CN217985819U - Power amplifier heat abstractor, power amplifier module and portable frequency interference appearance - Google Patents
Power amplifier heat abstractor, power amplifier module and portable frequency interference appearance Download PDFInfo
- Publication number
- CN217985819U CN217985819U CN202221701332.9U CN202221701332U CN217985819U CN 217985819 U CN217985819 U CN 217985819U CN 202221701332 U CN202221701332 U CN 202221701332U CN 217985819 U CN217985819 U CN 217985819U
- Authority
- CN
- China
- Prior art keywords
- heat
- power amplifier
- heat dissipation
- circuit board
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The utility model discloses a power amplifier heat abstractor, power amplifier module and portable frequency interference appearance. The power amplifier heat dissipation device comprises a heat dissipation base body, a heat pipe, a plurality of heat conduction blocks and a heat conduction substrate. The heat dissipation base body dissipates heat to the atmosphere, the heat exchange area between the heat pipe and the heat dissipation base body is increased by the heat conduction blocks, the heat exchange medium is rapidly condensed, and the heat dissipation efficiency is effectively improved.
Description
Technical Field
The utility model belongs to the technical field of the electronic equipment heat dissipation, concretely relates to power amplifier heat abstractor, power amplifier module and portable frequency interference appearance.
Background
The power amplifier board is widely applied to electronic equipment and is mainly used for amplifying weak electric signals from a signal source. The power amplifier board generates more heat during operation, but because the number of independent modules in the power amplifier board is more, a narrow space in the power amplifier board is caused, and poor heat dissipation is easily caused, so that internal elements are ineffective or burnt out due to overhigh temperature, and a radiator is generally arranged for the power amplifier to ensure the normal operation of the power amplifier.
However, since the power of the electrical device elements on the power amplifier board is different, the heat emitted is different, and the conventional heat sink cannot radiate the power amplifier board in a targeted manner, thereby reducing the heat radiation effect and the heat radiation efficiency. The heat dissipation mode has limited effect and poor temperature uniformity, and can not meet the heat dissipation requirement of a high-power amplifier module.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a main aim at provides a power amplifier heat abstractor, power amplifier module and portable frequency interference appearance to solve current radiator and can not dispel the heat to the power amplifier board with pertinence, the not good problem of radiating effect.
In order to solve the above technical problem, on the one hand, the embodiment of the utility model provides a power amplifier heat abstractor is provided, include:
the heat dissipation device comprises a heat dissipation base body, a first heat dissipation plate and a second heat dissipation plate, wherein one side face of the heat dissipation base body is used as an installation face and used for installing a circuit board of a power amplifier module, and a first groove and a second groove which are intersected are formed in the installation face;
the heat pipe is fixed at the bottom of the first groove;
the heat conducting substrate is embedded in the second groove and is pressed on the heat pipe in a pressing mode, and the upper surface of the heat conducting substrate is flush with the mounting surface and is used for being in contact with the position, where the power amplifier chip is arranged, on the circuit board;
and the heat conducting blocks are sequentially embedded in the first grooves at intervals and are pressed on the heat pipe in a pressing manner, and the upper surface of the heat conducting blocks is not higher than the mounting surface and is used for increasing the heat exchange area between the heat pipe and the heat dissipation base body.
In a possible embodiment, the upper surface of the heat conducting block is lower than the mounting surface, and the other side surface of the heat dissipation base opposite to the mounting surface is provided with a plurality of heat dissipation fins.
In a possible implementation manner, a plurality of positioning columns for positioning the circuit board are arranged on the mounting surface, a frame protruding from the mounting surface is arranged at the edge of the mounting surface, the circuit board is mounted in an area surrounded by the frame, a switching connector for connecting the circuit board and the radio frequency cable is arranged on the frame, and a plurality of screw holes are arranged at the top of the frame.
In a possible embodiment, the heat pipe is a hollow copper pipe, and the inside of the heat pipe is filled with a heat dissipation medium.
In a possible embodiment, the heat dissipation base and the heat conduction block are both made of aluminum or copper;
the heat conducting substrate is made of copper.
In a possible embodiment, the cross sections of the first groove and the heat conduction block are in an inverted trapezoid shape.
