CN207818556U - A kind of heat dissipation element and IGBT modules - Google Patents
A kind of heat dissipation element and IGBT modules Download PDFInfo
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- CN207818556U CN207818556U CN201721854636.8U CN201721854636U CN207818556U CN 207818556 U CN207818556 U CN 207818556U CN 201721854636 U CN201721854636 U CN 201721854636U CN 207818556 U CN207818556 U CN 207818556U
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Abstract
This disclosure relates to a kind of heat dissipation element, which includes heat radiator body and thermal column, and the heat radiator body is aluminium silicon-carbon heat radiator body；One end of the thermal column is fixed on by layer on the downside surface of the aluminium silicon-carbon heat radiator body, and the other end of the thermal column is free end.The disclosure additionally provides a kind of IGBT modules, which includes IGBT circuit boards and heat dissipation element as described above.Pass through above-mentioned technical proposal, thermal column is welded on by layer in aluminium silicon-carbon heat radiator body by the disclosure, while ensureing heat dissipation effect, need not be integrally formed to form thermal column, thus the demoulding loss for greatly reducing integrated mould, extends the service life of integrated mould.
Description
Technical field
This disclosure relates to heat sink technology field, and in particular, to a kind of heat dissipation element and IGBT modules.
Background technology
IGBT (Insulated Gate Bipolar Transistor) is one kind by double pole triode and insulated-gate type
The compound full-control type voltage driven type power semiconductor of field-effect tube composition, is widely used on various electronic equipments.With
The development for the high current electronics such as frequency converter, for the performance of igbt chip, more stringent requirements are proposed, and igbt chip is held
By higher electric current, the heat that when work generates is continuously increased, it is therefore desirable to which heat dissipation element accelerates to radiate.
Often through being integrally formed, to be arranged, thermal column carrys out increasing heat radiation area and enhancing dissipates in existing IGBT heat dissipation elements
Thermal energy power.But the preparation for being integrally formed thermal column is higher to the loss of integrally formed mold, die life is very
It is short.
Utility model content
Purpose of this disclosure is to provide a kind of heat dissipation element, which has good heat dissipation effect and need not lead to
Integrated molding is crossed to form thermal column.
To achieve the goals above, present disclose provides a kind of heat dissipation element, which includes heat radiator body and dissipates
Plume, the heat radiator body are aluminium silicon-carbon heat radiator body；One end of the thermal column is fixed on the aluminium silicon-carbon by layer and dissipates
On the downside surface of hot ontology, the other end of the thermal column is free end.
Optionally, the thermal column is multiple；The thermal column is that copper post, aluminium column, aluminium alloy column and aluminium cover in copper post
It is at least one.
Optionally, the draft angle β of the thermal column is 0 degree~4 degree, and the height of the thermal column is 5~10 millimeters, described
The cross section of thermal column is a diameter of 2~6 millimeters of the cross section of the round and described thermal column.
Optionally, the thermal column is multiple, and the distance of the two neighboring thermal column is 0.4 millimeter~1.1 millimeters, institute
The draft angle β for stating thermal column is 0 degree~2 degree.
Optionally, the thermal column is multigroup thermal column, length of the multigroup thermal column along the aluminium silicon-carbon heat radiator body
Spend direction interval setting, multigroup thermal column include along the aluminium silicon-carbon heat radiator body length direction be arranged alternately first
In the thermal column of thermal column (5) first subgroup and the thermal column of second subgroup of the thermal column of subgroup and the second subgroup
Include the spaced multiple thermal columns of width direction along the aluminium silicon-carbon heat radiator body.
Optionally, the layer is Pb bases layer or Sn base layers；The thickness of the layer is 0.01mm~0.5mm；Institute
Layer is stated to be distributed in region that the thermal column is combined with the aluminium silicon-carbon heat radiator body and be continuous layer.
Optionally, the layer is PbSn layers, PbSnAg layers, SnAg layers or SnSb layers.
Optionally, the aluminium silicon-carbon heat radiator body includes silicon carbide porous skeleton and is existed by the integrally formed combination of aluminising
The aluminium of the silicon carbide porous skeletal internal.
Optionally, it is nickel coating, plating also to have coating, the coating between the aluminium silicon-carbon heat radiator body and the layer
At least one of nickel-gold layer and copper plate.
Optionally, the thickness of the coating is 3~30 microns.
Optionally, which further includes that ceramics cover aluminium heat carrier, is integrally formed ground in the aluminium silicon-carbon heat radiator body
It is combined with one or more ceramics and covers aluminium heat carrier, the thermal column covers aluminium heat carrier with the ceramics and is separately positioned on institute
It states on two opposite surfaces of aluminium silicon-carbon heat radiator body.
Optionally, the ceramics cover aluminium heat carrier and include Ceramic insulator and be set to the opposite of the Ceramic insulator
The first aluminium layer on two surfaces and the second aluminium layer, and the Ceramic insulator is connected with being integrally formed by first aluminium layer
It is connected in the aluminium silicon-carbon heat radiator body；The Ceramic insulator is isolated by second aluminium layer with first aluminium layer, and institute
State the second aluminium layer and aluminium silicon-carbon heat radiator body isolation.
Optionally, the surface that the aluminium silicon-carbon heat radiator body is connected with first aluminium layer is flat surface.
Optionally, one or more slots are offered in the aluminium silicon-carbon heat radiator body, the ceramics cover the insertion of aluminium heat carrier
In the slot.
Optionally, the upper surface of second aluminium layer and the upper surface shape other than the slot of the aluminium silicon-carbon heat radiator body
At flat surface.
Optionally, second aluminium layer and the apparent surface of Ceramic insulator connection surface are connected with copper with being also integrally formed
The thickness of layer, the layers of copper is 0.2~0.6mm.
Optionally, one or more slots are offered in the aluminium silicon-carbon heat radiator body, the ceramics cover the insertion of aluminium heat carrier
In the slot.
Optionally, the upper surface of the layers of copper is formed flat with the upper surface other than the slot of the aluminium silicon-carbon heat radiator body
Whole surface.
Optionally, the Ceramic insulator is alumina ceramic plate, reinforced alumina ceramic plate, al nitride ceramic board or nitrogen
SiClx ceramic wafer；First aluminium layer and second aluminium layer are aluminum layer and/or aluminium alloy layer.
Optionally, the thickness of first aluminium layer is 0.02~0.15mm, the thickness of the Ceramic insulator is 0.25~
The thickness of 1mm, second aluminium layer are 0.02~1.0mm.
On the other hand, the disclosure additionally provides a kind of IGBT modules, which includes IGBT circuit boards and institute as above
The heat dissipation element stated.
Through the above technical solutions, thermal column is welded on by layer in aluminium silicon-carbon heat radiator body by the disclosure, ensureing
It while heat dissipation effect, need not be integrally formed to form thermal column, thus greatly reduce the de- of integrated mould
Mode loss extends the service life of integrated mould.
Other feature and advantage of the disclosure will be described in detail in subsequent specific embodiment part.
Description of the drawings
Attached drawing is for providing further understanding of the disclosure, and a part for constitution instruction, with following tool
Body embodiment is used to explain the disclosure together, but does not constitute the limitation to the disclosure.In the accompanying drawings：
Fig. 1 is the heat dissipation element sectional view for not having ceramics and covering aluminium heat carrier.
Fig. 2 is the heat dissipation element sectional view that the ceramics that there is convex type to combine cover aluminium heat carrier.
Fig. 3 is the heat dissipation element sectional view that there are embedded combination ceramics to cover aluminium heat carrier.
Fig. 4 is the bottom view of heat dissipation element.
Fig. 5 is the sectional view for the heat dissipation element that the ceramics that there is convex type to combine cover aluminium heat carrier.
Reference sign
1 aluminium silicon-carbon heat radiator body, 2 Ceramic insulator
3 first aluminium layer, 4 second aluminium layer
5 thermal column, 6 layer
7 slot, 8 first subgroup
9 second subgroups
Specific implementation mode
The specific implementation mode of the disclosure is described in detail below in conjunction with attached drawing.It should be understood that this place is retouched
The specific implementation mode stated is only used for describing and explaining the disclosure, is not limited to the disclosure.
In the disclosure, in the absence of explanation to the contrary, the noun of locality used such as " upper and lower, left and right " typically refers to
Direction shown in Fig. 1 drawings.
On the one hand, present disclose provides a kind of heat dissipation element, which includes heat radiator body and thermal column 5, described
Heat radiator body is aluminium silicon-carbon heat radiator body 1；One end of the thermal column 5 is fixed on the aluminium silicon-carbon heat radiator body 1 by layer 6
Downside surface on, the other end of the thermal column 5 is free end.
Wherein it is possible to by adding solder and being welded between the aluminium silicon-carbon heat radiator body 1 and the thermal column 5
The mode of processing forms the layer 6.The soldering does not need mold, can be by the thermal column 5 and the aluminium silicon
Carbon heat radiator body 1 is assembled by guide plate, is used in combination graphite pressing plate to push down guide plate so that the thermal column 5 is close to described
Aluminium silicon-carbon heat radiator body 1, is then welded.The soldering can in the soldering furnace under reduction or inert atmosphere into
Row, welding temperature can be 270~395 DEG C.
Optionally, the thermal column 5 is multiple；The thermal column 5 is that copper post, aluminium column, aluminium alloy column and aluminium cover in copper post
At least one.In order to enhance the effect of heat dissipation heat conduction, the preferably described thermal column 5 is copper post.
Optionally, the draft angle β of the thermal column 5 is 0 degree~4 degree.Described in such setting contributes to after the completion of welding
The separation of thermal column and guide plate.In order to further enhance heat dissipation effect, the draft angle β of the preferably thermal column 5 is 0 degree~2
Degree.
Optionally, the height of the thermal column 5 is 5~10 millimeters.It, can be so as to by the way that the height of thermal column 5 is rationally arranged
In the heat dissipation effect for ensureing thermal column 5.
Optionally, it is 2~6 that the cross section of the thermal column 5, which is the average diameter of the cross section of the round and described thermal column 5,
Millimeter.It, can be in order to ensureing the heat dissipation effect of thermal column 5 by the way that the average diameter of the cross section of thermal column 5 is rationally arranged.Its
In, in the case where draft angle β is not 0, the average diameter is the diameter and thermal column 5 and layer 6 of the free end of thermal column 5
The average value of the diameter of the welding section of connection.
Optionally, the thermal column 5 is multiple, and the distance of the two neighboring thermal column 5 is 0.4 millimeter~1.1 millimeters.
It is such that interfering with each other between can reducing two neighboring thermal column 5 at least to some extent is set, it thereby may be ensured that every
The normal heat exchange of a thermal column 5.
Optionally, as shown in figure 4, the thermal column 5 is multigroup thermal column 5, multigroup thermal column 5 is along the aluminium silicon-carbon
The length direction interval of heat radiator body 1 is arranged, and multigroup thermal column 5 includes along the length side of the aluminium silicon-carbon heat radiator body 1
To the thermal column 5 of the thermal column 5 and the second subgroup 9 of the first subgroup 8 being arranged alternately, the thermal column 5 of first subgroup 8 and institute
It includes spaced multiple heat dissipations of width direction along the aluminium silicon-carbon heat radiator body 1 to state in the thermal column 5 of the second subgroup 9
Column 5.Wherein, the thermal column 5 of adjacent first subgroup 8 and the thermal column 5 of second subgroup 9 can be staggered.It can be with
Understand, the thermal column 5 for the first subgroup 8 being arranged alternately and the thermal column 5 of second subgroup 9 can make multiple heat dissipations
Column 5 is reasonably distributed in the aluminium silicon-carbon heat radiator body 1, it is ensured that the heat-exchange capacity of thermal column 5.
Optionally, the layer 6 is Pb bases layer or Sn base layers.Selection Pb bases layer and Sn base layers, which have, to be easy to weld
Connect the advantage of processing.
Optionally, the layer 6 is PbSn layers, PbSnAg layers, SnAg layers or SnSb layers.
Optionally, the thickness of the layer 6 is 0.01mm~0.5mm.The such thickness of setting is conducive to save material, carry
High weld strength and heat-conducting effect.
Optionally, the layer be distributed in region that the thermal column (5) and the aluminium silicon-carbon heat radiator body (1) combine and
For continuous layer.
Optionally, the aluminium silicon-carbon heat radiator body 1 including silicon carbide porous skeleton and passes through the integrally formed combination of aluminising
In the aluminium of the silicon carbide porous skeletal internal.It is described be filled in the intraskeletal aluminium of silicon carbide porous can be by integrally formed
Mode is filled in silicon carbide porous skeleton；Aluminium silicon-carbon heat radiator body can also be prepared using powder metallurgic method：First it is prepared
Silicon-carbide particle, after the silicon-carbide particle is mixed with aluminium powder according to a certain percentage by cold moudling, hot pressing, annealing and
Aluminium silicon-carbon heat radiator body is prepared in heat preservation；The intraskeletal aluminium of silicon carbide porous that is filled in can enhance the knot of heat radiator body
Structure intensity and bonding strength.
Optionally, also there is coating between the aluminium silicon-carbon heat radiator body 1 and the layer 6.The coating is conducive to increase
It is welded with the intensity of layer.
Optionally, the coating is at least one of nickel coating, nickel plating layer gold and copper plate.Select coating for nickel plating
At least one of layer, nickel plating layer gold and copper plate contribute to the formation of coating and help to increase the intensity of layer.
Optionally, the thickness of the coating is 3~30 microns.
Optionally, which further includes that ceramics cover aluminium heat carrier, is integrally formed ground in the aluminium silicon-carbon heat radiator body 1
It is combined with one or more ceramics and covers aluminium heat carrier, the thermal column 5 covers aluminium heat carrier with the ceramics and is separately positioned on
On two opposite surfaces of the aluminium silicon-carbon heat radiator body 1.
Optionally, the ceramics cover aluminium heat carrier and include Ceramic insulator 2 and be set to the opposite of the Ceramic insulator 2
Two surfaces on the first aluminium layer 3 and the second aluminium layer 4, and the Ceramic insulator 2 by the one of first aluminium layer 3 at
It is connected to type in the aluminium silicon-carbon heat radiator body 1；The Ceramic insulator 2 is by second aluminium layer 4 and first aluminium layer 3
Isolation, and second aluminium layer 4 and the aluminium silicon-carbon heat radiator body 1 isolation.First aluminium layer, 3 integrally formed connection is radiated
Ontology 1 and Ceramic insulator 2, without cavity and crack between each hierarchical structure, can improve the intensity of heat dissipation element, resistance to pressure with
Radiating efficiency prolongs the service life.
Optionally, the surface that the aluminium silicon-carbon heat radiator body 1 is connected with first aluminium layer 3 is flat surface.Also
To be the aluminium silicon-carbon heat radiator body 1 with the ceramics, which cover aluminium heat carrier, forms convex type and is combined.The flat surface of formation has utilization
Pad pasting when subsequent etch, makes pad pasting not rupture, according to the default accuracy for being etched and improving and etching.
Optionally, one or more slots 7 are offered in the aluminium silicon-carbon heat radiator body 1, it is embedding that the ceramics cover aluminium heat carrier
Enter in the slot 7.Wherein, the operation that one or more slots 7 are opened up in the heat radiator body 1 can be real by numerically-controlled machine tool CNC
It is existing.The ceramics, which are covered aluminium heat carrier and are placed in the slot 7 of the aluminium silicon-carbon heat radiator body 1, can make ceramics when integrated molding cover aluminium
The aluminum layer thickness of heat carrier is easily controllable, integrally formed heat dissipation element surfacing；And the heat dissipation element surface into
When row etching, pad pasting edge is not easily broken, and is convenient for it is anticipated that design carries out circuit etch.
Optionally, the upper surface of second aluminium layer 4 and the upper table other than the slot 7 of the aluminium silicon-carbon heat radiator body 1
Face forms flat surface.The namely described aluminium silicon-carbon heat radiator body 1 covers aluminium heat carrier with the ceramics and forms embedded combination.Shape
At flat surface have using pad pasting when subsequent etch, so that pad pasting is not ruptured, etching improved according to default be etched
Accuracy.
Optionally, the apparent surface of second aluminium layer 4 and 2 connection surface of Ceramic insulator is connected with being also integrally formed
The thickness of layers of copper, the layers of copper is 0.2~0.6mm.It adds layers of copper 8 and forms ceramic copper-clad aluminium heat carrier, be conducive to the biography of heat
It leads and improves ceramics and cover support of the aluminum bronze heat carrier for electric elements, improve the structural strength that ceramics cover aluminum bronze heat carrier,
Prolong the service life.
Optionally, one or more slots 7 are offered in the aluminium silicon-carbon heat radiator body 1, is connected with the ceramics of layers of copper 8
Aluminium heat carrier is covered to be embedded in the slot 7.
Optionally, the upper surface of the layers of copper is formed with the upper surface other than the slot 7 of the aluminium silicon-carbon heat radiator body 1
Flat surface.The flat surface of formation has using pad pasting when subsequent etch, and pad pasting is made not rupture, and is etched according to default
Improve the accuracy of etching.
Optionally, the Ceramic insulator 2 be alumina ceramic plate, reinforced alumina ceramic plate, al nitride ceramic board or
Silicon nitride ceramic plate；First aluminium layer 3 and second aluminium layer 4 are aluminum layer and/or aluminium alloy layer.The aluminium layer and aluminium close
Layer gold can meet the heat conductive design of heat dissipation element, and aluminium layer and aluminium alloy layer hardness are relatively low, and cold-resistant thermal shock resistance properties is more
Superior, the Ceramic insulator 2 of above-mentioned material has lower density and higher hardness, is conducive to extend service life.
Optionally, the thickness of first aluminium layer 3 is 0.02~0.15mm, and the thickness of the Ceramic insulator 2 is 0.25
The thickness of~1mm, second aluminium layer 4 are 0.02~1.0mm.It may be carried using the aluminium layer and Ceramic insulator 2 of the thickness
High ceramics cover the efficiency and structural strength of aluminium heat carrier, prolong the service life.
On the other hand, the disclosure additionally provides a kind of IGBT modules, which includes IGBT circuit boards and institute as above
The heat dissipation element stated.
The heat dissipation element of the disclosure is further described below in conjunction with the accompanying drawings.
As shown in Figure 1, the heat dissipation element includes aluminium silicon-carbon heat radiator body 1 and thermal column 5；The aluminium silicon-carbon heat radiator body
1 thickness is 4.5mm, a length of 215mm, width 110mm, and the surface of the aluminium silicon-carbon heat radiator body 1 is coated with nickel coating；368
A thermal column 5 is welded on by layer 6 on the surface of 1 one side surface of aluminium silicon-carbon heat radiator body, and layer 6 welds for PbSn
Layer.
The length of the thermal column 5 is 8mm, and the thickness of the layer 6 is 0.2mm；5 a diameter of 4mm's of the thermal column
One end is welded with aluminium silicon-carbon heat radiator body by layer 6, and the other end of a diameter of 3mm is free end；The appearance of the thermal column 5
Face is contacted with coolant liquid, by the heat transfer of IGBT operations to coolant liquid.
Aluminium heat carrier, aluminium silicon-carbon heat radiator body 1 and thermal column 5 are covered as shown in Fig. 2, the heat dissipation element includes ceramics；Institute
The thickness for stating aluminium silicon-carbon heat radiator body is 4.5mm, a length of 215mm, width 110mm, and the surface of the aluminium silicon-carbon heat radiator body 1
It is coated with copper plate；The thermal column 5 and the ceramics cover aluminium heat carrier, and to be separately positioned on the aluminium silicon-carbon heat radiator body opposite
On two surfaces；The aluminium silicon-carbon heat radiator body covers aluminium heat carrier with ceramics, aluminium silicon-carbon heat radiator body is connected with thermal column 5
Surface is flat surface；It is 2 that the ceramics, which cover aluminium heat carrier or ceramic copper-clad aluminium heat carrier, is spaced between 2 heat carriers
6.9mm；For 368 to meet radiating requirements, the thermal column 5 is welded on the aluminium silicon-carbon by layer 6 and dissipates the thermal column 5
On hot ontology 1, layer 6 is PbSnAg layers.
It includes the Ceramic insulator 2 and be set to the Ceramic insulator that thickness is 0.32mm that the ceramics, which cover aluminium heat carrier,
The first aluminium layer 3 that thickness on 2 two opposite surfaces is 0.1mm and the second aluminium layer 4 that thickness is 0.5mm, the ceramics
Insulation board 2 is isolated by second aluminium layer 4 with first aluminium layer 3；First aluminium layer, the 3 integrally formed aluminium silicon-carbon that is connected to radiates
To improve the bonding strength that ceramics cover aluminium heat carrier and aluminium silicon-carbon heat radiator body on ontology；First aluminium layer 3, the second aluminium layer 4
It is also integrally formed between insulated ceramic plates 2.Ceramics, which cover, can etch to form IGBT electricity on the second aluminium layer 4 of aluminium heat carrier
Road plate, ceramics cover aluminium heat carrier support igbt chip and generate the effect of heat conduction and insulation, ensure the peace of IGBT modules work
Quan Xing.
The length of the thermal column 5 is 8mm, and the thickness of the layer 6 is 0.2mm；5 a diameter of 4mm's of the thermal column
One end is fixedly connected with aluminium silicon-carbon heat radiator body, and the other end of a diameter of 3mm is free end；The outer surface of the thermal column 5 with
Coolant liquid contacts, by the heat transfer of IGBT operations to coolant liquid.
Aluminium heat carrier, aluminium silicon-carbon heat radiator body 1 and thermal column 5 are covered as shown in figure 3, the heat dissipation element includes ceramics, and
The surface of the aluminium silicon-carbon heat radiator body 1 is coated with nickel coating；The thickness of the aluminium silicon-carbon heat radiator body 1 is 4.5mm, a length of
215mm, width 110mm；It is 0.92mm, a length of to offer 3 depth by numerically-controlled machine tool in the aluminium silicon-carbon heat radiator body
67mm, width are 61mm slots 7, and slot 7 is spaced 6.9mm each other, and the ceramics cover aluminium heat carrier and are embedded in the slot 7；Described 368
A thermal column 5 is welded on the aluminium silicon-carbon heat radiator body 1 by layer 6 and is embedded in the phase that the ceramics cover one side surface of aluminium heat carrier
To on surface, layer 6 is SnAg layers；The surface that the aluminium silicon-carbon heat radiator body 1 is connected with thermal column 5 is flat surface.
It includes the Ceramic insulator 2 and set that thickness is 0.32mm, a length of 67mm, width are 61mm that the ceramics, which cover aluminium heat carrier,
The first aluminium layer 3 and thickness that the thickness being placed on two opposite surfaces of the Ceramic insulator 2 is 0.1mm are 0.5mm's
Second aluminium layer 4 is isolated with first aluminium layer 3 for second aluminium layer 4, the Ceramic insulator 2, second aluminium layer 4 and slot
Between with 1mm interval；First aluminium layer 3 is integrally formed to be connected in aluminium silicon-carbon heat radiator body 1, and aluminium silicon-carbon heat radiator body is made
1 forms aluminium Infiltration layer with the faying face of the first aluminium layer 3 improves that ceramics cover aluminium heat carrier and the connection of aluminium silicon-carbon heat radiator body 1 is strong
Degree；It is also integrally formed between first aluminium layer 3, the second aluminium layer 4 and insulated ceramic plates 2.Ceramics cover the of aluminium heat carrier
It can etch to form IGBT circuit boards on two aluminium layers 4, ceramics cover aluminium heat carrier support igbt chip and generate heat conduction and insulation
Effect, ensure IGBT modules work safety.
The length of the thermal column 5 is 8mm, and the thickness of the layer 6 is 0.2mm；5 a diameter of 4mm's of the thermal column
One end is welded with aluminium silicon-carbon heat radiator body 1 by layer 6, and the other end of a diameter of 3mm is free end；Outside the thermal column 5
Surface is contacted with coolant liquid, by the heat transfer of IGBT operations to coolant liquid.
The preferred embodiment of the disclosure is described in detail above in association with attached drawing, still, the disclosure is not limited to above-mentioned reality
The detail in mode is applied, in the range of the technology design of the disclosure, a variety of letters can be carried out to the technical solution of the disclosure
Monotropic type, these simple variants belong to the protection domain of the disclosure.
It is further to note that specific technical features described in the above specific embodiments, in not lance
In the case of shield, can be combined by any suitable means, in order to avoid unnecessary repetition, the disclosure to it is various can
The combination of energy no longer separately illustrates.
In addition, arbitrary combination can also be carried out between a variety of different embodiments of the disclosure, as long as it is without prejudice to originally
Disclosed thought equally should be considered as disclosure disclosure of that.
Claims (21)
1. a kind of heat dissipation element, which is characterized in that the heat dissipation element includes heat radiator body and thermal column (5), the heat radiator body
For aluminium silicon-carbon heat radiator body (1)；One end of the thermal column (5) is fixed on the aluminium silicon-carbon heat radiator body (1) by layer (6)
Downside surface on, the other end of the thermal column (5) is free end.
2. heat dissipation element according to claim 1, which is characterized in that the thermal column (5) is multiple；The thermal column
(5) it is that copper post, aluminium column, aluminium alloy column and aluminium cover at least one of copper post.
3. heat dissipation element according to claim 1, which is characterized in that the draft angle β of the thermal column (5) is 0 degree~4
The height of degree, the thermal column (5) is 5~10 millimeters, and the cross section of the thermal column (5) is the round and described thermal column (5)
Cross section average diameter be 2~6 millimeters.
4. heat dissipation element according to claim 1, which is characterized in that the thermal column (5) be it is multiple, it is two neighboring described
The distance of thermal column (5) is 0.4 millimeter~1.1 millimeters, and the draft angle β of the thermal column (5) is 0 degree~2 degree.
5. heat dissipation element according to claim 1, which is characterized in that the thermal column (5) is multigroup thermal column (5), institute
It states multigroup thermal column (5) along the length direction interval of the aluminium silicon-carbon heat radiator body (1) to be arranged, multigroup thermal column (5) packet
Include the thermal column (5) and the second subgroup of the first subgroup for being arranged alternately along the length direction of the aluminium silicon-carbon heat radiator body (1)
Include along the aluminium silicon in thermal column (5), the thermal column (5) of first subgroup and the thermal column (5) of second subgroup
The spaced multiple thermal columns (5) of width direction of carbon heat radiator body (1).
6. heat dissipation element according to claim 1, which is characterized in that the layer (6) is Pb bases layer or Sn base layers；
The thickness of the layer (6) is 0.01mm~0.5mm；The layer is distributed in the thermal column (5) and radiates with the aluminium silicon-carbon
Ontology (1) combine region and be continuous layer.
7. heat dissipation element according to claim 1, which is characterized in that the layer (6) is PbSn layers, PbSnAg welderings
Layer, SnAg layers or SnSb layers.
8. heat dissipation element according to claim 1, which is characterized in that the aluminium silicon-carbon heat radiator body (1) includes silicon carbide
Stephanoporate framework and by the integrally formed combination of aluminising the silicon carbide porous skeletal internal aluminium.
9. heat dissipation element according to claim 1, which is characterized in that the aluminium silicon-carbon heat radiator body (1) and the layer
(6) it is at least one of nickel coating, nickel plating layer gold and copper plate also to have coating, the coating between.
10. heat dissipation element according to claim 9, which is characterized in that the thickness of the coating is 3~30 microns.
11. the heat dissipation element according to any one of claim 1~10, which is characterized in that the heat dissipation element further includes
Ceramics cover aluminium heat carrier, one or more ceramics are combined on the aluminium silicon-carbon heat radiator body (1) with being integrally formed cover aluminium
Heat carrier, the thermal column (5) cover aluminium heat carrier with the ceramics and are separately positioned on the opposite of the aluminium silicon-carbon heat radiator body (1)
Two surfaces on.
12. heat dissipation element according to claim 11, which is characterized in that it includes ceramic insulation that the ceramics, which cover aluminium heat carrier,
Plate (2) and the first aluminium layer (3) being set on two opposite surfaces of the Ceramic insulator (2) and the second aluminium layer (4), and
And the Ceramic insulator (2) is connected to the aluminium silicon-carbon heat radiator body (1) with being integrally formed by first aluminium layer (3)
On；The Ceramic insulator (2) is isolated by second aluminium layer (4) with first aluminium layer (3), and second aluminium layer (4)
It is isolated with the aluminium silicon-carbon heat radiator body (1).
13. heat dissipation element according to claim 12, which is characterized in that the aluminium silicon-carbon heat radiator body (1) and described the
The surface that one aluminium layer (3) is connected is flat surface.
14. heat dissipation element according to claim 12, which is characterized in that offered on the aluminium silicon-carbon heat radiator body (1)
One or more slots (7), the ceramics cover aluminium heat carrier and are embedded in the slot (7).
15. heat dissipation element according to claim 14, which is characterized in that the upper surface of second aluminium layer (4) with it is described
Upper surface other than the slot (7) of aluminium silicon-carbon heat radiator body (1) forms flat surface.
16. heat dissipation element according to claim 12, which is characterized in that second aluminium layer (4) and Ceramic insulator (2)
The apparent surface of connection surface is connected with layers of copper (8) with being also integrally formed, and the thickness of the layers of copper (8) is 0.2~0.6mm.
17. heat dissipation element according to claim 16, which is characterized in that offered on the aluminium silicon-carbon heat radiator body (1)
One or more slots (7), the ceramics cover aluminium heat carrier and are embedded in the slot (7).
18. heat dissipation element according to claim 17, which is characterized in that the upper surface of the layers of copper is dissipated with the aluminium silicon-carbon
Upper surface other than the slot (7) of hot ontology (1) forms flat surface.
19. heat dissipation element according to claim 12, which is characterized in that the Ceramic insulator (2) is aluminium oxide ceramics
Plate, reinforced alumina ceramic plate, al nitride ceramic board or silicon nitride ceramic plate；First aluminium layer (3) and second aluminium layer
(4) it is aluminum layer and/or aluminium alloy layer.
20. heat dissipation element according to claim 12, which is characterized in that the thickness of first aluminium layer (3) be 0.02~
The thickness of 0.15mm, the Ceramic insulator (2) are 0.25~1mm, and the thickness of second aluminium layer (4) is 0.02~1.0mm.
21. a kind of IGBT modules, which is characterized in that the IGBT modules include arbitrary in IGBT circuit boards and claim 1~20
Heat dissipation element described in one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201721854636.8U CN207818556U (en) | 2017-12-26 | 2017-12-26 | A kind of heat dissipation element and IGBT modules |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201721854636.8U CN207818556U (en) | 2017-12-26 | 2017-12-26 | A kind of heat dissipation element and IGBT modules |
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| CN207818556U true CN207818556U (en) | 2018-09-04 |
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| CN201721854636.8U Active CN207818556U (en) | 2017-12-26 | 2017-12-26 | A kind of heat dissipation element and IGBT modules |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111403358A (en) * | 2020-02-26 | 2020-07-10 | 致瞻科技(上海)有限公司 | Double-sided water-cooling radiator and power tube integrated unit |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111403358A (en) * | 2020-02-26 | 2020-07-10 | 致瞻科技(上海)有限公司 | Double-sided water-cooling radiator and power tube integrated unit |
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