CN214688314U - High-heat-dissipation low-dielectric-constant copper-clad plate - Google Patents
High-heat-dissipation low-dielectric-constant copper-clad plate Download PDFInfo
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- CN214688314U CN214688314U CN202023016991.2U CN202023016991U CN214688314U CN 214688314 U CN214688314 U CN 214688314U CN 202023016991 U CN202023016991 U CN 202023016991U CN 214688314 U CN214688314 U CN 214688314U
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Abstract
The utility model discloses a high heat dissipation low dielectric constant copper-clad plate, including aluminium base board, the fixed surface of aluminium base board outer lane is connected with aluminium fin board, and the frame is glued to the outer lane of aluminium base board top surface and the equal fixedly connected with heat conduction of the outer lane of bottom surface, and the heat dissipation window has all been seted up to the both sides that the frame inner chamber was glued in the heat conduction, and the frame is glued in the heat conduction and is kept away from one side fixedly connected with copper foil of aluminium base board, and the fixed surface of copper foil outer lane is connected with copper fin board. The utility model discloses a set up heat conduction frame, copper fin board, the cooperation of aluminium fin board and heat dissipation window is used, the heat radiating area of copper-clad plate has been improved, made things convenient for the inside heat dissipation of copper-clad plate simultaneously, the radiating efficiency of copper-clad plate is higher like this, the in-process of copper-clad plate using has been solved, because of heat radiating area is less, simultaneously its inside can not dispel the heat, make the situation that temperature accumulation appears in the copper-clad plate easily to the problem that high temperature damaged appears in the electronic component who leads to installing on the copper-clad plate.
Description
Technical Field
The utility model relates to a copper-clad plate technical field specifically is a high heat dissipation low dielectric constant copper-clad plate.
Background
The copper-clad plate is also called a base material, a reinforcing material is soaked with resin, one side or two sides of the reinforcing material are covered with copper foils, and the plate-shaped material is formed by hot pressing and is called a copper-clad laminate, which is a basic material used as a PCB (printed circuit board), often called a base material, and is also called a core plate when the base material is used for producing a multilayer plate.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a high heat dissipation low dielectric constant copper-clad plate possesses the improvement heat radiating area, has made things convenient for the inside radiating advantage of copper-clad plate simultaneously, has solved the copper-clad plate at the in-process that uses, because of heat radiating area is less, simultaneously its inside can not dispel the heat, makes the situation that temperature accumulation appears in the copper-clad plate easily to the problem that high temperature damaged appears in the electronic component who leads to installation on the copper-clad plate.
In order to achieve the above object, the utility model provides a following technical scheme: a copper-clad plate with high heat dissipation and low dielectric constant comprises an aluminum substrate, wherein the surface of the outer ring of the aluminum substrate is fixedly connected with an aluminum fin plate, the outer ring of the top surface and the outer ring of the bottom surface of the aluminum substrate are both fixedly connected with a heat conducting rubber frame, heat dissipation windows are arranged on both sides of the inner cavity of the heat conduction rubber frame, a copper foil is fixedly connected to one side of the heat conduction rubber frame away from the aluminum substrate, the surface of the outer ring of the copper foil is fixedly connected with a copper fin plate, the inner rings of the surface of the top and the surface of the bottom of the aluminum substrate and positioned on the heat-conducting rubber frame are fixedly connected with a low-dielectric-constant binder, one side of the low-dielectric-constant binder far away from the aluminum substrate is fixedly connected with the copper foil, the low-dielectric-constant binder comprises an epoxy resin layer, the glass fiber cloth is filled in the epoxy resin layer, and a PE protective film covers one side, away from the heat conducting rubber frame, of the copper foil.
Preferably, the aluminum fin plate and the copper fin plate have the same size and shape, and the aluminum substrate and the copper foil have the same size and shape.
Preferably, the thickness of the low-dielectric-constant adhesive is the same as that of the heat-conducting adhesive frame, and the transverse length and the longitudinal length of the heat-conducting adhesive frame are both smaller than those of the aluminum substrate and the copper foil.
Preferably, one side of the epoxy resin layer, which is far away from the copper foil, is fixedly connected with the aluminum substrate, and one side of the epoxy resin layer, which is far away from the aluminum substrate, is fixedly connected with the copper foil.
Compared with the prior art, the beneficial effects of the utility model are as follows:
1. the utility model discloses a set up heat conduction frame, copper fin board, the cooperation of aluminium fin board and heat dissipation window is used, the heat radiating area of copper-clad plate has been improved, made things convenient for the inside heat dissipation of copper-clad plate simultaneously, the radiating efficiency of copper-clad plate is higher like this, the in-process of copper-clad plate using has been solved, because of heat radiating area is less, simultaneously its inside can not dispel the heat, make the situation that temperature accumulation appears in the copper-clad plate easily, thereby lead to the problem that the high temperature damaged appears in the electronic component of installation on the copper-clad plate, be worth promoting.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a top view of the aluminum substrate structure of the present invention;
fig. 3 is a front cross-sectional view of the low-k binder structure of the present invention.
In the figure: the heat dissipation structure comprises an aluminum substrate 1, a heat conduction glue frame 2, a copper foil 3, a PE protective film 4, a copper fin plate 5, an aluminum fin plate 6, a low-dielectric-constant binder 7, a heat dissipation window 8, an epoxy resin layer 9 and glass fiber cloth 10.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, a high-heat-dissipation low-dielectric-constant copper-clad plate comprises an aluminum substrate 1, an aluminum fin plate 6 is fixedly connected to the surface of the outer ring of the aluminum substrate 1, a heat-conducting rubber frame 2 is fixedly connected to the outer ring of the top surface and the outer ring of the bottom surface of the aluminum substrate 1, heat-dissipation windows 8 are formed in the two sides of the inner cavity of the heat-conducting rubber frame 2, a copper foil 3 is fixedly connected to one side of the heat-conducting rubber frame 2 away from the aluminum substrate 1, a copper fin plate 5 is fixedly connected to the surface of the outer ring of the copper foil 3, the size and the shape of the aluminum fin plate 6 are the same as those of the copper fin plate 5, the size and the shape of the aluminum substrate 1 are the same as those of the copper foil 3, a low-dielectric-constant binder 7 is fixedly connected to the inner rings of the heat-conducting rubber frame 2 on the surface and the surface of the top and the bottom of the aluminum substrate 1, the thickness of the low-dielectric-constant binder 7 is the same as that of the heat-conducting rubber frame 2, and the transverse length and longitudinal length of the heat-conducting rubber frame 2 are both smaller than those of the aluminum substrate 1 and the copper foil 3, the side of the low-dielectric-constant binder 7, which is far away from the aluminum substrate 1, is fixedly connected with the copper foil 3, the heat-conducting glue frame 2, the copper fin plate 5, the aluminum fin plate 6 and the heat-radiating window 8 are arranged to be matched for use, so that the heat-radiating area of the copper-clad plate is improved, and the heat radiation inside the copper-clad plate is convenient, so that the heat-radiating efficiency of the copper-clad plate is higher, the problem that the electronic components mounted on the copper-clad plate are damaged at high temperature due to the fact that the copper-clad plate cannot radiate heat because the heat-radiating area is smaller in the use process of the copper-clad plate is solved, the situation that the copper-clad plate cannot radiate heat easily is caused, and the low-dielectric-constant binder 7 comprises an epoxy resin layer 9, the glass fiber cloth 10 is filled in the epoxy resin layer 9, the side of the epoxy resin layer 9, which is far away from the copper foil 3, is fixedly connected with the aluminum substrate 1, and the side of the epoxy resin layer 9, which is far away from the aluminum substrate 1, is fixedly connected with the copper foil 3, one side of the copper foil 3, which is far away from the heat-conducting rubber frame 2, is covered with a PE protective film 4, and the copper-clad plate in an unused state can be protected by the PE protective film 4.
When the copper-clad plate is used, the heat-conducting rubber frame 2, the copper fin plate 5, the aluminum fin plate 6 and the heat dissipation window 8 are matched for use, so that the heat dissipation area of the copper-clad plate is increased, and the heat dissipation inside the copper-clad plate is facilitated; the heat dissipation area of the copper-clad plate is increased through the copper fin plate 5 and the aluminum fin plate 6; the heat dissipation inside the copper-clad plate is facilitated through the heat dissipation window 8.
All parts used in the application document are standard parts and can be purchased from the market, and the specific connection mode of all parts adopts conventional means such as bolts, rivets, welding and the like mature in the prior art, and detailed description is not given here.
In summary, the following steps: this high heat dissipation low dielectric constant copper-clad plate uses through the cooperation that sets up heat conduction glue frame 2, copper finned plate 5, aluminium finned plate 6 and heat dissipation window 8, has solved the copper-clad plate and at the in-process that uses, because of heat radiating area is less, its inside can not dispel the heat simultaneously, makes the situation of temperature accumulation appear in the copper-clad plate easily to the electronic component who leads to installing on the copper-clad plate problem that high temperature damaged appears.
In the description of the present invention, it should be understood that the indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (4)
1. The utility model provides a low dielectric constant copper-clad plate of high heat dissipation, includes aluminium base board (1), its characterized in that: the aluminum-clad plate is characterized in that an aluminum fin plate (6) is fixedly connected to the surface of the outer ring of the aluminum substrate (1), heat-conducting glue frames (2) are fixedly connected to the outer ring of the top surface and the outer ring of the bottom surface of the aluminum substrate (1), heat-radiating windows (8) are formed in two sides of the inner cavity of each heat-conducting glue frame (2), a copper foil (3) is fixedly connected to one side, away from the aluminum substrate (1), of each heat-conducting glue frame (2), a copper fin plate (5) is fixedly connected to the surface of the outer ring of the copper foil (3), a low-dielectric-constant binder (7) is fixedly connected to the surface of the top and the surface of the bottom of the aluminum substrate (1) and is located in the inner ring of each heat-conducting glue frame (2), one side, away from the aluminum substrate (1), of each low-dielectric-constant binder (7) is fixedly connected with the copper foil (3), each low-dielectric-constant binder (7) comprises an epoxy resin layer (9), and glass fiber cloth (10) is filled in the epoxy resin layer (9), one side of the copper foil (3) far away from the heat-conducting rubber frame (2) is covered with a PE protective film (4).
2. The copper-clad plate with high heat dissipation and low dielectric constant of claim 1 is characterized in that: the aluminum fin plate (6) and the copper fin plate (5) are the same in size and shape, and the aluminum substrate (1) and the copper foil (3) are the same in size and shape.
3. The copper-clad plate with high heat dissipation and low dielectric constant of claim 1 is characterized in that: the thickness of the low-dielectric-constant binder (7) is the same as that of the heat-conducting glue frame (2), and the transverse length and the longitudinal length of the heat-conducting glue frame (2) are both smaller than those of the aluminum substrate (1) and the copper foil (3).
4. The copper-clad plate with high heat dissipation and low dielectric constant of claim 1 is characterized in that: one side, far away from the copper foil (3), of the epoxy resin layer (9) is fixedly connected with the aluminum substrate (1), and one side, far away from the aluminum substrate (1), of the epoxy resin layer (9) is fixedly connected with the copper foil (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023016991.2U CN214688314U (en) | 2020-12-15 | 2020-12-15 | High-heat-dissipation low-dielectric-constant copper-clad plate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023016991.2U CN214688314U (en) | 2020-12-15 | 2020-12-15 | High-heat-dissipation low-dielectric-constant copper-clad plate |
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| CN214688314U true CN214688314U (en) | 2021-11-12 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116512699A (en) * | 2023-07-03 | 2023-08-01 | 山东森荣新材料股份有限公司 | Preparation method and application of double-sided flexible copper-clad plate |
-
2020
- 2020-12-15 CN CN202023016991.2U patent/CN214688314U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116512699A (en) * | 2023-07-03 | 2023-08-01 | 山东森荣新材料股份有限公司 | Preparation method and application of double-sided flexible copper-clad plate |
| CN116512699B (en) * | 2023-07-03 | 2023-09-01 | 山东森荣新材料股份有限公司 | Preparation method and application of double-sided flexible copper-clad plate |
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