In a possible embodiment, the heat pipe and/or the heat conducting block are fixed in the first groove by a heat conducting glue, and the heat conducting substrate is fixed in the second groove by a heat conducting glue.
In one possible embodiment, the heat-conducting glue fills the gaps between the heat pipe, the heat-conducting block, and the heat-conducting substrate and the heat-dissipating substrate, so as to increase the heat-dissipating efficiency of solid heat conduction.
Adopt the produced beneficial effect of above-mentioned technical scheme to lie in: the utility model discloses a set up crossing first recess and second recess on a side of heat dissipation base member, set up the heat pipe bottom first recess, also set up a plurality of heat conduction pieces in first recess and press on the heat pipe, still set up the heat conduction base plate in the second recess and press on the heat pipe, it is tight on the heat conduction base plate to have corresponding power amplifier module circuit board on the position that generates heat serious to paste during the use, the heat transmits for the heat pipe through the heat conduction base plate, the heat transfer medium gasification absorption heat in the heat pipe, transmit the heat dissipation base member with the absorbed heat again, the heat dissipation base member scatters and disappears the heat to the atmosphere, the heat conduction piece has increased the heat exchange area between heat pipe and the heat dissipation base member, make the quick condensation of heat transfer medium, the radiating efficiency has effectively been improved.
On the other hand, this application embodiment still provides a power amplifier module, including apron, circuit board to and above-mentioned power amplifier heat abstractor, the circuit board is installed on power amplifier heat abstractor's installation face, the apron sets up in the circuit board top, and with power amplifier heat abstractor connects, the apron is provided with a plurality of floors towards on a side of circuit board, the floor compresses tightly the circuit board on the installation face, wherein, the floor is used for shielding electromagnetic signal.
On the other hand, the embodiment of the application further provides a portable frequency interference instrument which applies the power amplifier module.
Drawings
The accompanying drawings, which form a part of the present disclosure, are included to provide a further understanding of the present disclosure, and are incorporated in and constitute a part of this specification, illustrate embodiments of the present disclosure and together with the description serve to explain the present disclosure.
Fig. 1 is a schematic structural diagram of a power amplifier heat dissipation device provided in embodiment 1 of the present invention;
fig. 2 is a schematic structural diagram of a power amplifier module according to embodiment 2 of the present invention;
fig. 3 is a top view of a power amplifier module according to embodiment 2 of the present invention;
fig. 4 is a schematic structural diagram of a cover plate in a power amplifier module according to embodiment 2 of the present invention;
FIG. 5 is a cross-sectional view of section C-C of FIG. 3;
fig. 6 is a partially enlarged view of fig. 5.
Wherein:
1. a heat-dissipating substrate; 10. a mounting surface; 11. a first groove; 12. a second groove; 13. a heat dissipating fin; 14. a positioning column; 15. a frame; 151. a screw hole; 2. a heat pipe; 3. a heat conducting block; 4. a heat conductive substrate; 5. a transfer joint; 100. a power amplifier heat dissipation device; 200. a circuit board; 300. a cover plate; 301. a rib plate; 302. and (3) conductive adhesive.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
In the description of the present invention, it should be clear that the terms "vertical", "horizontal", "longitudinal", "front", "rear", "left", "right", "up", "down", "horizontal", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for convenience of description of the present invention, and do not mean that the device or element referred to must have a specific orientation or position, and thus, cannot be construed as limiting the present invention.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Example 1
Optionally, in some embodiments, the upper surface of the heat conduction block 3 is lower than the mounting surface 10, for example, to avoid interference with components of the circuit board.
After the technical scheme is adopted, the first groove 11 and the second groove 12 which are intersected are formed in one side face of the heat dissipation base body 1, the heat pipe 2 is arranged at the bottom of the first groove 11, the heat conduction blocks 3 are also arranged in the first groove 11 and pressed on the heat pipe 2, the heat conduction base plate 4 is also arranged in the second groove 12 and pressed on the heat pipe 2, when the heat dissipation base plate is used, parts (such as power amplification chips and the like) which generate heat seriously on the circuit board 200 of the power amplification module are attached to the heat conduction base plate 4 in a targeted mode, heat is transmitted to the heat pipe 2 through the heat conduction base plate 4, heat exchange media in the heat pipe 2 are gasified and absorb heat, the absorbed heat is transmitted to the heat dissipation base body 1, the heat is dissipated into the atmosphere through the heat dissipation base body 1, the heat conduction blocks 3 increase the heat exchange area between the heat pipe 2 and the heat dissipation base body 1, the heat exchange media are rapidly condensed, and the heat dissipation efficiency is effectively improved.
