CN210432262U - Radiator for power amplifier - Google Patents
Radiator for power amplifier Download PDFInfo
- Publication number
- CN210432262U CN210432262U CN201920836951.0U CN201920836951U CN210432262U CN 210432262 U CN210432262 U CN 210432262U CN 201920836951 U CN201920836951 U CN 201920836951U CN 210432262 U CN210432262 U CN 210432262U
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- Prior art keywords
- heat dissipation
- radiator
- groove
- power amplifier
- inclined plane
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Abstract
The utility model provides a radiator for power amplifier, the radiator that sets up including two symmetries reaches the heat dissipation connection piece as an organic whole with two radiators, the radiator that two symmetries set up surrounds with the heat dissipation connection piece and constitutes a frame type structure of taking the open-ended, and the inboard of radiator has an inclined plane, and the below on inclined plane is provided with one dop with heat dissipation connection piece parallel arrangement, forms a draw-in groove between inclined plane and the dop, it has a logical groove to open on the radiator, and the inner wall that leads to the groove is provided with the corrugated arch, and the inner wall that leads to the groove is provided with many heat dissipation fin strips. The utility model discloses a set the radiator to frame type structure for the radiator can with the contact of power amplifier on the widest range, improve radiating contact surface, realize the radiating purpose simultaneously of multizone, set up the louvre simultaneously on the radiator, utilize structural change to accelerate the natural convection current of air, reach the purpose that improves the radiating efficiency.
Description
Technical Field
The utility model relates to a radiator field, concretely relates to a radiator for power amplifier.
Background
In the existing power amplifier equipment, two modes of heat dissipation by adding a fan and/or heat dissipation by utilizing natural convection of air are generally adopted. The additional fan has the characteristic of high heat dissipation efficiency, but the cost of heat dissipation is higher by adopting the mode, and the additional fan further occupies space due to the limited space of the power amplifier. Compared with the heat dissipation with a fan, the heat dissipation with natural air convection has the characteristics of low cost and high reliability, the conventional power amplifier radiator is generally provided with flaky radiating fins on a radiating plate, the structure of the radiator can expel part of heat by utilizing natural air convection, but the structure can be improved to improve the heat dissipation rate to protect a power amplifier.
Disclosure of Invention
The utility model discloses a to prior art not enough, provide a radiator for power amplifier, have that the radiating effect is good, long service life, the advantage of the processing of being convenient for.
The utility model adopts the technical scheme as follows: the utility model provides a radiator for power amplifier, includes the radiator that two symmetries set up and connects two radiators as an organic whole radiator connection piece, the radiator that two symmetries set up surrounds with radiator connection piece and constitutes a frame type structure of taking the open-ended, and the inboard of radiator has an inclined plane, and the below on inclined plane is provided with a dop with radiator connection piece parallel arrangement, forms a draw-in groove between inclined plane and the dop, it has a logical groove to open on the radiator, and the inner wall that leads to the groove is provided with the wave arch, and the inner wall that leads to the groove is provided with many radiating fin strips.
Furthermore, the inner side of the heat dissipation connecting sheet is provided with at least one connector.
Furthermore, the surface of the outer side of the heat dissipation connecting sheet is provided with a square heat conduction groove which is sunken downwards.
Furthermore, the heat conducting groove is provided with an oval through hole at the position of the through groove.
Compared with the prior art, the utility model discloses a set the radiator to frame type structure for the radiator can with the power amplifier contact on the widest range, improve radiating contact surface, realize the radiating purpose simultaneously of multizone, set up the louvre simultaneously on the radiator, utilize structural change to accelerate the natural convection of air, reach the purpose that improves the radiating efficiency. The utility model discloses simple structure, the preparation is convenient, can be applied to in the heat radiation structure of various big power amplifiers.
Drawings
Fig. 1 is a schematic structural diagram of the heat sink for power amplifier of the present invention;
fig. 2 is a schematic structural view of the heat dissipating connecting sheet shown in fig. 1.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, rather than all embodiments, and features in the embodiments and embodiments in the present application can be combined with each other without conflict.
