CN114771038B - Heat dissipation substrate and preparation equipment thereof - Google Patents

Heat dissipation substrate and preparation equipment thereof Download PDF

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Publication number
CN114771038B
CN114771038B CN202210488577.6A CN202210488577A CN114771038B CN 114771038 B CN114771038 B CN 114771038B CN 202210488577 A CN202210488577 A CN 202210488577A CN 114771038 B CN114771038 B CN 114771038B
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CN
China
Prior art keywords
insulating layer
punching press
metal core
heat
heat conduction
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Active
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CN202210488577.6A
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Chinese (zh)
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CN114771038A (en
Inventor
金琦
翟海峰
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Nantong Hanrui Communication Technology Co ltd
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Nantong Hanrui Communication Technology Co ltd
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Priority to CN202210488577.6A priority Critical patent/CN114771038B/en
Publication of CN114771038A publication Critical patent/CN114771038A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/30—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0012—Mechanical treatment, e.g. roughening, deforming, stretching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive

Abstract

The application relates to the technical field of heat dissipation substrate preparation, in particular to a heat dissipation substrate and preparation equipment thereof, which comprises a metal core substrate and a heat conduction insulating layer, wherein the metal core substrate is adhered to the heat conduction insulating layer, a plurality of convex blocks are arranged on the heat conduction insulating layer at intervals, the metal core substrate is provided with a plurality of notches corresponding to the convex blocks, each convex block is correspondingly positioned in each notch, the heat conduction insulating layer is formed by mixing epoxy resin and heat conduction filler, and the convex blocks are positioned in the notches, so that the heat conduction insulating layer and the metal core substrate can not be misplaced after long-term use, and the problem that the heat dissipation substrate is affected due to the fact that the metal core substrate and the heat conduction insulating layer are easy to misplaced after the heat dissipation substrate is used for a long time is solved.

Description

Heat dissipation substrate and preparation equipment thereof
Technical Field
The application relates to the technical field of heat dissipation substrate preparation, in particular to a heat dissipation substrate and preparation equipment thereof.
Background
The heat dissipation substrate is mostly used for electronic component mounting, and the heat dissipation performance of the heat dissipation substrate is mostly poor.
There is a heat dissipation substrate, in which a heat conducting insulating layer material is disposed on a metal core substrate to enhance the heat dissipation performance of the heat dissipation substrate.
However, most of the metal core substrate and the heat conducting insulating layer material are directly bonded together, and after the heat dissipation substrate is used for a long time, the metal core substrate and the heat conducting insulating layer material are easy to misplace, so that the use of the heat dissipation substrate is affected.
Disclosure of Invention
The application aims to provide a heat dissipation substrate and preparation equipment thereof, which solve the problem that the use of the heat dissipation substrate is affected due to the fact that the metal core substrate and the heat conduction insulating layer material are easy to misplace after the heat dissipation substrate is used for a long time.
In order to achieve the above object, the present application provides a heat dissipation substrate, which includes a metal core substrate and a heat conductive insulating layer, wherein the metal core substrate is bonded to the heat conductive insulating layer, the heat conductive insulating layer is provided with a plurality of bumps at intervals, the metal core substrate is provided with a plurality of recesses corresponding to the bumps, each of the bumps is correspondingly located inside each of the recesses, and the heat conductive insulating layer is formed by mixing epoxy resin and a heat conductive filler.
Wherein the epoxy resin is linear epoxy resin, and the heat conducting filler is one of alumina, silicon carbide or aluminum nitride.
The application also provides preparation equipment for preparing the radiating substrate, which comprises an installation seat, a first stamping cylinder, a second stamping cylinder, a first stamping template, a second stamping template, a first installation plate, a second installation plate and two pushing components, wherein the first installation plate and the second installation plate are rotationally connected and are positioned above the installation seat, the two pushing components are respectively arranged below the first installation plate and the second installation plate, the first stamping cylinder is arranged above the first installation plate, the first stamping template is fixedly connected with the output end of the first stamping cylinder, a plurality of stamping notches are formed at the bottom of the first stamping template at intervals, the second stamping cylinder is arranged above the second installation plate, the second stamping template is fixedly connected with the output end of the second stamping cylinder, and a plurality of stamping convex blocks are formed at the bottom of the second stamping template at intervals.
The output end of the first stamping cylinder is provided with a first stamping template for stamping the heat-conducting insulating layer, the output end of the second stamping cylinder is provided with a second stamping template for stamping the metal core substrate, the heat-conducting insulating layer and the metal core substrate are respectively placed on the first mounting plate and the second mounting plate, the first stamping cylinder and the second stamping cylinder simultaneously run to respectively stamp the heat-conducting insulating layer and the metal core substrate, the first stamping template extrudes the heat-conducting insulating layer so as to compress the heat-conducting insulating layer, the second stamping template punches the metal core substrate under the action of the stamping notch, the metal core substrate is stamped out of the notch under the action of the stamping template, then the first stamping cylinder and the second stamping cylinder respectively drive the first stamping template and the second stamping template to reset, a worker pushes the heat-conducting insulating layer and the metal core substrate to be coated with the metal core substrate, the heat-conducting layer is simultaneously pushed by the worker to push the heat-conducting layer to be coated with the metal core substrate, the heat-conducting layer is simultaneously inserted into the mounting plate and the heat-conducting substrate, the heat-conducting layer is simultaneously staggered by the heat-conducting plate is prevented from being adhered to the mounting plate, therefore, the problem that the use of the radiating substrate is affected due to the fact that the metal core substrate and the heat conducting insulating layer material are easy to misplace after the radiating substrate is used for a long time is solved.
The top of first mounting panel with the top of second mounting panel all is provided with the installation cavity that is used for placing metal core base plate or heat conduction insulating layer.
The mounting cavity of the first mounting plate is used for mounting the heat-conducting insulating layer, and the mounting cavity of the second mounting plate is used for mounting the metal core substrate so as to be convenient for positioning the heat-conducting insulating layer and the metal core substrate.
The top of mount pad is provided with L shape mounting panel, first punching press cylinder with the second punching press cylinder all with L shape mounting panel fixed connection.
The L-shaped mounting plate is used for mounting the first stamping cylinder and the second stamping cylinder.
The pushing assembly comprises a pushing air cylinder, a connecting block and a sliding block, wherein sliding grooves are formed in the bottoms of the first mounting plate and the second mounting block, the sliding block is movably arranged in the sliding grooves, the pushing air cylinder is arranged in the mounting seat, the connecting block is fixedly connected with the output end of the pushing air cylinder, and the connecting block is hinged to the sliding block.
When the stamping of the metal core substrate and the heat conduction insulating layer is completed and the gluing is completed, the pushing cylinder operates to drive the connecting block to move, so that the sliding block slides in the sliding groove to push the first mounting plate and the second mounting plate to rotate, so that the first mounting plate and the second mounting plate rotate and are attached, and the heat conduction insulating layer and the metal core substrate are bonded together.
The preparation equipment further comprises two movable components, wherein the two movable components are respectively arranged in the first mounting plate and the second mounting plate in the mounting cavity.
The movable component is used for pushing the heat conducting insulating plate or the metal core substrate out of the mounting cavity
According to the heat dissipation substrate and the preparation equipment thereof, the heat conduction insulating layer and the metal core substrate are respectively placed on the first mounting plate and the second mounting plate, the first punching cylinder and the second punching cylinder respectively operate to punch the heat conduction insulating layer and the metal core substrate, the first punching cylinder extrudes the heat conduction insulating layer so as to compress the heat conduction insulating layer, the surface of the heat conduction insulating layer is enabled to form the protruding block under the action of the punching notch, the second punching cylinder punches the metal core substrate out of the notch under the action of the punching protruding block, then the first punching cylinder and the second punching cylinder respectively drive the first punching cylinder and the second punching cylinder to reset, a worker smears an adhesive on the heat conduction insulating layer and the metal core substrate, then the two pushing assemblies simultaneously push the first mounting plate and the second mounting plate to rotate, the first mounting plate and the second mounting plate are enabled to be easily attached to the heat conduction insulating layer, and the heat dissipation material is enabled to be easily misplaced between the heat dissipation substrate and the heat dissipation substrate after the heat dissipation substrate is easily inserted into the heat dissipation substrate, and the heat dissipation substrate is easily misplaced, and the heat dissipation material is easily affected between the heat dissipation substrate and the heat dissipation substrate is enabled.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below.
Fig. 1 is a structural cross-sectional view of a heat dissipating substrate according to a first embodiment of the present application.
Fig. 2 is a structural sectional view of a manufacturing apparatus of the first embodiment of the present application.
Fig. 3 is a structural sectional view of a manufacturing apparatus of a second embodiment of the present application.
Fig. 4 is a cross-sectional view of the other side of the first mounting plate of a manufacturing apparatus according to the second embodiment of the present application.
Fig. 5 is a structural sectional view of a manufacturing apparatus of a third embodiment of the present application.
Fig. 6 is a partial enlarged view of a third embodiment of the present application at a in fig. 5.
101-metal core substrate, 102-heat conductive insulating layer, 103-bump, 104-notch, 105-mount, 106-first stamping cylinder, 107-second stamping cylinder, 108-first stamping die plate, 109-second stamping die plate, 110-first mounting plate, 111-second mounting plate, 112-stamping notch, 113-stamping bump, 114-mounting cavity, 115-L-shaped mounting plate, 116-push cylinder, 117-connection block, 118-slider, 119-slide, 201-movable plate, 202-hold spring, 203-receiving slot, 204-movable plate, 301-compression spring, 302-fixed mount, 303-receiving cavity.
Detailed Description
The following detailed description of embodiments of the application, examples of which are illustrated in the accompanying drawings and, by way of example, are intended to be illustrative, and not to be construed as limiting, of the application.
The first embodiment of the application is as follows:
referring to fig. 1, fig. 1 is a cross-sectional view of a heat dissipating substrate according to a first embodiment of the present application. The application provides a heat dissipation substrate, which comprises a metal core substrate 101 and a heat conduction insulating layer 102, wherein the metal core substrate 101 is adhered to the heat conduction insulating layer 102, a plurality of protruding blocks 103 are arranged on the heat conduction insulating layer 102 at intervals, a plurality of notches 104 are arranged on the metal core substrate 101 corresponding to the protruding blocks 103, the protruding blocks 103 are correspondingly positioned in the notches 104, and the heat conduction insulating layer 102 is formed by mixing epoxy resin and heat conduction filler.
Specifically, the epoxy resin is linear epoxy resin, and the heat conducting filler is one of aluminum oxide, silicon carbide or aluminum nitride.
For this embodiment, a plurality of bumps 103 are disposed on the heat-conducting insulating layer 102, a plurality of notches 104 are disposed on the metal core substrate 101, an adhesive is coated on the heat-conducting insulating layer 102 and the metal core substrate 101, and then the bumps 103 of the heat-conducting insulating layer 102 are inserted in the notches 104 of the metal core substrate 101, so that the heat-conducting insulating layer 102 and the metal core substrate 101 are bonded together, and as the bumps 103 are located inside the notches 104, the heat-conducting insulating layer 102 and the metal core substrate 101 are not dislocated after being used for a long time, thereby solving the problem that the heat-dissipating substrate is affected due to the fact that the materials of the metal core substrate 101 and the heat-conducting insulating layer 102 are dislocated after the heat-dissipating substrate is used for a long time.
