CN210199360U - Heat radiation optical module - Google Patents
Heat radiation optical module Download PDFInfo
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- CN210199360U CN210199360U CN201921469994.6U CN201921469994U CN210199360U CN 210199360 U CN210199360 U CN 210199360U CN 201921469994 U CN201921469994 U CN 201921469994U CN 210199360 U CN210199360 U CN 210199360U
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- heat dissipation
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Abstract
The application relates to the technical field of signal conversion, especially, relate to a heat dissipation optical module, heat dissipation optical module includes: a housing and a heat dissipating member; the heat dissipation member is arranged in the shell; the heat dissipation member is in contact with the electronic component accommodated in the housing, and heat generated by the electronic component is transferred to the heat dissipation member; the casing is provided with the heat dissipation portion, and the heat dissipation component sets up in the heat dissipation portion at least partially, and the heat that transmits to the heat dissipation component is discharged outside the casing through the heat dissipation portion. The application provides a heat dissipation optical module can in time conduct the casing through the radiating part of casing through the main radiating part of radiating member as the heat that electronic components produced as the radiating part on the basis of accomplishing signal conversion, discharges the heat of transmission to the radiating member fast as supplementary radiating part through the casing, is showing and is improving the holistic radiating effect of optical module, effectively avoids electronic components to heat up and leads to operating condition to change.
Description
Technical Field
The application relates to the technical field of signal conversion, in particular to a radiating optical module.
Background
At present, the mainstream heat dissipation method in the industry mostly uses a zinc alloy shell structural member to dissipate heat by itself, and simultaneously, the zinc alloy shell structural member conducts heat to a stainless steel cage structure to dissipate heat. However, the thermal conductivity coefficient of the zinc alloy can only reach 113W/(mk) to the maximum, and when the power consumption of the chip inside the module is large, the heat distribution on the surface of the zinc alloy is uneven, the thermal resistance is large, the heat cannot be effectively conducted out in time, and the heat dissipation effect is not ideal.
SUMMERY OF THE UTILITY MODEL
The application aims to provide a radiating optical module to solve the technical problems that an optical module in the prior art cannot conduct heat out in time and the radiating effect is not ideal to a certain extent.
The application provides a thermal module that looses, includes: a housing and a heat dissipating member;
the heat dissipation member is disposed within the housing; the heat dissipation member is in contact with an electronic component accommodated in the housing, and heat generated by the electronic component is transferred to the heat dissipation member;
the casing is provided with a heat dissipation part, the heat dissipation member is at least partially arranged in the heat dissipation part, and heat transferred to the heat dissipation member is discharged out of the casing through the heat dissipation part.
In the above technical solution, the heat radiating portion is an opening provided in a surface of the housing, and the heat radiating member is exposed to an outside of the housing through the opening.
In any of the above technical solutions, further, the heat dissipation member includes a heat dissipation block and a heat conduction interface pad; the shape of the heat dissipation block is matched with that of the heat dissipation part, so that the heat dissipation block can be embedded in the heat dissipation part;
the heat conducting interface pad is arranged between one side surface of the heat dissipation block facing the shell and the electronic component.
In any of the above technical solutions, further, a protruding portion is disposed on an edge of the heat dissipating portion, a groove portion is disposed on a side edge of the heat dissipating block, and the protruding portion is adapted to the groove portion.
In any of the above technical solutions, further, the heat conductivity coefficient of the heat dissipation block is greater than 110 w/m · degree.
In any of the above technical solutions, further, the heat conducting interface pad is a heat conducting silicone pad or a heat conducting silicone pad.
In any of the above technical solutions, further, the housing includes a first cover and a second cover, and the first cover and the second cover can be fastened to each other; the heat dissipation portion is provided on one of the first cover and the second cover.
In any one of the above technical solutions, further, both the first cover body and the second cover body are metal cover bodies.
In any of the above technical solutions, further, a heat dissipation hole is formed in the other of the first cover and the second cover.
In any one of the above technical solutions, further, the heat radiation optical module further includes a PCBA, the PCBA is disposed in the housing, and the electronic component is disposed on the PCBA.
