CN219395398U - Gateway equipment with good heat dissipation effect - Google Patents
Gateway equipment with good heat dissipation effect Download PDFInfo
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- CN219395398U CN219395398U CN202320294870.9U CN202320294870U CN219395398U CN 219395398 U CN219395398 U CN 219395398U CN 202320294870 U CN202320294870 U CN 202320294870U CN 219395398 U CN219395398 U CN 219395398U
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- metal
- heat conduction
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- heat
- bracket
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
- Y02A30/00—Adapting or protecting infrastructure or their operation
Abstract
The utility model relates to the technical field of heat dissipation of electronic products, and particularly discloses gateway equipment with good metal heat conduction and heat dissipation effects through a metal heat conduction bracket, which comprises a U-shaped metal bottom shell, a metal surface shell, a metal front cover and a metal rear cover, wherein an accommodating space is formed by surrounding the U-shaped metal bottom shell, the metal surface shell, the metal front cover and the metal rear cover; the top of the metal heat conduction support is provided with a plurality of heat conduction fins which are abutted with the bottom surface of the metal surface shell, and the two sides of the metal heat conduction support are provided with heat conduction silver paste layers which are respectively abutted with the metal heat conduction support and the inner side surface of the U-shaped metal bottom shell.
Description
Technical Field
The utility model relates to the technical field of heat dissipation of electronic products, in particular to gateway equipment with good heat dissipation effect.
Background
The gateway equipment is an industrial intelligent gateway which has strong edge computing capability, supports remote self-defined configuration, integrates the technologies of remote deployment, gateway state monitoring and the like into a whole and is embedded with a network operating system, a chip, a communication module, a storage module and the like are often arranged in the gateway equipment, and when the gateway equipment is used, the heating value of the parts is large, and the heat needs to be emitted in time so as to avoid overheat burnout of an electric element. At present, heat dissipation of gateway equipment is mainly realized through setting up heat dissipation net or heat conduction fin on the shell of equipment, and the heat that electrical component work produced is conducted to the shell through the air in the shell to disperse through the heat dissipation net or the heat conduction fin on shell surface, because air heat conduction effect is relatively poor, the heat of shell inner chamber is difficult to in time derive, and then makes heat conduction and the radiating effect of product not enough.
Disclosure of Invention
In view of the above, it is necessary to provide a gateway device having a good heat dissipation effect.
The gateway equipment with good heat dissipation effect comprises a U-shaped metal bottom shell, a metal surface shell, a metal front cover and a metal rear cover, wherein the metal surface shell is covered on the top of the U-shaped metal bottom shell; the top of metal heat conduction support is equipped with a plurality of heat conduction fins, each heat conduction fin respectively with the bottom surface butt of metal face shell, the both sides side of metal heat conduction support is equipped with the heat conduction silver paste layer, the heat conduction silver paste layer respectively with the medial surface butt of the lateral surface of metal heat conduction support and U type metal drain pan.
In one embodiment, the U-shaped metal bottom shell, the metal face shell, the metal front cover, the metal rear cover and the metal heat conducting bracket are respectively made of 6063 aluminum alloy materials.
In one embodiment, two opposite outer sides of the metal heat conduction support are respectively provided with a limiting bayonet, and the heat conduction silver paste layer is embedded in the limiting bayonet and is respectively attached to the outer side of the metal heat conduction support and the inner side of the U-shaped metal bottom shell.
In one embodiment, mounting notches are formed on two sides of the top of the metal heat conduction support, and the bottom surface of the metal surface shell is convex and forms concave-convex matching convex blocks with the mounting notches.
In one embodiment, the metal heat conduction bracket comprises a bottom plate, at least two heat conduction pipes arranged on the upper surface of the bottom plate at intervals, and a plurality of heat conduction fins arranged between the heat conduction pipes and outside the heat conduction pipes, wherein the top surfaces of the heat conduction pipes are flush with the top surfaces of the heat conduction fins; the lower surface interval of bottom plate sets up a plurality of stabilizer blades, the stabilizer blade wears to establish the PCB board and with the horizontal portion fixed connection of U type metal drain pan, form the control area that is used for acceping chip, communication module and storage module between bottom plate's lower surface and the PCB board.
In one embodiment, the inner side surface of the vertical part of the U-shaped metal bottom shell is provided with a clamping groove for embedding the PCB.
In one embodiment, a positioning column is arranged on the upper surface of the transverse part of the U-shaped metal bottom shell, a threaded hole is formed in the positioning column, and the metal heat conduction bracket is fixedly connected with the U-shaped metal bottom shell through a bolt penetrating through the supporting leg, the PCB and inserted into the threaded hole.
In one embodiment, the metal surface shell is in concave-convex fit connection with the U-shaped metal bottom shell, and the metal front cover and the metal rear cover are respectively in screw connection with the U-shaped metal bottom shell.
In one embodiment, the metal front cover is provided with a DC socket, an LED lamp and an HDMI (high-definition multimedia interface) which are electrically connected with the PCB, and also comprises an Ethernet interface which is electrically connected with the communication module, a USB interface and an I/O interface which are electrically connected with the storage module; and the metal rear cover is provided with an antenna electrically connected with the communication module.
According to the gateway equipment with good heat dissipation effect, the metal heat conduction bracket is arranged in the accommodating space formed by surrounding the U-shaped metal bottom shell, the metal surface shell, the metal front cover and the metal rear cover, so that the PCB board is positioned, meanwhile, the top of the metal heat conduction bracket is directly abutted with the metal surface shell, the side surface of the metal heat conduction bracket is abutted with the vertical part of the U-shaped metal bottom shell through the heat conduction silver paste layer, the bottom of the metal heat conduction bracket is abutted with the transverse part of the U-shaped metal bottom shell, the PCB board is directly contacted with the vertical part of the U-shaped metal bottom shell, the metal heat conduction bracket is attached to each electric element through the heat conduction pad, when the PCB board and other electric elements generate heat, the heat is directly transferred to the metal surface shell and the U-shaped metal bottom shell through the metal heat conduction bracket and is led out, the heat transfer efficiency is improved, the heat conduction fin design on the metal heat conduction bracket increases the contact area between air in the accommodating space and the metal heat conduction bracket, the heat in the air is rapidly conducted to the metal surface shell and the U-shaped metal bottom shell to be dispersed, and the effect of the gateway equipment is remarkably improved.
Drawings
Fig. 1 is a schematic structural diagram of a gateway device according to an embodiment of the present utility model;
fig. 2 is a schematic cross-sectional structure of a gateway device according to an embodiment of the present utility model;
FIG. 3 is a schematic diagram of an exploded structure of a gateway device with a metallic front cover and a metallic back cover removed according to an embodiment of the present utility model;
fig. 4 is a schematic diagram of an exploded structure of the gateway device with a housing removed according to an embodiment of the present utility model.
Detailed Description
In order that the above objects, features and advantages of the utility model will be readily understood, a more particular description of the utility model will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present utility model. The present utility model may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the utility model, whereby the utility model is not limited to the specific embodiments disclosed below.
Aiming at the technical problem that the heat generated by an electric element is transferred to a shell through air conduction by the traditional gateway equipment, and the radiating effect is insufficient, the utility model provides the gateway equipment, which uses the metal heat conduction support as a main heat conduction device and realizes the bonding of the metal heat conduction support and the electric element which generates heat and the metal heat conduction support and the shell through various heat conduction components, so that the heat generated by the electric element during operation is transferred to the metal heat conduction support through the various heat conduction components, is further transferred to the shell through the metal heat conduction support and is radiated to the outside, the whole gateway equipment adopts metal heat conduction, and a small amount of heat is conducted through the air, thereby remarkably improving the heat conduction efficiency in the shell and improving the radiating effect of the gateway equipment.
