CN112601421A - High-efficient heat radiation structure of 3U airtight quick-witted case - Google Patents
High-efficient heat radiation structure of 3U airtight quick-witted case Download PDFInfo
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- CN112601421A CN112601421A CN202011397831.9A CN202011397831A CN112601421A CN 112601421 A CN112601421 A CN 112601421A CN 202011397831 A CN202011397831 A CN 202011397831A CN 112601421 A CN112601421 A CN 112601421A
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- plate
- heat dissipation
- side plate
- temperature
- heat
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- 230000005855 radiation Effects 0.000 title claims description 6
- 230000017525 heat dissipation Effects 0.000 claims abstract description 42
- 230000005494 condensation Effects 0.000 claims abstract description 10
- 238000009833 condensation Methods 0.000 claims abstract description 10
- 238000001704 evaporation Methods 0.000 claims abstract description 10
- 230000008020 evaporation Effects 0.000 claims abstract description 10
- 238000001816 cooling Methods 0.000 claims abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20309—Evaporators
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/03—Covers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/069—Other details of the casing, e.g. wall structure, passage for a connector, a cable, a shaft
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20318—Condensers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
- H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
Abstract
The invention discloses a 3U closed case efficient heat dissipation structure, which relates to the technical field of case heat dissipation and comprises a left side plate, a right side plate, a rear cover plate, a heat pipe heat dissipation device, a temperature-uniforming plate cold plate, a functional plate card and a locking device, wherein U-shaped guide rail slots are formed in corresponding positions on the left side plate and the right side plate, two sides of the temperature-uniforming plate cold plate provided with the functional plate card are correspondingly inserted into the U-shaped guide rail slots on the left side plate and the right side plate, and the locking device presses and contacts the temperature-uniforming plate cold plate with the left side plate and the right side; the heat pipe heat dissipation device is provided with an evaporation section and a condensation section, wherein the evaporation section is fixed on the surface of the cold plate of the temperature equalizing plate in a contact mode, and the condensation section is fixed on the surface of the rear cover plate in a contact mode. Based on the phase change heat dissipation cooling technology, the invention realizes a two-dimensional and three-dimensional heat conduction mode by utilizing the high heat conductivity of the temperature-equalizing plate and the heat pipe, thereby greatly improving the overall heat dissipation efficiency; the temperature of the working module is effectively reduced, so that the case can be used in a high-temperature environment and has the performance of anti-electromagnetic interference.
Description
Technical Field
The invention relates to the technical field of chassis heat dissipation, in particular to a high-efficiency heat dissipation structure of a 3U closed chassis.
Background
Generally, a closed chassis has functions of protecting internal devices, shielding electromagnetic radiation, and the like. On the premise of ensuring that the equipment bears various external environments and mechanical stress, the thermal design of the case aims to fully ensure the convective heat transfer, conduction and radiation and furthest dissipate the generated heat. Along with the development of the technology, more and more board cards have higher thermal power density, so that the thermal power consumption of the case is greatly improved, and the requirements of heat dissipation and low noise cannot be met. However, the heat dissipation capacity of the enclosed chassis is limited due to the long heat transfer path, the small conduction cross section and the large contact thermal resistance inside the enclosed chassis. At present, the working temperature of a high-power module in a closed case is higher, and the module arranged in the middle of the case can not be tightly attached to the wall of the case for heat dissipation, so that the normal work of the module is influenced.
In order to effectively solve the heat dissipation problem of the components in the electronic device, a temperature-equalizing plate and a heat pipe with better heat conduction efficiency based on the phase-change heat dissipation technology are respectively provided in the industry to effectively solve the heat dissipation problem. Compared with the heat conduction mode of the uniform temperature plate and the heat pipe, the heat conduction mode of the uniform temperature plate is two-dimensional and is a surface heat conduction mode, and the heat conduction mode of the heat pipe is a one-dimensional heat conduction mode (namely, remote heat dissipation), so that the heat dissipation requirement of the closed case can not be met only by adopting a structure of a single heat pipe or the uniform temperature plate.
Disclosure of Invention
The invention aims to overcome the defects in the prior art, provides the high-efficiency heat dissipation structure of the 3U closed case, can realize high-efficiency heat dissipation in a limited space, ensures the normal work of a functional board card, and has the advantages of simple structure, convenience in use, safety and reliability.
The purpose of the invention is achieved by the following technical scheme: the high-efficiency heat dissipation structure of the 3U closed case comprises a left side plate, a right side plate, a rear cover plate, a heat pipe heat dissipation device, a uniform temperature plate cold plate, a functional plate card and a locking device, wherein U-shaped guide rail slots are formed in corresponding positions on the left side plate and the right side plate, two sides of the uniform temperature plate cold plate provided with the functional plate card are correspondingly inserted into the U-shaped guide rail slots on the left side plate and the right side plate, and the uniform temperature plate cold plate is pressed and contacted with the left side plate and the right side plate by the locking device; the heat pipe heat dissipation device is provided with an evaporation section and a condensation section, wherein the evaporation section is fixed on the surface of the cold plate of the temperature equalizing plate in a contact mode, and the condensation section is fixed on the surface of the rear cover plate in a contact mode.
As a preferable technical scheme, a plurality of lightening grooves are formed on the outer sides of the left side plate and the right side plate.
Preferably, the roughness of the contact surface of the U-shaped guide rail slot is Ra1.6.
As the preferred technical scheme, a plurality of efficient radiating fins are uniformly distributed on the rear cover plate.
As an optimized technical scheme, a heat conducting pad is filled in a gap between the cold plate of the temperature equalizing plate and the contact surface of the functional plate card.
Preferably, the uniform temperature plate cold plate has a thermal conductivity of at least 2000W/m.K on a two-dimensional surface.
According to a preferable technical scheme, the heat pipe radiating device comprises two heat pipes and three guide plates, wherein the two heat pipes are bent by 90 degrees to form an L shape, one ends of the two heat pipes are fixed on the same guide plate at intervals to form an evaporation section, the other ends of the two heat pipes are respectively and symmetrically fixed on the other two guide plates to form a condensation section, and a 45 degree angle is formed between each heat pipe and the guide plate which is fixed together.
As a preferred technical scheme, the heat pipe is a circular pipe, and the guide plate is made of red copper.
The invention has the beneficial effects that:
1) based on the phase change heat dissipation cooling technology, the two-dimensional and three-dimensional heat conduction mode is realized by utilizing the high heat conductivity of the temperature equalizing plate and the heat pipe, so that the overall heat dissipation efficiency can be greatly improved;
2) the temperature of the working module is effectively reduced, and high-efficiency heat dissipation can be performed even if the high-power module is not in contact with the wall of the case in the closed case;
3) the sealed case structure with efficient heat dissipation is provided, so that the case has the advantages of good stability, no noise, corrosion resistance, dust resistance, electromagnetic interference resistance and capability of being used in a high-temperature environment.
Drawings
FIG. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a structural sectional view of the present invention.
Fig. 3 is a schematic structural diagram of a heat pipe heat dissipation device.
Description of reference numerals: the device comprises a left side plate 1, a right side plate 2, a rear cover plate 3, a heat pipe heat dissipation device 4, a temperature equalizing plate cold plate 5, a functional board card 6 and a locking device 7.
