CN108093564B

CN108093564B - Circuit board, manufacturing method thereof and electronic equipment

Info

Publication number: CN108093564B
Application number: CN201810050135.7A
Authority: CN
Inventors: 张文真
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2018-01-18
Filing date: 2018-01-18
Publication date: 2020-08-04
Anticipated expiration: 2038-01-18
Also published as: CN108093564A

Abstract

The application discloses a circuit board, a manufacturing method thereof and electronic equipment. The circuit board comprises a substrate and a plurality of bonding pads arranged on the substrate, wherein waterproof sealant covers the bonding pads and is used for sealing the bonding pads. Waterproof sealant is arranged around the plurality of bonding pads, so that liquid can not permeate around the plurality of bonding pads, the waterproof effect of the circuit board is ensured, the whole height of the circuit board can be well limited, and the light and thin requirements of the electronic equipment are not easily influenced.

Description

Circuit board, manufacturing method thereof and electronic equipment

Technical Field

The application relates to the technical field of electronic equipment, in particular to a circuit board, a manufacturing method thereof and electronic equipment.

Background

In recent years, electronic devices such as smart phones are developed in a light and thin direction, because of differences in use environments of consumers, liquid inlet failure ratios of display screens are continuously improved, and standards of smart phone manufacturers for waterproof grades are also continuously improved. But the existing waterproof schemes of the display screen device are not ideal.

Content of application

The circuit board, the manufacturing method thereof and the electronic device can improve the waterproof effect of the electronic device.

In a first aspect, an embodiment of the present application provides a circuit board, including a substrate and a plurality of pads arranged on the substrate, a plurality of pads are covered with waterproof sealant, so as to seal the plurality of pads.

In a second aspect, an embodiment of the present application provides a method for manufacturing a circuit board, including the following steps: attaching a film made of waterproof sealant to a circuit board so that the film covers a plurality of bonding pads arranged on the circuit board;

and pressing the surface of the film so that the film is wrapped on the surfaces of the plurality of bonding pads.

In a third aspect, an embodiment of the present application provides an electronic device, where the electronic device includes a housing and a circuit board disposed in the housing, and the circuit board is the circuit board described above.

The circuit board that this application embodiment provided includes the base plate and sets up a plurality of pads on the base plate, a plurality of pads coats and is stamped waterproof sealant, be used for with a plurality of pads are sealed to be set up. Waterproof sealant is arranged around the plurality of bonding pads, so that liquid can not permeate around the plurality of bonding pads, the waterproof effect of the circuit board is ensured, the whole height of the circuit board can be well limited, and the light and thin requirements of the electronic equipment are not easily influenced.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application.

Fig. 2 is another schematic structural diagram of an electronic device according to an embodiment of the present application.

Fig. 3 is another schematic structural diagram of an electronic device according to an embodiment of the present application.

Fig. 4 is another schematic structural diagram of an electronic device according to an embodiment of the present application.

Fig. 5 is another schematic structural diagram of an electronic device according to an embodiment of the present application.

Fig. 6 is a schematic structural diagram of a display screen assembly according to an embodiment of the present application.

Fig. 7 is a partially disassembled structural diagram of a display screen assembly according to an embodiment of the present application.

Fig. 8 is a partial cross-sectional view of fig. 6 in the direction a-a.

Fig. 9 is a schematic structural diagram of a circuit board according to an embodiment of the present application.

Fig. 10 is another cross-sectional view of a circuit board according to an embodiment of the present application.

Fig. 11 is a schematic flow chart of a circuit board manufacturing method according to an embodiment of the present disclosure.

Fig. 12 is another schematic flow chart of a circuit board manufacturing method according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The following disclosure provides many different embodiments or examples for implementing different features of the application. In order to simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.

The embodiment of the application provides a circuit board, a manufacturing method thereof and electronic equipment. The details will be described below separately. The circuit board can be arranged in the electronic equipment, and the electronic equipment can be a smart phone, a tablet computer and the like.

Referring to fig. 1 and fig. 2, fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present disclosure, and fig. 2 is another schematic structural diagram of the electronic device according to the embodiment of the present disclosure. The electronic device 100 may include a cover plate 110, a display 120, a circuit board 130, a battery 140, a housing 150, a camera 160, and a fingerprint unlock module 170. It should be noted that the electronic device 1 shown in fig. 1 and fig. 2 is not limited to the above, and may include other devices, or does not include the camera 160, or does not include the fingerprint unlocking module 170.

