CN209882213U - Labyrinth type high-efficiency heat dissipation printed circuit board - Google Patents
Labyrinth type high-efficiency heat dissipation printed circuit board Download PDFInfo
- Publication number
- CN209882213U CN209882213U CN201920294010.9U CN201920294010U CN209882213U CN 209882213 U CN209882213 U CN 209882213U CN 201920294010 U CN201920294010 U CN 201920294010U CN 209882213 U CN209882213 U CN 209882213U
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- heat dissipation
- cavity
- labyrinth
- layer
- holes
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Abstract
The utility model discloses a high-efficient heat dissipation printed circuit board of labyrinth, including circuit body, insulating layer and labyrinth heat dissipation layer, the circuit body is equipped with a plurality of first louvres, the insulating layer is equipped with a plurality of second louvres, labyrinth heat dissipation layer top is equipped with a plurality of third louvres, be equipped with first cavity, second cavity and third cavity in the labyrinth heat dissipation layer respectively, first cavity and each third louvre intercommunication, labyrinth heat dissipation layer bottom is equipped with a plurality of fourth heat dissipation holes that are the matrix arrangement. The utility model discloses a set up first cavity, second cavity and third cavity in labyrinth heat dissipation layer, communicate each other in each cavity, form the labyrinth cavity, the labyrinth cavity communicates with circuit body through the louvre, increase the surface area of labyrinth heat dissipation layer, can give off the heat that produces on the circuit body high-efficiently fast; the heat dissipation structure has the beneficial effects of high-efficiency heat dissipation, stable structure, long service life and the like.
Description
Technical Field
The utility model relates to a printed circuit board field especially relates to a high-efficient heat dissipation printed circuit board of labyrinth.
Background
With the rapid development of electronic technology, the power per unit area or volume of electronic components and devices is increasing day by day, and the problem of heat generation caused by the power is also a focus of research in practical application. Related studies have shown that the major failure of electronic instruments and equipment is damage due to overheating, that excessive temperatures can cause more than 55% failure of the instruments and equipment, and that the failure rate of instruments and equipment increases exponentially with increasing temperature. The printed circuit board is used as a provider for electrical connection of electronic components, and is widely applied to various electronic devices, such as computers, electronic watches, light source devices and the like, components on the printed circuit board are high in power and dense, and the problem of poor heat dissipation generally exists, so that the service performance of an electronic instrument is influenced, the aging rate of the components is increased, and the service life of the electronic instrument is shortened.
Accordingly, the prior art is deficient and needs improvement.
SUMMERY OF THE UTILITY MODEL
The utility model discloses the technical problem that will solve is: the labyrinth type efficient heat dissipation printed circuit board is efficient in heat dissipation, stable in structure and long in service life.
The technical scheme of the utility model as follows: a labyrinth type high-efficiency heat dissipation printed circuit board comprises a circuit body, an insulating layer and a labyrinth type heat dissipation layer, wherein the insulating layer is bonded on the lower surface of the circuit body, the labyrinth type heat dissipation layer is bonded on the lower surface of the insulating layer, the circuit body is provided with a plurality of first heat dissipation holes which are arranged in a matrix mode, the insulating layer is provided with a plurality of second heat dissipation holes which correspond to the first heat dissipation holes, and the top of the labyrinth type heat dissipation layer is provided with a plurality of third heat dissipation holes which correspond to the second heat dissipation holes;
the labyrinth heat dissipation layer is provided with a first cavity, a second cavity and a third cavity, the first cavity is communicated with each third heat dissipation hole, the second cavity is communicated with the first cavity through a plurality of column holes, the third cavity is communicated with the second cavity through a plurality of column holes, a plurality of fourth heat dissipation holes arranged in a matrix are formed in the bottom of the labyrinth heat dissipation layer, and each fourth heat dissipation hole is communicated with the third cavity.
By adopting the technical scheme, in the labyrinth type high-efficiency heat dissipation printed circuit board, a plurality of first heat dissipation holes on the circuit body are arranged in a 3 x 3 matrix.
By adopting the technical scheme, in the labyrinth type high-efficiency heat dissipation printed circuit board, the labyrinth type heat dissipation layer is made of aluminum alloy.
By adopting the technical scheme, in the labyrinth type high-efficiency heat dissipation printed circuit board, the cross sections of the first heat dissipation hole, the second heat dissipation hole and the third heat dissipation hole are in any one of rectangular shape, circular shape and triangular shape.
By adopting the technical scheme, in the labyrinth type high-efficiency heat dissipation printed circuit board, the insulating layer is made of the epoxy resin substrate.
By adopting the technical scheme, in the labyrinth type high-efficiency heat dissipation printed circuit board, a plurality of fourth heat dissipation holes at the bottom of the labyrinth type heat dissipation layer are arranged in a 4 multiplied by 4 matrix.
By adopting the technical scheme, the first cavity, the second cavity and the third cavity are arranged in the labyrinth heat dissipation layer, the cavities are communicated with each other to form the labyrinth cavity, and the labyrinth cavity is communicated with the circuit body through the heat dissipation holes; meanwhile, the bottom of the third cavity is communicated with a fourth heat dissipation hole which is communicated with the external environment, so that the heat dissipation speed of the utility model is further improved; overall structure is simple stable, and heat dispersion is higher, and reducible electronic components's fault rate improves the utility model discloses a life.
Drawings
Fig. 1 is a schematic sectional structure of the present invention;
fig. 2 is a schematic diagram of the upper surface of the circuit body of the present invention;
fig. 3 is a schematic view of the lower surface of the labyrinth heat dissipation layer of the present invention.
Detailed Description
The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.
As shown in fig. 1, a labyrinth type printed circuit board with high heat dissipation efficiency comprises a circuit body 1, an insulating layer 2 and a labyrinth type heat dissipation layer 3, wherein the insulating layer 2 is bonded on the lower surface of the circuit body 1, the labyrinth type heat dissipation layer 3 is bonded on the lower surface of the insulating layer 2, the circuit body 1 is provided with a plurality of first heat dissipation holes 11 arranged in a matrix manner, the insulating layer 2 is provided with a plurality of second heat dissipation holes 21 corresponding to the first heat dissipation holes 11, and the top of the labyrinth type heat dissipation layer 3 is provided with a plurality of third heat dissipation holes 31 corresponding to the second heat dissipation holes 21;
wherein be equipped with first cavity 32, second cavity 33 and third cavity 34 in the labyrinth heat dissipation layer 3, first cavity 32 and each third louvre 31 intercommunication, second cavity 33 is through a plurality of post holes 35 and first cavity 32 intercommunication, third cavity 34 is through a plurality of post holes 35 and second cavity 33 intercommunication, labyrinth heat dissipation layer 3 bottom is equipped with a plurality of fourth heat dissipation holes 36 that are the matrix arrangement, each fourth heat dissipation hole 36 communicates with third cavity 34 respectively.
As shown in fig. 1, an insulating layer 2 is bonded to the lower surface of the circuit body 1. The insulating layer 2 can isolate the electronic components arranged on the circuit body 1, and the electronic components are prevented from being interfered by electromagnetic radiation. Preferably, the insulating layer 2 is made of an epoxy resin substrate. The epoxy resin substrate has good insulating property, excellent sealing property and high structural strength, and the insulating layer 2 is made to be bonded on the lower surface of the circuit body 1, so that the stability of the whole connecting structure can be improved while insulation and interference prevention are realized. Electronic components who connects on the circuit body 1 can produce a large amount of heats at long-time working process, if the heat can't give off, will probably lead to electronic components trouble, leads to the instrument to become invalid. In order to facilitate heat dissipation, the circuit body 1 is provided with a plurality of first heat dissipation holes 11 arranged in a matrix, the insulating layer 2 is provided with a plurality of second heat dissipation holes 21 corresponding to the first heat dissipation holes 11, and the top of the labyrinth heat dissipation layer 3 is provided with a plurality of third heat dissipation holes 31 corresponding to the second heat dissipation holes 21. Through the heat dissipation holes arranged correspondingly, heat generated on the circuit body 1 can be directly transferred into the labyrinth heat dissipation layer 3 for heat dissipation.
As shown in fig. 1 and 2, preferably, the first heat dissipation holes 11 of the circuit body 1 are arranged in a 3 × 3 matrix. The first heat dissipation holes 11 are arranged in a 3 × 3 matrix, so that heat on the circuit body 1 can be equally transferred to the labyrinth heat dissipation layer 3, and the heat transfer rate is higher as the number of the first heat dissipation holes 11 is larger. Of course, the first heat dissipation holes 11 formed in the circuit body 1 may be arranged in other arrangement and quantity, and the present invention is not limited to this.
As shown in fig. 1, a first cavity 32, a second cavity 33 and a third cavity 34 are respectively disposed in the labyrinth heat dissipation layer 3. The first cavity 32 is communicated with the third heat dissipation holes 31, the second cavity 33 is communicated with the first cavity 32 through a plurality of column holes 35, and the third cavity 34 is communicated with the second cavity 33 through a plurality of column holes 35. First cavity 32, second cavity 33 and third cavity 34 communicate each other, form the labyrinth cavity, can improve the inside surface area in labyrinth heat dissipation layer 3 greatly for the heat increases at the area of contact of the circulation heat transfer in labyrinth heat dissipation layer 3, thereby improves the utility model discloses a radiating efficiency. Meanwhile, a plurality of fourth heat dissipation holes 36 arranged in a matrix are formed in the bottom of the labyrinth heat dissipation layer 3, and each fourth heat dissipation hole 36 is respectively communicated with the third cavity 34. Through the heat of heat transfer in labyrinth heat dissipation layer 3, in the fourth heat dissipation hole 36 distributes to the air, improves once more the utility model discloses a radiating rate.
Preferably, the labyrinth heat dissipation layer 3 is made of an aluminum alloy to increase the heat dissipation rate of the labyrinth heat dissipation layer 3. The aluminum alloy has good heat conductivity and corrosion resistance, when promoting 3 radiating efficiency on labyrinth heat dissipation layer, still is difficult to corrode to improve the utility model discloses a life.
As shown in fig. 1 and 3, preferably, in order to rapidly dissipate heat exchanged by the third cavity 34 to the air, a plurality of fourth heat dissipating holes 36 at the bottom of the labyrinth heat dissipating layer 3 are arranged in a 4 × 4 matrix. The fourth heat dissipation holes 36 are arranged in a 4 × 4 matrix, so that the heat in the third cavity 34 can be uniformly and rapidly dissipated to the outside.
As shown in fig. 1 and 2, the cross-sectional shapes of the first louver 11, the second louver 21, and the third louver 31 are preferably any one of rectangular, circular, and triangular. In this embodiment, the cross-sectional shape of the first heat dissipation hole 11, the second heat dissipation hole 21 and the third heat dissipation hole 31 is circular, and the circular heat dissipation holes are easier to process, which can reduce the production cost of the present invention.
By adopting the technical scheme, the first cavity, the second cavity and the third cavity are arranged in the labyrinth heat dissipation layer, the cavities are communicated with each other to form the labyrinth cavity, and the labyrinth cavity is communicated with the circuit body through the heat dissipation holes; meanwhile, the bottom of the third cavity is communicated with a fourth heat dissipation hole which is communicated with the external environment, so that the heat dissipation speed of the utility model is further improved; overall structure is simple stable, and heat dispersion is higher, and reducible electronic components's fault rate improves the utility model discloses a life.
The above description is only exemplary of the present invention and should not be construed as limiting the present invention, and any modifications, equivalents and improvements made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (6)
1. The utility model provides a high-efficient heat dissipation printed circuit board of labyrinth which characterized in that: the circuit comprises a circuit body, an insulating layer and a labyrinth heat dissipation layer, wherein the insulating layer is bonded on the lower surface of the circuit body, the labyrinth heat dissipation layer is bonded on the lower surface of the insulating layer, the circuit body is provided with a plurality of first heat dissipation holes which are arranged in a matrix manner, the insulating layer is provided with a plurality of second heat dissipation holes which correspond to the first heat dissipation holes, and the top of the labyrinth heat dissipation layer is provided with a plurality of third heat dissipation holes which correspond to the second heat dissipation holes;
the labyrinth heat dissipation layer is provided with a first cavity, a second cavity and a third cavity, the first cavity is communicated with each third heat dissipation hole, the second cavity is communicated with the first cavity through a plurality of column holes, the third cavity is communicated with the second cavity through a plurality of column holes, a plurality of fourth heat dissipation holes arranged in a matrix are formed in the bottom of the labyrinth heat dissipation layer, and each fourth heat dissipation hole is communicated with the third cavity.
2. The printed circuit board with labyrinth high efficiency heat dissipation according to claim 1, wherein: the plurality of first heat dissipation holes on the circuit body are arranged in a 3 x 3 matrix.
3. The printed circuit board with labyrinth high efficiency heat dissipation according to claim 1, wherein: the labyrinth heat dissipation layer is made of aluminum alloy.
4. The printed circuit board with labyrinth high efficiency heat dissipation according to claim 1, wherein: the cross section shapes of the first heat dissipation hole, the second heat dissipation hole and the third heat dissipation hole are any one of rectangle, circle and triangle.
5. The printed circuit board with labyrinth high efficiency heat dissipation according to claim 1, wherein: the insulating layer is made of an epoxy resin substrate.
6. The printed circuit board with labyrinth high efficiency heat dissipation according to claim 1, wherein: and a plurality of fourth heat dissipation holes at the bottom of the labyrinth heat dissipation layer are arranged in a 4 multiplied by 4 matrix.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920294010.9U CN209882213U (en) | 2019-03-07 | 2019-03-07 | Labyrinth type high-efficiency heat dissipation printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920294010.9U CN209882213U (en) | 2019-03-07 | 2019-03-07 | Labyrinth type high-efficiency heat dissipation printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209882213U true CN209882213U (en) | 2019-12-31 |
Family
ID=68954351
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920294010.9U Active CN209882213U (en) | 2019-03-07 | 2019-03-07 | Labyrinth type high-efficiency heat dissipation printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209882213U (en) |
-
2019
- 2019-03-07 CN CN201920294010.9U patent/CN209882213U/en active Active
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