CN216218460U

CN216218460U - High-efficient natural heat radiation structure of signal processing board

Info

Publication number: CN216218460U
Application number: CN202122655950.6U
Authority: CN
Inventors: 刘升华
Original assignee: Xi'an Tianyuan Electro Optical Technology Co ltd
Current assignee: Xi'an Tianyuan Electro Optical Technology Co ltd
Priority date: 2021-11-02
Filing date: 2021-11-02
Publication date: 2022-04-05
Anticipated expiration: 2031-11-02

Abstract

The utility model discloses a high-efficiency natural heat dissipation structure of a signal processing board, which comprises a case and the signal processing board arranged in the case; the signal processing board is provided with a high heat consumption chip and device, a low heat consumption chip and device, a signal processing heat dissipation plate in heat conduction contact with the low heat consumption chip and device is arranged on the front face of the signal processing board, a heat pipe heat dissipation assembly is arranged on the signal processing heat dissipation plate, a heat absorption end of the heat pipe heat dissipation assembly penetrates through the signal processing heat dissipation plate to be in heat conduction contact with the high heat consumption chip and device, and a heat dissipation end of the heat pipe heat dissipation assembly is located on the outer side of the case. The utility model enhances the heat dissipation capability of the signal processing board, thereby improving the thermal reliability of the case.

Description

High-efficient natural heat radiation structure of signal processing board

Technical Field

The utility model belongs to the field of electronic information, and relates to an efficient heat dissipation structure of a signal processing assembly.

Background

At present, in the field of electronic information, because a heating device in a case is required to be environment-adaptive, a full-sealing design must be adopted, and a heat dissipation mode must be adopted for natural heat dissipation, the dissipated heat is mainly transferred to a case body through an air medium in the case body and then dissipated by the case body. Because the thermal resistance of air is relatively high, the heat dissipation capability of the heat dissipation mode is very limited. In a case with high power, multiple chips and narrow space, the heat dissipation method cannot meet the natural heat dissipation requirement of the electronic equipment, and may cause the electronic equipment to fail due to overhigh temperature and even burn out the electronic equipment.

Disclosure of Invention

The utility model aims to provide an efficient natural heat dissipation structure of a signal processing board, which solves the problems of overhigh temperature of the signal processing board and slow heat dissipation of a case.

The utility model adopts the technical scheme that the high-efficiency natural heat dissipation structure of the signal processing board comprises a case and the signal processing board arranged in the case; the signal processing board is provided with a high heat consumption chip and device, a low heat consumption chip and device, a signal processing heat dissipation plate in heat conduction contact with the low heat consumption chip and device is arranged on the front face of the signal processing board, a heat pipe heat dissipation assembly is arranged on the signal processing heat dissipation plate, a heat absorption end of the heat pipe heat dissipation assembly penetrates through the signal processing heat dissipation plate to be in heat conduction contact with the high heat consumption chip and device, and a heat dissipation end of the heat pipe heat dissipation assembly is located on the outer side of the case.

Preferably, the back surface of the signal processing heat dissipation plate is provided with a plurality of first bosses, the first bosses correspond to the low heat consumption chips and the devices, and the front surface of the signal processing heat dissipation plate is provided with a plurality of first heat dissipation teeth at intervals.

Preferably, the heat pipe heat dissipation assembly comprises a heat dissipation plate, a heat absorption plate and a heat pipe; the heat dissipation plate is vertically fixed at one end of the heat absorption plate; the heat absorption plate is arranged on the signal processing heat dissipation plate, the front side and the back side of the heat absorption plate are respectively provided with a second boss at the corresponding position of the high heat consumption chip and the device, the heat absorption end of the heat pipe is fixedly connected with the second bosses, and the heat release end of the heat pipe is fixedly connected with the heat dissipation plate.

Preferably, a plurality of second heat dissipation teeth are arranged at intervals outside the heat dissipation plate.

Preferably, an opening is formed in an upper plate of the case, and the heat dissipation plate is installed at the opening.

Preferably, a heat conducting gasket is arranged between the second boss and the high heat consumption chip and device.

Preferably, the heat conductive pad is an elastic member.

Preferably, the material of the heat pipe heat dissipation component is aluminum.

The utility model has the beneficial effects that:

1. arranging a signal processing heat dissipation plate to dissipate heat of the low heat consumption chip and the device;

2. the heat pipe can quickly conduct heat generated by a high-heat-consumption chip and a device to the air, so that the heat reliability is ensured;

3. the number of the heat pipes can be increased or decreased at will according to the heat consumption of the product; the product can be bent at will according to the specific space and layout requirements of the product;

4. the first heat dissipation teeth and the second heat dissipation teeth are arranged, so that heat can be dissipated more rapidly.

5. The heat conducting pad is set to make the heat pipe radiating assembly contact closely with the high heat consumption chip and device.

Drawings

Fig. 1 is a partial sectional view of a high-efficiency natural heat dissipation structure of a signal processing board of the present invention.

Fig. 2 is a sectional view taken along line a-a of fig. 1.

Fig. 3 is a top view of an efficient natural heat dissipation structure of the signal processing board of the present invention.

Fig. 4 is a schematic diagram of a signal processing board structure according to the present invention.

Fig. 5 is a front view of the signal processing heat dissipation plate and the mounting position of the present invention.

Fig. 6 is a sectional view taken along line B-B in fig. 5.

Fig. 7 is a right side view of the heat pipe heat sink assembly of the present invention.

Fig. 8 is a front view of the heat pipe heat sink assembly of the present invention.

Fig. 9 is an opening view of the upper plate of the enclosure of the present invention.

Wherein: 1. the heat pipe heat dissipation device comprises a signal processing board, 2, a signal processing heat dissipation board, 201, first heat dissipation teeth, 202, an opening, 203, a first boss, 3, a heat pipe heat dissipation component, 301, a heat absorption board, 3011, a second boss, 302, a heat pipe, 303, a heat dissipation board, 304, second heat dissipation teeth, 4, a case, 5, a signal processing bottom board, 6 and a heat conduction gasket.

Detailed Description

The present invention will now be described in detail by way of preferred embodiments with reference to the accompanying drawings. Referring to fig. 1-9, wherein:

as shown in fig. 1 and fig. 2, the efficient natural heat dissipation structure of the signal processing board includes a signal processing board 1, a signal processing heat dissipation plate 2, a heat pipe heat dissipation assembly 3, a chassis 4, a signal processing bottom plate 5, and a heat conduction pad 6.

The signal processing board 1 is mounted on the signal processing board 5. As shown in fig. 4, the front surface of the signal processing board 1 is designed with many power chips and heating devices, which can be divided into high heat consumption chips and devices and low heat consumption chips and devices, wherein the FPGA chip and the DSP chip have large heat productivity and high unit heat density, and are high heat consumption chips.

And a signal processing heat radiation plate 2, wherein the signal processing heat radiation plate 2 covers the front surface of the signal processing plate 1. As shown in fig. 5 and fig. 6, the front surface of the signal processing heat sink 2 is provided with a first heat sink 201, and the signal processing heat sink 2 is provided with an opening 202 directly above the high heat dissipation chip and the device, wherein the size of the opening 202 is slightly larger than the cross-sectional size of the corresponding high heat dissipation chip and the device; the first boss 203 is designed on the back side of the signal processing heat dissipation plate 2 and is in heat conduction contact with the low heat consumption chip and the device of the signal processing plate 1, and the heat of the low heat consumption chip and the device is transferred to the first heat dissipation teeth 201 on the front side of the signal processing heat dissipation plate 2 through the first boss 203 and is diffused into the case 1, so that the heat reliability is ensured.

The heat pipe heat dissipation assembly 3, the heat absorption end of the heat pipe heat dissipation assembly passes through the signal processing heat dissipation plate to be in heat conduction contact with the high heat dissipation chip and the device, and the heat dissipation end of the heat pipe heat dissipation assembly is located outside the case, and comprises a heat absorption plate 301, a heat pipe 302, a heat dissipation plate 303 and a second heat dissipation tooth 304 which are all made of aluminum 6063 with high heat conductivity. The heat absorbing plate 301 corresponds to the position of high heat consumption chip and device, namely sets up the second boss 3011 on the position that corresponds FPGA chip and DSP chip, and the second boss 3011 sets up the positive and reverse side at the heat absorbing plate 301, and the size is the same with FPGA chip and DSP chip, and when the system work, the second boss 3011 of heat absorbing plate 301 reverse side can with FPGA chip and DSP chip heat conduction contact to play radiating effect. The heat absorbing end of the heat pipe 302 is welded with the second boss 3011 on the front surface of the heat absorbing plate 301. The heat releasing ends of the heat pipes 302 are welded with the heat dissipating plate 303 into a whole, and a plurality of second heat dissipating teeth 304 are arranged on the back surface of the heat dissipating plate at intervals, so that the heat dissipating area is maximized and the heat is uniform, the heat pipes 302 are arranged at intervals, and the heat releasing ends are distributed in a fan shape. It should be noted that the number of the heat pipes 302 can be increased or decreased arbitrarily according to the heat consumption of the product; the bending can be carried out at will according to the specific space and layout requirements of the product.