Specifically, please refer to fig. 1-4, the gateway device with good heat dissipation effect in the present embodiment includes a housing for accommodating the electrical components of the gateway device and for dissipating heat from the electrical components, so as to avoid the problem of damage to the electrical components caused by heat accumulation in the housing. In this embodiment, the housing includes a U-shaped metal bottom shell 100, a metal surface shell 200 covering the top of the U-shaped metal bottom shell 100, a metal front cover 300 and a metal rear cover 400 disposed opposite to two end surfaces of the U-shaped metal bottom shell 100 and fixedly connected to the U-shaped metal bottom shell 100, where the U-shaped metal bottom shell 100, the metal surface shell 200, the metal front cover 300 and the metal rear cover 400 surround to form an accommodating space. The U-shaped metal bottom case 100 includes a transverse portion and vertical portions disposed opposite to both sides of the transverse portion, and both sides of the transverse portion of the U-shaped metal bottom case 100 are further provided with lugs 101, and the lugs 101 are provided with mounting holes to fix the gateway device. In this embodiment, the metal shell 200 is in concave-convex fit connection with the U-shaped metal bottom shell 100. Preferably, the top of the vertical portion of the U-shaped metal bottom shell 100 is provided with a flange 110, the bottom surface of the metal surface shell 200 is provided with a socket 210 that is in concave-convex fit with the flange 110, the vertical section of the flange 110 is in a major arc structure, and the inner contour of the socket 210 is adapted to the outer contour of the flange 110, so as to realize the clamping connection between the metal surface shell 200 and the U-shaped metal bottom shell 100. The metal front cover 300 and the metal rear cover 400 are respectively screw-coupled with the U-shaped metal bottom chassis 100 so that the electrical components in the receiving space are inspected by removing the metal front cover 300 and the metal rear cover 400 or the electrical components are mounted in the receiving space when the device is assembled.
The outer side surface of the U-shaped metal bottom case 100 and the outer surface of the metal surface case 200 are respectively provided with a plurality of heat dissipation strips 500, specifically, the outer surface of the vertical portion of the U-shaped metal bottom case 100 and the outer surface of the metal surface case 200 are respectively provided with a plurality of protrusions at intervals to form the heat dissipation strips 500, and the heat dissipation strips 500 are used for increasing the surface areas of the U-shaped metal bottom case 100 and the metal surface case 200, namely increasing the heat exchange areas of air in the external environment and the U-shaped metal bottom case 100 and the metal surface case 200, so as to accelerate the heat dissipation speed. The accommodating space is provided with a PCB 600, in this embodiment, the PCB 600 is adjacent to the lateral portion of the U-shaped metal bottom shell 100, and two sides of the PCB 600 are fixedly connected with the inner side surface of the vertical portion of the U-shaped metal bottom shell 100, which can, of course, also fix the PCB 600 on the lateral portion of the U-shaped metal bottom shell 100 through screws. A metal heat conduction bracket 700 is arranged between the PCB 600 and the metal surface shell 200, and the metal heat conduction bracket 700 penetrates through the PCB 600 and is fixedly connected with the U-shaped metal bottom shell 100. In this embodiment, the PCB 600 is provided with a through hole for providing a connection channel between the metal heat conduction bracket 700 and the U-shaped metal bottom case 100.
The chip 610, the communication module 620 and the storage module 630 are arranged between the metal heat conduction bracket 700 and the PCB 600, the chip 610, the communication module 620 and the storage module 630 are respectively attached to the bottom of the metal heat conduction bracket 700 through the heat conduction pad 800, in this embodiment, one surface of the heat conduction pad 800 is attached to the bottom of the metal heat conduction bracket 700, and the other surface of the heat conduction pad 800 is attached to the chip 610, the communication module 620 or the storage module 630, however, one surface of the heat conduction pad 800 can be attached to the chip 610, the communication module 620 or the storage module 630, and the other surface of the heat conduction pad 800 is attached to the bottom of the metal heat conduction bracket 700. The top of the metal heat conduction bracket 700 is provided with a plurality of heat conduction fins 710, each heat conduction fin 710 is respectively abutted with the bottom surface of the metal surface shell 200, two sides of the metal heat conduction bracket 700 are provided with heat conduction silver paste layers 900, and the heat conduction silver paste layers 900 are respectively abutted with the outer side surface of the metal heat conduction bracket 700 and the inner side surface of the U-shaped metal bottom shell 100. In this embodiment, the top surface of the heat conducting fin 710 is a plane, and both side surfaces of the heat conducting silver paste layer 900 are planes, so when the heat conducting fin 710 abuts against the bottom surface of the metal shell 200, the heat conducting fin will be attached to the bottom surface of the metal shell 200, and similarly, the heat conducting silver paste layer 900 is attached to the outer side surface of the metal heat conducting bracket 700 and the inner side surface of the U-shaped metal bottom shell 100, respectively, so as to increase the heat conducting area between the metal heat conducting bracket 700 and the metal shell 200, and between the metal heat conducting bracket and the U-shaped metal bottom shell 100.
In one embodiment, the U-shaped metal bottom case 100, the metal face case 200, the metal front cover 300, the metal rear cover 400 and the metal heat conduction bracket 700 are made of 6063 aluminum alloy material respectively. Further, the heat-conducting pad 800 is also made of 6063 aluminum alloy material. In this embodiment, the thermal conductivity of the U-shaped metal bottom case 100, the metal face case 200, the metal front cover 300, the metal rear cover 400, the metal thermal conductive bracket 700 and the thermal conductive pad 800 is 201w/m·k, and the thermal conductivity of the thermal conductive silver paste layer 900 is 8.5w/m·k. In other embodiments, the components described above may also be made of metallic copper or stainless steel materials.
In order to realize positioning and mounting of the heat-conducting silver paste layer 900, in an embodiment, two opposite outer sides of the metal heat-conducting bracket 700 are respectively provided with a limiting bayonet 720, and the heat-conducting silver paste layer 900 is embedded in the limiting bayonet 720 and is respectively attached to the outer side of the metal heat-conducting bracket 700 and the inner side of the U-shaped metal bottom shell 100. Preferably, the limiting bayonet 720 is a notch with an opening facing the outer side of the metal heat conduction bracket 700, and the thickness of the heat conduction silver paste layer 900 is equal to or slightly greater than the depth of the limiting bayonet 720, so that after the heat conduction silver paste layer 900 is embedded into the limiting bayonet 720, the outer side surface of the heat conduction silver paste layer 900 is attached to the inner side surface of the U-shaped metal bottom shell 100, so as to facilitate heat conduction between the metal heat conduction bracket 700 and the metal surface shell 200 and heat conduction between the metal heat conduction silver paste layer 900 and the U-shaped metal bottom shell 100.
Further, in order to achieve the limitation of the metal heat conduction bracket 700, in this embodiment, the two sides of the top of the metal heat conduction bracket 700 are provided with the mounting notches 730, the bottom surface of the metal surface shell 200 is convex and forms the convex-concave matching convex blocks 220 with the mounting notches 730, so that the metal heat conduction bracket 700 is positioned through the limit matching of the convex blocks 220 on the metal surface shell 200 and the mounting notches 730 on the edge of the metal heat conduction bracket 700, the influence of the shaking of the metal heat conduction bracket 700 on the electric elements in the shell when the gateway equipment is impacted by the outside in the storage and transportation link can be prevented, and the looseness of the heat conduction silver paste layer 900 and the heat conduction pad 800 can be avoided, so that the heat conduction effect in the gateway equipment shell is ensured.
In addition, in an embodiment, a clamping groove for embedding the PCB 600 is provided on the inner side surface of the vertical portion of the U-shaped metal bottom case 100. Preferably, the inner side surface of the vertical part of the U-shaped metal bottom shell 100 is provided with a plurality of protruding parts 120 along the height direction of the U-shaped metal bottom shell 100 at intervals, a clamping position is formed between two adjacent protruding parts 120, when the PCB 600 is installed, the PCB 600 can be installed by selecting the clamping position with the corresponding height according to the size of the accommodating space in the shell and the size of the metal heat conduction bracket 700, so that the PCB 600 is prevented from falling off from the U-shaped metal bottom shell 100, and meanwhile, the PCB 600 is convenient for transferring heat to the protruding parts 120, and then the heat is led out through the heat dissipation strip 500 on the outer surface of the U-shaped metal bottom shell 100.
