CN207021295U - A kind of heat-radiating substrate with insulating radiation layer - Google Patents
A kind of heat-radiating substrate with insulating radiation layer Download PDFInfo
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- CN207021295U CN207021295U CN201720580306.8U CN201720580306U CN207021295U CN 207021295 U CN207021295 U CN 207021295U CN 201720580306 U CN201720580306 U CN 201720580306U CN 207021295 U CN207021295 U CN 207021295U
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Abstract
It the utility model is related to a kind of heat-radiating substrate with insulating radiation layer, it mainly solve conductive layer in the prior art caused by heat be transmitted to thermally conductive insulating layer successively, metal substrate is transmitted to again to be radiated, conduction heat depends on the material characteristic of material in itself, using the preferable material of thermal conductivity, the problem of manufacturing cost increase, including conductive layer, thermally conductive insulating layer and metal substrate, the thermally conductive insulating layer is arranged on the downside of conductive layer, the lower surface of the thermally conductive insulating layer is provided with least one projection for being advantageous to radiating, the metal substrate is arranged on the downside of thermally conductive insulating layer, the upper surface of the metal substrate is provided with and raised corresponding groove, the lower surface of the metal substrate is provided with least one heat dissipation metal fin.
Description
Technical field
It the utility model is related to a kind of heat-radiating substrate with insulating radiation layer.
Background technology
LED effect is that electric energy is switched into luminous energy, and can produce temperature, LED inputing power in process caused by luminous energy
There is 80%~95% to be transformed into heat, and LED chip area very little, with the increase of input power, the heat accumulated on chip
Amount will be more and more, therefore radiating is the key issue that LED encapsulation must solve.LED radiating mode is tied when LED is encapsulated
Unify heat-radiating substrate, mainly there is preferable heat conductivity in itself using its heat-radiating substrate material, by thermal source in a manner of thermal conductivity
Exported from LED grain.Existing heat-radiating substrate sets one layer of heat-conducting silicone grease generally between conductive layer and metal substrate, then
LED anode and cathode weld face on the electrically conductive, heat is transmitted on metal substrate by heat-conducting silicone grease caused by LED
To be radiated, radiating effect is simultaneously bad, and the easy oxidation by air of circuit of conductive layer, aging are fast.
China Patent No.：201220465210.4 a kind of LED heat radiation substrate is disclosed, including the Metal Substrate positioned at bottom
Plate, the thermally conductive insulating layer on the metal substrate and the conduction that can be electrically connected in the thermally conductive insulating layer with LED
Layer, the thermally conductive insulating layer is made up of diamond, be provided with the conductive layer upper surface can heat conduction layer of protective material.Should
LED heat radiation substrate is arranged to diamond by thermally conductive insulating layer so that the excellent thermal conductivity of thermally conductive insulating layer, thermal conductivity is significantly
Improve, on the electrically conductive surface be provided with can heat conduction layer of protective material, layer of protective material has the anti-oxidation work(of anticorrosion waterproof
Can, the metal on conductive layer can be prevented to be oxidized, effectively reduce the degree of aging of conductive layer upper surface circuit；But conductive layer
Caused heat is transmitted to thermally conductive insulating layer successively, then is transmitted to metal substrate and is radiated, and conduction heat depends on material
The material characteristic of itself, using the preferable material of thermal conductivity, manufacturing cost increase.
Utility model content
Therefore, for it is above-mentioned the problem of, the utility model provides a kind of heat-radiating substrate with insulating radiation layer, and it is main
Heat caused by solving conductive layer in the prior art is transmitted to thermally conductive insulating layer successively, then is transmitted to metal substrate and is dissipated
Heat, conduction heat depends on the material characteristic of material in itself, using the preferable material of thermal conductivity, the problem of manufacturing cost increase.
To achieve the above object, the utility model employs following technical scheme：A kind of radiating with insulating radiation layer
Substrate, including conductive layer, thermally conductive insulating layer and metal substrate, the thermally conductive insulating layer is arranged on the downside of conductive layer, described to lead
The lower surface of thermal insulation layer is provided with least one projection for being advantageous to radiating, and the metal substrate is arranged on thermally conductive insulating layer
Downside, the upper surface of the metal substrate are provided with the groove corresponding with projection, and the lower surface of the metal substrate is provided with
At least one heat dissipation metal fin.
Further, the face that the conductive layer is in contact with thermally conductive insulating layer is arranged to the mat surface of bumps.
Further, the heat dissipation metal fin and metal substrate integrally connected.
Further, the raised diamond high for thermal conductivity factor.
Further, the raised bottom extends to outside through metal substrate.
By using preceding solution, the beneficial effects of the utility model are：This has the radiating base of insulating radiation layer
Plate is provided with the projection beneficial to radiating by the lower surface of thermally conductive insulating layer, increases the contact surface of thermally conductive insulating layer and metal substrate
Long-pending, the heat in quickening thermally conductive insulating layer, which is transmitted on metal substrate, to be radiated, the metal of the lower surface setting of metal substrate
Radiating fin, accelerate the radiating of metal substrate；Further, the face that conductive layer is in contact with thermally conductive insulating layer is arranged to bumps
Mat surface, the contact area of conductive layer and thermally conductive insulating layer is added, accelerate the heat conduction on conductive layer；Further, it is golden
Category radiating fin is advantageous to conduction of the heat in metal inside with metal substrate integrally connected, shortens heat and is transmitted to metal fin
Time, accelerate radiating efficiency；Further, the raised diamond high for thermal conductivity factor, the heat conduction system of diamond
Number is more than metal, but cost is higher, and raised made of diamond, the heat of quickening is set by the bottom of thermally conductive insulating layer
The downward conduction of amount, accelerates the radiating of thermally conductive insulating layer.
Brief description of the drawings
Fig. 1 is the cross section structure diagram of the utility model embodiment one；
Fig. 2 is the cross section structure diagram of metal substrate in the utility model embodiment one；
Fig. 3 is the cross section structure diagram of the utility model embodiment two.
Embodiment
The utility model is further illustrated in conjunction with the drawings and specific embodiments.
The utility model embodiment is：
Embodiment one：With reference to figure 1 and Fig. 2, a kind of heat-radiating substrate with insulating radiation layer, including conductive layer 1, heat conduction are exhausted
Edge layer 2 and metal substrate 3, the thermally conductive insulating layer 2 are arranged on the downside of conductive layer 1, the conductive layer 1 and thermally conductive insulating layer 2
The face being in contact is arranged to the mat surface of bumps, and the lower surface of the thermally conductive insulating layer 2 is provided with the projection 4 beneficial to radiating, institute
It is the high diamond of thermal conductivity factor to state projection 4, and the metal substrate 3 is arranged on the downside of thermally conductive insulating layer 2, the metal
The upper surface of substrate 3 be provided with raised 4 corresponding grooves 5, the lower surface of the metal substrate 2 is provided with heat dissipation metal wing
Piece 6, the heat dissipation metal fin 6 and the integrally connected of metal substrate 3.
Embodiment two：With reference to figure 3, a kind of heat-radiating substrate with insulating radiation layer, the Research idea phase with embodiment one
Together, its different is technically characterized in that：Raised 4 bottom extends to outside through metal substrate 3.
Working method of the present utility model is：There is the heat-radiating substrate of insulating radiation layer to pass through under thermally conductive insulating layer 2 for this
Surface is provided with the projection 4 beneficial to radiating, increase thermally conductive insulating layer 2 and the contact area of metal substrate 3, accelerates thermally conductive insulating layer
Heat on 2, which is transmitted on metal substrate 3, to be radiated, and the heat dissipation metal fin 6 of the lower surface setting of metal substrate 3, is accelerated
The radiating of metal substrate 3；Conductive layer 1 is arranged to the mat surface of bumps with the face that thermally conductive insulating layer 2 is in contact, and adds conductive layer
1 with the contact area of thermally conductive insulating layer 2, accelerate the heat conduction on conductive layer 1；Heat dissipation metal fin 6 and the one of metal substrate 3
Connection is advantageous to conduction of the heat in metal inside, shortens the time that heat is transmitted to metal fin 6, accelerates radiating efficiency；It is convex
It is the high diamond of thermal conductivity factor to play 4, and the thermal conductivity factor of diamond is more than metal, but cost is higher, passes through heat conduction
The bottom of insulating barrier 2 sets the projection 4 made of diamond, the downward conduction of the heat of quickening, accelerates thermally conductive insulating layer 2
Radiating.
Although specifically showing and describing the utility model with reference to preferred embodiment, those skilled in the art should
This is understood, is not departing from the spirit and scope of the present utility model that appended claims are limited, in form and details
On the utility model can be made a variety of changes, be the scope of protection of the utility model.
Claims (5)
1. a kind of heat-radiating substrate with insulating radiation layer, including conductive layer, thermally conductive insulating layer and metal substrate, its feature exist
In：The thermally conductive insulating layer is arranged on the downside of conductive layer, and it is favourable that the lower surface of the thermally conductive insulating layer is provided with least one
In the projection of radiating, the metal substrate is arranged on the downside of thermally conductive insulating layer, the upper surface of the metal substrate be provided with
Raised corresponding groove, the lower surface of the metal substrate is provided with least one heat dissipation metal fin.
2. the heat-radiating substrate according to claim 1 with insulating radiation layer, it is characterised in that：The conductive layer and heat conduction
The face that insulating barrier is in contact is arranged to the mat surface of bumps.
3. the heat-radiating substrate according to claim 1 with insulating radiation layer, it is characterised in that：The heat dissipation metal fin
With metal substrate integrally connected.
4. the heat-radiating substrate with insulating radiation layer according to claims 1 to 3 any claim, it is characterised in that：
The raised diamond high for thermal conductivity factor.
5. the heat-radiating substrate according to claim 4 with insulating radiation layer, it is characterised in that：Wear the raised bottom
Cross metal substrate and extend to outside.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720580306.8U CN207021295U (en) | 2017-05-23 | 2017-05-23 | A kind of heat-radiating substrate with insulating radiation layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720580306.8U CN207021295U (en) | 2017-05-23 | 2017-05-23 | A kind of heat-radiating substrate with insulating radiation layer |
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| Publication Number | Publication Date |
|---|---|
| CN207021295U true CN207021295U (en) | 2018-02-16 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201720580306.8U Active CN207021295U (en) | 2017-05-23 | 2017-05-23 | A kind of heat-radiating substrate with insulating radiation layer |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108601207A (en) * | 2018-06-22 | 2018-09-28 | 东莞市斯慕电子商务有限公司 | The LED circuit board of good heat dissipation effect |
| CN108848607A (en) * | 2018-06-22 | 2018-11-20 | 东莞市鹏辉金属制品有限公司 | High thermal conductivity wiring board |
| CN111312670A (en) * | 2020-02-26 | 2020-06-19 | 南通智通达微电子物联网有限公司 | Heat dissipation packaging method |
| CN113966648A (en) * | 2019-04-12 | 2022-01-21 | 上海诺基亚贝尔股份有限公司 | Heat dissipation |
| CN114771038A (en) * | 2022-05-06 | 2022-07-22 | 南通汉瑞通信科技有限公司 | Heat dissipation substrate and preparation equipment thereof |
-
2017
- 2017-05-23 CN CN201720580306.8U patent/CN207021295U/en active Active
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108601207A (en) * | 2018-06-22 | 2018-09-28 | 东莞市斯慕电子商务有限公司 | The LED circuit board of good heat dissipation effect |
| CN108848607A (en) * | 2018-06-22 | 2018-11-20 | 东莞市鹏辉金属制品有限公司 | High thermal conductivity wiring board |
| CN113966648A (en) * | 2019-04-12 | 2022-01-21 | 上海诺基亚贝尔股份有限公司 | Heat dissipation |
| CN111312670A (en) * | 2020-02-26 | 2020-06-19 | 南通智通达微电子物联网有限公司 | Heat dissipation packaging method |
| CN111312670B (en) * | 2020-02-26 | 2022-04-01 | 南通智通达微电子物联网有限公司 | Heat dissipation packaging method |
| CN114771038A (en) * | 2022-05-06 | 2022-07-22 | 南通汉瑞通信科技有限公司 | Heat dissipation substrate and preparation equipment thereof |
| CN114771038B (en) * | 2022-05-06 | 2023-12-08 | 南通汉瑞通信科技有限公司 | Heat dissipation substrate and preparation equipment thereof |
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