CN220171501U - Industrial control computer and computer - Google Patents

Abstract

The utility model provides an industrial personal computer and a computer. The industrial personal computer comprises: a CPU; a network chip; the first heat dissipation assembly comprises a first heat conduction piece and a first heat radiator, the CPU, the first heat conduction piece and the first heat radiator are in heat conduction fit in sequence, the first heat radiator comprises a first heat dissipation surface, and the area of the first heat dissipation surface is at least five hundred times of the heat dissipation area of the CPU; and the second heat dissipation assembly comprises a second heat conduction piece and a second heat radiator, the network chip, the second heat conduction piece and the second heat radiator are in heat conduction fit in sequence, the second heat radiator comprises a second heat dissipation surface, and the area of the second heat dissipation surface is at least fifty times that of the network chip. The industrial personal computer of the technical scheme can solve the problems of increased energy consumption and noise existing in the existing industrial personal computer radiating through the fan.

Description

Industrial control computer and computer

Technical Field

The utility model relates to the technical field of industrial control equipment, in particular to an industrial control computer and a computer.

Background

In the working process of the industrial personal computer, heat can be generated inside the industrial personal computer, and the heat needs to be dissipated in time, so that the safe and stable operation of the industrial personal computer is ensured. The CPU and the network chip in the industrial personal computer are components with the largest heat dissipation capacity, so that the working temperatures of the two components are kept within a specified temperature range, and the operation safety of the industrial personal computer can be ensured.

In the prior art known to the inventor, the component for radiating heat from the industrial personal computer is a fan, and the CPU and the network chip are connected with the fan through copper pipes or other heat conducting components, so that heat of the CPU and the network chip is radiated out of the industrial personal computer through the fan. The heat dissipation mode needs to provide kinetic energy for the fan due to the existence of the fan, so that energy consumption is increased, and the fan is noisy, so that noise pollution of different degrees can be caused.

Disclosure of Invention

The utility model mainly aims to provide an industrial personal computer and a computer, which can solve the problems of increased energy consumption and noise of the existing industrial personal computer radiating through a fan.

To achieve the above object, according to an aspect of the present utility model, there is provided an industrial personal computer comprising: a CPU; a network chip; the first heat dissipation assembly comprises a first heat conduction piece and a first heat radiator, the CPU, the first heat conduction piece and the first heat radiator are in heat conduction fit in sequence, the first heat radiator comprises a first heat dissipation surface, and the area of the first heat dissipation surface is at least five hundred times of the heat dissipation area of the CPU; and the second heat dissipation assembly comprises a second heat conduction piece and a second heat radiator, the network chip, the second heat conduction piece and the second heat radiator are in heat conduction fit in sequence, the second heat radiator comprises a second heat dissipation surface, and the area of the second heat dissipation surface is at least fifty times that of the network chip.

Further, the first radiator further comprises a first heat conducting surface and a first heat conducting pipe, the first heat conducting piece further comprises a second heat conducting surface, the first heat conducting surface is provided with a first groove, the first heat conducting pipe is arranged in the first groove, one surface of the first heat conducting pipe, which faces the second heat conducting surface, is a plane, the surface of the first heat conducting pipe is flush with the first heat conducting surface, and the second heat conducting surface is in heat conducting fit with the first heat conducting pipe.

Further, the first heat conduction pipe comprises a heat conduction section and a heat conduction section which are in heat conduction connection, the heat conduction section of the first heat conduction pipe is attached to the second heat conduction surface of the first heat conduction piece, and the heat conduction section of the first heat conduction pipe extends to each edge of the first heat conduction surface of the first radiator; or, the first heat conduction pipes comprise heat conduction sections and heat conduction sections which are in heat conduction connection, the plurality of first heat conduction pipes are arranged, the heat conduction sections of the plurality of first heat conduction pipes are arranged side by side or side by side, the heat conduction sections of the plurality of first heat conduction pipes are attached to the second heat conduction surface of the first heat conduction piece, and the heat conduction sections of the plurality of first heat conduction pipes extend to the edges of the first heat conduction surface of the first radiator respectively.

Further, the first heat conduction piece still includes third heat conduction face and second heat conduction pipe, second heat conduction pipe is including the first linkage segment, interlude and the second linkage segment that in proper order heat conduction is connected, the second recess has been seted up on the second heat conduction face, first linkage segment sets up in the second recess, the one side of first linkage segment orientation first radiator is the plane, this face of first linkage segment flushes with the second heat conduction face of first heat conduction piece, the first heat conduction laminating of this face of first heat conduction pipe and first radiator all with first linkage segment, the third recess has been seted up on the third heat conduction face, the second linkage segment sets up in the third recess, the one side of the second heat conduction face of second linkage segment deviating from first heat conduction piece is the plane, this face of second linkage segment flushes with the third heat conduction face of first heat conduction piece.

Further, the first heat conduction piece still includes first heat conduction pad, and first heat conduction pad sets up on the third heat conduction face of first heat conduction piece, and the second linkage segment of the third heat conduction face of first heat conduction piece and second heat conduction pipe all with the first face heat conduction laminating of first heat conduction pad, the second face and the CPU heat conduction laminating of first heat conduction pad.

Further, the first heat conducting member further includes a first heat conducting pad, and the heat radiating area of the CPU, the area of the first surface of the first heat conducting pad, the area of the third heat conducting surface of the first heat conducting member, the area of the second heat conducting surface of the first heat conducting member, and the area of the first heat radiating surface of the first heat radiator are sequentially increased.

Further, the second heat dissipation assembly further comprises a third heat conduction pipe, and the second heat conduction piece is in heat conduction connection with the second heat radiator through the third heat conduction pipe; and/or, the second heat conduction piece further comprises a fourth heat conduction surface, the second heat conduction piece further comprises a second heat conduction pad, the first surface of the second heat conduction pad is in heat conduction fit with the fourth heat conduction surface of the second heat conduction piece, and the second surface of the second heat conduction pad is in heat conduction fit with the network chip.

Further, the first radiator further comprises a first heat conduction pipe and a plurality of first radiating fins, the plurality of first radiating fins are uniformly distributed on the first radiating surface and occupy the whole area of the first radiating surface, and the first heat conduction pipe is in heat conduction fit with the first radiating fins; and/or the second radiator further comprises a plurality of second radiating fins, the second radiating fins are uniformly distributed on the second radiating surface and occupy the whole area of the second radiating surface, and the third heat conduction pipe is in heat conduction fit with the second radiating fins.

Further, the industrial personal computer further includes: the CPU, the network chip, the first heat conducting piece and the second heat conducting piece are all positioned in the case body, mounting through holes are formed in the side wall of the case body, and the second radiator is arranged in the mounting through holes in a penetrating mode; and the upper cover is arranged at the top of the case body, the first radiator is also arranged at the top of the case body, and the first radiator and the upper cover jointly seal the top of the case body.

According to another aspect of the present utility model, there is provided a computer including the industrial personal computer described above.

By applying the technical scheme of the utility model, the first heat dissipation component and the second heat dissipation component are respectively arranged for the CPU and the network chip, heat generated by the CPU is transmitted to the first heat radiator through the first heat conduction piece and is dissipated through the first heat radiator, heat generated by the network chip is transmitted to the second heat radiator through the second heat conduction piece and is dissipated through the second heat radiator, and as the area of the first heat dissipation surface of the first heat radiator is at least five hundred times of the heat dissipation area of the CPU, the area of the second heat dissipation surface of the second heat radiator is at least fifty times of the heat dissipation area of the network chip, so that most of heat generated by the CPU and the network chip can be dissipated, and further the working temperature of the CPU and the network chip can be kept within a specified temperature range. The fan is not required to be arranged, so that the energy consumption is relatively reduced, and noise pollution caused by starting the fan is avoided.

Drawings

The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the utility model. Attached at

In the figure:

fig. 1 shows a schematic structural diagram of an industrial personal computer according to an embodiment of the present utility model;

FIG. 2 shows an exploded view of the industrial personal computer of FIG. 1;

FIG. 3 is a schematic diagram illustrating a structure of the industrial personal computer of FIG. 1 except for a first heat sink;

FIG. 4 is a schematic diagram illustrating a structure of the industrial personal computer of FIG. 1 except for a first heat dissipation assembly;

FIG. 5 is a schematic diagram illustrating a first heat dissipation assembly of the industrial personal computer of FIG. 1;

FIG. 6 is a schematic diagram illustrating a first heat sink of the industrial personal computer of FIG. 1; and

fig. 7 is a schematic structural diagram illustrating a second heat dissipation assembly of the industrial personal computer of fig. 1.

Wherein the above figures include the following reference numerals:

10. a CPU; 20. a network chip; 30. a first heat dissipation assembly; 31. a first heat conductive member; 311. a second heat conduction pipe; 312. a first thermal pad; 32. a first heat sink; 321. a first heat conduction pipe; 322. a first heat sink; 40. a second heat dissipation assembly; 41. a second heat conductive member; 42. a second heat sink; 421. a second heat sink; 43. a third heat conduction pipe; 50. a case main body; 51. mounting through holes; 60. and (5) an upper cover.

Detailed Description

It should be noted that, without conflict, the embodiments of the present utility model and features of the embodiments may be combined with each other. The utility model will be described in detail below with reference to the drawings in connection with embodiments.

It should be noted that, the first heat dissipation surface of the first heat dissipation device 32 described below is the lower surface of the first heat dissipation device 32 in fig. 5 and 6, and the first heat conduction surface of the first heat dissipation device 32 is the upper surface of the first heat dissipation device 32 in fig. 5 and 6; the first section of the first heat conduction surface of the first heat sink 32 is a section provided with the first heat conduction member 31, and the second section of the first heat conduction surface of the first heat sink 32 is a section not provided with the first heat conduction member 31; the second heat conduction surface of the first heat conduction member 31 is the lower surface of the first heat conduction member 31 in fig. 5; the third heat conducting surface of the first heat conducting member 31 is the upper surface of the first heat conducting member 31 in fig. 5; the first connection section of the second heat conductive pipe 311 is a portion of fig. 5 where the second heat conductive pipe 311 is connected to the lower surface of the first heat conductive member 31, that is, a lower portion of the second heat conductive pipe 311 in fig. 5, and the second connection section of the second heat conductive pipe 311 is a portion of fig. 5 where the second heat conductive pipe 311 is connected to the upper surface of the first heat conductive member 31, that is, an upper portion of the second heat conductive pipe 311 in fig. 5; the first surface of the first thermal pad 312 is the lower surface of the first thermal pad 312 in fig. 5, and the second surface of the first thermal pad 312 is the upper surface of the first thermal pad 312 in fig. 5; the fourth heat conduction surface of the second heat conduction member 41 is the lower surface of the second heat conduction member 41 in fig. 4 and 7.

Referring to fig. 1 to 7, the present utility model provides an industrial personal computer, including: a CPU10; a network chip 20; the first heat dissipation assembly 30 comprises a first heat conduction member 31 and a first heat dissipation device 32, the CPU10, the first heat conduction member 31 and the first heat dissipation device 32 are in heat conduction fit in sequence, the first heat dissipation device 32 comprises a first heat dissipation surface, and the area of the first heat dissipation surface is at least five hundred times that of the CPU10; and a second heat dissipation assembly 40, including a second heat conduction member 41 and a second heat sink 42, where the network chip 20, the second heat conduction member 41 and the second heat sink 42 are in heat conduction fit in sequence, and the second heat sink 42 includes a second heat dissipation surface, and the area of the second heat dissipation surface is at least fifty times that of the network chip 20.

In this embodiment, the heat emitted by the CPU10 during the operation is transferred to the first heat conducting member 31, the first heat conducting member 31 transfers the heat to the first heat sink 32, the first heat sink 32 dissipates the heat through the first heat dissipating surface, the heat emitted by the network chip 20 during the operation is transferred to the second heat conducting member 41, the second heat conducting member 41 transfers the heat to the second heat sink 42, and the second heat sink 42 dissipates the heat through the second heat dissipating surface. The heat dissipation surface of the CPU10 is the surface with the largest heat generation amount of the CPU10, and since the area of the first heat dissipation surface of the first heat sink 32 is at least five hundred times of the heat dissipation area of the CPU10, a large amount of heat emitted by the CPU10 can be dissipated by the first heat sink 32; the heat dissipation surface of the network chip 20 is the surface with the largest heat generation amount of the network chip 20, and since the area of the second heat dissipation surface of the second heat sink 42 is at least fifty times of the heat dissipation area of the network chip 20, a large amount of heat emitted by the network chip 20 can be dissipated by the second heat sink 42.

Through the arrangement of the areas of the first heat dissipation surface and the second heat dissipation surface, a large amount of heat emitted by the CPU10 and the network chip 20 can be dissipated by the first heat dissipation component 30 and the second heat dissipation component 40 even if the fans are not included, so that the heat dissipation effect of the first heat dissipation component 30 and the second heat dissipation component 40 can be equal to that of the fans in the prior art, and further, the working temperatures of the CPU10 and the network chip 20 can be kept within a specified temperature range. The industrial personal computer is not provided with a fan, does not need to provide kinetic energy for the fan, relatively reduces energy consumption, saves energy, and can avoid noise generated in the starting process of the fan so as to avoid noise pollution caused by the noise.

Specifically, the area of the first heat dissipation surface is five hundred times to one thousand times, preferably one thousand times, that of the CPU10, and the area of the second heat dissipation surface is fifty times to eighty times, preferably eighty times, that of the network chip 20.

Referring to fig. 1 to 7, in an embodiment of the present utility model, the first heat sink 32 further includes a first heat conducting surface and a first heat conducting tube 321, the first heat conducting member 31 further includes a second heat conducting surface, a first groove is formed on the first heat conducting surface, the first heat conducting tube 321 is disposed in the first groove, a surface of the first heat conducting tube 321 facing the second heat conducting surface is a plane, the surface of the first heat conducting tube 321 is flush with the first heat conducting surface, and the second heat conducting surface is in heat conducting fit with the first heat conducting tube 321.

In the present embodiment, the first heat conductive pipe 321 is used to conduct the heat on the first heat conductive member 31 to the first heat sink 32. A part of the second heat conducting surface of the first heat conducting member 31 is in heat conducting fit with the first heat conducting tube 321, and the other part of the second heat conducting surface of the first heat conducting member 31 is in heat conducting fit with the first heat conducting surface of the first heat radiator 32, so that two paths of heat conducted by the first heat conducting member 31 to the first heat radiator 32 are provided: the first path is conducted from the second heat conducting surface of the first heat conducting member 31, the first heat conducting pipe 321, and the first heat conducting surface of the first heat sink 32 to the first heat radiating surface of the first heat sink 32, and the second path is conducted from the second heat conducting surface of the first heat conducting member 31, the first heat conducting surface of the first heat sink 32 to the first heat radiating surface of the first heat sink 32. The two heat conducting paths are arranged, on one hand, the heat of the first heat conducting piece 31 can be conducted to the first radiator 32 more quickly because the heat conducting performance of the first heat conducting pipe 321 is better than that of the first heat conducting surface of the first radiator 32; on the other hand, the first heat conductive pipe 321 of the first heat sink 32 and the first heat conductive surface conduct heat together due to the high cost of the first heat conductive pipe 321, so that the installation length of the first heat conductive pipe 321 can be saved, and the cost can be reduced.

Specifically, the first heat conduction pipe 321 is a heat conduction copper pipe, and has good heat conduction performance and high heat conduction speed, and can rapidly conduct the heat on the first heat conduction member 31 to the first radiator 32, so that the heat dissipation speed of the CPU10 is higher, and the operation is more stable.

Referring to fig. 1 to 7, in one embodiment of the present utility model, the first heat conductive pipe 321 includes a heat conductive section and a heat conductive section that are connected by heat conduction, the heat conductive section of the first heat conductive pipe 321 is attached to the second heat conductive surface of the first heat conductive member 31, and the heat conductive section of the first heat conductive pipe 321 extends to each edge of the first heat conductive surface of the first heat sink 32; alternatively, the first heat conductive pipes 321 include a plurality of heat conductive sections and heat conductive sections that are in heat conductive connection, the heat conductive sections of the plurality of first heat conductive pipes 321 are arranged side by side or side by side, the heat conductive sections of the plurality of first heat conductive pipes 321 are attached to the second heat conductive surface of the first heat conductive member 31, and the heat conductive sections of the plurality of first heat conductive pipes 321 extend to respective edges of the first heat conductive surface of the first heat radiator 32.

In this embodiment, the heat on the first heat conducting member 31 is conducted from the heat conducting section, and the first heat conducting surface of the first heat sink 32 to the first heat radiating surface of the first heat sink 32 in order, and is dissipated by the first heat sink 32, and the heat conducting section can conduct the heat to each position of the first heat radiating surface. When the number of the first heat conductive pipes 321 is plural, the heat conductive sections of each first heat conductive pipe 321 are concentrated in one position in a side-by-side or parallel manner, so as to be convenient to be attached to the second heat conductive surface of the first heat conductive member 31, so that the heat of the first heat conductive member 31 can be conducted to the heat conductive sections of each first heat conductive pipe 321.

Specifically, the heat conducting section and the heat conducting section of the first heat conducting pipe 321 are of an integrated structure, that is, the first heat conducting pipe 321 is a complete heat conducting copper pipe, so that heat can be fully conducted from the heat conducting section to the heat conducting section.

Specifically, as shown in fig. 5 and 6, the first heat conducting surface of the first heat radiator 32 is in an "L" shape, and includes a first section and a second section that are perpendicular to each other, the first heat conducting member 31 is disposed in the first section, the first heat conducting pipes 321 are three, the heat conducting sections of the three first heat conducting pipes 321 are all disposed in the first section, the shapes of the two first heat conducting pipes 321 are both in an "L" shape and are matched with the shapes of the first heat conducting surfaces of the first heat radiator 32, the heat conducting sections of the two first heat conducting pipes 321 are all disposed in the second section, the shape of the other first heat conducting pipe 321 is in a "U" shape, and the heat conducting sections of the first heat conducting pipes 321 are all disposed in the first section. The shape of the first heat conductive pipe 321 enables the first heat conductive pipe 321 to rapidly and completely conduct heat to the first heat radiating surface of the first heat radiator 32.

Referring to fig. 1 to 7, in an embodiment of the present utility model, the first heat conducting member 31 further includes a third heat conducting surface and a second heat conducting tube 311, the second heat conducting tube 311 includes a first connecting section, a middle section and a second connecting section that are sequentially connected by heat conduction, a second groove is formed on the second heat conducting surface, the first connecting section of the second heat conducting tube 311 is disposed in the second groove, a surface of the first connecting section facing the first heat sink 32 is a plane, the surface of the first connecting section is flush with the second heat conducting surface of the first heat conducting member 31, the first heat conducting surfaces of the first heat conducting tube 321 and the first heat sink 32 are thermally bonded with the surface of the first connecting section of the second heat conducting tube 311, a third groove is formed on the third heat conducting surface, the second connecting section of the second heat conducting tube 311 is disposed in the third groove, a surface of the second connecting section facing away from the second surface of the first heat conducting member 31 is a plane, and the surface of the second connecting section of the second heat conducting tube 311 is flush with the third surface of the first heat conducting member 31.

In the present embodiment, there are two paths for heat conducted from the third heat conducting surface of the first heat conducting member 31 to the second heat conducting surface of the first heat conducting member 31: the first path is conducted from the third heat conducting surface of the first heat conducting piece 31 to the second heat conducting surface of the first heat conducting piece 31 through the heat conducting property of the first heat conducting piece 31, the second path is conducted from the third heat conducting surface of the first heat conducting piece 31, the second connecting section of the second heat conducting pipe 311, the middle section of the second heat conducting pipe 311 and the first connecting section of the second heat conducting pipe 311 to the second heat conducting surface of the first heat conducting piece 31 in sequence, and the two paths conduct heat simultaneously, so that the heat on the third heat conducting surface of the first heat conducting piece 31 can be completely and quickly conducted to the second heat conducting surface of the first heat conducting piece 31.

The bottom of the second groove is an arc surface, the cross section of the first connecting section of the second heat conduction pipe 311 is semicircular, and the arc surface part of the first connecting section of the second heat conduction pipe 311 is attached to the bottom of the second groove, so that the contact area between the first connecting section of the second heat conduction pipe 311 and the second heat conduction surface of the first heat conduction piece 31 is increased, and the heat conduction performance is improved; the planar portion of the first connection section of the second heat conduction pipe 311 is attached to the first heat conduction surface of the first heat sink 32 and the first heat conduction pipe 321, so as to increase the contact area between the first connection section of the second heat conduction pipe 311 and the first heat conduction surface of the first heat sink 32, and the contact area between the first connection section of the second heat conduction pipe 311 and the first heat conduction pipe 321, thereby improving the heat conduction performance. The bottom of the third groove is an arc surface, the cross section of the second connecting section of the second heat conduction pipe 311 is semicircular, and the arc surface part of the second connecting section of the second heat conduction pipe 311 is attached to the bottom of the third groove, so that the contact area between the second connecting section of the second heat conduction pipe 311 and the third heat conduction surface of the first heat conduction piece 31 is increased, and the heat conduction performance is improved.

Specifically, the number of the second heat conductive pipes 311, the second grooves, and the third grooves is two.

Specifically, the first heat conducting member 31 is made of copper or aluminum, the second heat conducting tube 311 is made of a heat conducting copper tube, the heat conducting performance of the first heat conducting member 31 and the second heat conducting tube 311 is good, the heat conducting speed is high, and the heat of the third heat conducting surface of the first heat conducting member 31 can be quickly conducted to the second heat conducting surface of the first heat conducting member 31. The first connecting section, the middle section and the second connecting section of the second heat conduction pipe 311 are of an integrated structure, that is, the second heat conduction pipe 311 is a complete heat conduction copper pipe.

Specifically, the first heat conducting member 31 is further provided with a through hole for reducing the mass of the first heat conducting member 31.

Referring to fig. 1 to 7, in an embodiment of the present utility model, the first heat conducting member 31 further includes a first heat conducting pad 312, the first heat conducting pad 312 is disposed on the third heat conducting surface of the first heat conducting member 31, the third heat conducting surface of the first heat conducting member 31 and the second connecting section of the second heat conducting tube 311 are thermally bonded to the first surface of the first heat conducting pad 312, and the second surface of the first heat conducting pad 312 is thermally bonded to the CPU 10.

In this embodiment, the first heat conductive pad 312 has elasticity, and the second surface of the first heat conductive pad 312 is attached to the heat dissipation surface of the CPU10 to form a soft connection, so as to prevent the CPU10 from being damaged by hard pressure. The first surface of the first heat conducting pad 312 is attached to the planar portion of the second connection section of the second heat conducting pipe 311, the first surface of the first heat conducting pad 312 is also attached to the third heat conducting surface of the first heat conducting member 31, and two paths are provided for conducting heat from the CPU10 to the third heat conducting surface of the first heat conducting member 31: the first path is the third heat conduction surface which is sequentially conducted from the CPU10 and the first heat conduction pad 312 to the first heat conduction member 31, the second path is the third heat conduction surface which is sequentially conducted from the CPU10, the first heat conduction pad 312 and the second heat conduction tube 311 to the first heat conduction member 31, and the two paths conduct heat simultaneously, so that the heat on the CPU10 can be completely and rapidly conducted to the third heat conduction surface of the first heat conduction member 31.

Specifically, the first thermal pad 312 is a thermally conductive silica gel.

Referring to fig. 1 to 7, in one embodiment of the present utility model, the first heat conductive member 31 further includes a first heat conductive pad 312, and the heat dissipation area of the cpu10, the area of the first surface of the first heat conductive pad 312, the area of the third heat conductive surface of the first heat conductive member 31, the area of the second heat conductive surface of the first heat conductive member 31, and the area of the first heat dissipation surface of the first heat sink 32 sequentially increase.

In this embodiment, the first thermal pad 312 is rectangular or square, and the first surface and the second surface of the first thermal pad 312 have the same area; the area of the first heat conduction surface of the first heat sink 32 is the same as the area of the first heat dissipation surface.

Through the above arrangement, the heat conducted per unit area of the first heat conduction pad 312, the third heat conduction surface of the first heat conduction member 31, the second heat conduction surface of the first heat conduction member 31, and the first heat conduction surface of the first heat dissipation surface is sequentially reduced, so that the heat conduction speed is gradually increased, and the first heat dissipation surface of the first heat sink 32 is enabled to dissipate most of the heat emitted from the CPU 10.

Referring to fig. 1 to 7, in one embodiment of the present utility model, the second heat dissipating assembly 40 further includes a third heat conductive pipe 43, and the second heat conductive member 41 and the second heat sink 42 are thermally connected through the third heat conductive pipe 43.

By the arrangement of the third heat conduction pipe 43, on the one hand, the heat of the second heat conduction member 41 can be quickly conducted to the second heat sink 42; on the other hand, the mounting distance between the second heat conductive member 41 and the second heat sink 42 is increased, and further the mounting positions of the second heat conductive member 41 and the second heat sink 42 are not restricted to each other, facilitating the mounting of the second heat conductive member 41 and the second heat sink 42.

Specifically, the third heat conduction pipe 43 is a heat conduction copper pipe, which has good heat conduction performance and high heat conduction speed, and can rapidly conduct the heat on the second heat conduction member 41 to the second radiator 42, so that the heat dissipation speed of the network chip 20 is faster, and the operation is more stable.

Referring to fig. 1 to 7, in an embodiment of the present utility model, the second heat conducting member 41 further includes a fourth heat conducting surface, the second heat conducting member 41 further includes a second heat conducting pad, and the first surface of the second heat conducting pad is in heat conducting fit with the fourth heat conducting surface of the second heat conducting member 41, and the second surface of the second heat conducting pad is in heat conducting fit with the network chip 20.

In this embodiment, the second heat-conducting pad has elasticity, and the second surface of the second heat-conducting pad is attached to the heat-dissipating surface of the network chip 20 to form a flexible connection, so as to prevent the network chip 20 from being damaged by hard pressure.

Specifically, the second heat conductive pad is a heat conductive silica gel.

Referring to fig. 1 to 7, in an embodiment of the present utility model, the first heat spreader 32 further includes a first heat conductive pipe 321 and a plurality of first heat dissipation fins 322, wherein the plurality of first heat dissipation fins 322 are uniformly distributed on the first heat dissipation surface and occupy the entire area of the first heat dissipation surface, and the first heat conductive pipe 321 is in heat conductive fit with the first heat dissipation fins 322.

In this embodiment, the first heat dissipation fins 322 are arranged side by side or on the first heat dissipation surface of the first heat dissipation device 32 uniformly, the first heat dissipation fins 322 are perpendicular to the first heat dissipation surface of the first heat dissipation device 32, the first heat dissipation fins 322 are used for increasing the heat dissipation area, the area of the first heat dissipation surface is fully utilized, and a large amount of heat emitted by the CPU10 is ensured to be dissipated.

Specifically, the first heat sink 32 is a copper material or an aluminum material, and the first heat sink 322 is a copper material or an aluminum material.

Referring to fig. 1 to 7, in an embodiment of the present utility model, the second heat sink 42 further includes a plurality of second heat dissipation fins 421, the plurality of second heat dissipation fins 421 are uniformly distributed on the second heat dissipation surface and occupy the entire area of the second heat dissipation surface, and the third heat conduction tube 43 is in heat conduction fit with the second heat dissipation fins 421.

In this embodiment, the second heat dissipation fins 421 are arranged side by side or on the second heat dissipation surface of the second heat dissipation device 42, the second heat dissipation fins 421 are perpendicular to the second heat dissipation surface of the second heat dissipation device 42, the second heat dissipation fins 421 are used for increasing the heat dissipation area, and the area of the second heat dissipation surface is fully utilized to ensure that the heat emitted by the network chip 20 can be completely dissipated.

Specifically, the second heat sink 42 is a copper material or an aluminum material, and the second heat sink 421 is a copper material or an aluminum material.

Referring to fig. 1 to 7, in an embodiment of the present utility model, the industrial personal computer further includes: the case body 50, the top of the case body 50 is open, the CPU10, the network chip 20, the first heat conductive member 31 and the second heat conductive member 41 are all located inside the case body 50, the side wall of the case body 50 is provided with an installation through hole 51, and the second radiator 42 is arranged in the installation through hole 51 in a penetrating manner; and an upper cover 60 provided on the top of the casing body 50, the first radiator 32 also being provided on the top of the casing body 50, the first radiator 32 closing the top of the casing body 50 together with the upper cover 60.

