CN215682725U - Vehicle-mounted power supply device - Google Patents
Vehicle-mounted power supply device Download PDFInfo
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- CN215682725U CN215682725U CN202121114597.4U CN202121114597U CN215682725U CN 215682725 U CN215682725 U CN 215682725U CN 202121114597 U CN202121114597 U CN 202121114597U CN 215682725 U CN215682725 U CN 215682725U
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- supply apparatus
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Abstract
The utility model discloses a vehicle-mounted power supply device. The vehicle-mounted power supply device comprises a circuit board, wherein the circuit board is provided with a device surface, and a plurality of device welding pads are arranged on the device surface and used for installing devices in the vehicle-mounted power supply circuit. A plurality of through holes are formed in each device bonding pad, and heat conducting media are filled in the through holes. The utility model improves the heat dissipation performance of the vehicle-mounted power supply during operation.
Description
Technical Field
The utility model relates to the technical field of circuit board heat dissipation, in particular to a vehicle-mounted power supply device.
Background
At present, a vehicle-mounted high-power DCDC voltage reduction power supply on the market can generate certain heat during working, so that the internal temperature of the power supply can rise rapidly, if the heat is not dissipated out in time, the power supply can continuously rise in temperature, and devices can lose efficacy due to overheating. In order to solve the problems of heat dissipation and efficiency, a hardware engineer selects an aluminum-based PCB, a ceramic PCB and a gold-sinking PCB to carry a DCDC step-down power supply circuit and fixes the circuit on the surface of a heat sink to reduce the temperature inside the power supply.
SUMMERY OF THE UTILITY MODEL
The utility model mainly aims to provide a vehicle-mounted power supply device, and aims to improve the working heat dissipation of a vehicle-mounted power supply.
The utility model provides a vehicle-mounted power supply device, which comprises:
the circuit board is provided with a device surface, and a plurality of device welding pads are arranged on the device surface and used for installing devices in the vehicle-mounted power supply circuit; wherein the content of the first and second substances,
each device bonding pad is provided with a plurality of through holes, and the through holes are filled with heat-conducting media.
Optionally, the circuit board is a tin-spraying copper-clad PCB, and a grounding copper is arranged on the tin-spraying copper-clad PCB.
Optionally, the heat conducting medium is a heat conducting resin.
Optionally, the circuit board further has a heat dissipation surface disposed opposite to the device surface, and the vehicle-mounted power supply apparatus further includes:
a housing, the circuit board disposed within the housing;
the heat conducting pad is arranged in the shell, and heat conducting silicone grease is coated between the heat conducting pad and the heat radiating surface of the circuit board and is connected with the heat radiating surface in a clinging mode.
Optionally, the vehicle-mounted power supply device further includes:
the metal heat dissipation plate is arranged in the shell;
the metal heat dissipation plate is connected with one side of the heat conduction pad back to the circuit board in a clinging manner;
and heat-conducting silicone grease is coated between the metal heat dissipation plate and the heat-conducting pad.
Optionally, the vehicle-mounted power supply device further includes:
the shell is internally provided with a threaded hole, the circuit board, the heat conducting pad and the metal heat radiating plate are all provided with through holes at the corresponding positions of the threaded hole, and fixing screws penetrate through the threaded hole of the shell and the through holes of the circuit board, the heat conducting pad and the metal heat radiating plate so as to connect and fix the circuit board, the heat conducting pad and the metal heat radiating plate with the shell.
Optionally, the number of the fixing screws is multiple, and the number of the through holes and the number of the threaded holes correspond to the number of the fixing screws.
Optionally, the periphery of the through hole on the circuit board is provided with a grounding copper clad.
Optionally, a circuit board window is disposed on the heat dissipation surface of the circuit board corresponding to the plurality of device pads.
Optionally, a plurality of heat dissipation pads are further disposed on the device surface of the circuit board, and the plurality of heat dissipation pads are disposed on one side of the plurality of device pads.
According to the utility model, the through hole array is arranged on the device bonding pad of the circuit board, so that when the device works, the generated heat can be quickly conducted to air or other heat dissipation devices through the metal through hole. Meanwhile, the heat conducting medium is filled in the metal via hole, so that the heat conduction speed to the air is accelerated, the heat dissipation performance of the circuit board is improved, the device is guaranteed not to lose efficacy due to overheating during working, the working stability and the service life of the device are improved, and the overall working stability, reliability and heat dissipation performance of the vehicle-mounted power supply equipment are improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a vehicle power supply apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of an embodiment of a vehicle power supply apparatus according to the present invention;
FIG. 3 is a schematic structural diagram of an embodiment of a vehicle power supply apparatus according to the present invention;
FIG. 4 is a schematic structural diagram of an embodiment of a vehicle power supply apparatus according to the present invention;
FIG. 5 is a schematic structural diagram of an embodiment of a vehicle power supply apparatus according to the present invention;
fig. 6 is a schematic structural diagram of an embodiment of the vehicle-mounted power supply device according to the utility model.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 10 | |
11 | Device side of |
| 12 | Heat radiation surface of |
20 | |
| 30 | Via |
40 | |
| 50 | |
60 | Metal |
| 70 | |
80 | Heat dissipation bonding pad |
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The utility model provides a vehicle-mounted power supply device, which improves the working heat dissipation of the vehicle-mounted power supply.
Referring to fig. 1, in an embodiment, an in-vehicle power supply apparatus provided by the present invention includes a circuit board 10.
The circuit board 10 has a device surface 11, and a plurality of device pads 20 are disposed on the device surface 11 for mounting devices in the vehicle-mounted power supply circuit.
Wherein, each device pad 20 is provided with a plurality of via holes 30, and the plurality of via holes 30 are filled with a heat-conducting medium.
In particular, in the vehicle-mounted power supply circuit, when in operation, a part of devices such as an inductor, a capacitor, a field effect transistor, a planar transformer and the like generate a large amount of heat, the large amount of heat is accumulated around the devices to raise the temperature of the devices, and once the temperature of the devices is overheated, the failure of the devices can occur to cause the low working efficiency of the power supply and even the burning of the devices.
In the present embodiment, copper may be selected as the material of the via 30, and a plurality of vias 30 may be disposed only on the device pad 20 of the device with a large heat generation amount, thereby reducing the production cost of the circuit board 10. A plurality of vias 30 may be arranged in a row at a certain pitch on the device pad 20 to form an array of vias 30, so as to improve the heat dissipation efficiency of the vias 30.
In this embodiment, the sizes of the vias 30 on the device pads 20 of different devices may be different, and the diameter of the via 30 of a device with a larger heat generation amount may be larger than the diameter of the via 30 of a device with a smaller heat generation amount, for example, the via 30 on the device pad 20 of a field effect transistor may be designed to be 0.4mm/0.6mm, and the via 30 on the device pad 20 of a capacitor may be designed to be 0.35mm/0.5mm, so that the device with a larger heat generation amount can dissipate heat more quickly, and at the same time, the current load capacity can be improved, the impedance can be reduced, and the working efficiency of the device can be improved.
In this embodiment, the heat conducting medium may be silicone grease, resin, or other material, the plurality of via holes 30 may be plugged with resin, and a process of covering copper and oil on the surface is adopted, because the heat conducting medium, such as resin, has a good heat conducting property, when the device is in operation, the via holes 30 and the resin filled in the via holes 30 can conduct heat generated by the operation of the device to the air more quickly, thereby reducing the accumulation of heat around the device, and reducing the operating temperature of the device, thereby improving the stability and safety of the operation of the device, and further improving the stability of the operation of the vehicle-mounted power supply. Meanwhile, as the heat dissipation performance of the circuit board 10 is improved by arranging the via holes 30 and the heat-conducting resin on the circuit board 10, the circuit board 10 can adopt a cheaper FR-4 glass fiber board, so as to save the cost, and a radiator with a more complicated structure is not required to be additionally arranged, so that the whole volume of the equipment is reduced.
In addition, because the via holes 30 are filled with resin, when the circuit board 10 is subjected to the chip mounting operation, the solder paste on the steel mesh cannot leak along the through holes on the device bonding pads 20 and is condensed on the other side of the circuit board 10, so that the condition of false soldering of devices during chip mounting is reduced, and the yield of production is improved.
The present invention provides an array of vias 30 on the device pads 20 of the circuit board 10, so that during operation of the device, heat generated by the device can be quickly conducted to the air or other heat dissipating device through the metal vias 30. Meanwhile, the metal via holes 30 are filled with heat-conducting media, so that the heat conduction speed to the air is accelerated, the heat dissipation performance of the circuit board 10 is improved, the device is guaranteed not to lose efficacy due to overheating during operation, the working stability and the service life of the device are improved, and the stability, the reliability and the heat dissipation performance of the whole work of the vehicle-mounted power supply equipment are improved.
Referring to fig. 2, in an embodiment, the circuit board 10 is a tin-sprayed copper-clad PCB, and a grounding copper clad is disposed on the tin-sprayed copper-clad PCB.
In this embodiment, the circuit board 10 is a tin-spraying copper-clad PCB, the tin-spraying copper-clad PCB realizes electrical connection between devices through a copper foil, and the copper foil is covered with oil at the position of the copper foil routing to protect the copper foil, the thickness of the copper foil can be selected according to actual design requirements, the thicker the copper foil is, the larger the overcurrent capacity is, the better the heat dissipation performance is, for example, the copper foil with the thickness of 3 ounces is selected. Meanwhile, a welding-assistant layer is arranged on the copper foil to be connected with the device, and the welding-assistant layer is made of tin.
It should be noted that, in the design of the circuit board 10, after the circuit is laid, a certain board space is left, and the ground wire can be covered with copper on the whole circuit board 10, so as to reduce the ground wire impedance. Meanwhile, since the grounding copper clad is arranged at the blank position of the circuit board 10, the area of the copper foil can be increased, and the heat dissipation performance of the circuit board 10 is improved.
It is particularly noted that, in the present embodiment, since the grounding copper covers the circuit board 10, in the design of the circuit board 10, it is ensured that the grounding pads of the devices are placed neatly as much as possible, and a grounding copper cover can cover the ground signals of all the devices as much as possible, so as to improve the current load capacity, reduce the overall voltage drop of the circuit, improve the heat dissipation performance, and improve the conversion efficiency of the power supply.
Through the arrangement, the area of the copper foil on the circuit board 10 can be increased, and when the vehicle-mounted power supply works, heat generated by a high-power device in the vehicle-mounted power supply circuit can be quickly conducted away through a tin-spraying copper-clad PCB, so that the heat dissipation performance of the circuit board 10 is improved, the stability and the safety of the device in the vehicle-mounted power supply circuit in the working process are ensured, and the working stability of vehicle-mounted power supply equipment is further improved.
In another embodiment, since the circuit in the vehicle-mounted power supply has a high-frequency switching power supply device, such as a DC-DC chip, the grounding copper cladding may specifically be a grid copper cladding, so as to reduce interference to the high-frequency switching power supply device, and effectively improve the power conversion efficiency of the vehicle-mounted power supply.
In another embodiment, since the circuit board 10 may further include positive and negative pads, which require manual welding operation by production line staff during production, when copper is coated on the ground, the connection mode between the negative pads and the ground copper can be designed as a cross connection, which is beneficial to manual welding operation, prevents the occurrence of low manual welding efficiency and insufficient solder due to too fast heat dissipation, and improves production efficiency and yield.
Referring to fig. 3, in an embodiment, the circuit board 10 further has a heat dissipation surface 12 disposed opposite to the device surface 11, and the vehicle-mounted power supply apparatus further includes:
a housing 40, the circuit board 10 being disposed within the housing 40;
the heat conducting pad 50, the heat conducting pad 50 is disposed in the housing 40, and the heat conducting pad 50 and the heat dissipating surface 12 of the circuit board 10 are coated with heat conducting silicone grease and are connected in a close contact manner.
In this embodiment, the housing 40 may be made of a metal material such as copper, iron, or aluminum, for example, an aluminum alloy 6061-T5 with a thickness of 5mm, the circuit board 10 of the vehicle power supply is disposed inside the housing 40, and the circuit board 10 may be disposed in close contact with the housing 40. Meanwhile, the shell 40 made of the aluminum alloy 6061-T5 has the functions of quickly absorbing heat and quickly dissipating heat, and in the work of the vehicle-mounted power supply, heat generated by high-power devices in a power circuit of a vehicle can be quickly conducted to the shell 40 made of the aluminum alloy 6061-T5 from the circuit board 10, and then the shell 40 conducts the heat to the air, so that the devices of the vehicle-mounted power supply circuit in the work can not lose effectiveness due to overheating, the heat dissipation performance of the circuit board 10 and the vehicle-mounted power supply is improved, and the work stability of the vehicle-mounted power supply is further improved.
In this embodiment, the thermal pad 50 can be made of thermal grease, silicon tape, etc., and the thermal pad 50 is sandwiched between the circuit board 10 and the housing 40 or between the circuit board 10 and the metal heat sink 60, so as to perform the functions of damping, insulating, filling, etc. between the circuit board 10 and the housing 40 or between the circuit board 10 and the metal heat sink 60. Meanwhile, in practical application, the heat conductive pads 50 with different thicknesses and different shapes can be selected according to different structures inside the housing 40 to adapt to the assembly between the circuit board 10 and the housing 40 or between the circuit board 10 and the metal heat dissipation plate 60, so as to achieve the best heat dissipation effect. In addition, a heat conductive silicone grease may be coated between the heat conductive pad 50 and the heat dissipation surface 11 of the circuit board 10 to accelerate the heat conduction and improve the heat dissipation effect.
Referring to fig. 3, in an embodiment, the in-vehicle power supply apparatus further includes:
a metal heat sink 60, the metal heat sink 60 is disposed in the housing 40,
The metal heat dissipation plate 60 is closely connected with one side of the heat conduction pad 50 back to the circuit board 10,
The heat conductive silicone grease is coated between the metal heat dissipation plate 60 and the heat conductive pad 50.
In this embodiment, the material of the metal heat sink 60 may be copper, iron, aluminum, or other metal material, for example, 5mm thick aluminum alloy 6061-T5 plate. The metal heat dissipation plate 60 and the heat conduction pad 50 can be adhered and tightly connected by adopting an adhesive, and the metal has good heat conduction performance, so that heat transferred from the heat conduction pad 50 can be quickly conducted to the shell 40, and the metal heat dissipation plate 60 and the heat conduction pad 50 are tightly attached, so that the heat conduction speed is further increased. In addition, a heat conductive silicone grease may be coated between the metal heat dissipation plate 60 and the heat conductive pad 50 to accelerate heat conduction and improve heat dissipation.
Through the arrangement, when the vehicle-mounted power supply works, the heat transfer on the circuit board 10 and the heat conducting pad 50 is accelerated, so that the heat is conducted to the shell 40 of the vehicle-mounted power supply as soon as possible, the heat dissipation performance of the circuit board 10 is improved, and the stability and the reliability of devices in a vehicle-mounted power supply circuit in working are ensured. In addition, adopt metal cooling plate 60 as metal radiator, structural comparatively simple, can better adapt to the inside supporting structure of shell 40, improved the convenience of installation to purchasing cost is lower, has wholly reduced vehicle power supply's manufacturing cost.
Referring to fig. 3 and 4, in an embodiment, the in-vehicle power supply apparatus further includes:
threaded holes are formed in the shell 40, through holes are formed in the positions, corresponding to the threaded holes, of the circuit board 10, the heat conducting pad 50 and the metal heat dissipation plate 60, of the shell 40, the threaded holes, through which the fixing screws 70 penetrate, of the circuit board 10, the heat conducting pad 50 and the metal heat dissipation plate 60 are formed, and therefore the circuit board 10, the heat conducting pad 50 and the metal heat dissipation plate 60 are fixedly connected with the shell 40.
In this embodiment, the fixing screw 70 may be a stainless steel three-combination pan head cross self-tapping screw, which passes through the circuit board 10, the thermal pad 50 and the metal heat dissipation plate 60 and then is fixedly connected to the threaded hole of the housing 40, so that the circuit board 10, the thermal pad 50 and the metal heat dissipation plate 60 are fixedly connected to the housing 40, and the circuit board 10, the thermal pad 50 and the metal heat dissipation plate 60 are tightly attached to the housing 40. Meanwhile, the stainless steel three-combination pan head cross self-tapping locking screw has the performances of self-tapping, small torque and high locking, and is convenient for a user to assemble.
Through the arrangement, the circuit board 10, the heat conducting pad 50 and the metal heat dissipation plate 60 can be tightly attached together, so that when the power circuit works on the circuit board 10, generated heat can be quickly conducted on the shell 40 through the via holes 30 filled with resin and sequentially pass through the circuit board 10, the heat conducting pad 50 and the metal heat dissipation plate 60, and therefore the device of the vehicle-mounted power circuit cannot fail due to overheating when working. Meanwhile, because the screw is also a metal piece, when the power supply circuit works, part of heat emitted by the device can be transmitted to the screw along the circuit board 10 and then transmitted to the shell 40 by the screw, so that the speed of heat transmission is further increased, the heat dissipation performance of the circuit board 10 is improved, and the heat dissipation performance of the vehicle-mounted power supply is further improved. In addition, when the vehicle-mounted power supply apparatus is assembled, the fixing screws 70 may directly pass through the through holes of the circuit board 10, the thermal pad 50, and the metal heat sink 60 in sequence, so as to stably fix the circuit board 10 to the housing 40, which is simple to mount and improves the convenience of assembly.
It is particularly pointed out that, in another embodiment, referring to fig. 3, the periphery of the through hole on the circuit board 10 is provided with the grounding copper clad, as can be seen from the above embodiments, the area of the copper foil can be enlarged by arranging the grounding copper clad on the circuit board 10 outside the through hole, thereby increasing the heat conduction speed, and similarly, the grounding copper clad is covered on the circuit board 10 outside the through hole, so that the heat can be more quickly and better transferred to the fixing screw 70, and then the heat is transferred to the housing 40 through the fixing screw 70 made of a metal material, thereby further improving the heat dissipation performance and the service life of the circuit board 10, ensuring that the device in the vehicle-mounted power supply circuit does not fail due to overheating during operation, improving the working stability and the service life of the device, and further improving the working heat dissipation performance, stability and safety of the vehicle-mounted power supply. In addition, it can be understood that the number of the fixing screws 70 may be plural, the number of the through holes and the threaded holes corresponds to the number of the fixing screws 70, and the larger the number of the fixing screws 70 is, the better the heat dissipation effect is.
Referring to fig. 5, in one embodiment, the heat dissipation surface 12 of the circuit board 10 is provided with a window in the circuit board 10 at a location corresponding to the plurality of device pads 20.
In this embodiment, the heat dissipation surface 12 of the circuit board 10 is provided with a window of the circuit board 10, the area of the window of the circuit board 10 may be the same as the area of the corresponding device pad 20, or may be larger or smaller than the area of the device pad 20, and the window of the circuit board 10 and the device pad 20 are electrically connected through the via 30. Because the inner wall of via hole 30 is the metal copper product, can be with the heat conduction to the cooling surface 12 of circuit board 10 that the device during operation of vehicle mounted power supply circuit sent, and the circuit board 10 windowing of cooling surface 12 is the metal material, so have better heat conductivity, can be faster with the heat conduction of device work production to hug closely on the heat conduction pad 50 that sets up with cooling surface 12.
The circuit board 10 can be a copper-clad window, that is, a copper foil is arranged at the position of the radiating surface 12 of the circuit board 10 corresponding to the device pads 20, the solder mask is removed, the copper foil is directly exposed in the air, and the copper foil is electrically connected with the corresponding device pads 20 through the via hole 30 array, so that the heat generated during the operation of the device is accelerated to be conducted; in addition, the circuit board 10 can be windowed by not only simply covering copper, but also arranging a welding-assistant layer on the surface of the exposed copper foil, wherein the welding-assistant layer is made of tin material, the function of an additional radiator is played, and the heat conduction speed can be accelerated.
Through the arrangement, when the vehicle-mounted power supply circuit works, heat generated by high-power and high-power-consumption devices in the circuit can be quickly conducted to the heat conducting pad 50, the metal heat radiating plate 60 and the shell 40, so that the heat radiating performance of the circuit board 10 is improved, the devices are prevented from losing efficacy due to overheating, the working reliability and safety of the devices are further improved, and the working stability and heat radiating performance of vehicle-mounted power supply equipment are further improved. Meanwhile, as can be seen from the above embodiments, the via holes 30 are filled with the heat conducting medium, so that during the mounting, solder paste on the steel mesh does not leak to the heat dissipation surface 12 due to the array of the via holes 30, and is not melted and cooled and fixed on the window of the circuit board 10, thereby ensuring the thickness and yield of the circuit board 10.
Referring to fig. 6, in an embodiment, a plurality of thermal pads 80 are further disposed on the device side 11 of the circuit board 10, and the plurality of thermal pads 80 are disposed on one side of the plurality of device pads 20.
In the present embodiment, the heat dissipation pad 80 may be designed in a square, elongated shape, and partially overlaps the device pad 20, and partially protrudes from the device pad 20. A plurality of heat dissipation pads 80 can be simultaneously disposed on one device pad 20, and after the mounting, each heat dissipation pad 80 is directly exposed on the surface of the PCB board, which not only can additionally increase the area of the copper foil, but also increases the area of the solder mask layer, thereby further improving the heat dissipation performance of the circuit board 10.
Through the arrangement, when a high-power and high-power-consumption device in the vehicle-mounted power supply circuit works and generates heat, part of heat on the pad 20 covered by the device is conducted to the air through the overlapped heat dissipation pad 80, so that the heat dissipation performance of the device during working is further improved, and the heat dissipation performance and the stability of the vehicle-mounted power supply during working are further improved.
The above description is only an alternative embodiment of the present invention, and is not limited to the scope of the present invention, and all the modifications of the equivalent structure using the contents of the description and the drawings of the present invention or the direct/indirect application to other related technical fields are included in the scope of the present invention.
Claims (10)
1. An in-vehicle power supply device characterized by comprising:
the circuit board is provided with a device surface, and a plurality of device welding pads are arranged on the device surface and used for installing devices in the vehicle-mounted power supply circuit; wherein the content of the first and second substances,
each device bonding pad is provided with a plurality of through holes, and the through holes are filled with heat-conducting media.
2. The vehicular power supply apparatus according to claim 1, wherein the circuit board is a tin-coated copper-clad PCB board on which a ground copper clad is provided.
3. The vehicular power supply apparatus according to claim 1, wherein the heat conductive medium is a heat conductive resin.
4. The vehicular power supply apparatus according to claim 1, wherein the circuit board further has a heat radiation surface disposed opposite to the device surface, the vehicular power supply apparatus further comprising:
a housing, the circuit board disposed within the housing;
the heat conducting pad is arranged in the shell, and heat conducting silicone grease is coated between the heat conducting pad and the heat radiating surface of the circuit board and is connected with the heat radiating surface in a clinging mode.
5. The vehicular power supply apparatus according to claim 4, characterized by further comprising:
the metal heat dissipation plate is arranged in the shell;
the metal heat dissipation plate is connected with one side of the heat conduction pad back to the circuit board in a clinging manner;
and heat-conducting silicone grease is coated between the metal heat dissipation plate and the heat-conducting pad.
6. The vehicular power supply apparatus according to claim 5, further comprising:
the shell is internally provided with a threaded hole, the circuit board, the heat conducting pad and the metal heat radiating plate are all provided with through holes at the corresponding positions of the threaded hole, and fixing screws penetrate through the threaded hole of the shell and the through holes of the circuit board, the heat conducting pad and the metal heat radiating plate so as to connect and fix the circuit board, the heat conducting pad and the metal heat radiating plate with the shell.
7. The vehicular power supply apparatus according to claim 6, wherein the number of the fixing screws is plural, and the number of the through holes and the threaded holes corresponds to the number of the fixing screws.
8. The vehicular power supply apparatus according to claim 6, wherein a periphery of the through hole on the circuit board is provided with a ground copper clad.
9. The vehicular power supply apparatus according to claim 1, wherein a circuit board window is provided on a heat dissipating surface of the circuit board at a position corresponding to the plurality of device pads.
10. The vehicular power supply apparatus according to claim 1, wherein a plurality of heat dissipating pads are provided on a device face of said circuit board, the plurality of heat dissipating pads being provided on one side of the plurality of device pads.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121114597.4U CN215682725U (en) | 2021-05-24 | 2021-05-24 | Vehicle-mounted power supply device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121114597.4U CN215682725U (en) | 2021-05-24 | 2021-05-24 | Vehicle-mounted power supply device |
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| Publication Number | Publication Date |
|---|---|
| CN215682725U true CN215682725U (en) | 2022-01-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121114597.4U Active CN215682725U (en) | 2021-05-24 | 2021-05-24 | Vehicle-mounted power supply device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215682725U (en) |
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2021
- 2021-05-24 CN CN202121114597.4U patent/CN215682725U/en active Active
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