Wherein the cover plate 110 is mounted to the display screen 120 to cover the display screen 120. The cover plate 10 may be a transparent glass cover plate so that the display screen transmits light through the cover plate 110 for display. In some embodiments, the cover plate 110 may be a glass cover plate made of a material such as sapphire.

The housing 150 may include a middle frame 151 and a rear cover 152, the middle frame 151 and the rear cover 152 may be combined with each other to form the housing 150, and the middle frame 151 and the rear cover 152 may form a receiving space to receive the printed circuit board 130, the display screen 120, the battery 140, and the like. Further, the cover plate 110 may be fixed to the housing 150, and the cover plate 150 and the housing 150 form a closed space to accommodate the printed circuit board 130, the display 120, the battery 140, and the like. In some embodiments, the cover plate 110 is disposed over the middle frame 151, the rear cover 152 is disposed over the middle frame 151, the cover plate 110 and the rear cover 152 are disposed on opposite sides of the middle frame 151, and the cover plate 110 and the rear cover 152 are disposed opposite to each other.

In some embodiments, the housing 150 may be a metal housing, such as a metal such as magnesium alloy, stainless steel, and the like. It should be noted that the material of the housing 150 according to the embodiment of the present application is not limited to this, and other manners may also be adopted, such as: the housing 150 may be a plastic housing. Also for example: the housing 150 is a ceramic housing. For another example: the housing 150 may include a plastic part and a metal part, and the housing 150 may be a housing structure in which metal and plastic are matched with each other, specifically, the metal part may be formed first, for example, a magnesium alloy substrate is formed by injection molding, and then plastic is injected on the magnesium alloy substrate to form a plastic substrate, so as to form a complete housing structure.

It should be noted that, the structure of the housing in the embodiment of the present application is not limited to this, for example: the rear cover and the middle frame are integrally formed to form a completed housing 150 structure, which directly has a receiving space for the printed circuit board 130, the display 120, the battery 140, and the like.

The printed circuit board 130 is mounted in the housing 150, the printed circuit board 130 may be a motherboard of the electronic device 100, and one, two or more of a motor, a microphone, a speaker, an earphone interface, a usb interface, the camera 160, a distance sensor, an ambient light sensor, a receiver, and a processor may be integrated on the printed circuit board 130.

In some embodiments, the printed circuit board 130 may be secured within the housing 150. Specifically, the printed circuit board 130 may be screwed to the middle frame 151 by screws, or may be snapped to the middle frame 151 by means of a snap. It should be noted that the way that the printed circuit board 130 is specifically fixed to the middle frame 151 in the embodiment of the present application is not limited to this, and other ways, such as a way of fixing by a snap and a screw together, may also be used.

Wherein the battery 140 is mounted in the housing 150, and the battery 140 is electrically connected to the printed circuit board 130 to provide power to the electronic device 100. The housing 150 may serve as a battery cover for the battery 140. The case 150 covers the battery 140 to protect the battery 140, and particularly, the rear cover covers the battery 140 to protect the battery 140, reducing damage to the battery 140 due to collision, falling, and the like of the electronic apparatus 100.

The display screen 120 is mounted in the housing 150, and the display screen 120 is electrically connected to the printed circuit board 130 to form a display surface of the electronic device 100. The display screen 120 may include a display area and a non-display area. The display area may be used to display a screen of the electronic device 100 or provide a user with touch control. The top area of the non-display area is provided with an opening for conducting sound and light, and the bottom of the non-display area can be provided with functional components such as a fingerprint module, a touch key and the like. The cover plate 110 is mounted on the display screen 120 to cover the display screen 120, and may form the same display area and non-display area as the display screen 120 or different display areas and non-display areas.

Note that the structure of the display screen 120 is not limited to this. For example, the display screen 120 may be a special-shaped screen, specifically, please refer to fig. 3, and fig. 3 is another schematic structural diagram of the electronic device according to the embodiment of the present application. The electronic device in fig. 3 differs from the electronic device in fig. 1 in that: the electronic device 200 includes a display 220, a cover plate 210, a printed circuit board 230, a battery 240, and a housing 250. Wherein the display screen 220 has a light permeable area 280 formed directly thereon. Specifically, for example: the display screen 220 is provided with a through hole penetrating the display screen 220 in the thickness direction, the light-permeable area 280 may include the through hole, and the through hole may be provided with a front camera, an earpiece, a sensor assembly, and the like. For another example: the display screen 220 is provided with non-display areas, which the light permeable area 280 may comprise. Wherein the cover plate 210 is adapted to the structural arrangement of the display screen 220. It should be noted that the housing 250 may refer to the housing 150, the printed circuit board 230 may refer to the printed circuit board 130, and the battery 240 may refer to the battery 140, which are not described herein again.

Referring to fig. 4, fig. 4 is a schematic structural diagram of another electronic device according to an embodiment of the present disclosure, where the electronic device in fig. 4 is different from the electronic device in fig. 1 in that: the electronic device 400 in fig. 4 includes a display 420, a cover 410, a printed circuit board 430, a battery 440, and a housing 450. The display screen 420 is provided with a notch 490 at its periphery, and the notch 490 can be used for placing a front camera, an earphone, a sensor component, and the like. Wherein the cover plate 410 is adapted to the structural arrangement of the display screen 420. It should be noted that the housing 450 may refer to the housing 150, the printed circuit board 430 may refer to the printed circuit board 130, and the battery 440 may refer to the battery 140, which are not described herein again.

It should be further noted that, in some embodiments, the display screen 120 may not include the non-display area, but may be configured as a full-screen structure, and a distance sensor, an ambient light sensor, and other devices may be disposed below the display screen or at other positions. Specifically, please refer to fig. 5, and fig. 5 is another schematic structural diagram of the electronic device according to the embodiment of the present application. The electronic device 300 includes a display screen 320, a cover 310, a printed circuit board 330, a battery 340, and a housing 350. The display screen 320 covers the housing 350, and has no non-display area. Wherein the cover plate 310 fits the size of the display screen 320. It should be noted that, the housing 350 may refer to the housing 150, the printed circuit board 330 may refer to the printed circuit board 130, and the battery 340 may refer to the battery 140, which are not described herein again.

In some embodiments, the Display 120 may be a liquid Crystal Display (L acquired Crystal Display, L CD) or an Organic light Emitting Diode (Organic L light-Emitting Diode, O L ED) type Display.

In some embodiments, when the display 120 is a liquid crystal display, the electronic device 100 may further include a backlight module, which is not shown in the drawings.

In some embodiments, the cover plate 110, the display screen 120 and the backlight module in the electronic device 100 may form a display screen assembly. Alternatively, the electronic device 100 includes a display panel assembly, which may include a cover plate 110, a display panel 120, and a backlight module. The following description will be made in detail by taking a display screen assembly as an example.

Referring to fig. 6 and 7, fig. 6 is a schematic structural diagram of a display screen assembly according to an embodiment of the present application, and fig. 7 is a schematic partial-disassembled structural diagram of the display screen assembly according to the embodiment of the present application. The display screen assembly 1 may include a cover plate 110, a display screen 120, a backlight module 13 and a waterproof adhesive 12. The cover plate 110, the display screen 120 and the backlight module 13 are sequentially arranged.

Referring to fig. 8, fig. 8 is a partial sectional view of fig. 6 taken along the direction a-a. The cover plate 110 is disposed on the display screen 120, and in particular, the cover plate 110 may refer to the above contents. In some embodiments, the side of the cover plate 110 fixedly connected to the display screen 120 is defined as an inner surface of the cover plate, and the side of the cover plate 110 located outside the electronic device 100 is defined as an outer surface of the cover plate. I.e., the outer surface of the cover plate 110 is visible from the outside, and the inner surface of the cover plate 110 is located inside the electronic device 100.

The waterproof pad scheme of the circuit board of the display screen 120 may include a nano-film plating scheme, a dispensing scheme, an insulating mylar attaching scheme, and the like. The nano film plating scheme is that the plating layer (the putrefaction solution) only macroscopically increases the hydrophobicity of the surface of the device due to the thinness of the plating layer, and the device can not be corroded for a long time because the liquid can not be discharged or evaporated in time after the liquid is fed into the display screen 120, so that the problem of liquid feeding can not be fundamentally solved. The device periphery dispensing side surface of the dispensing scheme has a good waterproof effect, but the surface of the device is limited by the space of the whole machine and can not be dispensed or dispensed too much, and liquid can infiltrate from the upper surface of the bonding pad to corrode after the liquid is fed. According to the scheme of adhering the insulating mylar, due to the fact that the height difference exists between the device and the FPC soft board and the FPC or the double-layer FPC is not flat, the insulating mylar is not flat in adhesion, and liquid enters the corrosion device from a gap after liquid feeding.

Referring to fig. 9, fig. 9 is a schematic structural diagram of a circuit board according to an embodiment of the present disclosure, the circuit board 810 includes a substrate 811 and a plurality of pads 812 disposed on the substrate 811; a waterproof sealant 813 is disposed on the pads 812 to seal the pads 812.

To ensure the waterproof performance of the pads 812 on the circuit board 810, the pads 812 need to be completely surrounded by the waterproof sealant 813. When a plurality of pads 812 set up waterproof sealed glue 813 all around, waterproof sealed glue 813 permeates easily between two pads to the volume of gluing on pad top is wayward, and it is too little to glue the volume, can not surround completely, and it is too many to glue the volume, and whole module height will increase, can influence the intensity of complete machine. Therefore, after the waterproof sealant 813 covers the plurality of pads 812, the waterproof sealant 813 can be pressed, the waterproof effect of the circuit board can be guaranteed, the overall height can be well limited, and the light and thin requirements of the electronic equipment are not easily influenced.

In some embodiments, the waterproof sealant 813 is parallel to the substrate 811, so that the waterproof sealant 813 is not high on one side and low on the other side, that is, the height in the Z direction perpendicular to the substrate 811 is the smallest, which is suitable for the thinning of electronic devices and does not increase the thickness of the electronic devices.

In some embodiments, a waterproof sealant 813 is filled between the pads 812. Cover waterproof sealant 813 on a plurality of pads 812 earlier, and fill waterproof sealant 813 between a plurality of pads 812, because a plurality of pads 812 highly is different, and then cover the height of waterproof sealant 813 on a plurality of pads 812 also not the same, extrude waterproof sealant 813 this moment, make waterproof sealant 813 fill between a plurality of pads 812, with originally highly highest waterproof sealant 813 toward the next door extrusion, make the peripheral waterproof sealant 813 thickness thickening of pad. The waterproof sealant 813 is filled between the plurality of pads 812, so that the waterproof sealant 813 arranged on the circuit board is not easy to flow, the thickness of the waterproof sealant 813 above the pads or on the side edge is not enough, and the waterproof performance is affected. The waterproof sealant 813 which can be arranged at the outermost periphery of the bonding pad needs to be higher, and then the sealing performance of the circuit board 810 and the waterproof sealant 813 is enhanced through extrusion, so that the overall waterproof performance is improved.

In some embodiments, since the waterproof sealant has viscosity and affects the operation when being pressed, a layer of protective film may be covered on the surface of the waterproof sealant, as shown in fig. 10, the waterproof sealant 813 covers the pads 812, and the waterproof sealant 813 covers the spaces between the pads 812, the height of the waterproof sealant 813 is higher than that of the highest pad, that is, the waterproof sealant 813 covers all the pads and the spaces therebetween, the protective film 814 is disposed on the upper surface of the waterproof sealant 813, at this time, the waterproof sealant 813 is pressed by pressing the protective film 814, so that the waterproof sealant 813 is filled between the protective film 814 and the substrate 811, and the waterproof sealant 813 with the highest height is pressed aside, so that the waterproof sealant 813 is filled between the protective film 814 and the substrate 811 and overflows outward. The waterproof sealant 813 is filled between the protective film 814 and the substrate 811, the waterproof sealant 813 completely wraps the pads 812 to protect the waterproof property, and the waterproof sealant 813 is filled between the pads so that water in the horizontal direction cannot enter between the pads. It should be noted that, when the waterproof sealant 813 is provided, it can be provided layer by layer. After the pressing is completed, the protective film 814 is peeled off.