Detailed Description
The invention will be described in detail below with reference to the following drawings:
example (b): as shown in the attached figure 1, the 3U closed case efficient heat dissipation structure comprises a left side plate 1, a right side plate 2, a rear cover plate 3, a heat pipe heat dissipation device 4, a uniform temperature plate cold plate 5, a functional plate card 6 and a locking device 7, wherein U-shaped guide rail slots are formed in corresponding positions on the left side plate 1 and the right side plate 2, two sides of the uniform temperature plate cold plate 5 provided with the functional plate card 6 are correspondingly inserted into the U-shaped guide rail slots on the left side plate 1 and the right side plate 2, and the locking device 7 presses and contacts the uniform temperature plate cold plate 5 with the left side plate 1 and the right side plate 2; the heat pipe heat sink 4 has an evaporation section fixed on the surface of the cold plate 5 of the vapor chamber by screw contact and a condensation section fixed on the surface of the back cover plate 3 by screw contact.
Preferably, the roughness of the contact surface of the U-shaped guide rail slot is Ra1.6, so that the contact surface of the U-shaped guide rail slot is ensured to be attached to the cold plate 5 of the uniform temperature plate to the maximum extent. And a plurality of lightening grooves are formed in the outer sides of the left side plate 1 and the right side plate 2 and are used for increasing the heat exchange surface area and enhancing the radiation heat exchange. And a plurality of high-efficiency radiating fins with proper width-height ratio are uniformly distributed on the rear cover plate 3, so that heat is efficiently radiated through convection and radiation of the fins and air.
As shown in fig. 2, a gap between the contact surfaces of the cold plate 5 of the temperature equalizing plate and the functional board 6 is filled with a heat conducting pad to reduce the thermal conduction resistance between the two. The vapor chamber cold plate 5 has a thermal conductivity of 2000W/mK in a two-dimensional plane.
As shown in fig. 3, the heat pipe heat sink 4 includes two heat pipes 41 and three guide plates 42, wherein the two heat pipes 41 are bent 90 ° to form an L shape, one ends of the two heat pipes 41 are fixed (soldered) to the same guide plate 42 at intervals to form an evaporation section, the other ends of the two heat pipes 41 are respectively fixed (soldered) to the other two guide plates 42 symmetrically to form a condensation section, and a gap between each heat pipe 41 and the one guide plate 42 fixed together is 45 °. Preferably, the heat pipe 41 is a circular pipe, and the guide plate 42 is made of red copper; the guide plate 42 is provided with a semicircular groove at the welding position with the heat pipe 41.
The working principle of the invention is as follows: the structure of the invention utilizes the phase-change heat dissipation technology and simultaneously utilizes the temperature-equalizing plate and the heat pipe to conduct and dissipate heat. The heat conduction mode of the temperature equalizing plate is a two-dimensional heat conduction mode, and the heat conduction mode of the heat pipe is a one-dimensional heat conduction mode. The cold plate has two-dimensional and three-dimensional heat conduction modes on the whole, realizes the heat dissipation of the left side plate and the right side plate by the high-efficiency heat conduction of the cold plate, and can fully utilize the high-efficiency heat dissipation effect of the rear cover plate. The whole heat dissipation efficiency of the closed case is greatly improved.
It should be understood that equivalent substitutions and changes to the technical solution and the inventive concept of the present invention should be made by those skilled in the art to the protection scope of the appended claims.
Claims (8)
1. The utility model provides a high-efficient heat radiation structure of airtight quick-witted case of 3U which characterized in that: the heat pipe cooling device comprises a left side plate (1), a right side plate (2), a rear cover plate (3), a heat pipe cooling device (4), a temperature-equalizing plate cold plate (5), a functional board card (6) and a locking device (7), wherein U-shaped guide rail slots are formed in corresponding positions on the left side plate (1) and the right side plate (2), two sides of the temperature-equalizing plate cold plate (5) provided with the functional board card (6) are correspondingly inserted into the U-shaped guide rail slots on the left side plate (1) and the right side plate (2), and the locking device (7) enables the temperature-equalizing plate cold plate (5) to be in pressing contact with the left side plate (1) and the right side plate (2); the heat pipe heat dissipation device (4) is provided with an evaporation section and a condensation section, the evaporation section is in contact with and fixed on the surface of the cold plate (5) of the temperature-uniforming plate, and the condensation section is in contact with and fixed on the surface of the rear cover plate (3).
2. The efficient heat dissipation structure of a 3U enclosed chassis of claim 1, wherein: and a plurality of lightening grooves are formed in the outer sides of the left side plate (1) and the right side plate (2).
3. The efficient heat dissipation structure of a 3U enclosed chassis of claim 1, wherein: the roughness of the contact surface of the U-shaped guide rail slot is Ra1.6.
4. The efficient heat dissipation structure of a 3U enclosed chassis of claim 1, wherein: and a plurality of efficient radiating fins are uniformly distributed on the rear cover plate (3).
5. The efficient heat dissipation structure of a 3U enclosed chassis of claim 1, wherein: and a heat conducting pad is filled in a gap between the contact surfaces of the temperature equalizing plate cold plate (5) and the functional board card (6).
6. The efficient heat dissipation structure of a 3U enclosed chassis of claim 1, wherein: the cold plate (5) has a thermal conductivity of at least 2000W/m.K on a two-dimensional surface.
7. The efficient heat dissipation structure of a 3U enclosed chassis of claim 1, wherein: the heat pipe heat dissipation device (4) comprises two heat pipes (41) and three guide plates (42), wherein the two heat pipes (41) are bent by 90 degrees to form an L shape, one ends of the two heat pipes (41) are fixed on the same guide plate (42) at intervals to form an evaporation section, the other ends of the two heat pipes (41) are respectively and symmetrically fixed on the other two guide plates (42) to form a condensation section, and each heat pipe (41) and one guide plate (42) which is fixed together form a 45 degree angle.
8. The efficient heat dissipation structure of a 3U enclosed chassis of claim 7, wherein: the heat pipe (41) is a circular pipe, and the guide plate (42) is made of red copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011397831.9A CN112601421A (en) | 2020-12-04 | 2020-12-04 | High-efficient heat radiation structure of 3U airtight quick-witted case |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011397831.9A CN112601421A (en) | 2020-12-04 | 2020-12-04 | High-efficient heat radiation structure of 3U airtight quick-witted case |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112601421A true CN112601421A (en) | 2021-04-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011397831.9A Pending CN112601421A (en) | 2020-12-04 | 2020-12-04 | High-efficient heat radiation structure of 3U airtight quick-witted case |
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| Country | Link |
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| CN (1) | CN112601421A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114158241A (en) * | 2021-12-24 | 2022-03-08 | 深圳市华阳通达精密机械有限公司 | Radiating device for internal daughter board of case |
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| CN210744131U (en) * | 2019-12-19 | 2020-06-12 | 成都瑞迪威科技有限公司 | Heat radiation structure of phased array antenna |
| CN213522815U (en) * | 2020-08-18 | 2021-06-22 | 中国船舶重工集团公司第七一五研究所 | High-efficiency heat dissipation closed case based on phase change heat dissipation technology |
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2020
- 2020-12-04 CN CN202011397831.9A patent/CN112601421A/en active Pending
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| CN103199316A (en) * | 2013-04-19 | 2013-07-10 | 安科智慧城市技术（中国）有限公司 | Battery pack and heat radiation structure thereof |
| CN203289822U (en) * | 2013-06-25 | 2013-11-13 | 斯恩威（中国）自控系统工程有限公司 | Radiator for vehicle-mounted industrial personal computer |
| CN105511577A (en) * | 2015-12-08 | 2016-04-20 | 山东超越数控电子有限公司 | High heating flux module heat dissipation method combining uniform temperature plate and liquid cooling |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114158241A (en) * | 2021-12-24 | 2022-03-08 | 深圳市华阳通达精密机械有限公司 | Radiating device for internal daughter board of case |
| CN114158241B (en) * | 2021-12-24 | 2022-08-23 | 深圳市华阳通达精密机械有限公司 | Heat dissipation device for daughter board in case |
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