In one embodiment, the heat pipe 2 is a hollow copper pipe, the cross section of which is circular or elliptical, and the heat pipe is filled with a heat dissipation medium (such as a refrigerant) and conducts heat by utilizing heat absorption during vaporization and heat release during liquefaction of the heat transfer medium.
Because the cross section of the heat pipe 2 is circular or oval, the area of direct contact with the inner wall of the first groove 11 is small, and it takes a long time to transmit the absorbed heat to the heat dissipation substrate 1, further, the cross sections of the first groove 11 and the heat conduction block 3 are in inverted trapezoid shape, so that the heat conduction block 3 is conveniently pressed in the first groove 11, meanwhile, the contact area between the side wall of the heat conduction block 3 and the side wall of the first groove 11 can be increased to a certain extent, the bottom surface of the heat conduction block 3 is pressed on the heat pipe 2, which is equivalent to indirectly increasing the heat exchange area between the heat pipe 2 and the heat dissipation substrate 1, a part of the heat in the gasified heat dissipation medium can be transmitted to the heat dissipation substrate 1 through the pipe wall of the heat pipe 2 and the heat conduction block 3, the heat dissipation medium can be rapidly condensed, and more heat transmitted to the heat pipe 2 from the heat conduction substrate 4 can be conveniently absorbed in the following process.
Furthermore, a plurality of heat dissipation fins 13 are arranged on the other side surface of the heat dissipation base 1 opposite to the mounting surface 10, so as to increase the contact area between the heat dissipation base 1 and the air and improve the heat dissipation efficiency.
As shown in fig. 5-6, through the contact of heat conduction block 3 and heat pipe 2, heat conduction block 3 and the lateral wall butt of first recess 11, can form three solid heat conduction directions X1, X2, X3, the heat of X1 direction can be gone out the heat transfer through the air flow on heat radiation fins 13, the heat of X2 and X3 direction can be transmitted to heat dissipation base member 1 through the lateral wall of heat conduction block 3 on, heat conduction's heat dissipation direction increases to three with the solid through heat conduction block 3, can greatly accelerate the radiating efficiency. In addition, the thickness of the heat dissipating base 1 on the side facing the heat dissipating fins 13 can be reduced when designing the heat dissipating base 1, thereby reducing the product cost and reducing the product volume.
Furthermore, a plurality of positioning columns 14 are arranged on the mounting surface 10, so that the positioning is convenient for the mounting with the circuit board 200.
Further, the edge of the mounting surface 10 is provided with a frame 15 protruding from the mounting surface 10, and the circuit board 200 is mounted in the area surrounded by the frame 15. In order to facilitate the connection of the power amplifier heat dissipation device 100 with other components of a power amplifier module, a plurality of screw holes 151 are formed at the top of the frame 15.
In addition, still be equipped with adapter 5 on frame 15, power amplifier module's circuit board 200 installs the back on heat dissipation base member 1, and its output welds with adapter 5 one end that is located the frame 15 inboard, and during the use, the radio frequency cable is pegged graft and is located the other end in the frame 15 outside at adapter 5 and can normally use.
In one embodiment, the heat conducting substrate 4 is made of copper and has high thermal conductivity.
In one embodiment, the heat dissipation substrate 1 and the heat conduction block 3 are made of aluminum, so that the material cost can be reduced on the premise of meeting the heat dissipation requirement, and the heat dissipation substrate 1 and the heat conduction block 3 can also be made of copper materials, so that the heat dissipation efficiency is improved.
