CN210781515U - Circuit board with good anti-aging effect - Google Patents
Circuit board with good anti-aging effect Download PDFInfo
- Publication number
- CN210781515U CN210781515U CN201921918427.4U CN201921918427U CN210781515U CN 210781515 U CN210781515 U CN 210781515U CN 201921918427 U CN201921918427 U CN 201921918427U CN 210781515 U CN210781515 U CN 210781515U
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- circuit board
- heat dissipation
- heat
- silica gel
- layer
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Abstract
The utility model relates to a circuit board technical field just discloses an effectual circuit board of anti-aging, which comprises a substrate, the top fixed mounting of base plate has heat conduction silica gel. This effectual circuit board of anti-aging, through the base plate, a circuit board body is constituteed to heat conduction silica gel and circuit layer, then weld on the circuit layer through electronic component, form wholly, setting through the corner cover, the cover is at the holistic four corners of circuit board, make the circuit board corner receive the protection, can not lead to the circuit board wearing and tearing because of bumping, and compress tightly the circuit board in the mounting groove through the pressure disk that screws up fixing bolt makes its bottom, supplementary heat dissipation is carried out through the inside graphite alkene layer of mounting groove, then provide the heat dissipation space for graphite alkene layer through the louvre, make the radiating effect of circuit board better, prevent to lead to the temperature to rise to form the circuit board ageing owing to the radiating effect is poor, the effectual purpose of anti-aging has been.
Description
Technical Field
The utility model relates to a circuit board technical field specifically is a circuit board that anti-aging is effectual.
Background
The circuit board is also called as a circuit board, and the circuit board is divided into three large categories of a single-sided board, a double-sided board and a multilayer circuit board according to the number of layers, so that the circuit board enables the circuit to be miniaturized and visualized, and plays an important role in the batch production of fixed circuits and the optimization of the layout of electrical appliances.
Various circuit boards in the current market generally have the defect of poor anti-aging effect, and the circuit boards are aged due to heat, illumination, water or physical abrasion, however, the important reason for the aging of the common circuit boards is that the circuit boards are aged due to overhigh temperature caused by poor heat dissipation performance or the circuit boards are not well protected, and particularly, the corners of the circuit boards are easy to collide to generate abrasion, so that the circuit boards are aged, and the circuit boards with good anti-aging effect are provided to solve the problems.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
The utility model provides a not enough to prior art, the utility model provides a circuit board that anti-aging is effectual possesses advantages such as anti-aging is effectual, has solved heat, illumination, water or physical wear and tear and can all lead to the circuit board ageing, however the ageing important reason of ordinary circuit board is exactly that heat dispersion is poor to lead to the high temperature and ageing circuit board, perhaps circuit board itself does not obtain good protection, and the easy collision of the corner of especially circuit board produces wearing and tearing, leads to the ageing problem of circuit board.
(II) technical scheme
For realizing the effectual purpose of above-mentioned anti-aging, the utility model provides a following technical scheme: a circuit board with good anti-aging effect comprises a substrate, wherein the top of the substrate is fixedly provided with heat-conducting silica gel, the top of the heat-conducting silica gel is fixedly provided with a circuit layer, the top of the circuit layer is fixedly provided with an epoxy resin layer, the top of the epoxy resin layer is fixedly provided with an electronic element, the outer side of the substrate is movably provided with a corner sleeve, the inner part of the corner sleeve is provided with a mounting groove, the inner part of the mounting groove is fixedly provided with a graphene layer, the outer side of the corner sleeve is provided with a heat dissipation hole, the top of the corner sleeve is provided with a threaded hole, the inner part of the threaded hole is in threaded connection with a fixing bolt, the bottom of the fixing bolt is fixedly provided with a compression plate, the bottom of the substrate is provided with a first heat dissipation groove, the inner, the heat-conducting silica gel heat dissipation device is characterized in that an inserting block is fixedly mounted at the top of the heat-conducting silica gel, an inserting groove is formed in the bottom of the circuit layer, and a second heat dissipation groove is formed in the bottom of the heat-conducting silica gel.
Preferably, the length and the width of the substrate, the heat-conducting silica gel and the line layer are equal, and the corner sleeve is of an L-shaped three-dimensional structure.
Preferably, the height of mounting groove is greater than the distance between base plate bottom surface and the epoxy layer top surface, the quantity of corner cover is four, and the corner cover is the rubber sleeve.
Preferably, the number of the heat dissipation holes is sixteen, the number of the heat dissipation holes is four, and the heat dissipation holes are tightly attached to the graphene layer.
Preferably, every the inside fixed mounting of first radiating groove has the quantity to be four the radiating rod, base plate and heat conduction silica gel are run through and extend to the inside of heat conduction silica gel in the top of radiating rod.
Preferably, the bottom of the second heat dissipation groove penetrates through the top of the substrate and extends to the bottom of the substrate, and the insertion block is matched with the size of the insertion groove.
(III) advantageous effects
Compared with the prior art, the utility model provides a circuit board that anti-aging is effectual possesses following beneficial effect:
1. this effectual circuit board of anti-aging, through the base plate, a circuit board body is constituteed to heat conduction silica gel and circuit layer, then weld on the circuit layer through electronic component, form wholly, setting through the corner cover, the cover is at the holistic four corners of circuit board, make the circuit board corner receive the protection, can not lead to the circuit board wearing and tearing because of bumping, and compress tightly the circuit board in the mounting groove through the pressure disk that screws up fixing bolt makes its bottom, supplementary heat dissipation is carried out through the inside graphite alkene layer of mounting groove, then provide the heat dissipation space for graphite alkene layer through the louvre, make the radiating effect of circuit board better, prevent to lead to the temperature to rise to form the circuit board ageing owing to the radiating effect is poor, the effectual purpose of anti-aging has been.
2. This circuit board that anti-aging is effectual, the heat absorption that produces electronic component on with the circuit layer through heat conduction silica gel, and through the heat transfer on the heat conduction silica gel of heat dissipation stick, then provide the heat dissipation space for the heat dissipation stick through first radiating groove, heat dissipation rate has been accelerated, setting through inserted block and inserted groove, make heat conduction silica gel closely laminate with the circuit layer, make heat conduction silica gel's heat conduction effect better, and through the setting of insulating connecting post, with the base plate, heat conduction silica gel and circuit layer further link together and form wholly, and through the setting of second radiating groove, directly provide the radiating space of air for circuit layer and heat conduction silica gel, make inside air obtain the circulation, the heat conduction of cooperation radiating stick, carry out the dual heat dissipation, prevent that the high temperature is ageing, the effectual mesh of anti-aging has been reached.
Drawings
FIG. 1 is a schematic structural view of the present invention;
fig. 2 is a top view of the present invention.
In the figure: the heat dissipation device comprises a base plate 1, a heat conduction silica gel 2, a line layer 3, an epoxy resin layer 4, an electronic component 5, a corner sleeve 6, a mounting groove 7, a graphene layer 8, heat dissipation holes 9, threaded holes 10, fixing bolts 11, a pressing disc 12, a first heat dissipation groove 13, a heat dissipation rod 14, an insulating connecting column 15, an inserting block 16, an inserting groove 17 and a second heat dissipation groove 18.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-2, a circuit board with good anti-aging effect includes a substrate 1, a heat conductive silica gel 2 is fixedly mounted on the top of the substrate 1, a circuit layer 3 is fixedly mounted on the top of the heat conductive silica gel 2, an epoxy resin layer 4 is fixedly mounted on the top of the circuit layer 3, an electronic component 5 is fixedly mounted on the top of the epoxy resin layer 4, corner sleeves 6 are movably mounted on the outer side of the substrate 1, the length and the width of the substrate 1, the heat conductive silica gel 2 and the circuit layer 3 are equal, the corner sleeves 6 are in an L-shaped three-dimensional structure, mounting grooves 7 are formed in the corner sleeves 6, the height of the mounting grooves 7 is greater than the distance between the bottom surface of the substrate 1 and the top surface of the epoxy resin layer 4, the number of the corner sleeves 6 is four, the corner sleeves 6 are rubber sleeves, the rubber has good elasticity, and are sleeved on four, the interior of the mounting groove 7 is fixedly provided with a graphene layer 8, the outer side of the corner sleeve 6 is provided with heat dissipation holes 9, the number of the heat dissipation holes 9 is sixteen, the outer side of each corner sleeve 6 is provided with four heat dissipation holes 9, the heat dissipation holes 9 are tightly attached to the graphene layer 8, the top of the corner sleeve 6 is provided with a threaded