In the present embodiment, the first heat radiating surface of the first heat sink 32 and the second heat radiating surface of the second heat sink 42 are both directed to the outside of the chassis main body 50 to radiate heat of the CPU10 and the network chip 20 out of the chassis main body 50. The first heat dissipation assembly 30 and the second heat dissipation assembly 40 both transfer heat of the CPU10 and the network chip 20 to the external environment through the heat conduction principle, and finally, the temperatures of the CPU10 and the network chip 20 are kept within the specification temperature range.

The first radiator 32 utilizes the upper space of the case body 50 to maximize the area of the first radiating surface of the first radiator 32, and ensures that a large amount of heat emitted by the CPU10 can be radiated by the first radiator 32. The second radiator 42 uses the side space of the case body 50, and does not occupy the upper space of the case body 50 simultaneously with the first radiator 32, thereby avoiding the influence of the second radiator 42 on the heat radiation performance of the first radiator 32.

Specifically, the bottom wall of the chassis main body 50 is provided with two first mounting holes and two second mounting holes, the first mounting holes are located at the outer sides of two opposite angles of the CPU10, the first mounting holes are threaded holes and are used for connecting the first heat conducting pieces 31, the first heat conducting pieces 31 are connected to the bottom wall of the chassis main body 50 in a manner of screwing the screws into the first mounting holes, and the first heat conducting pieces 31 are located right above the CPU10; the second mounting holes are two and are positioned at the outer sides of two opposite angles of the network chip 20, the second mounting holes are used for connecting the second heat conduction pieces 41, the second heat conduction pieces 41 are connected to the bottom wall of the case body 50 in a mode that spring nails are inserted into the second mounting holes, and the second heat conduction pieces 41 are positioned right above the network chip 20.

The utility model also provides a computer comprising the industrial personal computer.

In this embodiment, the industrial personal computer of the computer has all the technical schemes and all the technical effects of the industrial personal computer, and will not be described herein.

The CPU10 of the industrial personal computer can be a KX-6640MA high-speed processor, the network chip 20 can be a WX1860 integrated network control chip, and the industrial personal computer can meet the composite application requirements of low cost, multiple network ports, multiple serial ports, B code pairs and high-performance storage. When the CPU10 is fully loaded and works at the environmental temperature of 70 ℃, the industrial control computer can keep the working temperatures of the CPU10 and the network chip 20 at a specified temperature on the premise of no fan.

From the above description, it can be seen that the above-described embodiments of the present utility model achieve the following technical effects: the heat dissipation device comprises a CPU, a network chip, a first heat dissipation component, a second heat dissipation component, a first heat conduction piece, a second heat conduction piece and a second heat dissipation component, wherein the first heat dissipation component and the second heat dissipation component are respectively arranged for the CPU and the network chip, heat generated by the CPU is transmitted to the first heat dissipation device through the first heat conduction piece and dissipated through the first heat dissipation device, the heat generated by the network chip is transmitted to the second heat dissipation device through the second heat dissipation device, the area of the first heat dissipation surface of the first heat dissipation device is at least five hundred times of the heat dissipation area of the CPU, the area of the second heat dissipation surface of the second heat dissipation device is at least fifty times of the heat dissipation area of the network chip, and most of the heat generated by the CPU and the network chip can be dissipated, so that the working temperature of the CPU and the network chip can be kept within a specified temperature range. The fan is not required to be arranged, so that the energy consumption is relatively reduced, and noise pollution caused by starting the fan is avoided.

It will be apparent that the embodiments described above are merely some, but not all, embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present utility model without making any inventive effort, shall fall within the scope of the present utility model.

It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of exemplary embodiments according to the present utility model. As used herein, the singular is also intended to include the plural unless the context clearly indicates otherwise, and furthermore, it is to be understood that the terms "comprises" and/or "comprising" when used in this specification are taken to specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof.

The above description is only of the preferred embodiments of the present utility model and is not intended to limit the present utility model, but various modifications and variations can be made to the present utility model by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.

Claims (10)

1. An industrial personal computer, characterized by comprising:

CPU(10)；

a network chip (20);

the first heat dissipation assembly (30) comprises a first heat conduction piece (31) and a first heat dissipation device (32), wherein the CPU (10), the first heat conduction piece (31) and the first heat dissipation device (32) are in heat conduction fit in sequence, the first heat dissipation device (32) comprises a first heat dissipation surface, and the area of the first heat dissipation surface is at least five hundred times that of the CPU (10); and

the second heat dissipation assembly (40) comprises a second heat conduction piece (41) and a second heat radiator (42), wherein the network chip (20) is in heat conduction fit with the second heat conduction piece (41) and the second heat radiator (42) in sequence, the second heat radiator (42) comprises a second heat dissipation surface, and the area of the second heat dissipation surface is at least fifty times that of the network chip (20).

2. The industrial personal computer according to claim 1, wherein the first heat sink (32) further comprises a first heat conducting surface and a first heat conducting tube (321), the first heat conducting member (31) further comprises a second heat conducting surface, a first groove is formed in the first heat conducting surface, the first heat conducting tube (321) is arranged in the first groove, one surface of the first heat conducting tube (321) facing the second heat conducting surface is a plane, the surface of the first heat conducting tube (321) is flush with the first heat conducting surface, and the second heat conducting surface is in heat conducting fit with the first heat conducting tube (321).

3. The industrial personal computer according to claim 2, wherein the first heat conducting pipe (321) comprises a heat conducting section and a heat conducting section which are in heat conducting connection, the heat conducting section of the first heat conducting pipe (321) is attached to the second heat conducting surface of the first heat conducting member (31), and the heat conducting section of the first heat conducting pipe (321) extends to each edge of the first heat conducting surface of the first radiator (32); or,

the first heat conduction pipes (321) comprise heat conduction sections and heat transfer sections which are in heat conduction connection, the first heat conduction pipes (321) are arranged in a plurality of mode, the heat conduction sections of the first heat conduction pipes (321) are arranged side by side or side by side, the heat conduction sections of the first heat conduction pipes (321) are attached to the second heat conduction surfaces of the first heat conduction pieces (31), and the heat transfer sections of the first heat conduction pipes (321) are respectively extended to the edges of the first heat conduction surfaces of the first heat radiators (32).

4. The industrial personal computer according to claim 3, wherein the first heat conducting member (31) further comprises a third heat conducting surface and a second heat conducting tube (311), the second heat conducting tube (311) comprises a first connecting section, a middle section and a second connecting section which are sequentially connected in a heat conducting manner, the second heat conducting surface is provided with a second groove, the first connecting section is arranged in the second groove, one surface of the first connecting section facing the first heat radiator (32) is a plane, the surface of the first connecting section is flush with the second heat conducting surface of the first heat conducting member (31), the first heat conducting surfaces of the first heat conducting tube (321) and the first heat radiator (32) are in heat conducting fit with the surface of the first connecting section, a third groove is formed in the third heat conducting surface, one surface of the second connecting section facing away from the second surface of the first member (31) is a plane, and the first heat conducting surface of the second connecting section is flush with the first heat conducting surface of the first heat conducting member (31).

5. The industrial personal computer according to claim 4, wherein the first heat conducting member (31) further comprises a first heat conducting pad (312), the first heat conducting pad (312) is disposed on a third heat conducting surface of the first heat conducting member (31), the third heat conducting surface of the first heat conducting member (31) and the second connecting section of the second heat conducting tube (311) are in heat conducting fit with the first surface of the first heat conducting pad (312), and the second surface of the first heat conducting pad (312) is in heat conducting fit with the CPU (10).

6. The industrial personal computer according to any one of claims 1 to 5, wherein the first heat conductive member (31) further includes a first heat conductive pad (312), and the heat dissipation area of the CPU (10), the area of the first surface of the first heat conductive pad (312), the area of the third heat conductive surface of the first heat conductive member (31), the area of the second heat conductive surface of the first heat conductive member (31), and the area of the first heat dissipation surface of the first heat sink sequentially increase.

7. The industrial personal computer according to claim 6, wherein the second heat dissipating assembly (40) further comprises a third heat conducting pipe (43), and the second heat conducting member (41) and the second heat sink (42) are thermally connected by the third heat conducting pipe (43); and/or the number of the groups of groups,

the second heat conduction piece (41) further comprises a fourth heat conduction surface, the second heat conduction piece (41) further comprises a second heat conduction pad, the first surface of the second heat conduction pad is in heat conduction fit with the fourth heat conduction surface of the second heat conduction piece (41), and the second surface of the second heat conduction pad is in heat conduction fit with the network chip (20).

8. The industrial personal computer according to claim 7, wherein the first heat spreader (32) further comprises a first heat conductive pipe (321) and a plurality of first heat dissipation fins (322), the plurality of first heat dissipation fins (322) are uniformly distributed on the first heat dissipation surface and occupy the whole area of the first heat dissipation surface, and the first heat conductive pipe (321) is in heat conductive fit with the first heat dissipation fins (322); and/or the number of the groups of groups,

the second radiator (42) further comprises a plurality of second radiating fins (421), the second radiating fins (421) are uniformly distributed on the second radiating surface and occupy the whole area of the second radiating surface, and the third heat conduction pipe (43) is in heat conduction fit with the second radiating fins (421).

9. The industrial personal computer according to any one of claims 1 to 4, further comprising:

the CPU (10), the network chip (20), the first heat conduction piece (31) and the second heat conduction piece (41) are all positioned inside the case body (50), an installation through hole (51) is formed in the side wall of the case body (50), and the second radiator (42) is arranged in the installation through hole (51) in a penetrating mode; and

the upper cover (60) is arranged at the top of the case main body (50), the first radiator (32) is also arranged at the top of the case main body (50), and the first radiator (32) and the upper cover (60) jointly seal the top of the case main body (50).

10. A computer comprising an industrial personal computer as claimed in any one of claims 1 to 9.