CN216413231U - Heat radiation structure of phased array antenna, phased array antenna and satellite platform - Google Patents

Abstract

The utility model belongs to the technical field of aerospace heat control, and discloses a heat dissipation structure of a phased array antenna, the phased array antenna and a satellite platform, wherein the heat dissipation structure of the phased array antenna is used for dissipating heat of the phased array antenna of the satellite platform, the satellite platform comprises a satellite cabin plate, and the heat dissipation structure of the phased array antenna comprises a first heat pipe, a flat heat pipe and a second heat pipe; the first heat pipe is buried in the satellite cabin plate; the flat heat pipe is arranged on the inner surface of the satellite deck and used for supporting an antenna assembly of the phased-array antenna, a first bulge is arranged on the flat heat pipe, the first bulge is positioned in the satellite deck, the outer side surface of the first bulge and part of the flat heat pipe positioned on the outer side of the first bulge are attached to the first heat pipe; the second heat pipe is arranged on the inner surface of the satellite cabin plate. The heat dissipation structure of the phased array antenna occupies small space, solves the heat dissipation problem of the antenna assembly, shortens the heat dissipation path, improves the heat dissipation efficiency, and ensures the normal work of the phased array antenna on the satellite platform.

Description

Heat radiation structure of phased array antenna, phased array antenna and satellite platform

Technical Field

The utility model relates to the technical field of aerospace thermal control, in particular to a radiating structure of a phased array antenna, the phased array antenna and a satellite platform.

Background

The application fields of the phased array antenna used for the communication function at present mainly include a satellite-borne phased array antenna and a roadbed phased array antenna. Due to the particularity and complexity of the satellite-borne environment, the phased-array antenna used on the satellite platform cannot dissipate heat in an air cooling and water cooling mode, can only dissipate heat through radiation and heat conduction means, and cannot provide a heat dissipation surface with constant temperature for the phased-array antenna through the heat dissipation mode of the radiation and heat conduction means. The conventional phased array antenna used in a satellite-borne environment is high in heat flux density and poor in heat dissipation capacity.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a heat dissipation structure of a phased array antenna, which occupies small space, can shorten a heat dissipation path, improve heat dissipation efficiency and ensure long-time normal operation of the phased array antenna on a satellite platform.

In order to achieve the purpose, the utility model adopts the following technical scheme:

a heat dissipation structure for a phased array antenna of a satellite platform for dissipating heat from the phased array antenna, the satellite platform including a satellite deck, comprising:

the first heat pipe is buried in the satellite cabin plate;

the flat heat pipe is arranged on the inner surface of the satellite deck plate, a first bulge for installing an antenna assembly is arranged on the flat heat pipe, the first bulge is positioned in the satellite deck plate, and the outer side surface of the first bulge and the flat heat pipe positioned on the outer side of the first bulge are attached to the first heat pipe;

a second heat pipe disposed on an inner surface of the satellite deck.

Preferably, a projection of the second heat pipe on the satellite cabin plate is arranged to intersect with a projection of the first heat pipe on the satellite cabin plate.

Preferably, the first heat pipe and the second heat pipe are respectively provided with a plurality of heat pipes, the plurality of first heat pipes are arranged along the axial direction of the second heat pipe at intervals, and the plurality of second heat pipes are arranged along the axial direction of the first heat pipe at intervals.

Preferably, a first heat conduction and insulation pad is clamped between the flat heat pipe and the first heat pipe.

Preferably, a second protrusion is arranged on a surface of the flat heat pipe facing away from the first protrusion, and the second protrusion is used for connecting a part of the antenna assembly.

Preferably, the second protrusions are provided in plurality, and the plurality of second protrusions are arranged on the flat heat pipe at intervals.

Preferably, a second heat-conducting insulating pad is arranged on the second protrusion.

Preferably, the thermal control coating is arranged on the surface of the satellite cabin plate.

There is also preferably provided a phased array antenna including a heat dissipation structure for a phased array antenna as claimed in any one of the preceding claims, the antenna assembly comprising:

the first antenna module comprises an antenna transmitting unit and an electronic assembly, the electronic assembly is arranged on the first protrusion, and the antenna transmitting unit is arranged on the electronic assembly and extends out of the outer surface of the satellite cabin plate;

and the second antenna module is arranged on the surface of the flat heat pipe departing from the first bulge.

Preferably, the electronic component includes a multilayer circuit board, an AOP module and an antenna carrier, the multilayer circuit board is disposed on the first protrusion, the AOP module is disposed on the multilayer circuit board, the antenna carrier is disposed on the AOP module, and the antenna transmitting unit is disposed on the antenna carrier.

Preferably, the second antenna module includes a wave control plate, and a first chip module and a second chip module disposed on the wave control plate, the first chip module is sandwiched between the flat heat pipe and the wave control plate, and the second chip module is disposed on a surface of the wave control plate away from the flat heat pipe.

Preferably, the first chip assembly includes an AI chip, a power supply chip, and a refresh chip, and the AI chip, the power supply chip, and the refresh chip are disposed on the flat heat pipe at intervals.

Preferably, the second chip assembly includes a plurality of heat generating chips, and the plurality of heat generating chips are arranged on the wave control board at intervals.

Preferably, a satellite platform is further provided, which includes the phased array antenna as described in any of the above, a mounting hole is opened on the satellite deck, a part of the first heat pipe is located in the mounting hole and abuts against the flat heat pipe, the first protrusion and the electronic component are accommodated in the mounting hole, and the antenna emission unit extends out of the outer surface of the satellite deck.

Preferably, the satellite vehicle further comprises a shell which is arranged opposite to the mounting hole, the shell is respectively connected to the satellite cabin plate and the flat heat pipe, and the second antenna module is accommodated in the shell.

The utility model has the beneficial effects that:

according to the radiating structure of the phased-array antenna, the antenna assembly is supported and carried through the flat heat pipe arranged on the inner surface of the satellite cabin plate, the first protrusion on the flat heat pipe extends into the satellite cabin plate to enable the outer side surface of the first protrusion and the flat heat pipe positioned on the outer side of the first protrusion to be attached to the first heat pipe pre-embedded in the satellite cabin plate, the flat heat pipe and the first heat pipe are matched to accelerate radiating, thermal conduction resistance and thermal contact resistance are reduced, a radiating path is shortened, and heat generated when the antenna assembly works is rapidly conducted to the satellite cabin plate. Meanwhile, the second heat pipe is arranged, so that heat is further dissipated to the satellite cabin plate, the heat is dissipated to a cold space, the temperature difference between the antenna assembly and the satellite cabin plate is reduced, the heat dissipation quality of the heat dissipation structure of the phased array antenna to the antenna assembly is improved, and the normal work of the antenna assembly is guaranteed.

According to the phased-array antenna provided by the utility model, the first antenna module of the antenna assembly is arranged on the first bulge, and the second antenna module is arranged on the surface of the flat heat pipe, which is far away from the first bulge, so that the positions of different antenna devices with high heat are reasonably distributed, and the heat dissipation path is optimized, so that the heat generated by the first antenna module with high heat consumption during working can be more quickly conducted to the cabin plate to be dissipated, and the normal work of the antenna emission unit is ensured.

According to the satellite platform provided by the utility model, the first heat pipe buried in the satellite cabin plate is attached to the flat heat pipe supporting the antenna assembly through the mounting hole formed in the satellite cabin plate, the space size required for mounting the first heat pipe, the flat heat pipe and the antenna assembly is reduced in the direction vertical to the satellite cabin plate, and the overall envelope size of the satellite is reduced.

Drawings

Fig. 1 is a first schematic structural diagram of a phased array antenna applied to a satellite platform according to an embodiment of the present invention;

FIG. 2 is an enlarged view taken at A in FIG. 1;

fig. 3 is a schematic structural diagram of a first heat pipe and a flat heat pipe of a heat dissipation structure of a phased array antenna according to an embodiment of the present invention;

fig. 4 is a schematic structural diagram of a phased array antenna provided in an embodiment of the present invention;

fig. 5 is a schematic structural diagram of a phased array antenna applied to a satellite platform according to an embodiment of the present invention;

fig. 6 is a schematic structural diagram of a phased array antenna and a housing of a satellite platform according to an embodiment of the present invention;

fig. 7 is a schematic structural diagram of a satellite deck of a satellite platform according to an embodiment of the present invention;

fig. 8 is a schematic structural diagram three of the phased array antenna applied to a satellite platform according to the embodiment of the present invention.

In the figure:

100-satellite deck board; 101-mounting holes; 102-a housing; 1021-a backplane; 1022-a frame;

200-an antenna assembly; 201-an antenna transmission unit; 202-electronic components; 2021-multilayer circuit board; 2022-AOP module; 2023-an antenna carrier; 203-a wave control plate; 204-a first chip assembly; 2041-AI chip; 2042-Power chip; 2043-Refresh chip; 205-a second chip assembly;

1-a first heat pipe;

2-a flat heat pipe; 21-a first protrusion; 22-a first thermally conductive insulating pad; 23-a second protrusion; 231-a second thermally conductive insulating pad;

3-second heat pipe.

Detailed Description

Reference will now be made in detail to the embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar parts throughout or parts having the same or similar functions. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the utility model and are not to be construed as limiting the utility model.

In the description of the present invention, unless otherwise expressly specified or limited, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning a fixed connection, a removable connection, a mechanical connection, an electrical connection, a direct connection, an indirect connection via an intermediary, a connection between two elements, or an interaction between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In the description of the present invention, unless otherwise expressly specified or limited, the first feature "on" or "under" the second feature may include the first feature and the second feature being in direct contact, or may include the first feature and the second feature being in contact not directly but with another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The technical scheme of the utility model is further explained by the specific implementation mode in combination with the attached drawings.

As shown in fig. 1 to 4, the present embodiment provides a heat dissipation structure of a phased array antenna, which is used for dissipating heat of the phased array antenna of a satellite platform, where the satellite platform includes a satellite deck 100, and the heat dissipation structure of the phased array antenna includes a first heat pipe 1, a flat heat pipe 2, and a second heat pipe 3. Optionally, a mounting hole 101 is formed through the satellite deck 100; the first heat pipe 1 is buried in the satellite deck 100, and part of the first heat pipe 1 is accommodated in the mounting hole 101; the flat heat pipe 2 is arranged on the inner surface of the satellite deck board 100 and used for mounting and supporting the antenna assembly 200, further, the flat arrangement 2 is provided with a first protrusion 21 for supporting the antenna assembly 200, the first protrusion 21 is located in a mounting hole 101 formed in the satellite deck board 100, and the outer side surface of the first protrusion 21 and the flat heat pipe 2 located outside the first protrusion 21 can be attached to the first heat pipe 1 accommodated in the mounting hole 101; the second heat pipe 3 is arranged on the inner surface of the satellite cabin plate 100, the flat heat pipe 2 is arranged on the inner surface of the satellite cabin plate 100, the first heat pipe 1 is arranged on the flat heat pipe 1, and the first heat pipe 1 is arranged on the flat heat pipe 2.

In the heat dissipation structure of the phased-array antenna in the embodiment, the antenna assembly 200 is supported and carried by the flat heat pipe 2 arranged on the inner surface of the satellite deck 100, wherein the arrangement that the first protrusion 21 on the flat heat pipe 2 extends into the mounting hole 101 in the satellite deck 100 enables the outer side surface of the first protrusion 21 and the flat heat pipe 2 positioned outside the first protrusion 21 to be attached to the first heat pipe 1 pre-embedded in the satellite deck 100, which is beneficial to reducing thermal resistance. Meanwhile, the second heat pipe 3 is arranged, so that heat is further dissipated to the satellite cabin plate 100, the heat is dissipated to a cold space, the temperature difference between the antenna assembly 200 of the phased array antenna and the satellite cabin plate 100 is favorably reduced, the heat dissipation quality of the radiating structure of the phased array antenna to the antenna assembly 200 is improved, and the normal work of the antenna assembly 200 is ensured.

Optionally, the projection of the second heat pipe 3 on the satellite deck 100 is arranged to intersect the projection of the first heat pipe 1 on the satellite deck 100. The second heat pipe 3 arranged on the satellite cabin plate 1 is matched with the first heat pipe 1 in position, so that the collected heat of the satellite cabin plate 100 is favorably dissipated to the cold space around, and the heat dissipation efficiency of the satellite cabin plate 100 is improved.

Referring to fig. 1 and 8, the first heat pipes 1 and the second heat pipes 3 are respectively provided with a plurality of first heat pipes 1 arranged along the axial direction of the second heat pipes 3 at intervals, and the second heat pipes 3 arranged along the axial direction of the first heat pipes 1 at intervals, so that the first heat pipes 1 and the second heat pipes 3 are matched to form an orthogonal heat pipe network on the satellite deck plate 100, the temperature uniformity of the whole satellite deck plate 100 is improved, and the heat dissipation efficiency of a heat dissipation surface on the satellite deck plate 100 is further improved.

Optionally, the heat dissipation structure of the phased array antenna in this embodiment further includes a thermal control coating disposed on the surface of the satellite deck 100. Specifically, the outer surface of the satellite deck 100 facing away from the second heat pipe 3 is coated with KS-Z white paint as a heat dissipation surface to dissipate heat accumulated on the satellite deck 100 to the outside space, specifically, the white paint has an initial absorptivity of 0.14 and an emissivity of 0.92.

Optionally, the inner surface of the satellite deck 100 provided with the second heat pipe 3 is provided with E51-M black paint, and isothermal design is performed.

Optionally, the inner wall of the flat heat pipe 2 in this embodiment has a vacuum cavity with a capillary structure, the cavity is evacuated and filled with a working medium, heat transfer is performed based on a phase change process of the working medium in the cavity, and three-dimensional heat conduction is achieved, wherein the equivalent thermal conductivity of the flat heat pipe 2 facing the surface is 2000W/m/K at the maximum, the equivalent thermal conductivity of the normal direction is 100W/m/K at the maximum, and the maximum heat flux density can reach 40W/cm 2.

Referring to fig. 4, a first heat conduction insulating pad 22 is sandwiched between the flat heat pipe 2 and the first heat pipe 1, and the first heat conduction insulating pad 22 facilitates heat conduction and heat dissipation, so as to improve the heat conduction efficiency between the flat heat pipe 2 and the first heat pipe 1.

Referring to fig. 2 and 4, the second protrusion 23 is disposed on the surface of the flat heat pipe 2 away from the first protrusion 21, that is, the first protrusion 21 and the second protrusion 23 are respectively located on two sides of the flat heat pipe 2, the first protrusion 21 and the second protrusion 22 are matched to be used for installing and supporting devices with different heat consumptions of the antenna assembly 200, and meanwhile, the arrangement of the second protrusion 23 ensures that the devices of the antenna assembly 200 disposed on the second protrusion 23 can be in contact with the flat heat pipe 2, and a certain heat dissipation gap is also reserved between the devices and the flat heat pipe 2, so that the heat dissipation effect is improved.

Referring to fig. 4, the second bump 23 is provided with a second heat conducting insulating pad 231, and the second heat conducting insulating pad 231 has good viscosity, flexibility, good compression performance and good heat conductivity, and can completely exhaust air between the second bump 23 and the device of the antenna assembly 200, so as to achieve sufficient contact and enhance the heat transfer efficiency between the antenna assembly 200 and the second bump 23. Optionally, the thickness of the second thermal conductive and insulating pad 231 in this embodiment is 0.3 mm, and the compression amount thereof is designed to be 50%, that is, the thickness of the second thermal conductive and insulating pad 231 can be compressed to 0.15 mm when in use, so as to reduce the thermal conductive resistance in the thickness direction of the second thermal conductive and insulating pad 231 itself.

Optionally, referring to fig. 3 and 4, the second protrusions 23 are provided in plurality, and the plurality of second protrusions 23 are arranged on the flat heat pipe 2 at intervals, so that a plurality of devices of the antenna assembly 200 are distributed on the flat heat pipe 2 at intervals, and the influence on the normal operation of the antenna assembly 200 due to the local over-high temperature is prevented.

Optionally, the first heat pipe 1 and the second heat pipe 3 are both i-shaped double-hole ammonia axial channel heat pipes, and the pipe material is aluminum alloy.

The present embodiment also provides a phased array antenna, which includes the above-mentioned heat dissipation structure of the phased array antenna, wherein the antenna assembly 200 includes a first antenna module and a second antenna module respectively mounted on both sides of the flat heat pipe 2. Optionally, referring to fig. 2 to 6, the first antenna module includes an antenna emitting unit 201 and an electronic component 202, the electronic component 202 is disposed on the first protrusion 21, and the antenna emitting unit 201 is disposed on the electronic component 202 and extends out of the outer surface of the satellite deck 100; the second antenna module is disposed on the second protrusion 23 of the flat heat pipe 2 away from the first protrusion 21. The phased array antenna that this embodiment provided, install on first arch 21 through the first antenna module with antenna module 200, set up the second antenna module on dull and stereotyped heat pipe 2 deviates from the second arch 22 of first arch 21, the different antenna device's of rational distribution high heat position optimizes the heat dissipation route for the heat that the higher first antenna module during operation of heat loss produced can conduct more fast and distribute away to the cabin board, guarantees that antenna emission unit normally works.

Optionally, referring to fig. 2 and fig. 4, the electronic assembly 202 includes a multi-layer circuit board 2021 soldered on the first bump 21, and an AOP module 2022 soldered on the multi-layer circuit board 2021, wherein the AOP module 2022 is a packaged electronic structure carrying a chip to implement functions such as signal transmission and processing. Further, the antenna carrier 2023 is disposed on a surface of the AOP module 2022 facing away from the multi-layer circuit board 2021, and the antenna radiation unit 201 is disposed on the AOP module 2022 of the electronic component 202 through the antenna carrier 2023 and exposed outside the outer surface of the satellite deck 100. Specifically, the antenna radiation unit 201 is connected to the antenna carrier 2023 by soldering, and the surface of the antenna carrier 2023 away from the antenna radiation unit 201 is soldered to the AOP module 2022, so that the antenna radiation unit 201 is exposed out of the outer surface of the satellite deck board 100 to implement signal transmission and reception. In practical engineering applications, the antenna radiation unit 201 and the AOP module 2022 are respectively provided with a plurality of chips, and each AOP module 2022 is provided with 5 chips, the total power consumption of the AOP module 2022 can reach 2.5W, about 85% of heat consumption of the antenna assembly 200 is concentrated on the AOP module 2022 as an electronic component with higher power consumption, the AOP module 2022 in the above structural arrangement can conduct heat to the flat heat pipe 2 through the multilayer circuit board 2021, and the welding of the multilayer circuit board 2021 and the flat heat pipe 2 is also beneficial to reducing contact thermal resistance, so as to accelerate heat dissipation.

Referring to fig. 2 and 4, the second antenna module includes a wave control plate 203, and a first chip module 204 and a second chip module 205 that are disposed on the wave control plate 203, the wave control plate 203 and the flat heat pipe 2 are disposed at an interval, the first chip module 204 is sandwiched between the second heat-conducting insulating pad 231 and the wave control plate 203, and the arrangement is such that the first chip module 204 with relatively high heat consumption transfers heat to the first heat pipe 1 and the satellite compartment plate 100 through the heat-conducting pad 331 and the flat heat pipe 2 in sequence. The second chip assembly 205 with relatively low heat consumption is arranged on the surface of the wave control plate 203 departing from the flat heat pipe 2, and the position arrangement of the wave control plate 203, the first chip assembly 204 and the second chip assembly 205 in the second antenna module is optimized, so that the heat dissipation of the antenna assembly 200 is optimized, the heat dissipation path of the device with high heat consumption is reduced, and the heat dissipation efficiency is further improved.

Optionally, referring to fig. 4, the first chip assembly 204 includes an AI chip 2041, a power chip 2042, and a refresh chip 2043, the second bump 23 is provided in plurality, and the plurality of second bumps 23 are disposed on the flat heat pipe 2 at intervals, so that the AI chip 2041, the power chip 2042, and the refresh chip 2043 can be correspondingly soldered on one second bump 23, where the AI chip 2041 is an FPGA (Field Programmable Gate Array) chip, which is a device with high heat dissipation in the first chip assembly 204, and the heat dissipation path of the first chip assembly 204 is reduced by optimizing the disposition position of the first chip assembly 204 on the wave control board 203.

Alternatively, referring to fig. 4, the second chip assembly 205 includes a plurality of heat-generating chips with low heat dissipation, and the plurality of heat-generating chips are arranged on the wave control board 203 at intervals to facilitate heat dissipation.

Optionally, the antenna carrier plate 2023, the multilayer circuit board 2021, and the wave control plate 203 are all printed circuit boards.

In the present embodiment, a satellite platform is further provided, which includes the phased array antenna, referring to fig. 6 to 8, a mounting hole 101 is formed through a satellite deck board 100 of the satellite platform, the shape and size of the mounting hole 101 may be set according to the shape and mounting position of the first heat pipe 1 and the flat heat pipe 2, so as to ensure that a part of the first heat pipe 1 is located in the mounting hole 101 and abuts against the flat heat pipe 2, the first protrusion 21 and the electronic component 202 are accommodated in the mounting hole 101, and the antenna emitting unit 201 extends out of the outer surface of the satellite deck board 100. In the satellite platform provided in this embodiment, the installation hole 101 is formed in the satellite deck board 100, so that the first heat pipe 1 embedded in the satellite deck board 100 is attached to the flat heat pipe 2 supporting the antenna assembly 200, the size of the space required for mounting the first heat pipe 1, the flat heat pipe 2, and the antenna assembly 200 is reduced in the direction perpendicular to the satellite deck 100, that is, by making the mounting hole 101 and allowing the first antenna module to be accommodated in the mounting hole 101, the flat heat pipe 2 is partially accommodated in the mounting hole 101, so that the size of the space required for mounting the first heat pipe 1, the flat heat pipe 2 and the antenna assembly 200 in the direction perpendicular to the deck board 1 is reduced by the thickness value of the deck board, therefore, the size of the whole phased array antenna is thinned, and when the radiating structure of the phased array antenna and the phased array antenna are applied to a satellite platform, the envelope size of the whole phased array antenna is reduced.

The satellite platform in this embodiment further includes a casing 102 disposed opposite to the mounting hole 101, referring to fig. 6 to 8, the casing 102 is respectively connected to the deck 1 and the flat heat pipe 2, the second antenna module is accommodated in the casing 102, the flat heat pipe 2 is fixed on the outer surface of the satellite deck 1 through the casing 102, and the flat heat pipe 2 and the second antenna module are also sealed. Except that the antenna emitting unit 201 is exposed on the deck board 1, other parts on the antenna assembly 200 are all in the mounting hole 101 and the housing 102, so that the overall size of the phased array antenna is thinned, the integration level is high, and the overall envelope size of the satellite when the phased array antenna in the embodiment is applied to a satellite platform is favorably reduced.

Alternatively, referring to fig. 6 to 8, the housing 102 includes a bottom plate 1021 and a frame 1022 surrounding the bottom plate 1021, the bottom plate 1021 and the frame 1022 constitute the housing 102 having an opening, and the housing 102 is opened toward the mounting hole 101; the flat heat pipe 2 is connected to the inner surface of the frame 1022 through screws, and the frame 1022 is mounted on the cabin board 1 through screws, so that the installation and maintenance are convenient.

Optionally, the satellite compartment panel 100 in this embodiment is an aluminum skin aluminum honeycomb panel, wherein the skin thickness is 0.5mm and the honeycomb thickness is 10 mm.

It should be understood that the above-described embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.

Claims (15)

1. A heat dissipation structure of a phased array antenna for dissipating heat from a phased array antenna of a satellite platform, the satellite platform including a satellite deck board (100), comprising:

a first heat pipe (1) embedded in the satellite deck (100);

the flat heat pipe (2) is arranged on the inner surface of the satellite cabin plate (100), a first bulge (21) for installing an antenna assembly (200) is arranged on the flat heat pipe (2), the first bulge (21) is located in the satellite cabin plate (100), and the outer side surface of the first bulge (21) and the flat heat pipe (2) located on the outer side of the first bulge (21) are attached to the first heat pipe (1);

a second heat pipe (3), the second heat pipe (3) being disposed on an inner surface of the satellite deck (100).

2. The heat dissipation structure of a phased array antenna according to claim 1, characterized in that the projection of the second heat pipe (3) on the satellite pod plate (100) is arranged crosswise to the projection of the first heat pipe (1) on the satellite pod plate (100).

3. The heat dissipation structure of a phased array antenna according to claim 2, wherein the first heat pipe (1) and the second heat pipe (3) are respectively provided in plural numbers, the plural numbers of the first heat pipes (1) are provided at intervals in an axial direction of the second heat pipe (3), and the plural numbers of the second heat pipes (3) are provided at intervals in the axial direction of the first heat pipe (1).

4. The heat dissipation structure of a phased array antenna according to claim 1, characterized in that a first thermally conductive insulating pad (22) is sandwiched between the flat heat pipe (2) and the first heat pipe (1).

5. The heat dissipation structure of a phased array antenna according to claim 1, characterized in that a second protrusion (23) is provided on the surface of the flat heat pipe (2) facing away from the first protrusion (21), the second protrusion (23) being used for connecting a part of the device of the antenna assembly (200).

6. The heat dissipation structure of a phased-array antenna according to claim 5, wherein the second protrusion (23) is provided in plural, and the plural second protrusions (23) are provided on the flat heat pipe (2) at intervals.

7. The heat dissipation structure of a phased array antenna according to claim 5, characterized in that a second thermally conductive and insulating pad (231) is provided on the second bump (23).

8. The heat dissipation structure for a phased array antenna according to any of claims 1 to 7, further comprising a thermal control coating disposed on a surface of the satellite deck (100).

9. A phased array antenna, characterized in that it comprises a heat dissipation structure for a phased array antenna according to any of claims 1 to 8, the antenna assembly (200) comprising:

a first antenna module comprising an antenna emitting unit (201) and an electronic component (202), wherein the electronic component (202) is arranged on the first protrusion (21), and the antenna emitting unit (201) is arranged on the electronic component (202) and extends out of the outer surface of the satellite deck (100);

the second antenna module is arranged on the surface, deviating from the first protrusion (21), of the flat heat pipe (2).

10. The phased array antenna according to claim 9, characterized in that the electronic component (202) comprises a multilayer circuit board (2021), an AOP module (2022) and an antenna carrier board (2023), the multilayer circuit board (2021) being disposed on the first protrusion (21), the AOP module (2022) being disposed on the multilayer circuit board (2021), the antenna carrier board (2023) being disposed on the AOP module (2022), the antenna transmission unit (201) being disposed on the antenna carrier board (2023).

11. Phased array antenna according to claim 9, characterized in that the second antenna module comprises a wave control plate (203) and a first chip component (204) and a second chip component (205) arranged on the wave control plate (203), the first chip component (204) being sandwiched between the flat heat pipe (2) and the wave control plate (203), the second chip component (205) being arranged on a surface of the wave control plate (203) facing away from the flat heat pipe (2).

12. The phased array antenna according to claim 11, wherein the first chip assembly (204) comprises an AI chip (2041), a power chip (2042) and a refresh chip (2043), and the AI chip (2041), the power chip (2042) and the refresh chip (2043) are disposed on the flat heat pipe (2) at intervals.

13. The phased array antenna of claim 11, wherein the second chip assembly (205) comprises a plurality of heat generating chips, the plurality of heat generating chips being spaced apart on the wave control plate (203).

14. A satellite platform, comprising a phased array antenna according to any of claims 9 to 13, wherein the satellite deck (100) is provided with a mounting hole (101), a part of the first heat pipe (1) is located in the mounting hole (101) and abuts against the flat heat pipe (2), the first protrusion (21) and the electronic component (202) are accommodated in the mounting hole (101), and the antenna radiation unit (201) extends out of the outer surface of the satellite deck (100).

15. The satellite platform according to claim 14, further comprising a housing (102) disposed opposite to the mounting hole (101), wherein the housing (102) is connected to the satellite deck (100) and the flat heat pipe (2), respectively, and the second antenna module is accommodated in the housing (102).

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