Compared with the prior art, the beneficial effect of this application is:
the application provides a thermal module that looses includes: a housing and a heat dissipating member; the heat dissipation member is arranged in the shell and is in contact with the electronic component accommodated in the shell, so that heat generated by the electronic component in the working process can be timely transferred to the heat dissipation member, and the damage of the electronic component caused by the accumulation of heat on the electronic component is avoided; the casing is provided with the heat dissipation portion, and the heat radiation component sets up in the heat dissipation portion at least partially for the heat that transmits to the heat radiation component can in time be outside the casing through the heat dissipation portion discharge, avoids the heat to gather and lead to on heat backward flow to electronic components on the heat radiation component, effectively improves the radiating effect to electronic components. In addition, because the heat dissipation component sets up in the heat dissipation portion to contact with the lateral wall of heat dissipation portion promptly the casing, make the heat not only can discharge to the casing outside can also pass through the lateral wall transmission of heat dissipation portion to the casing from the heat dissipation portion on, discharge through the casing, make the heat can discharge from a plurality of angles, show the promotion radiating effect.
It is thus clear that the heat dissipation optical module that this application provided can in time conduct the casing through the radiating part of casing through the heat dissipation component that heat radiation component produced electronic components as main radiating part on the basis of accomplishing signal conversion, discharges the heat of transmission to the radiating component fast as supplementary radiating part through the casing, is showing to improve the holistic radiating effect of optical module, effectively avoids electronic components to heat up and leads to operating condition to change.
Drawings
In order to more clearly illustrate the detailed description of the present application or the technical solutions in the prior art, the drawings needed to be used in the detailed description of the present application or the prior art description will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a cross-sectional view of a thermal module according to an embodiment of the present application;
fig. 2 is a top view of a thermal module according to an embodiment of the present disclosure;
fig. 3 is a schematic structural diagram of a thermal module according to an embodiment of the present application.
Reference numerals:
1-shell, 101-heat dissipation part, 102-first cover, 103-second cover, 2-heat dissipation component, 201-heat dissipation block, 202-heat conduction interface pad, 3-electronic component, 4-PCBA.
Detailed Description
The technical solutions of the present application will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are only some embodiments of the present application, but not all embodiments.
The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application.
All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
A thermal light module according to some embodiments of the present application is described below with reference to fig. 1 to 3.
Referring to fig. 1 to 3, an embodiment of the present application provides a thermal light module, including: a housing 1 and a heat radiation member 2; the heat dissipation member 2 is disposed inside the case 1; the heat dissipation member 2 is in contact with the electronic component 3 accommodated in the housing 1, and heat generated by the electronic component 3 is transferred to the heat dissipation member 2; the case 1 is provided with a heat radiating portion 101, the heat radiating member 2 is at least partially provided in the heat radiating portion 101, and the heat transferred to the heat radiating member 2 is discharged to the outside of the case 1 through the heat radiating portion 101.
Note that the heat dissipation member 2 is disposed at least partially in the heat dissipation portion 101 means that the heat dissipation member 2 may be disposed entirely in the heat dissipation portion 101 or partially in the heat dissipation portion 101, and thus heat can be exhausted to the outside of the housing 1 through the heat dissipation portion 101.
The application provides a thermal module that looses includes: a housing 1 and a heat radiation member 2; the heat dissipation member 2 is arranged in the shell 1, and the heat dissipation member 2 is in contact with the electronic component 3 accommodated in the shell 1, so that heat generated by the electronic component 3 in the working process can be timely transmitted to the heat dissipation member 2, and the damage to the electronic component 3 caused by the heat accumulated on the electronic component 3 is avoided; casing 1 is provided with heat dissipation portion 101, and heat radiation member 2 sets up in heat dissipation portion 101 at least partially for the heat that transmits to heat radiation member 2 can in time be outside heat dissipation portion 101 discharges to casing 1, avoids the heat to gather and leads to the heat to flow back to electronic components 3 on heat radiation member 2, effectively improves the radiating effect to electronic components 3. In addition, because the heat dissipation member 2 is disposed in the heat dissipation portion 101 and is in contact with the side wall of the heat dissipation portion 101, that is, the housing 1, heat can be discharged from the heat dissipation portion 101 to the outside of the housing 1 and can also be transferred to the housing 1 through the side wall of the heat dissipation portion 101, and the heat can be discharged from a plurality of angles through the housing 1, so that the heat dissipation effect is remarkably improved.
