CN211956368U - Computer water-cooling heat abstractor - Google Patents

Computer water-cooling heat abstractor Download PDF

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Publication number
CN211956368U
CN211956368U CN202021024829.2U CN202021024829U CN211956368U CN 211956368 U CN211956368 U CN 211956368U CN 202021024829 U CN202021024829 U CN 202021024829U CN 211956368 U CN211956368 U CN 211956368U
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CN
China
Prior art keywords
heat dissipation
water
fins
fixed plate
heat
Prior art date
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Expired - Fee Related
Application number
CN202021024829.2U
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Chinese (zh)
Inventor
张健
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangsu Vocational College of Finance and Economics
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Jiangsu Vocational College of Finance and Economics
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Priority to CN202021024829.2U priority Critical patent/CN211956368U/en
Application granted granted Critical
Publication of CN211956368U publication Critical patent/CN211956368U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a computer water-cooling heat abstractor relates to computer heat dissipation technical field, including chassis exterior, chassis exterior one end is provided with a pair of fan fixed plate, and is provided with total heat radiation fins between a pair of fan fixed plate, the inside five sets of radiator fan that are provided with of fan fixed plate, the inside one side of chassis exterior is fixed with the mainboard, and mainboard one side is provided with CPU water pump head, the display card is installed to mainboard one side lower part. The utility model discloses a radiator fan and total heat radiation fins who sets up dispel the heat to chassis exterior inside, the fan fixed plate that combines to set up moves whole wind channel to one side and carries out integrated heat dissipation, forms the single channel wind channel, the effectual problem of having the wind channel conflict after radiator fan installs of having solved, and the baffle through setting up with inside completely cut off outward, the wind channel moves outward, can not bring the dust into chassis exterior inside, the dust that leads to when having avoided the heat dissipation is piled up.

Description

Computer water-cooling heat abstractor
Technical Field
The utility model relates to a computer heat dissipation technical field specifically is a computer water-cooling heat abstractor.
Background
Along with the development of science and technology, the processing capacity of computers is stronger and stronger, heat generated during working is more and more, heat dissipation devices of computers are gradually updated, and water-cooling heat dissipation devices absorb heat of accessories by using the high specific heat capacity of water to dissipate heat of the computers.
However, the existing water-cooling heat dissipation mostly adopts double water-cooling heat dissipation of the CPU and the GPU, so that too many windows are occupied, the air passing amount is large, the design requirement of an air duct cannot be met, the actual heat dissipation performance is weakened, and the air passing still passes through the interior of the case, so that a large amount of dust is accumulated in the interior of the case.
Disclosure of Invention
The utility model aims to provide a: in order to solve the problems of air channel conflict and large dust deposition amount in a case of the existing computer water-cooling heat dissipation device, the computer water-cooling heat dissipation device is provided.
In order to achieve the above object, the utility model provides a following technical scheme:
the utility model provides a computer water-cooling heat abstractor, includes chassis exterior, chassis exterior one end is provided with a pair of fan fixed plate, and is provided with total heat radiation fins between a pair of fan fixed plate, the inside five radiator fan of group that are provided with of fan fixed plate, the inside one side of chassis exterior is fixed with the mainboard, and mainboard one side is provided with CPU water pump head, the display card is installed to mainboard one side lower part, and is connected with second heat radiation fins between display card and the total heat radiation fins, be connected with first heat radiation fins and third heat radiation fins between CPU water pump head and the total heat radiation fins, be provided with the baffle between chassis exterior and fan fixed plate and the total heat radiation fins.
In a preferred embodiment of the present invention, water cooling tubes are connected between the first and third heat dissipation fins and the CPU pump head and the main heat dissipation fins.
In a preferred embodiment of the present invention, water cooling tubes are connected between the second heat dissipating fins and the main heat dissipating fins and between the second heat dissipating fins and the display card.
In a preferred embodiment of the present invention, the first heat dissipation fins, the second heat dissipation fins and the third heat dissipation fins are all provided with air channel circulation fans cooperating with the first heat dissipation fins, the second heat dissipation fins and the third heat dissipation fins.
In a preferred embodiment of the present invention, the holy ring is disposed outside the heat dissipation fan.
Compared with the prior art, the beneficial effects of the utility model are that: the utility model discloses a radiator fan and total heat radiation fins who sets up dispel the heat to chassis exterior inside, the fan fixed plate that combines to set up moves whole wind channel to one side and carries out integrated heat dissipation, forms the single channel wind channel, the effectual problem of having the wind channel conflict after radiator fan installs of having solved, and the baffle through setting up with inside completely cut off outward, the wind channel moves outward, can not bring the dust into chassis exterior inside, the dust that leads to when having avoided the heat dissipation is piled up.
Drawings
Fig. 1 is a side view and a cross-sectional view of the present invention.
Fig. 2 is a front cross-sectional view of the present invention.
Fig. 3 is a top view of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, a computer water-cooling heat dissipation device includes a chassis housing 1, a pair of fan fixing plates 2 is disposed at one end of the chassis housing 1, a total heat dissipation fin 11 is disposed between the pair of fan fixing plates 2, five sets of heat dissipation fans 3 are disposed inside the fan fixing plates 2, a main board 4 is fixed at one side inside the chassis housing 1, a CPU pump head 9 is disposed at one side of the main board 4, a display card 5 is mounted at a lower portion of one side of the main board 4, a second heat dissipation fin 7 is connected between the display card 5 and the total heat dissipation fin 11, a first heat dissipation fin 6 and a third heat dissipation fin 8 are connected between the CPU pump head 9 and the total heat dissipation fin 11, and a partition plate 10 is disposed between the chassis housing 1 and the fan fixing plates 2.
The utility model discloses a radiator fan 3 and total heat radiation fins 11 that set up dispel the heat to 1 inside of chassis exterior, the fan fixed plate 2 that combines to set up moves whole wind channel to one side and carries out integrated heat dissipation, form the single channel wind channel, the effectual problem of having the wind channel conflict after radiator fan installs of having solved, and completely cut off inside through the baffle 10 that sets up outside with inside, the wind channel moves outward, can not bring the dust into chassis exterior 1 inside, the dust that leads to when having avoided the heat dissipation is piled up.
Please refer to fig. 1 and fig. 2, a water cooling pipe is connected between the first heat dissipating fin 6 and the third heat dissipating fin 8 and the CPU pump head 9 and the main heat dissipating fin 11, and the water cooling pipe guides a part of the CPU water cooling medium to flow.
Please refer to fig. 1, a water cooling tube is connected between the second heat dissipating fins 7, the total heat dissipating fins 11 and the display card 5, and the water cooling tube guides a part of the GPU to flow as the cooling medium.
Please refer to fig. 1, the first heat sink fins 6, the second heat sink fins 7 and the third heat sink fins 8 are all provided with air channel circulating fans cooperating with the first heat sink fins 6, the second heat sink fins 7 and the third heat sink fins 8, which cooperate with the air channel circulating fans to form an internal dust-free circulating air channel to enhance the heat dissipation of the south bridge and the north bridge.
Please refer to fig. 1, the holy ring is disposed outside the heat dissipation fan 3, and the holy ring of the present invention improves the overall appearance color value of the heat dissipation device.
The working principle is as follows: the external power supply is firstly switched on, the water cooling medium transmits heat to the integral water cooling pipeline through the first radiating fins 6, the second radiating fins 7, the third radiating fins 8 and the CPU water pump head 9, the water cooling medium circulates to the total radiating fins 11 to rapidly take away the heat of the medium through the radiating fans 3 on the two sides, the temperature of equipment is maintained at a low temperature state, the air channel is blocked outside the case shell 1 through the partition plate 10, and the air channel is integrally arranged outside to prevent dust from entering the case shell 1.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims (5)

1. The utility model provides a computer water-cooling heat abstractor, includes chassis exterior, its characterized in that: case shell one end is provided with a pair of fan fixed plate, and is provided with total heat radiation fin between a pair of fan fixed plate, the inside five radiator fan that are provided with of fan fixed plate, the inside one side of case shell is fixed with the mainboard, and mainboard one side is provided with CPU water pump head, the display card is installed to mainboard one side lower part, and is connected with second heat radiation fin between display card and the total heat radiation fin, be connected with first heat radiation fin and third heat radiation fin between CPU water pump head and the total heat radiation fin, be provided with the baffle between case shell and fan fixed plate and the total heat radiation fin.
2. The water-cooling heat dissipation device for the computer of claim 1, wherein: and water cooling tubes are connected between the first radiating fins and the third radiating fins and between the CPU water pump head and the main radiating fins.
3. The water-cooling heat dissipation device for the computer of claim 1, wherein: and water cooling tubes are connected among the second radiating fins, the main radiating fins and the display card.
4. The water-cooling heat dissipation device for the computer of claim 1, wherein: the first heat dissipation fins, the second heat dissipation fins and the third heat dissipation fins are provided with air channel circulation fans matched with the first heat dissipation fins, the second heat dissipation fins and the third heat dissipation fins on the side surfaces.
5. The water-cooling heat dissipation device for the computer of claim 1, wherein: the holy rings are arranged on the outer sides of the heat dissipation fans.
CN202021024829.2U 2020-06-08 2020-06-08 Computer water-cooling heat abstractor Expired - Fee Related CN211956368U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202021024829.2U CN211956368U (en) 2020-06-08 2020-06-08 Computer water-cooling heat abstractor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202021024829.2U CN211956368U (en) 2020-06-08 2020-06-08 Computer water-cooling heat abstractor

Publications (1)

Publication Number Publication Date
CN211956368U true CN211956368U (en) 2020-11-17

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202021024829.2U Expired - Fee Related CN211956368U (en) 2020-06-08 2020-06-08 Computer water-cooling heat abstractor

Country Status (1)

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CN (1) CN211956368U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112527085A (en) * 2020-12-24 2021-03-19 黄山杰尔马热交换系统有限公司 Heat conduction mechanism and radiator based on same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112527085A (en) * 2020-12-24 2021-03-19 黄山杰尔马热交换系统有限公司 Heat conduction mechanism and radiator based on same

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GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20201117

Termination date: 20210608