In one embodiment, optionally, the heat pipe 2 or/and the heat conducting block 3 is fixed in the first groove 11, for example, but not limited to, by a heat conducting glue. Further optionally, the heat conducting substrate 4 is fixed in the second recess 12, for example, but not limited to, by a heat conducting glue.
The advantages of fixing by the heat-conducting glue are that: the gap between the heat pipe, the heat conducting block and the heat conducting substrate and the heat radiating base body can be filled, and the heat radiating efficiency of solid heat conduction is accelerated.
In one embodiment, the heat dissipating base 1, the heat dissipating fins 13, the positioning posts 14, and the frame 15 are integrally cast or cut.
A plurality of the power amplifier heat dissipation devices 100 may be spliced into a large heat dissipation device to mount a plurality of circuit boards of a power amplifier module.
Example 2
This embodiment 2 provides a power amplifier module, as shown in fig. 2-4, including a cover plate 300, a circuit board 200 and the power amplifier heat dissipation device 100 in embodiment 1, where the circuit board 200 is installed on an installation surface 10 of the power amplifier heat dissipation device 100, a main heating position of the circuit board 200 is attached to the heat conduction substrate 4, the cover plate 300 is fixed on the frame 15 through the cooperation of screws and screw holes 151, a side of the cover plate 300 facing the circuit board 200 is provided with a plurality of rib plates 301, and after the screws are tightened, the rib plates 301 press the circuit board 200 to abut against the installation surface 10.
In one embodiment, the cover plate 300 is made of aluminum.
Further, a conductive adhesive 302 is adhered to the top end of the rib 301, and the conductive adhesive 302 abuts against the circuit board, and the main function is to shield the electromagnetic signal, so that a clean electromagnetic environment is formed between the cover plate 300 and the heat dissipation base 100.
As shown in fig. 5-6, the heat conducting block 3 contacts the heat pipe 5, the heat conducting block 3 abuts against the side wall of the first groove 11, three solid heat conducting directions X1, X2 and X3 can be formed, heat in the X1 direction can be transferred out through air flowing on the heat radiating fins 13, heat in the X2 and X3 directions can be transferred to the heat radiating base body 1 through the side wall of the heat conducting block 3, the number of solid heat conducting heat radiating directions is increased to three through the heat conducting block 3, and the heat radiating efficiency can be greatly accelerated.
Example 3 real time
This embodiment 3 provides a portable frequency interferometer, which uses the power amplifier module in embodiment 2.
Optionally, the power amplifier module in this embodiment may also be applied to the driving field of low-frequency high-power loads such as motor systems and high-power ultrasonic devices.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention should be covered by the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. A power amplifier heat abstractor, its characterized in that includes:
the power amplifier module comprises a heat dissipation base body, a first connecting piece and a second connecting piece, wherein one side surface of the heat dissipation base body is used as an installation surface for installing a circuit board of the power amplifier module, and the installation surface is provided with a first groove and a second groove which are intersected;
the heat pipe is fixed at the bottom of the first groove;
the heat conducting substrate is embedded in the second groove and is pressed on the heat pipe in a pressing mode, and the upper surface of the heat conducting substrate is flush with the mounting surface and is used for being in contact with the position, where the power amplifier chip is arranged, on the circuit board;
and the heat conducting blocks are sequentially embedded in the first grooves at intervals and are pressed on the heat pipe in a pressing manner, and the upper surface of the heat conducting blocks is not higher than the mounting surface and is used for increasing the heat exchange area between the heat pipe and the heat dissipation base body.
2. The power amplifier heat dissipation device of claim 1, wherein an upper surface of the heat conduction block is lower than the mounting surface, and a plurality of heat dissipation fins are disposed on the other side surface of the heat dissipation base body opposite to the mounting surface.
3. The power amplifier heat dissipation device of claim 1, wherein a plurality of positioning posts for positioning the circuit board are disposed on the mounting surface, a frame protruding from the mounting surface is disposed at an edge of the mounting surface, the circuit board is mounted in an area surrounded by the frame, a transfer connector for connecting the circuit board and a radio frequency cable is disposed on the frame, and a plurality of screw holes are disposed at a top of the frame.
4. A power amplifier heat sink according to any one of claims 1-3, wherein the heat pipe is a hollow copper pipe, and the interior of the heat pipe is filled with a heat dissipation medium.