As shown in fig. 1, a heat sink for power amplifier includes two symmetrically disposed heat sinks 1 and a heat sink connecting sheet 2 connecting the two heat sinks 1 into a whole, the two symmetrically disposed heat sinks 1 and the heat sink connecting sheet 2 surround to form a frame structure with an opening, the inside of the frame structure is used for installing the power amplifier, the inside of the heat sink 1 has an inclined plane 11, the angle of the inclined plane 11 can be set according to the specific shape of the power amplifier, a chuck 13 parallel to the heat sink connecting sheet 2 is disposed below the inclined plane 11, the chuck 13 is used for fixing the power amplifier in the frame structure, a clamping groove 14 is formed between the inclined plane 11 and the chuck 13, and the clamping groove 14 structure can make the components of the power amplifier better contact with the inclined plane 11, so as to increase the heat conducting effect.
The radiator 1 is provided with a through groove 12, the through groove 12 is arranged to help rapid heat dissipation, the inner wall of the through groove 12 is provided with a wavy bulge to increase the heat dissipation area, the inner wall of the through groove 12 is provided with a plurality of heat dissipation fin strips 121 to further improve the heat dissipation effect, the heat dissipation fin strips 121 further enlarge the heat dissipation area, and the position of the through groove 12 corresponding to the inclined plane 11 is also provided with a plurality of heat dissipation fin strips 121.
The inner side of the heat dissipation connecting piece 2 is provided with at least one connector 21, the power amplifier is fixed by the connector 21, so that the power amplifier is in close contact with the heat dissipation connecting piece 2, normal heat transfer is guaranteed, and the heat dissipation connecting piece 2 can also be provided with wavy bulges as required to increase the heat dissipation area.
In order to further improve the heat dissipation efficiency, as shown in fig. 2, a square heat conduction groove 22 which is recessed downward is formed on the outer side surface of the heat dissipation connection sheet 2, on one hand, the heat conduction groove 22 is beneficial to increasing the heat dissipation area, on the other hand, the smoothness of the appearance is also kept, the manufacturing is more convenient compared with a method for increasing heat dissipation fin strips, and materials can be saved, and the heat conduction groove 22 is provided with an oval through hole 23 at the position of the through groove 12, so that the air convection rate of the through groove 12 is increased in the vertical direction, and the heat dissipation effect is improved.
The utility model discloses a set the radiator to frame type structure for the radiator can with the contact of power amplifier on the widest range, improve radiating contact surface, realize the radiating purpose simultaneously of multizone, set up the louvre simultaneously on the radiator, utilize structural change to accelerate the natural convection current of air, reach the purpose that improves the radiating efficiency. The utility model discloses simple structure, the preparation is convenient, can be applied to in the heat radiation structure of various big power amplifiers.
The above only is the embodiment of the present invention, not limiting the patent scope of the present invention, all utilize the equivalent structure or equivalent flow transformation that the content of the specification does, or directly or indirectly use in other related technical fields, all including in the same way the patent protection scope of the present invention.
Claims (4)
1. A radiator for power amplifier, its characterized in that: the heat dissipation structure comprises two symmetrically arranged heat dissipation bodies and a heat dissipation connecting sheet which connects the two heat dissipation bodies into a whole, wherein the two symmetrically arranged heat dissipation bodies and the heat dissipation connecting sheet are encircled to form a frame structure with an opening, an inclined plane is arranged on the inner side of each heat dissipation body, a clamping head which is parallel to the heat dissipation connecting sheet is arranged below the inclined plane, a clamping groove is formed between the inclined plane and the clamping head, a through groove is formed in each heat dissipation body, a wavy bulge is arranged on the inner wall of the through groove, and a plurality of heat dissipation fin strips are arranged on the inner wall of.
2. The heat sink for a power amplifier according to claim 1, wherein: the inner side of the heat dissipation connecting sheet is provided with at least one connector.
3. The heat sink for a power amplifier according to claim 1, wherein: the surface of the outer side of the heat dissipation connecting sheet is provided with a square heat conducting groove which is sunken downwards.
4. The heat sink for a power amplifier according to claim 3, wherein: the heat conducting groove is provided with an oval through hole at the position of the through groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920836951.0U CN210432262U (en) | 2019-06-03 | 2019-06-03 | Radiator for power amplifier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920836951.0U CN210432262U (en) | 2019-06-03 | 2019-06-03 | Radiator for power amplifier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210432262U true CN210432262U (en) | 2020-04-28 |
Family
ID=70373866
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920836951.0U Active CN210432262U (en) | 2019-06-03 | 2019-06-03 | Radiator for power amplifier |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210432262U (en) |
-
2019
- 2019-06-03 CN CN201920836951.0U patent/CN210432262U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |