CN208509371U - Great power LED circuit board - Google Patents

Great power LED circuit board Download PDF

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Publication number
CN208509371U
CN208509371U CN201821310861.XU CN201821310861U CN208509371U CN 208509371 U CN208509371 U CN 208509371U CN 201821310861 U CN201821310861 U CN 201821310861U CN 208509371 U CN208509371 U CN 208509371U
Authority
CN
China
Prior art keywords
layer
circuit board
bottom end
plate
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201821310861.XU
Other languages
Chinese (zh)
Inventor
沈斌
姚世荣
程林海
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KUNSHAN JINPENG ELECTRON Co Ltd
Original Assignee
KUNSHAN JINPENG ELECTRON Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KUNSHAN JINPENG ELECTRON Co Ltd filed Critical KUNSHAN JINPENG ELECTRON Co Ltd
Priority to CN201821310861.XU priority Critical patent/CN208509371U/en
Application granted granted Critical
Publication of CN208509371U publication Critical patent/CN208509371U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a kind of great power LED circuit boards, it includes outer circuit plate, stiffening plate, stiffener, epoxy resin layer, chip layer, inner layer circuit board, heat conduction silicone, heat-dissipating aluminium plate, radiating groove, one end of outer circuit plate is connected with stiffening plate, stiffening plate is located at outer circuit board bottom end, stiffener is located at stiffening plate bottom end, epoxy resin layer is located at stiffener bottom end, chip layer is located at epoxy resin layer bottom end, inner layer circuit board is located at chip layer bottom end, heat conduction silicone is located at inner layer circuit board bottom end, heat-dissipating aluminium plate is located at heat conduction silicone bottom end, radiating groove is located at heat-dissipating aluminium plate bottom end.The utility model has good heat dissipation performance, effectively prevents the damage of circuit board internal element, improves the service life of circuit board.

Description

Great power LED circuit board
Technical field
The utility model relates to a kind of LED circuit boards, more particularly to a kind of great power LED circuit board.
Background technique
Great power LED circuit board can generate a large amount of heat when in use, and common great power LED circuit board can not Rapid cooling will lead to the damage of circuit board internal element in this way, and circuit board intensity is low, and service life is short.
Summary of the invention
The technical problem to be solved by the utility model is to provide a kind of great power LED circuit boards, with good Heat dissipation performance effectively prevents the damage of circuit board internal element, improves the service life of circuit board.
The utility model is to solve above-mentioned technical problem by following technical proposals: a kind of great power LED circuit Plate, which is characterized in that it include outer circuit plate, stiffening plate, stiffener, epoxy resin layer, chip layer, inner layer circuit board, One end of heat conduction silicone, heat-dissipating aluminium plate, radiating groove, outer circuit plate is connected with stiffening plate, and stiffening plate is located at outer circuit plate Bottom end, stiffener are located at stiffening plate bottom end, and epoxy resin layer is located at stiffener bottom end, and chip layer is located at epoxy resin layer bottom End, inner layer circuit board are located at chip layer bottom end, and heat conduction silicone is located at inner layer circuit board bottom end, and heat-dissipating aluminium plate is located at heat conductive silica gel Layer bottom end, radiating groove are located at heat-dissipating aluminium plate bottom end, in which: outer circuit plate includes copper clad layers, circuit substrate, gluing oxidant layer, is covered One end of layers of copper is connected with circuit substrate, and circuit substrate is located at copper clad layers bottom end, and gluing oxidant layer is located at circuit substrate bottom end;Internal layer Circuit board includes the first copper foil layer, insulating plastic layer, the second copper foil layer, and one end of the first copper foil layer is connected with insulating plastic layer, Insulating plastic layer is located at the first copper foil layer bottom end, and the second copper foil layer is located at insulating plastic layer bottom end.
Preferably, the rear degree of the outer circuit plate and the thickness of inner layer circuit board are equal.
Preferably, the thickness of the gluing oxidant layer is less than the thickness of copper clad layers.
Preferably, the thickness of the circuit substrate is greater than the thickness of copper clad layers.
Preferably, the thickness of the epoxy resin layer is less than the thickness of chip layer.
Preferably, the outer circuit plate is equipped with multiple through-holes.
The positive effect of the utility model is: the utility model has good heat dissipation performance, effectively prevents The damage of circuit board internal element improves the service life of circuit board.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model.
Fig. 2 is the structural schematic diagram of the utility model outer circuit plate.
Fig. 3 is the structural schematic diagram of the utility model inner layer circuit board.
Specific embodiment
The utility model preferred embodiment is provided, with reference to the accompanying drawing the technical solution of the utility model is described in detail.
As shown in Figure 1 to Figure 2, the utility model great power LED circuit board includes outer circuit plate 1, stiffening plate 2, adds Strong reinforcing bar 3, epoxy resin layer 4, chip layer 5, inner layer circuit board 6, heat conduction silicone 7, heat-dissipating aluminium plate 8, radiating groove 9, outer layer electricity One end of road plate 1 is connected with stiffening plate 2, and stiffening plate 2 is located at 1 bottom end of outer circuit plate, and stiffener 3 is located at 2 bottom end of stiffening plate, Epoxy resin layer 4 is located at 3 bottom end of stiffener, and chip layer 5 is located at 4 bottom end of epoxy resin layer, and inner layer circuit board 6 is located at chip layer 5 bottom ends, heat conduction silicone 7 are located at 6 bottom end of inner layer circuit board, and heat-dissipating aluminium plate 8 is located at 7 bottom end of heat conduction silicone, and radiating groove 9 is located at 8 bottom end of heat-dissipating aluminium plate, in which: outer circuit plate includes copper clad layers 10, circuit substrate 11, gluing oxidant layer 12, and the one of copper clad layers 10 End is connected with circuit substrate 11, and circuit substrate 11 is located at 10 bottom end of copper clad layers, and gluing oxidant layer 12 is located at 11 bottom end of circuit substrate;It is interior Layer circuit board includes the first copper foil layer 13, insulating plastic layer 14, the second copper foil layer 15, one end of the first copper foil layer 13 and insulated plastic The bed of material 14 is connected, and insulating plastic layer 14 is located at 13 bottom end of the first copper foil layer, and the second copper foil layer 15 is located at 14 bottom end of insulating plastic layer.
The rear degree of the outer circuit plate and the thickness of inner layer circuit board are equal, can guarantee the whole steady of circuit board in this way It is qualitative.
The thickness of the gluing oxidant layer is less than the thickness of copper clad layers, can reduce the use of material in this way.
The thickness of the circuit substrate is greater than the thickness of copper clad layers, can guarantee the electric conductivity of circuit board in this way.
The thickness of the epoxy resin layer is less than the thickness of chip layer, can play the role of protecting chip layer and section in this way Material saving.
Outer circuit plate is equipped with multiple through-holes so that it is convenient to position and install.
The working principle of the utility model is as follows: the utility model great power LED circuit board by outer circuit plate with it is interior The composition such as layer circuit board, outer circuit plate includes copper clad layers, circuit substrate, gluing oxidant layer, and circuit substrate is made by semiconductor silicon It forms, semiconductor is a kind of material between conductor and insulator, and electric conductivity can be controlled, and is suitable as circuit board Material;Copper clad layers on circuit substrate are made of copper, can play conductive effect;Gluing oxidant layer can play fixed work With;Inner layer circuit board includes the first copper foil layer, insulating plastic layer, the second copper foil layer, and the first copper foil layer and the second copper foil layer are fixed At the both ends of insulating plastic layer, the first copper foil layer and the second copper foil layer are easy to be bonded in insulating plastic layer, can play guarantor in this way The effect of insulating plastic layer is protected, insulating plastic layer can play the role of insulation, the short circuit phenomenon effectivelying prevent inside circuit;Add Strong plate and stiffener are made of steel, and stiffening plate and stiffener can be improved the intensity of whole circuit board, increase circuit board Stability, improve the service life of circuit board;Epoxy resin layer can play the role of protecting chip layer;Chip layer is big function The core of rate LED circuit board, main material are monocrystalline silicon, and LED light can be made to shine;The composition of heat conduction silicone Material is silica gel, plays thermally conductive effect, and it can prevent short circuit occurred inside with insulating properties;Heat-dissipating aluminium plate be by Aluminium composition, with preferable heat dissipation effect;Radiating groove is located on heat-dissipating aluminium plate, strengthens heat dissipation effect;The utility model Each layer is stacked with each other and is fabricated.In conclusion the utility model has good heat dissipation performance, it effectively prevent The damage of circuit board internal element, improves the service life of circuit board.
Particular embodiments described above, the technical issues of to the solution of the utility model, technical scheme and beneficial effects It has been further described, it should be understood that the foregoing is merely specific embodiment of the utility model, not For limiting the utility model, within the spirit and principle of the utility model, any modification for being made, changes equivalent replacement Into etc., it should be included within the scope of protection of this utility model.