It can be seen that the heat dissipation optical module that this application provided can in time conduct the heat that electronic components 3 produced outside casing 1 through heat dissipation part 101 of casing 1 as main heat dissipation part through heat dissipation component 2 on the basis of accomplishing signal conversion, discharges the heat of transmission to heat dissipation component 2 fast as supplementary heat dissipation part through casing 1, is showing to improve the holistic radiating effect of optical module, effectively avoids electronic components 3 to heat up and leads to operating condition to change.
It should be noted that, the number and shape of the heat dissipation portions 101 and the heat dissipation members 2 are not limited, and may be adjusted according to the number and shape of the electronic components 3 in the housing 1, and optionally, the shapes of the heat dissipation portions 101 and the heat dissipation members 2 are the same as the surface shapes of the electronic components 3, so that the contact area between the electronic components 3 and the heat dissipation members 2 is the largest, and the heat dissipation effect is the best; the number of the heat dissipation parts 101 and the heat dissipation members 2 is the same as that of the electronic components 3, so that any electronic component 3 has the corresponding heat dissipation member 2 and the heat dissipation part 101 for heat dissipation, and the heat dissipation effect is ensured. Of course, an integral heat dissipation member 2 with a large area may also be selected, so that a side surface of the heat dissipation member 2 is simultaneously in contact with the surfaces of the plurality of electronic components 3, thereby ensuring the heat dissipation effect and simplifying the overall structure of the optical module.
In one embodiment of the present application, preferably, as shown in fig. 2, the heat dissipation portion 101 is an opening provided on a surface of the housing 1, and the heat dissipation member 2 is exposed to the outside of the housing 1 through the opening.
In this embodiment, after the heat generated by the electronic component 3 is transferred to the heat dissipation member 2, the heat is discharged out of the housing 1 through the heat dissipation portion 101 in time, so as to avoid heat accumulation.
In one embodiment of the present application, preferably, as shown in fig. 1 and 3, the heat dissipation member 2 includes a heat dissipation block 201 and a thermally conductive interface pad 202; the shape of the heat dissipation block 201 is matched with that of the heat dissipation part 101, so that the heat dissipation block 201 can be embedded in the heat dissipation part 101;
the thermal interface pad 202 is disposed between a surface of the heat slug 201 facing the inside of the housing 1 and the electronic component 3.
In this embodiment, the heat conducting interface pad 202 can adsorb the heat generated by the electronic component 3, thereby improving the conduction efficiency of the heat between the electronic component 3 and the heat dissipation block 201, enhancing the heat dissipation effect, and playing the roles of shock absorption, insulation, sealing and the like at the same time, thereby ensuring the normal operation of the electronic component 3.
The thickness of the thermal interface pad 202 is not limited, and is selected according to the height of the surface of the heat sink 201 away from the thermal interface pad 202 relative to the surface of the housing 1, preferably, the thermal interface pad 202 is disposed to make the surface of the heat sink 201 away from the thermal interface pad 202 flush with the surface of the housing 1 away from the thermal interface pad 202, and an external heat sink, such as a heat dissipation fan, is disposed on the outer surface of the housing 1, where the heat sink 201 is flush with the housing 1, so as to increase the contact area between the housing 1 and the heat sink 201 and the external heat sink, reduce the contact gap, and further enhance the heat dissipation effect.
It should be noted that, a side surface of the heat dissipation block 201 facing the electronic component 3 is not limited to a plane, and may form a curved surface according to the structure of the electronic component 3, or be provided with a boss or a groove, so as to be conveniently attached to the electronic component 3, and the heat conduction interface material has certain flexibility, and can be attached to the electronic component 3 along with the heat dissipation block 201, and the position between the two is relatively fixed, so that displacement is not likely to occur, in this case, the thickness of the heat conduction interface pad 202 can be reduced, and the heat conduction interface pad 202 can achieve a better heat conduction effect and insulation and protection effects on the electronic component 3 with a thinner thickness.
In an embodiment of the present application, preferably, a protruding portion (not shown) is disposed on an edge of the heat dissipation portion 101, and a groove portion (not shown) is disposed on a side edge of the heat dissipation block 201, and the protruding portion is adapted to the groove portion.
In this embodiment, when the heat dissipation block 201 is embedded and installed in the heat dissipation portion 101, the protruding portion on the edge of the heat dissipation portion 101 can be clamped into the groove portion on the side edge of the heat dissipation block 201, so that the heat dissipation block 201 and the heat dissipation portion 101 are relatively fixed, and the heat dissipation block 201 is prevented from moving and falling off to affect the heat dissipation effect.
In one embodiment of the present application, the thermal conductivity of the heatslug 201 is preferably greater than 110 watts/meter-degree.
In this embodiment, the heat dissipation block 201 is made of a metal or alloy having a thermal conductivity greater than 110 w/m · degree, such as copper and copper alloy, aluminum and aluminum alloy, but not limited thereto, the heat dissipation block may be made of a non-metal or aluminum nitride ceramic having a thermal conductivity also greater than 110 w/m · degree, and the material having a thermal conductivity greater than 110 w/m · degree has a significant thermal conductivity, so as to ensure a heat dissipation effect.
In one embodiment of the present application, the thermal interface pad 202 is preferably a thermal grease pad or a thermal silicone pad, as shown in fig. 1 and 3.
In this embodiment, the thermal interface pad 202 can be a thermal grease pad or a thermal silicone pad commonly used in the prior art, but not limited thereto, and other thermal interface materials such as a thermal pad made of a thermal insulating material, a thermal gel or a phase change material can achieve the same or similar effect, and can be used as an alternative to this embodiment and fall within the protection scope of the present application.
In one embodiment of the present application, preferably, as shown in fig. 3, the housing 1 includes a first cover 102 and a second cover 103, and the first cover 102 and the second cover 103 can be fastened to each other; the heat sink 101 is provided on one of the first cover 102 and the second cover 103.
In this embodiment, the first cover 102 and the second cover 103 are engaged with each other to form a housing space for housing the electronic component 3, the heat dissipation member 2, and other components and structures that enable the optical module to operate normally, and when the housing 1 is placed in the orientation shown in fig. 3, the first cover 102 is an upper cover, and the second cover 103 is a lower cover, and in this case, the heat dissipation portion 101 is provided on the first cover 102.
In one embodiment of the present application, it is preferable that the first cover 102 and the second cover 103 are both metal covers, as shown in fig. 3.
In this embodiment, the first cover 102 and the second cover 103 are made of common metal, such as zinc or zinc alloy, copper or copper alloy, but not limited thereto, so that the housing 1 has good thermal conductivity as well, and the heat dissipation portion 101 disposed on the housing 1 can assist in discharging the heat conducted to the heat dissipation member 2 out of the housing 1 in time. Preferably, the first cover 102 and the second cover 103 are made of metal with a thermal conductivity greater than 110 w/m.
In an embodiment of the present application, as shown in fig. 1 to 3, a heat dissipation hole (not shown) is preferably formed on the other of the first cover 102 and the second cover 103.
In this embodiment, when the housing 1 is placed in the orientation shown in fig. 3, the heat dissipation holes are disposed on the second cover 103, and the number and shape of the heat dissipation holes are not limited, and when the number of the heat dissipation holes is multiple, the heat dissipation holes can be distributed on the surface and the side of the second cover 103, so that the amount of the electronic components can be discharged from various angles, and the heat dissipation effect is enhanced.
In one embodiment of the present application, preferably, as shown in fig. 1 and 3, the thermal module further includes a PCBA4, the PCBA4 is disposed in the housing 1, and the electronic component 3 is disposed on the PCBA 4.
In this embodiment, a PCBA4(Printed Circuit Board + Assembly Board) is disposed inside the housing 1, and it should be noted that the PCBA is formed by a PCB (Printed Circuit Board) on which electronic components are mounted, and the PCB is used for supporting the electronic components and is used as a carrier for electrical connection of the electronic components.
Finally, it should be noted that: the above embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.
Claims (10)
1. A thermal module, comprising: a housing and a heat dissipating member;
the heat dissipation member is disposed within the housing; the heat dissipation member is in contact with an electronic component accommodated in the housing, and heat generated by the electronic component is transferred to the heat dissipation member;
the casing is provided with a heat dissipation part, the heat dissipation member is at least partially arranged in the heat dissipation part, and heat transferred to the heat dissipation member is discharged out of the casing through the heat dissipation part.
2. The thermal module according to claim 1, wherein the heat dissipating portion is an opening provided on a surface of the housing, and the heat dissipating member is exposed to the outside of the housing through the opening.
3. The thermal module of claim 2 wherein the thermal dissipation member comprises a thermal slug and a thermally conductive interface pad; the shape of the heat dissipation block is matched with that of the heat dissipation part, so that the heat dissipation block can be embedded in the heat dissipation part;
the heat conducting interface pad is arranged between one side surface of the heat dissipation block facing the shell and the electronic component.
4. The thermal module of claim 3, wherein the edge of the heat dissipating portion has a protrusion, the side of the heat dissipating portion has a groove, and the protrusion is adapted to the groove.
5. The thermal module of claim 3 wherein the thermal slug has a thermal conductivity greater than 110 watts/meter-degree.
6. The optical transceiver module as claimed in claim 3, wherein the thermal interface pad is a thermal silicone pad or a thermal silicone pad.
7. The optical module for dissipating heat according to claim 1, wherein the housing includes a first cover and a second cover, the first cover and the second cover being capable of being engaged with each other; the heat dissipation portion is provided on one of the first cover and the second cover.
8. The thermal optical module of claim 7, wherein the first cover and the second cover are both metal covers.
9. The thermal module as claimed in claim 7, wherein a heat dissipation hole is formed in the other of the first cover and the second cover.
10. The thermal module of any one of claims 1 to 9 further comprising a PCBA disposed within the housing, the electronic components being disposed on the PCBA.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921469994.6U CN210199360U (en) | 2019-09-04 | 2019-09-04 | Heat radiation optical module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921469994.6U CN210199360U (en) | 2019-09-04 | 2019-09-04 | Heat radiation optical module |
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| Publication Number | Publication Date |
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| CN210199360U true CN210199360U (en) | 2020-03-27 |
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| CN201921469994.6U Active CN210199360U (en) | 2019-09-04 | 2019-09-04 | Heat radiation optical module |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111465288A (en) * | 2020-05-09 | 2020-07-28 | 北京小马智行科技有限公司 | Protective housing subassembly and intelligent driving car |
| CN111638580A (en) * | 2020-07-26 | 2020-09-08 | 武汉永鼎光通科技有限公司 | High-speed radiating optical module tube structure |
| CN113448027A (en) * | 2021-06-17 | 2021-09-28 | 武汉光迅科技股份有限公司 | Optical module heat radiation structure, optical module and optical communication equipment |
| WO2022083149A1 (en) * | 2020-10-19 | 2022-04-28 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN114488423A (en) * | 2020-10-27 | 2022-05-13 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN114905028A (en) * | 2022-05-19 | 2022-08-16 | 深圳市宝田精工科技有限公司 | In-mold die-casting insert method and in-mold die-casting insert device based on optical communication module |
| WO2023231657A1 (en) * | 2022-06-01 | 2023-12-07 | 苏州旭创科技有限公司 | Optical module |
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2019
- 2019-09-04 CN CN201921469994.6U patent/CN210199360U/en active Active
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111465288A (en) * | 2020-05-09 | 2020-07-28 | 北京小马智行科技有限公司 | Protective housing subassembly and intelligent driving car |
| CN111465288B (en) * | 2020-05-09 | 2023-05-16 | 北京小马慧行科技有限公司 | Protective housing subassembly and intelligent driving car |
| CN111638580A (en) * | 2020-07-26 | 2020-09-08 | 武汉永鼎光通科技有限公司 | High-speed radiating optical module tube structure |
| WO2022083149A1 (en) * | 2020-10-19 | 2022-04-28 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN114488423A (en) * | 2020-10-27 | 2022-05-13 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN113448027A (en) * | 2021-06-17 | 2021-09-28 | 武汉光迅科技股份有限公司 | Optical module heat radiation structure, optical module and optical communication equipment |
| CN114905028A (en) * | 2022-05-19 | 2022-08-16 | 深圳市宝田精工科技有限公司 | In-mold die-casting insert method and in-mold die-casting insert device based on optical communication module |
| WO2023231657A1 (en) * | 2022-06-01 | 2023-12-07 | 苏州旭创科技有限公司 | Optical module |
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