The case 4 is a box body and has good heat conduction performance, the upper plate of the case 4 is connected with the signal processing bottom plate 5, an opening is arranged at the joint of the upper plate and the heat dissipation plate 303, and the size of the opening is larger than the layout size of heat pipes on the reverse side of the heat dissipation plate 303 of the heat pipe heat dissipation assembly 3.

When the signal processing heat dissipation plate 2 is installed on the signal processing board, the first boss 203 on the signal processing heat dissipation plate 2 is required to be ensured to be in heat conduction connection with the low heat consumption chip and the device of the signal processing board 1; the heat absorbing plate 301 of the heat pipe radiating assembly 3 passes through the top opening of the case 5 and is installed on the signal processing radiating plate 2, and the second boss 3011 on the heat absorbing plate 301 needs to be in heat conduction connection with a high heat consumption chip, namely an FPGA chip and a DSP chip, on the signal processing plate 1; a gap of 0.4mm is designed between the second boss 3011 and the chip. In order to ensure the adhesion between the second boss 3011 and the chip and reduce the interface thermal resistance, a thermal pad 6 with high thermal conductivity and a thickness of 0.5mm is added between the second boss 3011 and the chip. The heat conducting gasket 6 is an elastic piece, and is stressed and compressed by 0.1mm when being installed, so that the heat absorbing plate 301 of the heat pipe radiating assembly 3 is ensured to be tightly contacted with the FPGA chip and the DSP chip, the thermal resistance is the lowest, and the radiating effect is the best.

When the heat dissipation device works, heat dissipated by the low-heat-consumption chip and the device can be transferred to the first heat dissipation teeth 201 through the first bosses 203 on the signal processing heat dissipation plate 2 and further diffused into the case; the heat dissipated by the high heat consumption chip, i.e. the FPGA chip and the DSP chip, penetrates through the heat conductive pad 6 and is transferred to the second boss 3011 and the heat absorbing plate 301 of the heat pipe heat dissipating assembly 3, the heat pipe 302 rapidly transfers the heat to the heat dissipating plate 303, the heat dissipating plate 303 transfers the heat to the second heat dissipating teeth 304 exposed in the air, and finally, the heat is diffused in the air, thereby ensuring the thermal reliability of the chip.

The utility model provides a high-efficiency natural heat dissipation structure of a signal processing board, which enhances the heat dissipation capability of the signal processing board, thereby improving the thermal reliability of a case.

Claims

1. A high-efficiency natural heat dissipation structure of a signal processing board is characterized by comprising a case and the signal processing board arranged in the case; the signal processing board is provided with a high heat consumption chip and device, a low heat consumption chip and device, a signal processing heat dissipation plate in heat conduction contact with the low heat consumption chip and device is arranged on the front face of the signal processing board, a heat pipe heat dissipation assembly is arranged on the signal processing heat dissipation plate, a heat absorption end of the heat pipe heat dissipation assembly penetrates through the signal processing heat dissipation plate to be in heat conduction contact with the high heat consumption chip and device, and a heat dissipation end of the heat pipe heat dissipation assembly is located on the outer side of the case.

2. The efficient natural heat dissipation structure of signal processing board as claimed in claim 1, wherein the back surface of the heat dissipation board is provided with a plurality of first bosses corresponding to the low heat dissipation chip and the device, and the front surface is provided with a plurality of first heat dissipation teeth at intervals.

3. The efficient natural heat dissipation structure of signal processing board according to claim 1, wherein the heat pipe heat dissipation assembly comprises a heat dissipation plate, a heat absorption plate, a heat pipe; the heat dissipation plate is vertically fixed at one end of the heat absorption plate; the heat absorption plate is arranged on the signal processing heat dissipation plate, and the front side and the back side of the heat absorption plate are provided with second bosses at positions corresponding to the high heat consumption chip and the device; the heat absorption end of the heat pipe is fixedly connected with the second boss, and the heat release end of the heat pipe is fixedly connected with the heat dissipation plate.

4. The efficient natural heat dissipation structure of signal processing board as claimed in claim 3, wherein a plurality of second heat dissipation teeth are spaced outside the heat dissipation plate.

5. A high-efficiency natural heat-dissipating structure of a signal processing board according to claim 3, wherein the upper plate of the casing is provided with an opening, and the heat-dissipating plate is mounted at the opening.

6. The efficient natural heat dissipation structure of signal processing board according to claim 3, wherein a heat conductive gasket is disposed between the second bump and the high heat dissipation chip and device.

7. The efficient natural heat dissipation structure of signal processing board according to claim 6, wherein the heat conductive pad is an elastic member.

8. The efficient natural heat dissipation structure of signal processing board according to claim 1, wherein the heat pipe heat dissipation assembly material is aluminum.