CN112527085A - Heat conduction mechanism and radiator based on same - Google Patents

Heat conduction mechanism and radiator based on same Download PDF

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Publication number
CN112527085A
CN112527085A CN202011545977.3A CN202011545977A CN112527085A CN 112527085 A CN112527085 A CN 112527085A CN 202011545977 A CN202011545977 A CN 202011545977A CN 112527085 A CN112527085 A CN 112527085A
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CN
China
Prior art keywords
fixed
plate
water
pipe
fan
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Pending
Application number
CN202011545977.3A
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Chinese (zh)
Inventor
杨骏
曹定
王健伟
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Huangshan Djerma Heat Exchanging System Co ltd
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Huangshan Djerma Heat Exchanging System Co ltd
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Application filed by Huangshan Djerma Heat Exchanging System Co ltd filed Critical Huangshan Djerma Heat Exchanging System Co ltd
Priority to CN202011545977.3A priority Critical patent/CN112527085A/en
Publication of CN112527085A publication Critical patent/CN112527085A/en
Pending legal-status Critical Current

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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/18Packaging or power distribution
    • G06F1/183Internal mounting support structures, e.g. for printed circuit boards, internal connecting means

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention provides a heat conduction mechanism and a radiator based on the same, comprising a fixed plate, wherein the front end of the fixed plate is fixed with a radiating fan through a bolt, the middle of the heat radiation fan is fixed with a blocking device at the front end of the fixed plate, the front end of the heat radiation fan is fixed with a filtering device through a bolt, the water cooling pipe is fixed at the front end of the fixed plate on the right side of the radiating fan, the water cooling cold head and the fixed plate are fixed through the folding pipe, the arrangement of the water cooling pipe is convenient after the water cooling cold head and the fixed plate are fixed, the folding pipe moves along with the pulling of the water cooling pipe, when the length of the water cooling pipe is insufficient, the two ends of the folding pipe are pulled, the length of the folding pipe is changed, can adapt to the quick-witted case of variation in size, use the back for a long time at the radiator simultaneously, pull down the fixture block on water-cooling tube surface from the extrusion circle on folding tube surface, can change the coolant liquid of inside, guarantee the radiating efficiency of equipment.

