CN111403358A - Double-sided water-cooling radiator and power tube integrated unit - Google Patents
Double-sided water-cooling radiator and power tube integrated unit Download PDFInfo
- Publication number
- CN111403358A CN111403358A CN202010120996.5A CN202010120996A CN111403358A CN 111403358 A CN111403358 A CN 111403358A CN 202010120996 A CN202010120996 A CN 202010120996A CN 111403358 A CN111403358 A CN 111403358A
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- Prior art keywords
- water
- double
- power tube
- cover plate
- sided
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- 238000001816 cooling Methods 0.000 title claims abstract description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 22
- 230000017525 heat dissipation Effects 0.000 claims abstract description 21
- 238000005219 brazing Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 238000002474 experimental method Methods 0.000 description 3
- 239000002826 coolant Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000005669 field effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/739—Transistor-type devices, i.e. able to continuously respond to applied control signals controlled by field-effect, e.g. bipolar static induction transistors [BSIT]
- H01L29/7393—Insulated gate bipolar mode transistors, i.e. IGBT; IGT; COMFET
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Ceramic Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention provides a double-sided water-cooled radiator and a power tube integrated unit, belonging to the technical field of heat dissipation of electronic devices and comprising the following steps: the cover plate is used for arranging a power tube; the back surface of the shell is used for arranging the power tube, comprises a water outlet and a water inlet which are arranged on two sides and is matched with the cover plate to form a heat dissipation water channel; and the fins are arranged in the heat dissipation water channel. According to the double-sided water-cooling radiator and the power tube integrated unit, the shell and the cover plate form the radiating water channel, so that the power tube is radiated by introducing a water-cooling mode, and the radiating efficiency is improved; meanwhile, the power tubes are respectively arranged on the shell and the cover plate, so that the number of the power tubes which can support heat dissipation of the double-sided water-cooled radiator is increased, and the design volume of the equipment is reduced.
Description
Technical Field
The invention relates to the technical field of heat dissipation of electronic devices, in particular to a double-sided water-cooling heat radiator and a power tube integrated unit.
Background
For the heat dissipation problem of power tubes, especially Insulated Gate Bipolar Transistors (IGBTs), the air-cooled heat dissipation design is usually adopted. Taking the IGBT as an example, the single tube spreads the released heat to a complete heat sink substrate, the heat is transferred to the heat sink fins through the substrate, and the heat is transferred to the outside by forcing the high-speed airflow generated by the air cooling device to flow through the fins (the airflow can only flow to the outside through the fins), thereby achieving heat exchange. The air-cooled heat dissipation design has poor heat dissipation efficiency, and the heat radiator has large volume and is difficult to meet the requirement of high power density at present.
Disclosure of Invention
The invention aims to provide a double-sided water-cooling radiator and a power tube integrated unit, which can meet the radiating requirement of a power tube under the condition of saving the volume of equipment.
In order to achieve the above object, an aspect of the present invention provides a double-sided water-cooled heat sink, including:
the cover plate is used for arranging a power tube;
the back surface of the shell is used for arranging the power tube, and the shell comprises a water outlet and a water inlet which are arranged on two sides 1 and are matched with the cover plate to form a heat dissipation water channel; and
and the fins are arranged in the heat dissipation water channel.
Optionally, the water outlet and the water inlet are disposed on the top surface or the bottom surface of the housing and oriented perpendicular to the housing.
Optionally, the fins are connected with the shell and the cover plate in a brazing mode.
Optionally, the fins are zigzag-shaped and staggered with respect to each other to form a fin array.
Optionally, the housing includes screw holes for mounting the double-sided water-cooled heat sink to equipment.
On the other hand, the invention also provides a power tube integrated unit, which comprises the double-sided water-cooling radiator and at least one power tube arranged on the cover plate and the shell of the double-sided water-cooling radiator.
Optionally, a heat conducting gasket is disposed between the power tube and the cover plate or the housing.
According to the technical scheme, the double-sided water-cooling radiator and the power tube integrated unit provided by the invention adopt the shell and the cover plate to form the heat radiation water channel, so that a water cooling mode is introduced to radiate the power tube, and the heat radiation efficiency is improved; meanwhile, the power tubes are respectively arranged on the shell and the cover plate, so that the number of the power tubes which can support heat dissipation of the double-sided water-cooled radiator is increased, and the design volume of the equipment is reduced.
Additional features and advantages of the invention will be set forth in the detailed description which follows.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is an exploded view of a double-sided water-cooled heat sink according to one embodiment of the present invention;
FIG. 2 is a schematic overall view of a double-sided water-cooled heat sink according to one embodiment of the present invention;
FIG. 3 is a schematic view of a fin and fin array according to one embodiment of the present invention;
FIG. 4 is a schematic view of a fin according to one embodiment of the present invention;
FIG. 5 is a schematic view of a fin according to one embodiment of the present invention;
FIG. 6 is a schematic view of a fin according to one embodiment of the present invention;
FIG. 7 is a schematic view of a fin according to one embodiment of the present invention;
fig. 8 is an exploded view of a power tube integrated unit according to an embodiment of the present invention; and
fig. 9 is an overall schematic diagram of a power tube integrated unit according to an embodiment of the present invention.