In an embodiment, the metal heat-conducting bracket 700 includes a bottom plate 740, at least two heat-conducting pipes 750 disposed on the upper surface of the bottom plate 740 at intervals, and a plurality of heat-conducting fins 710 disposed between the heat-conducting pipes 750 and outside the heat-conducting pipes 750, wherein the top surfaces of the heat-conducting pipes 750 and the top surfaces of the heat-conducting fins 710 are flush, so as to ensure that the top surfaces of the heat-conducting pipes 750 and the top surfaces of the heat-conducting fins 710 are respectively attached to the bottom surface of the metal shell 200. The bottom surface of the bottom plate 740 is provided with a plurality of supporting legs 760 at intervals, the supporting legs 760 penetrate through the PCB 600 and are fixedly connected with the transverse portion of the U-shaped metal bottom shell 100, and a control area for accommodating the chip 610, the communication module 620 and the storage module 630 is formed between the bottom surface of the bottom plate 740 and the PCB 600. Further, the upper surface of the transverse portion of the U-shaped metal bottom shell 100 is provided with a positioning column 130, the positioning column 130 is provided with a threaded hole, and the metal heat conduction bracket 700 is fixedly connected with the U-shaped metal bottom shell 100 through a bolt penetrating through the supporting leg 760 and the PCB 600 and inserted into the threaded hole.
In addition, the metal front cover 300 is provided with a DC socket, an LED lamp and an HDMI interface which are electrically connected with the PCB 600, and a power supply conversion device which is electrically connected with the PCB 600 is also arranged in the control area, and the DC socket is electrically connected with the power supply conversion device so as to access current from the outside and supply power to the gateway equipment; the LED lamp is used for indicating the working state of the gateway device, and the HDMI interface is electrically connected to the chip 610, for accessing audio/video signals from outside. The metal front cover 300 further includes an ethernet interface electrically connected to the communication module 620, and a USB interface and an I/O interface electrically connected to the storage module 630, where the ethernet interface is used to connect to a network cable, so that the gateway device accesses an external network, and the USB interface and the I/O interface are used to access data signals from the outside. The metal back cover 400 is provided with an antenna 410 electrically connected to the communication module 620. In this embodiment, the interfaces on the metal front cover 300 are arranged in two layers, so that on one hand, routing management is facilitated, and on the other hand, the overall size of the gateway device can be reduced; the antenna 410 is arranged on the metal back cover 400, so that interference of other magnetic fields can be avoided, and the radio frequency effect is improved.
According to the gateway equipment with good heat dissipation effect, the metal heat conduction bracket 700 is arranged in the accommodating space formed by surrounding the U-shaped metal bottom shell 100, the metal surface shell 200, the metal front cover 300 and the metal rear cover 400, so that the PCB 600 is positioned, meanwhile, the heat transfer efficiency is improved, the design of the heat conduction bracket 700 on the metal heat conduction bracket 700 increases the contact area between the air in the accommodating space and the metal heat conduction bracket 700 because the top of the metal heat conduction bracket 700 is directly abutted with the metal surface shell 200 and the side surface of the metal heat conduction bracket 700 is abutted with the vertical part of the U-shaped metal bottom shell 100 through the heat conduction silver paste layer 900, the bottom of the metal heat conduction bracket 700 is directly abutted with the horizontal part of the U-shaped metal bottom shell 100, the PCB 600 is directly contacted with the vertical part of the U-shaped metal bottom shell 100, and each electric element is attached with the metal heat conduction bracket 700 through the heat conduction pad 800, and when the PCB 600 and other electric elements generate heat, the heat is directly transferred to the metal surface shell 200 and the U-shaped metal bottom shell 100 through the metal heat conduction bracket 700, the heat transfer efficiency is improved, the contact area between the air in the accommodating space and the metal heat conduction bracket 700 is increased, the heat dissipation effect of the gateway equipment is remarkably improved.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples illustrate only a few embodiments of the utility model, which are described in detail and are not to be construed as limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.