5. The power amplifier heat dissipation device of claim 4, wherein the heat dissipation substrate and the heat conduction block are both made of aluminum or copper; the heat conducting substrate is made of copper.
6. The power amplifier heat dissipation device of claim 4, wherein the cross-sections of the first groove and the heat conduction block are in an inverted trapezoid shape.
7. The power amplifier heat dissipation device of claim 4, wherein the heat pipe and/or the heat conduction block are fixed in the first groove by a heat conduction adhesive, and the heat conduction substrate is fixed in the second groove by a heat conduction adhesive.
8. The power amplifier heat dissipation device of claim 7, wherein the thermal conductive paste fills gaps between the heat pipe, the thermal conductive block, and the thermal conductive substrate and the heat dissipation substrate to increase heat dissipation efficiency of solid thermal conduction.
9. A power amplifier module, characterized in that, includes apron, circuit board, and any one of claims 1-8 the power amplifier heat abstractor, the circuit board is installed on power amplifier heat abstractor's installation face, the apron sets up in the circuit board top, and with power amplifier heat abstractor is connected, be provided with a plurality of floor on the apron towards a side of circuit board, the floor compresses tightly the circuit board on the installation face, wherein, the floor is used for shielding electromagnetic signal.
10. A portable frequency interferometer, characterized in that a power amplifier module according to claim 9 is applied.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221701332.9U CN217985819U (en) | 2022-07-04 | 2022-07-04 | Power amplifier heat abstractor, power amplifier module and portable frequency interference appearance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221701332.9U CN217985819U (en) | 2022-07-04 | 2022-07-04 | Power amplifier heat abstractor, power amplifier module and portable frequency interference appearance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217985819U true CN217985819U (en) | 2022-12-06 |
Family
ID=84275739
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221701332.9U Active CN217985819U (en) | 2022-07-04 | 2022-07-04 | Power amplifier heat abstractor, power amplifier module and portable frequency interference appearance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217985819U (en) |
-
2022
- 2022-07-04 CN CN202221701332.9U patent/CN217985819U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108924393B (en) | Heat radiation structure of large target surface image sensor | |
| JP2009223881A (en) | Radio communication apparatus | |
| CN210470147U (en) | Power device heat abstractor and motor driver | |
| CN217985819U (en) | Power amplifier heat abstractor, power amplifier module and portable frequency interference appearance | |
| CN207282486U (en) | A kind of fixed structure, controller and the electric car of controller metal-oxide-semiconductor | |
| JP2790044B2 (en) | Power amplifier heat dissipation mounting structure | |
| CN210042640U (en) | Electronic equipment and power module thereof | |
| CN209594178U (en) | A kind of switching tube radiator structure and vehicle power supply | |
| CN220629923U (en) | Heat radiation structure of audio equipment | |
| CN220274107U (en) | Chip heat dissipation assembly and high-efficiency heat dissipation controller applying same | |
| CN213692022U (en) | IGBT single tube heat dissipation and electrical connection device | |
| CN214038707U (en) | Automatically controlled box conducting strip mounting structure, automatically controlled box and air conditioner thereof | |
| CN219395398U (en) | Gateway equipment with good heat dissipation effect | |
| CN216218460U (en) | High-efficient natural heat radiation structure of signal processing board | |
| CN218296028U (en) | Heat transfer mechanism, electric appliance box, outdoor unit and air conditioning system | |
| CN220021110U (en) | Power semiconductor module | |
| CN219046591U (en) | Circuit board chip radiating shell | |
| CN215773699U (en) | High heat conduction chip package copper-based circuit board | |
| CN218830767U (en) | PCB heat radiation structure | |
| CN216391508U (en) | High heat conduction circuit board | |
| CN216413231U (en) | Heat radiation structure of phased array antenna, phased array antenna and satellite platform | |
| CN219999861U (en) | Heat radiating device and electronic element | |
| CN211509670U (en) | Mounting structure of high-efficient heat dissipation circuit board | |
| CN215188083U (en) | Chassis and robot | |
| JP3512013B2 (en) | Power supply for magnetron drive |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |