CN215451106U - Magnetic device structure with encapsulated heat dissipation - Google Patents
Magnetic device structure with encapsulated heat dissipation Download PDFInfo
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- CN215451106U CN215451106U CN202121270530.XU CN202121270530U CN215451106U CN 215451106 U CN215451106 U CN 215451106U CN 202121270530 U CN202121270530 U CN 202121270530U CN 215451106 U CN215451106 U CN 215451106U
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Abstract
The utility model provides a magnetic device structure for encapsulation and heat dissipation, wherein a cover plate is a water-cooling plate or an air-cooling radiator, heat dissipation silicone grease is filled between the cover plate and a conducting sheet, when the magnetic device generates heat, the heat generated by the magnetic device is conducted to a heat conducting assembly through a fixing plate, is conducted to the conducting sheet through the heat conducting assembly, and is released to the outside through the conducting sheet, the heat conducting assembly shields the conducting sheet, so that the contact area between heat conducting glue and the conducting sheet is smaller, the heat conduction on the conducting sheet is reduced, the heat conduction into the heat conducting glue is reduced, as the conducting sheet is abutted against the cover plate, most of the heat conducted to the conducting sheet can be released to the outside through the cover plate, and the heat of the magnetic device is conveniently released to the outside of the cover plate, the magnetic device adopting the structure for heat dissipation by encapsulation has lower structure cost and better heat dissipation performance.
Description
Technical Field
The utility model relates to the field of magnetic devices, in particular to a magnetic device structure for encapsulation and heat dissipation.
Background
In the ground aviation, a power supply requires high-voltage input, high power, a soft switch and high reliability, for the high-power supply, a magnetic device in the high-power supply can generate a large amount of heat in working, in order to better conduct heat, a method of filling heat-dissipating silica gel is traditionally adopted, however, in the traditional process of filling heat-dissipating silica gel, a coil and a magnetic core of the magnetic device need to be subjected to safety regulation insulation treatment, one is to be wound by high-temperature adhesive tape or to be added with silica gel for insulation treatment, so that the installation process is very complicated and not attractive, the other is to weld the magnetic device by adopting a single-layer or multi-layer aluminum substrate, but the aluminum substrate is relatively expensive compared with a PCB (printed circuit board), particularly the multi-layer aluminum substrate is relatively long in processing and manufacturing time compared with the PCB.
And weld the magnetic device on PCB panel on the existing market, make the magnetic element back-off on the radiator, and make the magnetic element carry out the encapsulating after contacting the radiator drain pan, in this kind of back-off method, the heat on the magnetic device can be conducted on the copper sheet on the PCB panel in a large number through the welding foot, lead to the copper foil temperature on the PCB panel to be on the high side, this PCB panel can be with heat conduction in the cavity, if this PCB panel is also in the encapsulating glue, because the copper sheet temperature on the PCB panel is too high, can make copper sheet and colloid contact department bubble, make lose adhesion and heat conductivity between heat dissipation glue and the magnetic element.
SUMMERY OF THE UTILITY MODEL
In order to solve the above problems, the present invention provides a magnetic device structure with encapsulation and heat dissipation.
The utility model is realized by the following technical scheme:
the utility model provides a magnetic device structure for encapsulation and heat dissipation, which comprises: the heat conduction glue is used for wrapping the magnetic device, the heat conduction assembly, the conduction piece and the fixed plate, and the cover plate is attached to the heat conduction glue.
Further, the heat conduction subassembly is two, every the heat conduction subassembly includes a PCB heat-conducting plate, two spliced poles, the both ends of spliced pole respectively with the PCB heat-conducting plate fixed connection of fixed plate.
Further, the conduction piece is two, two the conduction piece with two PCB heat-conducting plate one-to-one, the both sides of conduction piece respectively with PCB heat-conducting plate, apron butt.
Further, the conducting piece, the fixed plate, the spliced pole the PCB heat-conducting plate with form the mounting groove between the apron, magnetic device fixed mounting is in the mounting groove.
Further, the magnetic device abuts against the cover plate.
Furthermore, the single PCB heat-conducting plate is at least two layers of PCB plates overlapped together.
The utility model has the beneficial effects that:
the utility model provides a magnetic device structure for encapsulation and heat dissipation, wherein a cover plate is a water-cooling plate or an air-cooling radiator, heat dissipation silicone grease is filled between the cover plate and a conducting sheet, when the magnetic device generates heat, the heat generated by the magnetic device is conducted to a heat conducting assembly through a fixing plate, is conducted to the conducting sheet through the heat conducting assembly, and is released to the outside through the conducting sheet, the heat conducting assembly shields the conducting sheet, so that the contact area between heat conducting glue and the conducting sheet is smaller, the heat conduction on the conducting sheet is reduced, the heat conduction into the heat conducting glue is reduced, as the conducting sheet is abutted against the cover plate, most of the heat conducted to the conducting sheet can be released to the outside through the cover plate, and the heat of the magnetic device is conveniently released to the outside of the cover plate, the magnetic device adopting the structure for heat dissipation by encapsulation has lower structure cost and better heat dissipation performance.
Drawings
FIG. 1 is an exploded view of the encapsulated heat dissipating magnetic device structure of the present invention;
FIG. 2 is a partial perspective view of the potted heat dissipating magnetic device structure of the present invention;
FIG. 3 is an enlarged view of the point A in FIG. 2;
fig. 4 is a cross-sectional view of a potted heat dissipating magnetic device structure of the present invention.
Detailed Description
In order to more clearly and completely explain the technical scheme of the utility model, the utility model is further explained with reference to the attached drawings.