Detailed Description
The following detailed description of embodiments of the invention refers to the accompanying drawings. It should be understood that the detailed description and specific examples, while indicating the present invention, are given by way of illustration and explanation only, not limitation.
Fig. 1 is an exploded view of a double-sided water-cooled heat sink according to an embodiment of the present invention. In fig. 1, the double-sided water-cooled heat sink may include a cover plate 01, a case 02, and fins 03. The cover plate 01 may be used to dispose a power tube. The power transistor may include, for example, an IGBT (insulated gate bipolar transistor), an MSOFET (Metal-Oxide-Semiconductor Field-effect transistor), and the like. The back of the housing 02 may also be used to provide power tubes. The housing 02 may include a water outlet 021 and a water inlet 022 disposed at both sides. The housing 02 may form a heat sink channel with the cover plate 01 for external coolant to flow therethrough to exchange heat. The fins 03 may be disposed in the heat-dissipating water passage to guide heat of the cover plate 01 and the housing 02 into the coolant.
Fig. 2 is an overall schematic diagram of a double-sided water-cooled radiator according to an embodiment of the invention. In fig. 2, the water outlet 021 and the water inlet 022 may be disposed on the top or bottom surface of the housing 02 and oriented perpendicular to the housing 02 in consideration of design requirements of actual devices (e.g., location of the remaining controller and the like). In addition, as shown in fig. 2, the housing 02 may further include screw holes 023 for mounting the double-sided water-cooled heat sink to equipment.
In one embodiment of the present invention, the fins 03, the housing 02, and the cover plate 01 may be connected by brazing, in consideration of the device characteristics of the double-sided water-cooled heat sink.
In this embodiment, as for the shape of the fin 03, various forms known to those skilled in the art, such as the shapes shown in fig. 3 to 7, and the like, are possible. In a preferred example of the present invention, the fin 03 may have a shape as shown in fig. 3. In fig. 3, the fins 03 may be zigzag-shaped and staggered (two adjacent rows 90 degrees) to form a fin array 04. The shape shown in fig. 3 is proved to have a better heat dissipation effect through experiments. The specific experiment is as follows:
first, experiments were performed using the same heat generating unit using a double-sided water-cooled radiator constituted by fins of different shapes (see fig. 3 to 7). In the experimental process, the pressure difference between the water inlet and the water outlet and the surface temperature of the heating unit after the same time of executing the heat dissipation operation are respectively detected. The experimental data are shown in table 1,
TABLE 1
| Serial number | Shape of fin | Pressure difference between inlet and outlet (KPa) | Maximum surface temperature (. degree. C.) |
| 1 | FIG. 3 | 3.8 | 83.4 |
| 2 | FIG. 4 | 4.8 | 84.6 |
| 3 | FIG. 5 | 3.9 | 89 |
| 4 | FIG. 6 | 6.8 | 85.4 |
| 5 | FIG. 7 | 14.9 | 109.3 |
As can be seen from the experimental data shown in table 1, the smallest pressure difference between the inlet and the outlet (the pressure difference between the water inlet and the water outlet) corresponding to the fin shown in fig. 3 indicates that the fin is subjected to the smallest water pressure, so that the fin is not easily damaged, and in addition, in view of the heat dissipation effect, the highest surface temperature of the heat generating unit corresponding to the fin shown in fig. 3 is the lowest in the case of heat dissipation after the same time has elapsed. Therefore, the heat dissipation effect is also the best, so the shape shown in fig. 3 can better improve the heat dissipation effect of the present invention.
On the other hand, the invention also provides a power tube integrated unit, which may include any one of the double-sided water-cooled heat sinks described above and at least one power tube 05 disposed on the cover plate 01 and the housing 02 of the double-sided water-cooled heat sink 10, and its exploded view is shown in fig. 8, and its combined view is shown in fig. 9. Further, in order to better conduct the heat of the power tube 05 to the cover plate 01 or the housing 02, a heat conduction gasket 06 may be disposed between the power tube 05 and the cover plate 01 or the housing 02.
According to the technical scheme, the double-sided water-cooling radiator and the power tube integrated unit provided by the invention adopt the shell and the cover plate to form the heat radiation water channel, so that a water cooling mode is introduced to radiate the power tube, and the heat radiation efficiency is improved; meanwhile, the power tubes are respectively arranged on the shell and the cover plate, so that the number of the power tubes which can support heat dissipation of the double-sided water-cooled radiator is increased, and the design volume of the equipment is reduced.
While the invention has been described in detail with reference to the drawings, the invention is not limited to the details of the above-described alternative embodiments, and various simple modifications can be made to the technical solution of the invention within the technical idea of the invention, and the simple modifications are within the protective scope of the invention.
