CN219042332U

CN219042332U - Heat abstractor that memory strip was used

Info

Publication number: CN219042332U
Application number: CN202222906935.9U
Authority: CN
Inventors: 王祖连; 张高峰
Original assignee: Shenzhen Xueeryou Technology Industry Co ltd
Current assignee: Shenzhen Xueeryou Technology Industry Co ltd
Priority date: 2022-11-02
Filing date: 2022-11-02
Publication date: 2023-05-16
Anticipated expiration: 2032-11-02

Abstract

The utility model relates to the field of heat dissipation devices, in particular to a heat dissipation device for a memory bank, which comprises a coiled pipe, a fan, a circulating pipe, a motor bracket, a circulating pump motor, a temperature sensor, a connecting interface, a heat conduction clamping piece, a telescopic pipe and a heat conduction patch; the side surface of the coiled pipe is connected with a plurality of groups of fans; the side surface of the coiled pipe is connected with the circulating pipe; one end of the circulating pipe, which is far away from the coiled pipe, is connected with a circulating pump motor; the bottom of the circulating pump motor is connected with a motor bracket; the output end of the circulating pump motor is connected with a temperature sensor; the temperature sensor is connected with the side face of the outer end face of the coiled pipe; according to the utility model, the heat dissipation and heat exchange efficiency of the memory bank can be effectively improved, and the temperature monitoring precision of the device can be effectively improved through the combination of the temperature sensors, so that the working strength of the circulating pump motor can be adjusted through the current temperature change in the circulating pipe, thereby ensuring the energy efficiency of the device and reducing the noise strength.

Description

Heat abstractor that memory strip was used

Technical Field

The present utility model relates to the field of heat dissipation devices, and in particular, to a heat dissipation device for a memory bank.

Background

With the rapid development of modern technology, the requirements on the memory are increased, the storage capacity and frequency of the memory are continuously increased, the heat generated in the working process is correspondingly increased, and how to dissipate the heat of the memory in the use process is increasingly important. In electronic products such as computers, a plurality of memory banks are usually installed side by side on a chassis, however, the space between every two memory banks is too small, which is not beneficial to ventilation of the memory banks, and the performance of the memory banks is reduced after a long time, so that the service life of the memory banks is shortened.

The Chinese patent with the publication number of CN107918475A discloses a memory bank heat dissipation device, which comprises a first heat dissipation part and a second heat dissipation part, wherein the first heat dissipation part and the second heat dissipation part are sequentially arranged in a memory bank along the wind flow direction, the first heat dissipation part comprises two first heat dissipation fins symmetrically arranged along the memory bank, the second heat dissipation part comprises two second heat dissipation fins symmetrically arranged along the memory bank, a plurality of ventilation fins are respectively arranged on the inner side surfaces of the two second heat dissipation fins, one end of each ventilation fin is arranged on the outer side surfaces of the two first heat dissipation fins, the heat dissipation device is provided with a memory bank heat dissipation device, and the temperature concentrated at the rear part of the memory bank can be reduced through arranging the second heat dissipation part at the rear part of the memory bank or the rear part of the first heat dissipation part, so that the ventilation and cooling performance of the memory bank is improved, the service life of the memory bank can be correspondingly prolonged, and the like.

However, the above disclosed solution has the following disadvantages: the scheme has the advantages that the connection difficulty is high in the actual use process, and the memory bank structure shapes with different shapes are not compatible.

Disclosure of Invention

The utility model aims at solving the technical problems in the background art and provides a heat dissipation device for a memory bank.

The utility model provides a heat dissipating device for a memory bank, which comprises a coiled pipe, a fan, a circulating pipe, a motor bracket, a circulating pump motor, a temperature sensor, a connecting interface, a heat conducting clamping piece, a telescopic pipe and a heat conducting patch;

the side surface of the coiled pipe is connected with a plurality of groups of fans; the side surface of the coiled pipe is connected with the circulating pipe; one end of the circulating pipe, which is far away from the coiled pipe, is connected with a circulating pump motor; the bottom of the circulating pump motor is connected with a motor bracket; the output end of the circulating pump motor is connected with a temperature sensor; the temperature sensor is connected with the side face of the outer end face of the coiled pipe; one end of the temperature sensor, which is far away from the circulating pump motor, is connected with the connecting interface; the top of the connecting interface is connected with the heat conduction clamping piece; the heat conducting clamping pieces are symmetrically arranged at two ends of the telescopic pipe; one end of the heat conduction clamping piece, which is far away from the telescopic pipe, is connected with the heat conduction patch.