Claims (6)

1. a kind of great power LED circuit board, which is characterized in that it includes outer circuit plate, stiffening plate, stiffener, epoxy Resin layer, chip layer, inner layer circuit board, heat conduction silicone, heat-dissipating aluminium plate, radiating groove, one end of outer circuit plate and stiffening plate It is connected, stiffening plate is located at outer circuit board bottom end, and stiffener is located at stiffening plate bottom end, and epoxy resin layer is located at stiffener bottom End, chip layer are located at epoxy resin layer bottom end, and inner layer circuit board is located at chip layer bottom end, and heat conduction silicone is located at inner layer circuit board Bottom end, heat-dissipating aluminium plate are located at heat conduction silicone bottom end, and radiating groove is located at heat-dissipating aluminium plate bottom end, in which: outer circuit plate includes covering Layers of copper, circuit substrate, gluing oxidant layer, one end of copper clad layers are connected with circuit substrate, and circuit substrate is located at copper clad layers bottom end, gluing Oxidant layer is located at circuit substrate bottom end;Inner layer circuit board includes the first copper foil layer, insulating plastic layer, the second copper foil layer, the first copper foil One end of layer is connected with insulating plastic layer, and insulating plastic layer is located at the first copper foil layer bottom end, and the second copper foil layer is located at ambroin Layer bottom end.
2. great power LED circuit board as described in claim 1, which is characterized in that the thickness of the outer circuit plate and interior The thickness of layer circuit board is equal.
3. great power LED circuit board as described in claim 1, which is characterized in that the thickness of the gluing oxidant layer, which is less than, to be covered The thickness of layers of copper.
4. great power LED circuit board as described in claim 1, which is characterized in that the thickness of the circuit substrate, which is greater than, to be covered The thickness of layers of copper.
5. great power LED circuit board as described in claim 1, which is characterized in that the thickness of the epoxy resin layer is less than The thickness of chip layer.
6. great power LED circuit board as described in claim 1, which is characterized in that the outer circuit plate is equipped with multiple Through-hole.
CN201821310861.XU 2018-08-15 2018-08-15 Great power LED circuit board Expired - Fee Related CN208509371U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201821310861.XU CN208509371U (en) 2018-08-15 2018-08-15 Great power LED circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201821310861.XU CN208509371U (en) 2018-08-15 2018-08-15 Great power LED circuit board

Publications (1)

Publication Number Publication Date
CN208509371U true CN208509371U (en) 2019-02-15

Family

ID=65300833

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201821310861.XU Expired - Fee Related CN208509371U (en) 2018-08-15 2018-08-15 Great power LED circuit board

Country Status (1)

Country Link
CN (1) CN208509371U (en)

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GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20190215

Termination date: 20210815

CF01 Termination of patent right due to non-payment of annual fee