technology collocation
High curved surface backlight module can be made in plate, there will be an opportunity to take the lead in being directed in mobile phone, TV, vehicle-mounted panel, and the competing pen electricity of electricity etc.
A variety of applications, and Mini LED is not necessarily to the technical threshold for overcoming flood tide to shift, it is easier to realize volume production.
Mini LED backlight is the area source of not frame, can meet the requirement of Rimless mould group, but due to four
There is no frame week, light can be projected from surrounding leads to light leakage, shows as having light leakage in the gap of casing in complete machine, in dark
Environment is with particularly evident.
Utility model content
The technical problem to be solved by the utility model is to provide a kind of backlight modules, since edge sealing adhesive is set to wiring board
The light of outer rim and circular light conversion film, surrounding can be absorbed or be reflected by edge sealing adhesive, be avoided from surrounding light leakage.
The utility model additionally provides a kind of display module.
Technical problem to be solved in the utility model is achieved by the following technical programs:
In order to solve the above technical problems, the utility model provides a kind of backlight module comprising wiring board, Mini LED
Lamp, light conversion film and edge sealing adhesive, the Mini LED light are set on the wiring board;The light conversion film is set to the wiring board
Above and cover the Mini LED light;The edge sealing adhesive is set to the wiring board outer rim and around the light conversion film.
Further, the height of the edge sealing adhesive is greater than or equal to the height of the light conversion film.
Further, the color of the edge sealing adhesive is black.
Further, the light conversion film is fluorescent film.
Further, the light conversion film is quantum dot film.
Further, the edge sealing adhesive is UV glue.
A kind of display module comprising backlight module described in any of the above embodiments and the TFT on the light conversion film
Mould group.
Further, the upper surface of the edge sealing adhesive is concordant with the upper surface of the TFT mould group.
The utility model has the following beneficial effects:
Since edge sealing adhesive is set to wiring board outer rim and around light conversion film, the light of surrounding can be absorbed or anti-by edge sealing adhesive
It penetrates, avoids from surrounding light leakage.
Detailed description of the invention
Fig. 1 is a kind of back light module unit structure schematic diagram provided by the utility model.
Fig. 2 is vapour molecule route schematic diagram.
Fig. 3 is the structural schematic diagram of wiring board.
Fig. 4 is a kind of display module structural schematic diagram provided by the utility model.
Specific embodiment
The utility model is described in detail below with reference to embodiment, embodiment is only the preferred reality of the utility model
Mode is applied, is not the restriction to the utility model.
Referring to Fig. 1, being a kind of backlight module provided by the utility model comprising wiring board 1, multiple Mini LED light
2, light conversion film 3 and edge sealing adhesive 4, the Mini LED light 2 are set on the wiring board 1;The light conversion film 3 is set to the line
On road plate 1 and cover the Mini LED light 2;The edge sealing adhesive 4 is set to 1 outer rim of wiring board and around the light conversion film
3, the end to end formation closed loop of the edge sealing adhesive 4, edge sealing adhesive 4 is abutted to light conversion film 3, and then promotes the waterproof of backlight module
Vapour effect.Since edge sealing adhesive 4 is set to 1 outer rim of wiring board and around light conversion film 3, the light of surrounding can be absorbed by edge sealing adhesive 4 or
Reflection, avoids from surrounding light leakage.
Further, the height of the edge sealing adhesive 4 is greater than or equal to the height of the light conversion film 3, is further prevented with this
Only light sheds from surrounding, promotes the leakproof light ability of backlight module.
Further, the color of the edge sealing adhesive 4 is black, and the edge sealing adhesive 4 of black can be further improved absorption light
Ability, prevent from light leakage from edge sealing adhesive 4.
Further, the light conversion film 3 is fluorescent film.
Further, the light conversion film 3 is quantum dot film, can effectively improve color saturation and color gamut value.
Further, the edge sealing adhesive 4 is UV glue, and UV glue is suitble to do edge sealing adhesive, and technical maturity is high-efficient.
Referring to Fig. 2, further, added with inorganic material 5 that is neutral, being insoluble in water, inorganic material in the edge sealing adhesive 4
Material 5 is evenly distributed on inside edge sealing adhesive 4, and due to the blocking of inorganic material 5, vapour molecule 6 can not directly penetrate into inside, is seeped
Saturating passage length is elongated, and the width of infiltration lane narrows.It can be in the premise for not changing edge sealing adhesive 4 apparent thickness and width
Under, promote waterproof, the oxygen performance of edge sealing adhesive 4.Edge sealing adhesive 4 is preferably UV glue in the present embodiment, since UV glue belongs to organic matter,
Its distinguishing feature is that waterproof, oxygen performance be not high, and after addition inorganic material 5, waterproof, oxygen performance are available significant
It improves.
Further, diameter phi≤1 μm of the inorganic material 5.
Further, the inorganic material 5 is silicide.
Further, the silicide is SiO2Or Si3N4。
Referring to Fig. 3, further, which includes substrate layer 11, and the upper surface of substrate layer 11 is provided with circuit layer
12, the lower surface of substrate layer 11 is provided with metallic radiating layer 13, and set-up mode can divide for circuit layer 12, metallic radiating layer 13
Not Tong Guo sticking double faced adhesive tape on substrate layer 11.Due to the thinner thickness of substrate layer 11, the heat on wiring board 1 can pass through base
Material layer 11 is diffused into metallic radiating layer 13, which can effectively increase the heat dissipation area of wiring board 1, plays uniformly
The effect of heat dissipation, to improve the radiating efficiency of wiring board 1.Wherein substrate layer 11 can for polyimides, polyester, polysulfones or
Any one in polytetrafluoroethylene (PTFE), double-sided adhesive are any one in acrylic acid glue-line or epoxy glue layer, which dissipates
Thermosphere 13 can be copper foil layer.
Further, wiring board 1 further includes at least one through substrate layer 11, circuit layer 12 and metallic radiating layer 13
Through-hole 14, the inner wall of the through-hole 14 are provided with the heat-conducting layer contacted with circuit layer 12, metallic radiating layer 13, using good at through-hole 14
Good heating conduction can be electrically connected the circuit layer 12 and metallic radiating layer 13 of 11 two sides of substrate layer, play good thermally conductive
Function, and heat-conducting layer can provide thermally conductive function, to reach good heat dissipation effect.Wherein, which can be conductive for copper glue
Ink layer.
Further, it is provided with the heat carrier connecting with external conductive structure in through-hole 14, the heat carrier is from circuit layer
12 side is connected with external conductive structure, is also in contact with the heat-conducting layer in through-hole 14, so that circuit layer 12, metal dissipate
Thermosphere 13 can be connected by through-hole 14 with external conductive structure, so that the heat in wiring board 1 passes through the through-hole 14
In heat carrier diffuse to external conductive structure, to further increase the radiating efficiency of wiring board 1.Preferably, in order to make through-hole
14 can be connected with external conductive structure, which is set to the marginal position of wiring board 1.
Further, the metallic radiating layer 13 be uniform radiating structure, structure can for reticular structure, strip structure,
Any one in wavelike structure or honeycomb structure can preferably improve heat dissipation effect by the uniform radiating structure.
Referring to Fig. 4, the utility model additionally provides a kind of display module comprising backlight mould described in any of the above embodiments
Group and the TFT mould group 7 on the light conversion film 3.
Further, the upper surface of the edge sealing adhesive 4 is concordant with the upper surface of the TFT mould group 7.So that edge sealing adhesive 4 can
It is assembled for TFT mould group 7, reduces other packaging technologies, reduce production cost.
Above embodiments only express the embodiments of the present invention, and the description thereof is more specific and detailed, but can not
Therefore it is interpreted as that a limitation on the scope of the patent of the present invention, as long as the form using equivalent substitution or equivalent transformation is obtained
Technical solution, shall fall within the scope of the present invention.
Claims (8)
1. a kind of backlight module, characterized in that it comprises:
Wiring board;
Mini LED light is set on the wiring board;
Light conversion film is set on the wiring board and covers the Mini LED light;
Edge sealing adhesive is set to the wiring board outer rim and around the light conversion film.
2. backlight module according to claim 1, which is characterized in that the height of the edge sealing adhesive is greater than or equal to the light
Convert the height of film.
3. backlight module according to claim 1, which is characterized in that the color of the edge sealing adhesive is black.
4. backlight module according to claim 1, which is characterized in that the light conversion film is fluorescent film.
5. backlight module according to claim 1, which is characterized in that the light conversion film is quantum dot film.
6. backlight module according to claim 5, which is characterized in that the edge sealing adhesive is UV glue.
7. a kind of display module, which is characterized in that it include backlight module as claimed in any one of claims 1 to 6 and be set to institute
State the TFT mould group on light conversion film.
8. display module according to claim 7, which is characterized in that the upper surface of the edge sealing adhesive and the TFT mould group
Upper surface it is concordant.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201821349884.1U CN208606015U (en) | 2018-08-21 | 2018-08-21 | A kind of backlight module and display module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201821349884.1U CN208606015U (en) | 2018-08-21 | 2018-08-21 | A kind of backlight module and display module |
Publications (1)
Publication Number | Publication Date |
---|---|
CN208606015U true CN208606015U (en) | 2019-03-15 |
Family
ID=65680228
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201821349884.1U Active CN208606015U (en) | 2018-08-21 | 2018-08-21 | A kind of backlight module and display module |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN208606015U (en) |
-
2018
- 2018-08-21 CN CN201821349884.1U patent/CN208606015U/en active Active
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