CN212112399U - Air-cooled heat dissipation device for display card - Google Patents
Air-cooled heat dissipation device for display card Download PDFInfo
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- CN212112399U CN212112399U CN202022216238.1U CN202022216238U CN212112399U CN 212112399 U CN212112399 U CN 212112399U CN 202022216238 U CN202022216238 U CN 202022216238U CN 212112399 U CN212112399 U CN 212112399U
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Abstract
The utility model provides a display card forced air cooling heat abstractor, it includes the heat conduction bottom plate, be equipped with heat conduction heat pipe, samming board, radiator and fan on the heat conduction bottom plate, heat conduction heat pipe communicates with the inside cavity of samming board, heat conduction heat pipe, samming board are located the below of radiator, the fan is located one side of radiator. By adopting the technical scheme of the utility model, the thermal resistance is better reduced by adopting the mode of communicating the temperature equalizing plate with the heat conducting heat pipe, and the heat radiating efficiency is improved; further carry out gilding to the temperature-uniforming plate and handle, reduced thermal contact resistance, improved heat conduction efficiency, generally speaking, the technical scheme of the utility model better radiating effect has.
Description
Technical Field
The utility model relates to a display card heat dissipation technical field especially relates to a display card forced air cooling heat abstractor.
Background
At present, in an air cooling system of a graphics card radiator, a heat radiation mode combining heat conduction of a copper plate, a heat pipe and a VC (Vapor chamber, commonly called as a plane heat pipe, a temperature equalizing plate and a Vapor equalizing plate in the industry) with fins is adopted, and the principle is that heat of a chip is conducted to the heat pipe through a VC/copper bottom, the heat pipe transfers the heat to the fins, and the heat is blown by air cooling of a fan, so that the purpose of cooling is achieved. However, the scheme of the uniform temperature plate heating pipe has low heat conduction efficiency and cannot achieve the optimal heat dissipation effect; and the contact thermal resistance between the surface of the temperature equalizing plate and the chip is large, and the contact thermal resistance and the heat conduction thermal resistance exist between the temperature equalizing plate and the copper material between the heat pipes, so that the heat transfer efficiency and the heat dissipation effect are influenced.
SUMMERY OF THE UTILITY MODEL
To the technical problem, the utility model discloses a display card forced air cooling heat abstractor has better radiating effect.
To this end, the technical scheme of the utility model is that:
the utility model provides a display card forced air cooling heat abstractor, its includes the heat conduction bottom plate, be equipped with heat conduction heat pipe, temperature-uniforming plate, radiator and fan on the heat conduction bottom plate, the heat conduction heat pipe communicates with the inside cavity of temperature-uniforming plate, heat conduction heat pipe, temperature-uniforming plate are located the below of radiator, the fan is located one side of radiator. By adopting the technical scheme, the heat conduction heat pipe is communicated with the inner cavity of the temperature-uniforming plate, the internal gas-liquid phase change substance can directly and freely move in the 2 cavities, the thermal contact resistance and the thermal conduction resistance between the wall of the heat conduction pipe and the surface of the temperature-uniforming plate are directly removed, the thermal resistance is reduced, and the heat dissipation efficiency is improved.
As a further improvement of the utility model, the temperature-uniforming plate is a 3D temperature-uniforming plate.
As a further improvement of the utility model, the heat conduction bottom plate is an aluminum plate.
As a further improvement of the utility model, the heat radiator is in the shape of an arc inwards concave on one side adjacent to the fan. Further, the side of the heat sink adjacent to the fan is equidistant from the edge of the fan.
By adopting the technical scheme, the inward-concave arc of the radiator is actually the avoiding position of the fins, so that the wind noise can be reduced. Furthermore, the avoiding positions are equidistantly arranged according to the arc radian of the fan, and the distance between each fin and the fan is equidistant, so that the wind noise can be more effectively reduced.
As a further improvement of the present invention, an air guiding ring is disposed on one side of the heat sink adjacent to the fan, and the extending direction of the fins of the heat sink faces the fan.
As a further improvement, the arc-shaped circle center of the wind guide ring is concentric with the fan.
As a further improvement, the fins of the heat sink are equidistantly spaced from the adjacent outer side of the fan arc.