It should be noted that the various features described in the above embodiments may be combined in any suitable manner without departing from the scope of the invention. In order to avoid unnecessary repetition, the embodiments of the present invention will not be described separately for the various possible combinations.
In addition, any combination of the various embodiments of the present invention is also possible, and the same should be considered as disclosed in the embodiments of the present invention as long as it does not depart from the spirit of the embodiments of the present invention.
Claims (7)
1. The utility model provides a two-sided water-cooling radiator which characterized in that, two-sided water-cooling radiator includes:
the cover plate is used for arranging a power tube;
the back surface of the shell is used for arranging the power tube, comprises a water outlet and a water inlet which are arranged on two sides and is matched with the cover plate to form a heat dissipation water channel; and
and the fins are arranged in the heat dissipation water channel.
2. The double-sided water-cooled heat sink as recited in claim 1, wherein the water outlet and the water inlet are disposed on a top surface or a bottom surface of the housing and oriented perpendicular to the housing.
3. The double-sided water-cooled heat sink as recited in claim 1, wherein the fins are connected to the housing and the cover plate by brazing.
4. The double-sided water-cooled heat sink as recited in claim 1, wherein the fins are zigzag-shaped and staggered to form a fin array.
5. The double-sided water-cooled heat sink of claim 1, wherein the housing includes screw holes for mounting the double-sided water-cooled heat sink to equipment.
6. A power tube integrated unit, characterized in that, the power tube integrated unit comprises the double-sided water-cooled heat sink as claimed in any one of claims 1 to 5 and at least one power tube arranged on the cover plate and the shell of the double-sided water-cooled heat sink.
7. The power tube integrated unit according to claim 6, wherein a heat conducting gasket is arranged between the power tube and the cover plate or the shell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010120996.5A CN111403358A (en) | 2020-02-26 | 2020-02-26 | Double-sided water-cooling radiator and power tube integrated unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010120996.5A CN111403358A (en) | 2020-02-26 | 2020-02-26 | Double-sided water-cooling radiator and power tube integrated unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111403358A true CN111403358A (en) | 2020-07-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010120996.5A Pending CN111403358A (en) | 2020-02-26 | 2020-02-26 | Double-sided water-cooling radiator and power tube integrated unit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111403358A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113192910A (en) * | 2021-04-15 | 2021-07-30 | 常州易控汽车电子股份有限公司 | IGBT module heat radiation structure |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2445432Y (en) * | 2000-10-13 | 2001-08-29 | 魏文珍 | Heat sink |
| CN201146657Y (en) * | 2007-09-25 | 2008-11-05 | 张健 | Electronic component and radiator for electronic chip |
| CN201197250Y (en) * | 2008-05-22 | 2009-02-18 | 南京南瑞继保电气有限公司 | Water cooling radiator of high power electric power electronic component |
| CN101697448A (en) * | 2009-10-24 | 2010-04-21 | 永济新时速电机电器有限责任公司 | Two-side water cooling substrate of power module of current transformer |
| CN207818556U (en) * | 2017-12-26 | 2018-09-04 | 比亚迪股份有限公司 | A kind of heat dissipation element and IGBT modules |
| CN209914351U (en) * | 2019-01-30 | 2020-01-07 | 深圳市库马克新技术股份有限公司 | Water-cooling plate radiator of frequency converter |
-
2020
- 2020-02-26 CN CN202010120996.5A patent/CN111403358A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2445432Y (en) * | 2000-10-13 | 2001-08-29 | 魏文珍 | Heat sink |
| CN201146657Y (en) * | 2007-09-25 | 2008-11-05 | 张健 | Electronic component and radiator for electronic chip |
| CN201197250Y (en) * | 2008-05-22 | 2009-02-18 | 南京南瑞继保电气有限公司 | Water cooling radiator of high power electric power electronic component |
| CN101697448A (en) * | 2009-10-24 | 2010-04-21 | 永济新时速电机电器有限责任公司 | Two-side water cooling substrate of power module of current transformer |
| CN207818556U (en) * | 2017-12-26 | 2018-09-04 | 比亚迪股份有限公司 | A kind of heat dissipation element and IGBT modules |
| CN209914351U (en) * | 2019-01-30 | 2020-01-07 | 深圳市库马克新技术股份有限公司 | Water-cooling plate radiator of frequency converter |
Non-Patent Citations (2)
| Title |
|---|
| 中国工程热物理学会: "《中国工程热物理学会 第十一届年会论文集 传热传质学》", 31 December 2005 * |
| 美国泰莱达因•大陆发动机公司通用产品部编写，章锦、李仁业译: "《车辆冷却系统设计手册》", 31 July 1984, 国防工业出版社 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113192910A (en) * | 2021-04-15 | 2021-07-30 | 常州易控汽车电子股份有限公司 | IGBT module heat radiation structure |
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