hole 10, the interior of the threaded hole 10 is in threaded connection with a fixing bolt 11, the bottom of the fixing bolt 11 is fixedly provided with a pressing disc 12, a circuit board body is formed by the substrate 1, the heat-conducting silica gel 2 and the circuit layer 3, and then the circuit board body is welded on the circuit layer 3 through the electronic element 5 to form a whole body, the corner sleeve 6 is sleeved on four corners of the whole circuit board to protect the corners of the circuit board, the circuit board cannot be abraded due to collision, and the circuit board is pressed in the, the auxiliary heat dissipation is carried out through the graphene layer 8 in the mounting groove 7, then a heat dissipation space is provided for the graphene layer 8 through the heat dissipation holes 9, so that the heat dissipation effect of the circuit board is better, the aging of the circuit board caused by the rise of temperature due to poor heat dissipation effect is prevented, and the purpose of good anti-aging effect is achieved, the bottom of the substrate 1 is provided with first heat dissipation grooves 13, heat dissipation rods 14 are fixedly arranged in the first heat dissipation grooves 13, four heat dissipation rods 14 are fixedly arranged in each first heat dissipation groove 13, the tops of the heat dissipation rods 14 penetrate through the substrate 1 and the heat conducting silica gel 2 and extend to the interior of the heat conducting silica gel 2, the interior of the substrate 1 is fixedly provided with an insulating connecting column 15, the top of the heat conducting silica gel 2 is fixedly provided with an inserting block 16, the bottom of the circuit layer 3 is provided with an inserting groove 17, the bottom of the second heat dissipation groove 18 penetrates the top of the substrate 1 and extends to the bottom of the substrate 1, the plug-in block 16 is matched with the plug-in groove 17 in size, heat generated by the electronic element 5 on the circuit layer 3 is absorbed through the heat-conducting silica gel 2, heat on the heat-conducting silica gel 2 is transferred through the heat dissipation rod 14, then a heat dissipation space is provided for the heat dissipation rod 14 through the first heat dissipation groove 13, the heat dissipation rate is accelerated, the heat-conducting silica gel 2 is tightly attached to the circuit layer 3 through the plug-in block 16 and the plug-in groove 17, the heat conduction effect of the heat-conducting silica gel 2 is better, the substrate 1, the heat-conducting silica gel 2 and the circuit layer 3 are further connected together to form a whole through the arrangement of the insulation connecting column 15, an air heat dissipation space is directly provided for the circuit layer 3 and the heat-conducting silica gel 2 through the arrangement of the second heat dissipation groove 18, the internal air is circulated, the dual heat dissipation is carried out, the aging caused by overhigh temperature is prevented, and the purpose of good anti-aging effect is achieved.
When using, to put by base plate 1, heat conduction silica gel 2, the circuit board that circuit layer 3 and electronic component 5 are constituteed is in mounting groove 7 on four corner cover 6, and tighten up fixing bolt 11, compress tightly the circuit board through compressing tightly dish 12, prevent that the circuit board corner from taking place wearing and tearing and leading to the circuit board ageing, and graphite alkene layer 8 cooperation louvre 9 dispels the heat, heat conduction silica gel 2 conducts the heat dissipation through heat dissipation rod 14 after absorbing the heat that produces on circuit layer 3, and ventilate the heat dissipation through second radiating groove 18, make the temperature of circuit board reduce fast, prevent ageing.
To sum up, this effectual circuit board of anti-aging, through base plate 1, a circuit board body is constituteed to heat conduction silica gel 2 and circuit layer 3, then weld on circuit layer 3 through electronic component 5, form wholly, through the setting of corner cover 6, the cover is at the holistic four corners of circuit board, make the circuit board corner receive the protection, can not lead to the circuit board wearing and tearing owing to bump, and compress tightly the circuit board in mounting groove 7 through the pressure disk 12 of screwing up fixing bolt 11 messenger's bottom, supplementary heat dissipation is carried out through the inside graphite alkene layer 8 of mounting groove 7, then for graphite alkene layer 8 provides the heat dissipation space through louvre 9, make the radiating effect of circuit board better, prevent to lead to the temperature to rise to form the circuit board ageing owing to the radiating effect is poor, the effectual purpose of anti-aging has been reached.
Moreover, the heat generated by the electronic element 5 on the circuit layer 3 is absorbed by the heat-conducting silica gel 2, the heat on the heat-conducting silica gel 2 is transferred by the heat-radiating rod 14, then a heat-radiating space is provided for the heat-radiating rod 14 by the first heat-radiating groove 13, the heat-radiating rate is accelerated, the heat-conducting silica gel 2 is tightly attached to the circuit layer 3 by the arrangement of the insertion block 16 and the insertion groove 17, the heat-conducting silica gel 2 has better heat-conducting effect, the substrate 1, the heat-conducting silica gel 2 and the circuit layer 3 are further connected together into a whole by the arrangement of the insulating connection column 15, an air heat-radiating space is directly provided for the circuit layer 3 and the heat-conducting silica gel 2 by the arrangement of the second heat-radiating groove 18, the internal air is circulated, the double heat radiation is carried out by matching with the heat conduction of the heat-radiating rod 14, the aging caused by overhigh temperature is prevented, The circuit board is aged due to illumination, water or physical abrasion, however, the important reason for the aging of the common circuit board is that the circuit board is aged due to overhigh temperature caused by poor heat dissipation performance, or the circuit board is not well protected, and particularly, the corners of the circuit board are easy to collide to generate abrasion, so that the circuit board is aged.
It is to be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a circuit board that ageing-resistant is effectual, includes base plate (1), its characterized in that: the heat-conducting silicon rubber (2) is fixedly mounted at the top of the substrate (1), the circuit layer (3) is fixedly mounted at the top of the heat-conducting silicon rubber (2), the epoxy resin layer (4) is fixedly mounted at the top of the circuit layer (3), the electronic element (5) is fixedly mounted at the top of the epoxy resin layer (4), the corner sleeve (6) is movably mounted at the outer side of the substrate (1), the mounting groove (7) is formed in the corner sleeve (6), the graphene layer (8) is fixedly mounted in the mounting groove (7), the heat dissipation hole (9) is formed in the outer side of the corner sleeve (6), the threaded hole (10) is formed in the top of the corner sleeve (6), the fixing bolt (11) is connected with the internal thread of the threaded hole (10), the pressing disc (12) is fixedly mounted at the bottom of the fixing bolt (11), and the first heat dissipation groove (13) is formed, the heat dissipation structure is characterized in that a heat dissipation rod (14) is fixedly mounted inside the first heat dissipation groove (13), an insulation connection column (15) is fixedly mounted inside the substrate (1), an insertion block (16) is fixedly mounted at the top of the heat conduction silica gel (2), an insertion groove (17) is formed in the bottom of the circuit layer (3), and a second heat dissipation groove (18) is formed in the bottom of the heat conduction silica gel (2).
2. The circuit board with good anti-aging effect according to claim 1, characterized in that: the length and the width of the base plate (1), the heat-conducting silica gel (2) and the circuit layer (3) are equal, and the corner sleeve (6) is of an L-shaped three-dimensional structure.
3. The circuit board with good anti-aging effect according to claim 1, characterized in that: the height of mounting groove (7) is greater than the distance between base plate (1) bottom surface and epoxy layer (4) top surface, the quantity of corner cover (6) is four, and corner cover (6) are the rubber sleeve.
4. The circuit board with good anti-aging effect according to claim 1, characterized in that: the number of the heat dissipation holes (9) is sixteen, the number of the heat dissipation holes (9) is four, and the heat dissipation holes (9) are tightly attached to the graphene layer (8).
5. The circuit board with good anti-aging effect according to claim 1, characterized in that: every the inside fixed mounting of first radiating groove (13) has heat dissipation stick (14) that quantity is four, the inside of base plate (1) and heat conduction silica gel (2) and extension to heat conduction silica gel (2) is run through at the top of heat dissipation stick (14).
6. The circuit board with good anti-aging effect according to claim 1, characterized in that: the bottom of the second heat dissipation groove (18) penetrates through the top of the substrate (1) and extends to the bottom of the substrate (1), and the insertion block (16) is matched with the insertion groove (17) in size.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921918427.4U CN210781515U (en) | 2019-11-08 | 2019-11-08 | Circuit board with good anti-aging effect |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921918427.4U CN210781515U (en) | 2019-11-08 | 2019-11-08 | Circuit board with good anti-aging effect |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210781515U true CN210781515U (en) | 2020-06-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921918427.4U Expired - Fee Related CN210781515U (en) | 2019-11-08 | 2019-11-08 | Circuit board with good anti-aging effect |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210781515U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112197183A (en) * | 2020-10-12 | 2021-01-08 | 衢州市川特电子科技有限公司 | High heat dissipation LED lamp based on circuit board |
-
2019
- 2019-11-08 CN CN201921918427.4U patent/CN210781515U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112197183A (en) * | 2020-10-12 | 2021-01-08 | 衢州市川特电子科技有限公司 | High heat dissipation LED lamp based on circuit board |
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200616 Termination date: 20211108 |
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| CF01 | Termination of patent right due to non-payment of annual fee |