As a further improvement, one end of the heat conducting heat pipe is connected with the inlet of the inner cavity of the temperature equalizing plate, and the other end of the heat conducting heat pipe is positioned on the surface of the temperature equalizing plate.
As a further improvement of the utility model, the bottom surface of the temperature-uniforming plate is provided with a gold-plated layer. In the technical scheme, the gold-plated layer is arranged on the side, which is in contact with the bottom plate, of the temperature equalizing plate, so that the heat conduction resistance can be better reduced, and the heat dissipation efficiency is improved.
As a further improvement of the utility model, the surface of the temperature equalizing plate is a copper plate. The temperature equalizing plate is connected with the fin radiator through the copper plate, heat is rapidly transferred to the fin radiator, and then the heat is forcibly exhausted by air cooling of the fan, so that the purpose of cooling is achieved.
As a further improvement, the display card air-cooled heat dissipation device comprises an upper cover, the upper cover is arranged above the radiator and the fan, and the air port is opposite to the fan.
Compared with the prior art, the beneficial effects of the utility model are that:
by adopting the technical scheme of the utility model, the thermal resistance is better reduced by adopting the mode of communicating the temperature equalizing plate with the heat conducting heat pipe, and the heat radiating efficiency is improved; further carry out gilding to the temperature-uniforming plate and handle, reduced thermal contact resistance, improved heat conduction efficiency, generally speaking, the technical scheme of the utility model better radiating effect has.
Drawings
Fig. 1 is a schematic structural view of an air-cooled heat dissipation device for a display card of the present invention.
Fig. 2 is an exploded schematic view of the air-cooled heat dissipation device for a display card of the present invention.
Fig. 3 is a schematic diagram of the heat conducting heat pipe, the temperature equalizing plate and the heat sink of the air cooling heat dissipation device for the display card of the present invention.
Fig. 4 is a schematic view of the heat conducting pipe and the temperature equalizing plate of the air cooling heat dissipation device for display card of the present invention.
Fig. 5 is a top view of the fan and the heat sink of the air cooling heat dissipation device for a display card of the present invention.
The reference numerals include:
1-upper cover, 2-heat conducting bottom plate, 3-heat conducting heat pipe, 4-temperature equalizing plate, 5-fin radiator, 6-fan, 7-gold plating layer, 8-air port, 9-air guiding ring, 10-fin and 11-PCB.
Detailed Description
Preferred embodiments of the present invention will be described in further detail with reference to the accompanying drawings.
As shown in fig. 1 to 5, an air-cooled heat dissipation device for a display card includes an upper cover 1 and a heat conduction bottom plate 2, the heat conduction bottom plate 2 is provided with a heat conduction heat pipe 3, a temperature equalization plate 4, a fin radiator 5 and a fan 6, one end of the heat conduction heat pipe 3 is connected with an inlet of an internal cavity of the temperature equalization plate 4, and the other end of the heat conduction heat pipe 3 is located on the surface of the temperature equalization plate 4. The heat conduction heat pipe 3 and the temperature equalizing plate 4 are positioned below the fin radiator 5, and the fan 6 is positioned on one side of the fin radiator 5. The gold-plated layer 7 is arranged on one surface of the temperature equalizing plate 4, which is in contact with the heat conducting bottom plate 2, so that the heat conducting resistance can be better reduced by contacting with a part to be radiated, and the radiating efficiency is improved. The surface of the temperature equalizing plate 4 is a copper plate. The upper cover 1 covers the fin radiator 5 and the fan 6, and the upper cover 1 is provided with an air opening 8, and the air opening 8 faces the fan 6.
As shown in fig. 5, the side of the fin heat sink 5 adjacent to the fan 6 is an arc shape that is concave inwards. Furthermore, the distance between one side of the fin radiator 5 adjacent to the fan 6 and the edge of the fan 6 is equal, the inward concave arc forms a avoiding position, the avoiding position is equidistant according to the arc radian of the fan 6, and the distance between each fin 10 and the fan 6 is equidistant, so that the wind noise can be effectively reduced. The side of the fin radiator 5 adjacent to the fan 6 is provided with an air guiding ring 9, and the extending direction of the fins 10 of the fin radiator 5 faces the fan 6.