Referring to fig. 1 to 4, the present invention provides a magnetic device structure for heat dissipation by encapsulation, including: the heat conduction assembly comprises a magnetic device 10, a cover plate 11, a heat conduction assembly 12, a copper conduction piece 13, a fixing plate 14 and heat conduction glue 15, wherein the fixing plate 14 is fixedly connected with the heat conduction assembly 12, the heat conduction assembly 12 is abutted to the conduction piece 13, the heat conduction assembly 12 shields the conduction piece 13, the conduction piece 13 is abutted to the cover plate 11, the heat conduction glue 15 wraps the magnetic device 10, the heat conduction assembly 12, the conduction piece 13 and the fixing plate 14, and the cover plate 11 is attached to the heat conduction glue 15.
In this embodiment, the heat conducting glue 15 can partially absorb the heat generated by the magnetic device 10, the cover plate 11 is a water-cooled plate or an air-cooled radiator, heat dissipating silicone grease is filled between the cover plate 11 and the conducting sheet 13, when the magnetic device 10 generates heat, the heat generated by the magnetic device 10 is conducted to the heat conducting component 12 through the fixing plate 14, conducted to the conducting sheet 13 through the heat conducting component 12, conducted to the cover plate 11 through the conducting sheet 13 and released to the outside, because the heat conducting component 12 shields the conducting sheet 13, the contact area between the heat conducting glue 15 and the conducting sheet 13 is smaller, the heat conducted on the conducting sheet 13 to the heat conducting glue 15 is reduced, because the conducting sheet 13 abuts against the cover plate 11, most of the heat conducted to the conducting sheet 13 can be released to the outside through the cover plate 11, make things convenient for the heat release extremely apron 11 is outside for adopt this structure the cost of embedment radiating magnetic device structure is lower, and the radiating effect is better.
Further, the number of the heat conducting components 12 is two, each of the heat conducting components 12 includes a PCB heat conducting plate 121 and two connecting columns 122, and two ends of each connecting column 122 are respectively fixedly connected to the PCB heat conducting plate 121 and the fixing plate 14.
Further, the number of the conducting pieces 13 is two, the conducting pieces 13 correspond to the two PCB heat-conducting plates 121 one by one, and two sides of the conducting pieces 13 are respectively abutted to the PCB heat-conducting plates 121 and the cover plate 11.
In this embodiment, the PCB heat conducting plate 121 and the connecting column 122 are used for conducting heat, two sides of the conducting sheet 13 are respectively abutted against the PCB heat conducting plate 121 and the cover plate 11, the PCB heat conducting plate 121 shields the conducting sheet 13, and the heat on the PCB heat conducting plate 121 is prevented from being completely conducted into the heat conducting glue 15.
Further, a mounting groove 16 is formed among the conductive sheet 13, the fixing plate 14, the connecting column 122, the PCB heat conducting plate 121 and the cover plate 11, and the magnetic device 10 is fixedly mounted in the mounting groove 16.
Further, the magnetic device 10 abuts against the cover plate 11.
In the present embodiment, since the magnetic device 10 abuts against the cover plate 11, a part of heat generated by the magnetic device 10 can be directly released to the outside through the cover plate 11; the mounting groove 16 facilitates the mounting of the magnetic device 10, and the magnetic core 100 of the magnetic device 10 is mounted in the mounting groove 16.
Further, the single PCB heat conductive plate 121 is formed by at least two layers of PCB plates overlapped together.
In this embodiment, the single PCB heat conductive plate 121 is at least two layers of PCB plates overlapped together, so that the heat conductive effect of the PCB heat conductive plate 121 is better.
In the present embodiment, the conductive sheet 13 can be provided in a mesh structure, so that the effect of conducting heat is more excellent.
Of course, the present invention may have other embodiments, and based on the embodiments, those skilled in the art can obtain other embodiments without any creative effort, and all of them are within the protection scope of the present invention.
Claims (6)
1. The utility model provides an embedment radiating magnetic device structure which characterized in that, embedment radiating magnetic device structure includes: the heat conduction glue is used for wrapping the magnetic device, the heat conduction assembly, the conduction piece and the fixed plate, and the cover plate is attached to the heat conduction glue.
2. The structure of the magnetic device with heat-sinking and sealing functions as claimed in claim 1, wherein the number of the heat-conducting components is two, each heat-conducting component comprises a PCB heat-conducting plate and two connecting columns, and two ends of each connecting column are fixedly connected with the PCB heat-conducting plate and the fixing plate respectively.
3. The structure of magnetic device with heat dissipation encapsulated as claimed in claim 2, wherein there are two conducting pieces, two conducting pieces are corresponding to two PCB heat-conducting plates one by one, and two sides of the conducting pieces are respectively abutted to the PCB heat-conducting plates and the cover plate.
4. The encapsulated radiating magnetic device structure as claimed in claim 3, wherein a mounting groove is formed among the conductive sheet, the fixing plate, the connecting column, the PCB heat-conducting plate and the cover plate, and the magnetic device is fixedly mounted in the mounting groove.
5. The potted heat dissipating magnetic device structure of claim 4, wherein the magnetic device abuts the cover plate.
6. The potted heat dissipating magnetic device structure of claim 2, wherein the single PCB thermal conductive plate is at least two layers of PCB board material stacked together.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121270530.XU CN215451106U (en) | 2021-06-07 | 2021-06-07 | Magnetic device structure with encapsulated heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121270530.XU CN215451106U (en) | 2021-06-07 | 2021-06-07 | Magnetic device structure with encapsulated heat dissipation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215451106U true CN215451106U (en) | 2022-01-07 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121270530.XU Active CN215451106U (en) | 2021-06-07 | 2021-06-07 | Magnetic device structure with encapsulated heat dissipation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215451106U (en) |
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2021
- 2021-06-07 CN CN202121270530.XU patent/CN215451106U/en active Active
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