Description

Heat conduction mechanism and radiator based on same
Technical Field
The invention relates to the field of heat dissipation equipment, in particular to a heat conduction mechanism and a heat radiator based on the same.
Background
The heat radiator is a device or an instrument which transfers heat generated by machinery or other appliances in the working process in time so as to avoid influencing the normal work of the machinery or other appliances, and common heat radiators can be divided into various types such as air cooling, heat pipe radiators, liquid cooling, semiconductor refrigeration, compressor refrigeration and the like according to the heat dissipation mode.
However, the existing radiator moves the water-cooling liquid through the water-cooling pipe when in use, but the existing water-cooling pipe is fixed in length and the size of the case is different, so that the existing water-cooling pipe is difficult to adapt to the cases with different sizes, and unnecessary troubles are caused.
Disclosure of Invention
The present invention is directed to a heat conducting mechanism and a heat sink based on the same, so as to solve the above technical problems.
In order to solve the technical problems, the invention adopts the following technical scheme: the utility model provides a heat conduction mechanism and because its radiator, includes the fixed plate, the front end of fixed plate is fixed with radiator fan through the bolt, radiator fan's centre is fixed with the separation device in the front position department of fixed plate, radiator fan's front end is fixed with filter equipment through the bolt, radiator fan's the right-hand front position department at the fixed plate is fixed with the water-cooled tube, the below of fixed plate is pegged graft in the left end position department of water-cooled tube and is had folding tube, the left end of folding tube is fixed with the water-cooling cold head.
Preferably, the surface of the folding pipe is provided with an extrusion ring, and the surface of the water-cooling pipe is provided with a fixture block and is clamped inside the extrusion ring on the surface of the folding pipe.
Preferably, the blocking device comprises a limiting block, a blocking plate is fixed at the front end of the limiting block, and an airflow groove is fixed on the surface of the blocking plate.
Preferably, the lower ends of the limiting block and the blocking plate are fixed on the surface of the fixing plate, and the upper end of the blocking plate is higher than the upper end of the heat dissipation fan.
Preferably, the filtering device comprises a connecting plate, a fixing frame is fixed on the surface of the connecting plate in a welding mode, and a filter screen is fixed inside the fixing frame.
Preferably, the surface of the connecting plate is fixed on the surface of the heat dissipation fan through bolts, and the lower end of the fixing frame is in contact with the surface of the heat dissipation fan.
The invention has the beneficial effects that:
1. according to the invention, the water-cooling cold head and the fixing plate are fixed through the folding pipe, the arrangement of the water-cooling pipe is convenient, the folding pipe moves along with the pulling of the water-cooling pipe, when the length of the water-cooling pipe is insufficient, the two ends of the folding pipe are pulled, the length of the folding pipe is changed, the machine box can adapt to machine boxes with different sizes, and meanwhile, after the radiator is used for a long time, the fixture blocks on the surface of the water-cooling pipe are detached from the extrusion rings on the surface of the folding pipe, so that the internal cooling liquid can be replaced, and the heat dissipation.
2. According to the invention, the movement direction of air is blocked by the blocking plate, so that the airflows of the two cooling fans cannot be influenced mutually, the hot air can be directly exhausted into the air, the reduction of the rotating speed of the fan blades due to the mutual influence of the airflows of the two cooling fans is avoided, and the cooling efficiency is ensured.
3. According to the invention, the connecting plate is fixed on the surface of the cooling fan, so that external dust is prevented from being accumulated on the fan blades on the surface of the cooling fan, and therefore, the trouble of subsequent cleaning is reduced.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of the structure of the barrier device of the present invention;
FIG. 3 is a schematic view of the structure of the filter device of the present invention;
reference numerals: 1. a fixing plate; 2. a filtration device; 3. a barrier device; 4. a heat radiation fan; 5. a water-cooled tube; 6. folding the tube; 7. water cooling the cold head; 21. a connecting plate; 22. filtering with a screen; 23. a fixing frame; 31. a limiting block; 32. a barrier plate; 33. and an airflow groove.
Detailed Description
In order to make the technical means, the original characteristics, the achieved purposes and the effects of the invention easily understood, the invention is further described below with reference to the specific embodiments and the attached drawings, but the following embodiments are only the preferred embodiments of the invention, and not all embodiments. Based on the embodiments in the implementation, other embodiments obtained by those skilled in the art without any creative efforts belong to the protection scope of the present invention.
Specific embodiments of the present invention are described below with reference to the accompanying drawings.
Example 1
As shown in fig. 1, a heat conduction mechanism and a radiator based on the same, including a fixing plate 1, a heat radiation fan 4 is fixed at the front end of the fixing plate 1 through a bolt, a blocking device 3 is fixed at the front end position of the fixing plate 1 in the middle of the heat radiation fan 4, a filtering device 2 is fixed at the front end of the heat radiation fan 4 through a bolt, a water cooling pipe 5 is fixed at the front end position of the fixing plate 1 on the right side of the heat radiation fan 4, a folding pipe 6 is inserted at the left end position of the water cooling pipe 5 below the fixing plate 1, and a water cooling cold head 7 is fixed at the left end of the folding pipe 6.
Fixing the water-cooling cold head 7 on the surface of the computer mainboard and contacting with the surface of the CPU through the heat-conducting silicone grease, then fixing the fixing plate 1 in the case, inserting the radiator connector on the surface of the mainboard, connecting the case power supply, the heat radiation fan 4 is electrified to rotate, meanwhile, the water cooling cold head 7 drives the cooling water to move, the cooling water heated by the CPU is cooled by the heat radiation fan 4 to circulate again, the water cooling cold head 7 and the fixing plate 1 are fixed through the folding tube 6, the arrangement of the water cooling tube 5 is convenient, the folding tube 6 moves along with the pulling of the water cooling tube 5, when the length of the water-cooled tube 5 is insufficient, the two ends of the folding tube 6 are pulled, the length of the folding tube 6 is changed, can adapt to the quick-witted case of variation in size, use the back for a long time at the radiator simultaneously, pull down the fixture block on 5 surfaces of water-cooling pipe from the extrusion circle on 6 surfaces of folding tube, can change the coolant liquid of inside, guarantee the radiating efficiency of equipment.
Example 2
As shown in fig. 1-2, a heat conduction mechanism and a radiator based on the same, including a fixing plate 1, a heat radiation fan 4 is fixed at the front end of the fixing plate 1 through a bolt, a separation device 3 is fixed at the front end of the fixing plate 1 in the middle of the heat radiation fan 4, a filter device 2 is fixed at the front end of the heat radiation fan 4 through a bolt, a water-cooling pipe 5 is fixed at the front end of the fixing plate 1 on the right side of the heat radiation fan 4, a folding pipe 6 is inserted at the left end of the water-cooling pipe 5 below the fixing plate 1, a water-cooling cold head 7 is fixed at the left end of the folding pipe 6, the separation device 3 includes a limiting block 31, a separation plate 32 is fixed at the front end of the limiting block 31, and an airflow groove 33 is fixed.
Stopper 31 and separation board 32 are fixed on the surface of fixed plate 1, and when radiator fan 4 switched in the power and began to rotate, the flabellum on radiator fan 4 surface drove gaseous removal, and gaseous forward movement blocks gaseous moving direction through separation board 32, makes two radiator fan 4's air current can not influence each other, makes during steam can directly arrange the air, avoids two radiator fan 4 air currents to influence each other and reduces the flabellum rotational speed to guarantee the radiating efficiency.
Example 3
As shown in fig. 1-3, a heat conduction mechanism and a heat sink based on the same, including a fixing plate 1, a heat dissipation fan 4 is fixed at the front end of the fixing plate 1 through bolts, a blocking device 3 is fixed at the front end of the fixing plate 1 in the middle of the heat dissipation fan 4, a filter device 2 is fixed at the front end of the heat dissipation fan 4 through bolts, a water cooling pipe 5 is fixed at the front end of the fixing plate 1 on the right side of the heat dissipation fan 4, a folding pipe 6 is inserted at the left end of the water cooling pipe 5 below the fixing plate 1, a water cooling cold head 7 is fixed at the left end of the folding pipe 6, the filter device 2 includes a connecting plate 21, a fixing frame 23 is fixed on the surface of the connecting plate 21 by welding, and a filter screen 22 is fixed inside.
Fix connecting plate 21 on radiator fan 4's surface, circulation of air filter screen 22 when radiator fan 4 rotates, when radiator fan 4 stall, outside dust is piled up on the filter screen 22 surface not with radiator fan 4 surperficial flabellum contact, fix the surface at radiator fan 4 through connecting plate 21, avoid outside dust to pile up on radiator fan 4 surperficial flabellum, thereby reduce the trouble of follow-up clearance, filter equipment 2 dismantles simply simultaneously, it is simple to dismantle after long-time the use, avoid influencing the gas flow rate on radiator fan 4 surface, guarantee the radiating effect.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and the preferred embodiments of the present invention are described in the above embodiments and the description, and are not intended to limit the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims (6)

1. The utility model provides a heat conduction mechanism and because its radiator, includes fixed plate (1), its characterized in that: the front end of fixed plate (1) is fixed with radiator fan (4) through the bolt, radiator fan (4) the centre is fixed with separation device (3) in the front position department of fixed plate (1), radiator fan's (4) front end is fixed with filter equipment (2) through the bolt, radiator fan's (4) right-hand front position department at fixed plate (1) is fixed with water-cooling pipe (5), the below of fixed plate (1) is pegged graft in the left end position department of water-cooling pipe (5) and is had folded tube (6), the left end of folded tube (6) is fixed with water-cooling cold head (7).
2. A heat conducting mechanism and heat sink based thereon according to claim 1, wherein: the surface of the folding pipe (6) is provided with an extrusion ring, and the surface of the water cooling pipe (5) is provided with a clamping block and is clamped inside the extrusion ring on the surface of the folding pipe (6).
3. A heat conducting mechanism and heat sink based thereon according to claim 1, wherein: the blocking device (3) comprises a limiting block (31), a blocking plate (32) is fixed at the front end of the limiting block (31), and an airflow groove (33) is fixed on the surface of the blocking plate (32).
4. A heat conducting mechanism and heat sink based thereon according to claim 3, wherein: the lower ends of the limiting blocks (31) and the blocking plate (32) are fixed on the surface of the fixing plate (1), and the upper end of the blocking plate (32) is higher than the upper end of the heat dissipation fan (4).
5. A heat conducting mechanism and heat sink based thereon according to claim 1, wherein: filter equipment (2) are including connecting plate (21), the surface welded fastening of connecting plate (21) has fixed frame (23), the inside of fixed frame (23) is fixed with filter screen (22).
6. A heat conducting mechanism and heat sink based thereon according to claim 5, wherein: the surface of the connecting plate (21) is fixed on the surface of the cooling fan (4) through bolts, and the lower end of the fixing frame (23) is in contact with the surface of the cooling fan (4).
CN202011545977.3A 2020-12-24 2020-12-24 Heat conduction mechanism and radiator based on same Pending CN112527085A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202011545977.3A CN112527085A (en) 2020-12-24 2020-12-24 Heat conduction mechanism and radiator based on same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202011545977.3A CN112527085A (en) 2020-12-24 2020-12-24 Heat conduction mechanism and radiator based on same

Publications (1)

Publication Number Publication Date
CN112527085A true CN112527085A (en) 2021-03-19

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CN202011545977.3A Pending CN112527085A (en) 2020-12-24 2020-12-24 Heat conduction mechanism and radiator based on same

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CN (1) CN112527085A (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070258208A1 (en) * 2006-05-02 2007-11-08 Lg Electronics Inc. Computer cooling apparatus
CN106708219A (en) * 2015-11-17 2017-05-24 济南宇星测绘仪器有限公司 Radiating device for computer chip and working method of radiating device
CN107918473A (en) * 2017-12-20 2018-04-17 重庆同传创译科技发展有限公司 Computer heat radiating device
CN209311972U (en) * 2018-12-27 2019-08-27 甘肃圣文商贸有限公司 A kind of radiator being conveniently replaceable strainer
CN211956368U (en) * 2020-06-08 2020-11-17 江苏财经职业技术学院 Computer water-cooling heat abstractor

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070258208A1 (en) * 2006-05-02 2007-11-08 Lg Electronics Inc. Computer cooling apparatus
CN106708219A (en) * 2015-11-17 2017-05-24 济南宇星测绘仪器有限公司 Radiating device for computer chip and working method of radiating device
CN107918473A (en) * 2017-12-20 2018-04-17 重庆同传创译科技发展有限公司 Computer heat radiating device
CN209311972U (en) * 2018-12-27 2019-08-27 甘肃圣文商贸有限公司 A kind of radiator being conveniently replaceable strainer
CN211956368U (en) * 2020-06-08 2020-11-17 江苏财经职业技术学院 Computer water-cooling heat abstractor

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