Further, the temperature-uniforming plate 4 is a 3D temperature-uniforming plate 4. The heat conduction bottom plate is an aluminum plate.
The display card air-cooling heat dissipation device is arranged on the PCB 11 of the display card, the heat of the chip is transferred to the heat conduction bottom plate 2, and the heat of the heat conduction bottom plate 2 is transferred to the temperature equalizing plate 4 and the heat conduction heat pipe 3 through the gold-plated layer 7, so that the contact thermal resistance is reduced, and the heat conduction efficiency is improved; the heat conduction heat pipe 3 is communicated with the inner cavity of the temperature-uniforming plate 4, the gas-liquid phase change substances in the heat conduction heat pipe can directly and freely move in the 2 cavities, and the thermal contact resistance and the thermal conduction resistance between the pipe wall of the heat conduction heat pipe 3 and the surface of the temperature-uniforming plate 4 are directly removed under the action of the fan 6 and the fin radiator 5, so that the heat dissipation efficiency is improved, and the thermal resistance is reduced. The fins 10 of the fin radiator 5 are equidistantly avoided according to the arc radian of the fan 6, so that the wind noise can be effectively reduced.
The above-mentioned embodiments are the preferred embodiments of the present invention, and the scope of the present invention is not limited to the above-mentioned embodiments, and the scope of the present invention includes and is not limited to the above-mentioned embodiments, and all equivalent changes made according to the shape and structure of the present invention are within the protection scope of the present invention.
Claims (9)
1. The utility model provides a display card forced air cooling heat abstractor which characterized in that: the heat conduction bottom plate is provided with a heat conduction heat pipe, a temperature equalizing plate, a radiator and a fan, the heat conduction heat pipe is communicated with an inner cavity of the temperature equalizing plate, the heat conduction heat pipe and the temperature equalizing plate are located below the radiator, and the fan is located on one side of the radiator.
2. The graphics card air-cooled heat dissipation device of claim 1, wherein: one side of the radiator adjacent to the fan is in an inward concave arc shape.
3. The graphics card air-cooled heat dissipation device of claim 2, wherein: and one side of the radiator adjacent to the fan is provided with an air guide ring, and the extending direction of the fins of the radiator faces the fan.
4. The graphics card air-cooled heat dissipation device of claim 3, wherein: the fins of the radiator are arranged at equal intervals with the adjacent arc-shaped outer side faces of the fans.
5. The graphics card air-cooled heat dissipation device of claim 3, wherein: the heat conduction bottom plate is an aluminum plate.
6. The air-cooled heat dissipation device for the display card according to any one of claims 1 to 5, wherein: one end of the heat conduction heat pipe is connected with an inlet of the inner cavity of the temperature-equalizing plate, and the other end of the heat conduction heat pipe is located on the surface of the temperature-equalizing plate.
7. The graphics card air-cooled heat dissipation device of claim 6, wherein: and a gold plating layer is arranged on the bottom surface of the temperature-equalizing plate.
8. The graphics card air-cooled heat dissipation device of claim 7, wherein: the surface of the temperature equalizing plate is a copper plate.
9. The graphics card air-cooled heat dissipation device of claim 6, wherein: the fan cover comprises an upper cover, wherein the upper cover is arranged above the radiator and the fan, and an air opening is formed in the upper cover and faces the fan.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022216238.1U CN212112399U (en) | 2020-10-09 | 2020-10-09 | Air-cooled heat dissipation device for display card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022216238.1U CN212112399U (en) | 2020-10-09 | 2020-10-09 | Air-cooled heat dissipation device for display card |
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| Publication Number | Publication Date |
|---|---|
| CN212112399U true CN212112399U (en) | 2020-12-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202022216238.1U Active CN212112399U (en) | 2020-10-09 | 2020-10-09 | Air-cooled heat dissipation device for display card |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113412031A (en) * | 2021-06-21 | 2021-09-17 | 合肥联宝信息技术有限公司 | Heating module and electronic equipment |
-
2020
- 2020-10-09 CN CN202022216238.1U patent/CN212112399U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113412031A (en) * | 2021-06-21 | 2021-09-17 | 合肥联宝信息技术有限公司 | Heating module and electronic equipment |
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