CN213987397U

CN213987397U - CPU water-cooling radiator

Info

Publication number: CN213987397U
Application number: CN202022638580.0U
Authority: CN
Inventors: 刘仁峰
Original assignee: Guangdong Runhua Precision Manufacturing Co ltd
Current assignee: Guangdong Runhua Precision Manufacturing Co ltd
Priority date: 2020-11-16
Filing date: 2020-11-16
Publication date: 2021-08-17
Anticipated expiration: 2030-11-16

Abstract

The utility model relates to a CPU water-cooling radiator, including base and heat dissipation mechanism, the spacing groove has all been seted up to the lower lateral wall of base, and the both sides of base all are provided with the connecting block, the outside of connecting block is provided with the bolt, the outside top of base is provided with the water pump, and the outside of water pump is provided with the dust screen, one side of water pump is provided with the inlet tube, and the opposite side of water pump is provided with the outlet pipe, the outside of inlet tube and outlet pipe all is provided with the sleeve pipe, the outside top of outlet pipe is provided with the water-cooling head, the outside top of base is provided with the bracing piece, and the outside top of bracing piece is provided with the connecting plate, the constant head tank has all been seted up to the inside wall of connecting plate. The utility model discloses, through being provided with the sleeve pipe, through the outside parcel sleeve pipe at outlet pipe and inlet tube to prevent that the inside liquid leakage of inlet tube and outlet pipe from leading to the CPU short circuit to burn out, thereby the effectual practicality that improves the device.

Description

CPU water-cooling radiator

Technical Field

The utility model relates to a relevant technical field of radiator especially relates to a CPU water-cooling radiator.

Background

The heat radiator is a device or an instrument which transfers heat generated by machinery or other appliances in the working process in time so as to avoid influencing the normal work of the machinery or other appliances, common heat radiators can be divided into various types such as air cooling, heat pipe radiators, liquid cooling, semiconductor refrigeration, compressor refrigeration and the like according to heat dissipation modes, a large number of integrated circuits are used in computer parts, as is known, high temperature is the enemy of the integrated circuits, the high temperature can not only cause unstable system operation and shortened service life, but also can even cause that some parts are burnt out, and the heat of the high temperature does not come from the outside of the computer but also comes into the inside of the computer, or inside the integrated circuit, the radiator is used for absorbing the heat and then radiating the heat into the case or outside the case, so that the temperature of computer parts is normal, and the water-cooling radiator has a better radiating effect than an ordinary air-cooling radiator, so that the CPU water-cooling radiator is provided.

The existing CPU water-cooling radiator used at present can not prevent the water pipe from leaking to cause the burning of the CPU, can not further install the device and an adjacent device, and can not be convenient for cleaning.

In order to solve the above problems, the present application provides a CPU water-cooled heat sink.

SUMMERY OF THE UTILITY MODEL

Objects of the invention

For solving the technical problem that exists among the background art, the utility model provides a CPU water-cooling radiator, the CPU water-cooling radiator who uses at present can not prevent that the water pipe from leaking and leading to CPU to burn out, can not further install the device and adjacent device, can not be convenient for clear up.

(II) technical scheme

In order to solve the problems, the utility model provides a CPU water-cooling radiator, which comprises a base and a heat dissipation mechanism, wherein the lower side wall of the base is provided with a limiting groove, both sides of the base are provided with connecting blocks, the outer side of the connecting blocks is provided with bolts, a water pump is arranged above the outer side of the base, the outer side of the water pump is provided with a dust screen, one side of the water pump is provided with a water inlet pipe, the other side of the water pump is provided with a water outlet pipe, the outer sides of the water inlet pipe and the water outlet pipe are provided with sleeves, a water cooling head is arranged above the outer side of the water outlet pipe, a support rod is arranged above the outer side of the base, a connecting plate is arranged above the outer side of the support rod, the inner side wall of the connecting plate is provided with a positioning groove, a baffle is arranged above the outer side of the connecting plate, both sides of the baffle are provided with positioning rods, and heat dissipation fins are arranged above the outer side of the baffle, the heat dissipation structure is characterized in that an acoustic board is arranged below the outer side of the connecting board, the heat dissipation mechanism is arranged below the outer side of the acoustic board, a heat pipe is arranged above the outer side of the water cooling head, and a fixing block is arranged above the outer side of the heat pipe.

Preferably, the connecting block is in threaded connection with a bolt, and the bolt is symmetrically arranged along the axis of the base.

Preferably, the inner side of the dust screen is tightly attached to the outer side of the water pump, and the length of the dust screen is smaller than that of the water pump.

Preferably, the water inlet pipe is symmetrically arranged about the central axis of the water outlet pipe, and the length of the water inlet pipe is equal to that of the water outlet pipe.

Preferably, the sleeve is of a cylindrical structure, and the size of the sleeve is larger than that of the water outlet pipe.

Preferably, the heat dissipation fins are distributed above the outer side of the baffle at equal intervals, and the length of the heat dissipation fins is equal to that of the baffle.

Preferably, the heat dissipation mechanism comprises a placing plate and a fan, and the fan is arranged below the outer side of the placing plate.

The above technical scheme of the utility model has following profitable technological effect:

1. the utility model discloses, through being provided with spacing groove and connecting block, at first carry out preliminary installation with the device and adjacent device through the spacing groove, carry out further installation through twisting the bolt in the connecting block outside adjacent device after the installation to effectually prevent to drop, improved the device's practicality.

2. The utility model discloses, through being provided with the sleeve pipe, through the outside parcel sleeve pipe at outlet pipe and inlet tube to prevent that the inside liquid leakage of inlet tube and outlet pipe from leading to the CPU short circuit to burn out, thereby the effectual practicality that improves the device.

3. The utility model discloses, through being provided with the locating lever, when heat radiation fins need clear up, through twisting out the inside locating lever of constant head tank to dismantle the baffle, so that wash heat radiation fins, the effectual practicality that improves the device.

Drawings

FIG. 1 is a schematic cross-sectional front view of a CPU water-cooled heat sink.

FIG. 2 is a schematic top view of a CPU water-cooled heat sink.

FIG. 3 is a schematic view of a connection structure of a positioning groove and a positioning rod in a CPU water-cooling heat sink.

FIG. 4 is a schematic view of the connection structure between the water outlet pipe and the sleeve in the CPU water-cooled radiator.

Reference numerals: 1. a base; 2. a limiting groove; 3. connecting blocks; 4. a bolt; 5. a water pump; 6. a dust screen; 7. a water inlet pipe; 8. a water outlet pipe; 9. a sleeve; 10. a water cooling head; 11. a support bar; 12. a connecting plate; 13. positioning a groove; 14. a baffle plate; 15. positioning a rod; 16. heat dissipation fins; 17. a sound-absorbing panel; 18. a heat dissipation mechanism; 1801. placing the plate; 1802. a fan; 19. a heat pipe; 20. and (5) fixing blocks.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in detail with reference to the accompanying drawings. It should be understood that the description is intended to be illustrative only and is not intended to limit the scope of the present invention. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present invention.

As shown in figures 1-4, the utility model provides a CPU water-cooling radiator, which comprises a base 1 and a heat dissipation mechanism 18, wherein the lower side wall of the base 1 is provided with a limiting groove 2, both sides of the base 1 are provided with connecting blocks 3, the outer side of the connecting blocks 3 is provided with bolts 4, the upper part of the outer side of the base 1 is provided with a water pump 5, the outer side of the water pump 5 is provided with a dust screen 6, one side of the water pump 5 is provided with a water inlet pipe 7, the other side of the water pump 5 is provided with a water outlet pipe 8, the outer sides of the water inlet pipe 7 and the water outlet pipe 8 are provided with a sleeve 9, the upper part of the outer side of the water outlet pipe 8 is provided with a water cooling head 10, the upper part of the outer side of the base 1 is provided with a support rod 11, the upper part of the outer side of the support rod 11 is provided with a connecting plate 12, the inner side wall of the connecting plate 12 is provided with a positioning groove 13, the upper part of the outer side of the connecting plate 12 is provided with a baffle 14, both sides of the baffle 14 are provided with positioning rods 15, and the upper part of the outer side of the baffle 14 is provided with a heat radiation fin 16, the lower part of the outer side of the connecting plate 12 is provided with a sound absorption plate 17, a heat radiation mechanism 18 is arranged below the outer side of the sound absorption plate 17, the upper part of the outer side of the water cooling head 10 is provided with a heat pipe 19, and the upper part of the outer side of the heat pipe 19 is provided with a fixed block 20.

In an alternative embodiment, the connecting block 3 is in threaded connection with the bolt 4, and the bolt 4 is symmetrically arranged on the axis of the base 1, so that the bolt 4 on the outer side of the connecting block 3 is connected with an adjacent device, thereby effectively preventing the device from falling off from the adjacent device.

In an optional embodiment, the inner side of the dust screen 6 is closely attached to the outer side of the water pump 5, the length of the dust screen 6 is smaller than that of the water pump 5, and the dust screen 6 is arranged to dissipate heat and prevent dust for the water pump 5, so that the practicability of the device is effectively improved.

In an alternative embodiment, the water inlet pipe 7 is symmetrically arranged about the axis of the water outlet pipe 8, the length of the water inlet pipe 7 is equal to that of the water outlet pipe 8, the switch of the water pump 5 is turned on by connecting an external power supply, the water pump 5 starts to operate, and the water pump 5 and the water outlet pipe 8 are always circulated through the water inlet pipe 7, so that the temperature of the CPU is reduced.

In an optional embodiment, the sleeve 9 is a cylindrical structure, the size of the sleeve 9 is larger than that of the water outlet pipe 8, and the water outlet pipe 8 is wrapped by the sleeve 9, so that the CPU is effectively prevented from being burnt due to liquid leakage inside the water outlet pipe 8, and the practicability of the device is effectively improved.

In an alternative embodiment, the heat dissipation fins 16 are distributed over the outer side of the baffle 14 at equal intervals, and the length of the heat dissipation fins 16 is equal to the length of the baffle 14, so that the heat dissipation fins 16 are arranged to dissipate heat from the connecting plate 12, thereby effectively improving the practicability of the device.

In an alternative embodiment, the heat dissipation mechanism 18 includes a placing plate 1801 and a fan 1802, and the fan 1802 is disposed below the outer side of the placing plate 1801, and when an external power source is connected and a switch of the fan 1802 is turned on, the fan 1802 starts to operate, and the water inlet pipe 7 and the water outlet pipe 8 are blown by the fan 1802, so as to cool the liquid circulating inside the water inlet pipe 7 and the water outlet pipe 8.

The working principle is as follows: firstly, the device is moved to a proper position, then the base 1 and an adjacent device are installed through the limiting groove 2, after the device is installed, the bolt 4 on the outer side of the connecting block 3 is screwed in, so that the fixation of the device and the adjacent device is further improved, the falling is prevented, then the fixing block 20 and a CPU are installed, the temperature generated by the CPU can be quickly transferred to the water cooling head 10 to the maximum extent through the heat pipe 19 at the bottom of the fixing block 20, then the switch of the water pump 5 is turned on through the connection of an external power supply, at the moment, the water pump 5 starts to run, cold water flows through the water cooling head 10 to become hot water and take away the heat through the running of the water pump 5 in the water outlet pipe 8, the hot water flows into the water inlet pipe 7, the heat is transferred to the connecting plate 12, the switch of the fan 1802 is turned on through the connection of the external power supply, at the moment, the fan 1802 starts to run, the water inlet pipe 7 and the water outlet pipe 8 are blown through the fan 1802, therefore, further heat dissipation is carried out, then the heat dissipation is changed into a cold water flow return water pump 5, the cold water flow return water pump 5 flows into a water outlet pipe 8 through the water pump 5 to circulate, finally the connecting plate 12 dissipates heat through the heat dissipation fins 16, when the heat dissipation fins 16 need to be cleaned, the baffle plate 14 is detached by screwing out the positioning rods 15 inside the positioning grooves 13, the plate and the heat dissipation fins 16 are cleaned, the radiator cancels the blade teeth on the traditional radiator, the occupied space of the radiator can be reduced to the maximum extent, the use flow of the CPU water-cooling radiator is finished, the water pump 5 is PW-175EAH, and the fan 1802 is MH 902R.

It is to be understood that the above-described embodiments of the present invention are merely illustrative of or explaining the principles of the invention and are not to be construed as limiting the invention. Therefore, any modification, equivalent replacement, improvement and the like made without departing from the spirit and scope of the present invention should be included in the protection scope of the present invention. Further, it is intended that the appended claims cover all such variations and modifications as fall within the scope and boundaries of the appended claims or the equivalents of such scope and boundaries.

Claims

1. The CPU water-cooling radiator is characterized by comprising a base (1) and a heat dissipation mechanism (18), wherein a limiting groove (2) is formed in the lower side wall of the base (1), connecting blocks (3) are arranged on the two sides of the base (1), a bolt (4) is arranged on the outer side of each connecting block (3), a water pump (5) is arranged above the outer side of the base (1), a dust screen (6) is arranged on the outer side of the water pump (5), a water inlet pipe (7) is arranged on one side of the water pump (5), a water outlet pipe (8) is arranged on the other side of the water pump (5), sleeves (9) are arranged on the outer sides of the water inlet pipe (7) and the water outlet pipe (8), a water cooling head (10) is arranged above the outer side of the water outlet pipe (8), a support rod (11) is arranged above the outer side of the base (1), and a connecting plate (12) is arranged above the outer side of the support rod (11), locating slot (13) have all been seted up to the inside wall of connecting plate (12), and the outside top of connecting plate (12) is provided with baffle (14), the both sides of baffle (14) all are provided with locating lever (15), and the outside top of baffle (14) is provided with heat radiation fins (16), the outside below of connecting plate (12) is provided with abatvoix (17), heat dissipation mechanism (18) are installed in the outside below of abatvoix (17), the outside top of water-cooling head (10) is provided with heat pipe (19), and the outside top of heat pipe (19) is provided with fixed block (20).

2. The CPU water-cooled heat sink according to claim 1, wherein the connecting block (3) is in threaded connection with the bolt (4), and the bolt (4) is arranged symmetrically with respect to the central axis of the base (1).

3. The CPU water-cooling radiator according to claim 1, wherein the inner side of the dust screen (6) is closely attached to the outer side of the water pump (5), and the length of the dust screen (6) is smaller than that of the water pump (5).

4. The CPU water-cooled radiator according to claim 1, wherein the water inlet pipe (7) is arranged symmetrically with respect to the central axis of the water outlet pipe (8), and the length of the water inlet pipe (7) is equal to that of the water outlet pipe (8).

5. The CPU water-cooled radiator according to claim 1, characterized in that the sleeve (9) is a cylindrical structure, and the size of the sleeve (9) is larger than that of the outlet pipe (8).

6. The CPU water-cooled radiator according to claim 1, wherein the radiating fins (16) are distributed above the outer side of the baffle (14) at equal intervals, and the length of the radiating fins (16) is equal to that of the baffle (14).

7. The CPU water-cooled heat sink according to claim 1, wherein the heat dissipation mechanism (18) comprises a placing plate (1801) and a fan (1802), and the fan (1802) is arranged below the outer side of the placing plate (1801).