Preferably, a plurality of groups of fixing threaded holes are formed in the side face of the coiled pipe, and the plurality of groups of fixing threaded holes are distributed around the side face of the coiled pipe.

Preferably, a sliding damping piece is arranged on the side surface of the telescopic pipe, and the sliding damping piece is in sliding damping connection with the side surface of the telescopic pipe.

Preferably, a buffer layer is arranged on the side surface of the heat conduction clamping piece.

Preferably, the heat conduction patch is provided with elastic clamping pieces, and the elastic clamping pieces are symmetrically arranged at two ends of the heat conduction patch.

Preferably, a control cable is arranged in the temperature sensor and is connected with the motor control of the circulating pump, and the control cable is connected with the fan control.

Preferably, the outer end face of the coiled pipe is provided with a shell, and the side face of the inner wall of the coiled pipe is provided with a heat conducting sheet.

Preferably, the plurality of groups of fans are distributed on the side surface of the serpentine pipe at equal intervals.

The technical scheme of the utility model has the following beneficial technical effects:

according to the utility model, the heat dissipation and heat exchange efficiency of the memory strip can be effectively improved through the device, the temperature monitoring precision of the device can be effectively improved through the combination of the temperature sensors, so that the working strength of the circulating pump motor can be adjusted through the current temperature change in the circulating pipe, the energy efficiency of the device is ensured, the noise strength is reduced, the device can be compatible with different types of memory strip structures through the use combination of a plurality of groups of heat conduction structures of the device, the memory strip can be connected from two sides through the heat conduction clamping pieces, and if the side surface of the memory strip is protruded, the memory strip is connected and dissipated through the heat conduction patch.

Drawings

FIG. 1 is a schematic diagram of a heat dissipating device for a memory bank according to an embodiment of the present utility model;

FIG. 2 is a schematic diagram of a serpentine tube in a heat dissipating device for a memory bank according to the present utility model;

FIG. 3 is a bottom view of a heat dissipating device for a memory bank according to the present utility model;

reference numerals: 1. a serpentine tube; 2. a fan; 3. a circulation pipe; 4. a motor bracket; 5. a circulation pump motor; 6. a temperature sensor; 7. a connection interface; 8. a thermally conductive clip; 9. a telescopic tube; 10. and a heat conducting patch.

Detailed Description

Example 1

As shown in fig. 1-3, the heat dissipating device for a memory bank provided by the utility model comprises a coiled pipe 1, a fan 2, a circulating pipe 3, a motor bracket 4, a circulating pump motor 5, a temperature sensor 6, a connecting interface 7, a heat conducting clamping piece 8, a telescopic pipe 9 and a heat conducting patch 10;

the side surface of the coiled pipe 1 is connected with a plurality of groups of fans 2; the side surface of the coiled pipe 1 is connected with a circulating pipe 3; one end of the circulating pipe 3 far away from the coiled pipe 1 is connected with a circulating pump motor 5; the bottom of the circulating pump motor 5 is connected with the motor bracket 4; the output end of the circulating pump motor 5 is connected with the temperature sensor 6; the temperature sensor 6 is connected with the side surface of the outer end surface of the coiled pipe 1; one end of the temperature sensor 6, which is far away from the circulating pump motor 5, is connected with the connecting interface 7; the top of the connecting interface 7 is connected with the heat conducting clamping piece 8; the heat conducting clamping pieces 8 are symmetrically arranged at two ends of the telescopic pipe 9; one end of the heat conduction clamping piece 8, which is far away from the telescopic pipe 9, is connected with the heat conduction patch 10; a plurality of groups of fixing threaded holes are formed in the side face of the coiled pipe 1, and the plurality of groups of fixing threaded holes are distributed around the side face of the coiled pipe 1; the side surface of the telescopic pipe 9 is provided with a sliding damping piece which is in sliding damping connection with the side surface of the telescopic pipe 9; a buffer layer is arranged on the side surface of the heat conduction clamping piece 8; a control cable is arranged in the temperature sensor 6 and is in control connection with the circulating pump motor 5, and the control cable is in control connection with the fan 2; the outer end face of the coiled pipe 1 is provided with a shell, and the side face of the inner wall of the coiled pipe 1 is provided with a heat conducting sheet; the fan groups 2 are distributed on the side surface of the coiled pipe 1 at equal intervals.

In this embodiment, can effectually improve the efficiency of heat transfer exchange through this device, when comparing that the heat radiation structure efficiency of this device is higher in traditional forced air cooling or passive heat radiation structure, occupation area is littleer, thereby reduced the installation degree of difficulty at quick-witted incasement portion this device, when this device is in operating condition, can effectually improve the heat exchange efficiency of this device through the combination of coiled pipe 1 and multiunit fan 2, thereby can guarantee that coiled pipe 1 inside temperature is low, can effectually improve the heat transfer efficiency of this device through the combination of circulating pump motor 5 and circulating pipe 3, can compatible multiple memory strip's style and shape through the structure of multiple heat conduction clamping piece 8 and heat conduction paster 10, thereby guaranteed the use compatibility and the stability of this device.

Example two

As shown in fig. 2-3, in the heat dissipating device for a memory bank according to the present utility model, compared with the first embodiment, the heat conducting patch 10 is provided with elastic clamping members symmetrically disposed at two ends of the heat conducting patch 10.

In one embodiment of the present utility model, the heat conducting patch 10 can be conveniently fixed by the structure of the elastic clamping member, so that the heat conduction stability of the device is ensured.

The embodiments of the present utility model have been described in detail with reference to the drawings, but the present utility model is not limited thereto, and various changes can be made within the knowledge of those skilled in the art without departing from the spirit of the present utility model.

Claims

1. The heat dissipation device for the memory strip is characterized by comprising a coiled pipe (1), a fan (2), a circulating pipe (3), a motor bracket (4), a circulating pump motor (5), a temperature sensor (6), a connecting interface (7), a heat conduction clamping piece (8), a telescopic pipe (9) and a heat conduction patch (10);

the side surface of the coiled pipe (1) is connected with a plurality of groups of fans (2); the side surface of the coiled pipe (1) is connected with the circulating pipe (3); one end of the circulating pipe (3) far away from the coiled pipe (1) is connected with a circulating pump motor (5); the bottom of the circulating pump motor (5) is connected with the motor bracket (4); the output end of the circulating pump motor (5) is connected with a temperature sensor (6); the temperature sensor (6) is connected with the side surface of the outer end surface of the coiled pipe (1); one end of the temperature sensor (6) far away from the circulating pump motor (5) is connected with the connecting interface (7); the top of the connecting interface (7) is connected with the heat conducting clamping piece (8); the heat conducting clamping pieces (8) are symmetrically arranged at two ends of the telescopic pipe (9); one end of the heat conduction clamping piece (8) far away from the telescopic pipe (9) is connected with the heat conduction patch (10).

2. The heat dissipating device for a memory bank according to claim 1, wherein a plurality of groups of fixing screw holes are provided on the side surface of the serpentine tube (1), and the plurality of groups of fixing screw holes are distributed around the side surface of the serpentine tube (1).

3. A heat sink for a memory bank according to claim 1, characterized in that the side of the telescopic tube (9) is provided with a sliding damping member, which sliding damping member is in sliding damping connection with the side of the telescopic tube (9).

4. A heat sink for a memory bank according to claim 1, characterized in that the side of the thermally conductive clip (8) is provided with a buffer layer.

5. The heat dissipating device for a memory chip according to claim 1, wherein the heat conducting patch (10) is provided with elastic clamping members, and the elastic clamping members are symmetrically disposed at two ends of the heat conducting patch (10).

6. The heat sink for a memory bank according to claim 1, wherein a control cable is provided inside the temperature sensor (6), the control cable being in control connection with the circulation pump motor (5), the control cable being in control connection with the fan (2).

7. The heat sink for memory chips as defined in claim 1, wherein the outer end surface of the serpentine tube (1) is provided with a housing, and the inner wall side surface of the serpentine tube (1) is provided with a heat conductive sheet.

8. The heat dissipating device for a memory bank according to claim 1, wherein the plurality of sets of fans (2) are equally spaced apart on the side of the serpentine tube (1).