Claims (9)
1. The gateway equipment with the good heat dissipation effect is characterized by comprising a U-shaped metal bottom shell, a metal surface shell, a metal front cover and a metal rear cover, wherein the metal surface shell is covered on the top of the U-shaped metal bottom shell; the top of metal heat conduction support is equipped with a plurality of heat conduction fins, each heat conduction fin respectively with the bottom surface butt of metal face shell, the both sides side of metal heat conduction support is equipped with the heat conduction silver paste layer, the heat conduction silver paste layer respectively with the medial surface butt of the lateral surface of metal heat conduction support and U type metal drain pan.
2. The gateway device of claim 1, wherein the U-shaped metal bottom shell, metal face shell, metal front cover, metal rear cover, and metal thermally conductive bracket are each made of 6063 aluminum alloy material.
3. The gateway device according to claim 2, wherein two opposite outer sides of the metal heat conduction bracket are respectively provided with a limiting bayonet, and the heat conduction silver paste layer is embedded in the limiting bayonet and is respectively attached to the outer side of the metal heat conduction bracket and the inner side of the U-shaped metal bottom shell.
4. The gateway device of claim 3, wherein mounting notches are formed on two sides of the top of the metal heat conduction bracket, and the bottom surface of the metal face shell is convex and forms a convex-concave fit convex block with the mounting notches.
5. The gateway device of claim 4, wherein the metal heat conducting bracket comprises a bottom plate, at least two heat conducting pipes arranged on the upper surface of the bottom plate at intervals, and a plurality of heat conducting fins arranged between the heat conducting pipes and outside the heat conducting pipes, and the top surfaces of the heat conducting pipes are flush with the top surfaces of the heat conducting fins; the lower surface interval of bottom plate sets up a plurality of stabilizer blades, the stabilizer blade wears to establish the PCB board and with the horizontal portion fixed connection of U type metal drain pan, form the control area that is used for acceping chip, communication module and storage module between bottom plate's lower surface and the PCB board.
6. The gateway device of claim 5, wherein the inner side of the vertical portion of the U-shaped metal bottom case is provided with a slot for inserting a PCB board.
7. The gateway device of claim 6, wherein a positioning column is provided on an upper surface of a lateral portion of the U-shaped metal bottom shell, the positioning column is provided with a threaded hole, and the metal heat conduction bracket is fixedly connected with the U-shaped metal bottom shell through a bolt penetrating through the supporting leg, the PCB board and inserted into the threaded hole.
8. The gateway device of claim 7, wherein the metal face shell is in a concave-convex fit connection with the U-shaped metal bottom shell, and the metal front cover and the metal rear cover are respectively in screw connection with the U-shaped metal bottom shell.
9. The gateway device of claim 8, wherein the metal front cover is provided with a DC socket, an LED lamp and an HDMI interface which are electrically connected with the PCB, and further comprises an ethernet interface which is electrically connected with the communication module, and a USB interface and an I/O interface which are electrically connected with the storage module; and the metal rear cover is provided with an antenna electrically connected with the communication module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320294870.9U CN219395398U (en) | 2023-02-14 | 2023-02-14 | Gateway equipment with good heat dissipation effect |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320294870.9U CN219395398U (en) | 2023-02-14 | 2023-02-14 | Gateway equipment with good heat dissipation effect |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219395398U true CN219395398U (en) | 2023-07-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320294870.9U Active CN219395398U (en) | 2023-02-14 | 2023-02-14 | Gateway equipment with good heat dissipation effect |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219395398U (en) |
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2023
- 2023-02-14 CN CN202320294870.9U patent/CN219395398U/en active Active
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