In some embodiments, the pads 812 form a pad placement region, and the waterproof sealant 813 has an area larger than that of the pad placement region, and similarly, the protective film 814 has an area larger than that of the pad placement region. The plurality of pads 812 are provided on the substrate 811, and the plurality of pads 812 may form one pad provision region, or the outermost pads may form one pad provision region. The waterproof sealant 813 covers the area, the area of the waterproof sealant 813 is larger than that of the area where the pad is arranged, and therefore liquid can be prevented from contacting the pad from the upper side of the pad and corroding the pad. Meanwhile, the area of the waterproof sealant 813 is larger than that of the setting area of the bonding pad, the waterproof sealant 813 is filled between the protective film 814 and the substrate 811, the thickness of the waterproof sealant 813 can be thickened, and the waterproof performance in the horizontal direction is improved.

In some embodiments, the waterproof sealant 813 can be a UV light curable glue (UV glue). Volatile Organic Compound (VOC) volatile matters are not generated, and the pollution to the ambient air is avoided; no solvent and low flammability; the curing speed is high, and the curing can be finished within a few seconds to dozens of seconds, so that the automatic production line is facilitated, and the labor productivity is improved; after being cured, the glass can be detected and transported, so that the space is saved; the room temperature curing can save energy, for example, the energy required for producing 1g of photo-curing pressure-sensitive adhesive only needs 1 percent of that of the corresponding water-based adhesive and 4 percent of that of the solvent-based adhesive. The ultraviolet curing resin can be used for materials which are not suitable for high-temperature curing, and the energy consumption of the ultraviolet curing resin can be saved by 90 percent compared with that of the thermal curing resin; the curing equipment is simple, only lamps or conveyor belts are needed, and the space is saved; the system is a single-component system, does not need mixing and is convenient to use; for temperature, solvent and moisture sensitive materials may be used; the curing is controlled, the waiting time can be adjusted, and the curing degree can be adjusted; the sizing can be repeated for multiple times for curing; the ultraviolet lamp can be easily installed in an existing production line without major modification. After the waterproof sealant 813 is pressed, ultraviolet rays are irradiated to cure the waterproof sealant 813 on the surface of the bonding pad 812, so that the bonding pad is protected from liquid corrosion.

In some embodiments, a retaining wall protruding upwards is disposed on the substrate 811 around the pads 812, when the waterproof sealant 813 fills the periphery of the pads 812, the retaining wall can enclose the waterproof sealant 813 in the retaining wall, so as to save the loss of the waterproof sealant 813, the retaining wall is made of waterproof material, and the retaining wall is provided, so that the thickness of the edge of the waterproof sealant 813 is increased, and the waterproof effect in the horizontal direction can be enhanced.

Referring to fig. 11, fig. 11 is a schematic flow chart of a circuit board manufacturing method according to an embodiment of the present application, including the following steps:

and S101, attaching a film made of waterproof sealant to the circuit board so that the film covers a plurality of bonding pads arranged on the circuit board.

And step S102, pressing the surface of the film to wrap the film on the surfaces of the bonding pads.

In this embodiment, the film of making waterproof sealant is laminated with the circuit board, so that waterproof sealant covers on a plurality of pads, and fill waterproof sealant between a plurality of pads, because the height of a plurality of pads is different, and then the height of the waterproof sealant that covers on a plurality of pads is also different, extrude waterproof sealant this moment, make waterproof sealant fill between a plurality of pads, will highly the highest waterproof sealant toward next door extrusion originally, make the peripheral waterproof sealant thickness thickening of pad. The waterproof sealant is filled among the plurality of bonding pads, so that the waterproof sealant arranged on the circuit board is not easy to flow, the thickness of the waterproof sealant above the bonding pads or on the side edges is not enough, and the waterproof performance is influenced. The waterproof sealant which can be arranged at the outermost periphery of the bonding pad needs to be higher, and then the sealing performance of the circuit board and the waterproof sealant is enhanced through extrusion, so that the overall waterproof performance is improved.

On the basis of the previous embodiment, the present embodiment will further describe the manufacturing method of the circuit board, and with reference to fig. 12, fig. 12 is another schematic flow chart of the manufacturing method of the circuit board according to the embodiment of the present application, including the following steps:

step S201, a film made of waterproof sealant is attached to the circuit board so that the film covers a plurality of pads disposed on the circuit board.

In this embodiment, the waterproof sealant is an ultraviolet light curable adhesive, and the ultraviolet light curable adhesive is made into a transparent sheet, which has strong adhesiveness and certain elasticity and is cured and hardened after being irradiated by UV light. And attaching the film to the circuit board. So that the waterproof sealant covers the plurality of bonding pads, and the waterproof sealant is filled between the plurality of bonding pads.

Step S202, the protective film on the surface of the film body is pressed, so that the film covers a plurality of bonding pads arranged on the circuit board.

Because the ultraviolet light curing glue has viscosity, the operation can be influenced when the ultraviolet light curing glue is pressed, and a layer of protective film can be covered on the surface of the ultraviolet light curing glue. The protective film is arranged on the upper surface of the ultraviolet curing adhesive, the ultraviolet curing adhesive is extruded by pressing the protective film, and the ultraviolet curing adhesive can be filled between the protective film and the substrate, so that the adhesive sheet is tightly wrapped on the surface of the bonding pad.

Step S203, the protective film is torn off.

Step S204, irradiating the film by ultraviolet rays to enable the film to be solidified on the surfaces of the bonding pads.

After the ultraviolet light curing glue is pressed, ultraviolet rays are used for irradiating, so that the ultraviolet light curing glue is cured on the surfaces of the bonding pads, and the bonding pads are protected from being corroded by liquid entering the bonding pads.

The embodiment of the application provides a circuit board, a manufacturing method of the circuit board and electronic equipment. The circuit board comprises a substrate and a plurality of bonding pads arranged on the substrate, wherein waterproof sealant covers the bonding pads and is used for sealing the bonding pads. Waterproof sealant is arranged around the plurality of bonding pads, so that liquid can not permeate around the plurality of bonding pads, the waterproof effect of the circuit board is ensured, the whole height of the circuit board can be well limited, and the light and thin requirements of the electronic equipment are not easily influenced.

The circuit board, the manufacturing method thereof, and the electronic device provided by the embodiments of the present application are described in detail above, and the principles and embodiments of the present application are explained herein by applying specific examples, and the description of the above embodiments is only used to help understanding the present application. Meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims

1. A circuit board, the display module assembly of mobile terminal is applied to the circuit board, its characterized in that, the display module assembly includes display screen and sensor, the display screen is comprehensive screen structure, the sensor set up in the display area of display screen, so that the display screen does not include non-display area, the display screen with circuit board electric connection, the circuit board includes the base plate and sets up a plurality of pads on the base plate, a plurality of pads form a pad and set up the region, set up the barricade around the pad sets up the region, the regional barricade region that forms that the barricade centers on, a plurality of pads are covered with waterproof sealant, the area of waterproof sealant is greater than the regional area of pad setting and is less than the regional area of barricade, waterproof sealant is the film that the ultraviolet curing glue made, the film set up in a plurality of pads with between the barricade, the film surface is pressed and is used for making by ultraviolet irradiation a plurality of pad seal sets up, just the film is in the scope that the barricade surrounds, the barricade is used for restricting the edge of protection the film when the film shape, avoid liquid from the film edge infiltration with the pad contact makes the pad is corroded.

2. The circuit board of claim 1, wherein the waterproof sealant is filled between the pads.

3. A method of making the circuit board of claim 1, comprising the steps of:

attaching a film made of waterproof sealant to a circuit board so that the film covers a plurality of bonding pads arranged on the circuit board, wherein the waterproof sealant is ultraviolet curing adhesive and is provided with retaining walls around the bonding pads;

pressing the surface of the film to enable the film to wrap the surfaces of the bonding pads, wherein the film is in the range surrounded by the retaining walls;

irradiating the film by ultraviolet rays to cure the film on the surfaces of the plurality of pads.

4. The method of claim 3, wherein the pellicle comprises a pellicle body and a protective film on a surface of the pellicle body;

the step of pressing the surface of the film to make the film cover the plurality of pads arranged on the circuit board specifically includes:

pressing the protective film on the surface of the film body to enable the film to cover the plurality of bonding pads arranged on the circuit board, and tearing off the protective film after pressing.

5. An electronic device comprising a housing and a circuit board disposed in the housing, the circuit board being the circuit board according to any one of claims 1 to 2.

6. The electronic device of claim 5, further comprising a display module, the display module being electrically connected to the circuit board.