Referring to fig. 2, fig. 2 is a structural sectional view of a manufacturing apparatus according to a first embodiment of the present application. The application also provides a preparation device for preparing the heat dissipation substrate, which comprises a mounting seat 105, a first stamping cylinder 106, a second stamping cylinder 107, a first stamping template 108, a second stamping template 109, a first mounting plate 110, a second mounting plate 111 and two pushing components;
for the present embodiment, the first mounting plate 110 and the second mounting plate 111 are rotatably connected and are located above the mounting seat 105, the two pushing assemblies are respectively disposed below the first mounting plate 110 and the second mounting plate 111, the first punching cylinder 106 is disposed above the first mounting plate 110, the first punching die plate 108 is fixedly connected with the output end of the first punching cylinder 106, a plurality of punching recesses 112 are disposed at intervals on the bottom of the first punching die plate 108, the second punching cylinder 107 is disposed above the second mounting plate 111, the second punching die plate 109 is fixedly connected with the output end of the second punching cylinder 107, a plurality of punching bumps 113 are disposed at intervals on the bottom of the second punching die plate 109, the output end of the first punching cylinder 106 is provided with the first punching die plate 108 for punching the heat conducting insulation layer 102, the second punching die plate 101 is disposed at the output end of the second punching die plate 108 for punching the metal core substrate 101, the second punching die plate 109 acts on the heat conducting layer 102 and the heat conducting layer 102, simultaneously presses the second punching die plate 109 and the heat conducting layer 102 to the heat conducting layer 102, simultaneously, the first punching die plate 101 is pressed on the heat conducting layer 102 and the heat conducting layer 102, the second punching die plate is pressed by the first punching die plate 107, the heat conducting layer 102 is simultaneously, the heat conducting layer 102 is punched by the second punching die plate 102 is pressed, the heat conducting layer 102 is pressed, and the heat conducting layer 102 is simultaneously is punched by the heat conducting layer is pressed by the second punching die plate 102, the metal core substrate 101 is punched out of the notch 104, then the first punching cylinder 106 and the second punching cylinder 107 drive the first punching template 108 and the second punching template 109 to reset respectively, workers smear adhesive on the heat-conducting insulating layer 102 and the metal core substrate 101, then the two pushing components push the first mounting plate 110 and the second mounting plate 111 to rotate simultaneously, so that the first mounting plate 110 is attached to the second mounting plate 111, the heat-conducting insulating layer 102 is attached to the metal core substrate 101, the protruding blocks 103 of the heat-conducting insulating layer 102 are inserted into the notch 104 of the metal core substrate 101, and the heat-radiating substrate is not easy to misplace between materials of the metal core substrate 101 and the heat-conducting insulating layer 102 after long-term use, so that the problem that the use of the heat-radiating substrate is easy to misplace between materials of the metal core substrate 101 and the heat-conducting insulating layer 102 after long-time use of the heat-radiating substrate is solved.
Specifically, the top of the first mounting board 110 and the top of the second mounting board 111 are respectively provided with a mounting cavity 114 for placing the metal core substrate 101 or the heat conducting insulating layer 102, the mounting cavity 114 of the first mounting board 110 is used for mounting the heat conducting insulating layer 102, and the mounting cavity 114 of the second mounting board 111 is used for mounting the metal core substrate 101 so as to position the heat conducting insulating layer 102 and the metal core substrate 101.
Preferably, an L-shaped mounting plate 115 is disposed at the top of the mounting base 105, the first stamping cylinder 106 and the second stamping cylinder 107 are fixedly connected to the L-shaped mounting plate 115, and the L-shaped mounting plate 115 is used for mounting the first stamping cylinder 106 and the second stamping cylinder 107.
Further, the pushing assembly comprises a pushing air cylinder 116, a connecting block 117 and a sliding block 118, the bottoms of the first mounting plate 110 and the second mounting block are respectively provided with a sliding groove 119, the sliding block 118 is movably arranged in the sliding groove 119, the pushing air cylinder 116 is arranged in the mounting seat 105, the connecting block 117 is fixedly connected with the output end of the pushing air cylinder 116, the connecting block 117 is hinged with the sliding block 118, the pushing air cylinder 116 is obliquely arranged in the mounting seat 105, the sliding block 118 can slide in the sliding groove 119, and when the metal core substrate 101 and the heat conducting insulating layer 102 are stamped and glued, the pushing air cylinder 116 operates to drive the connecting block 117 to move, so that the sliding block 118 slides in the sliding groove 119 to push the first mounting plate 110 and the second mounting plate 111 to rotate, so that the first mounting plate 110 and the second mounting plate 111 rotate and are attached, and the heat conducting insulating layer 102 and the metal core substrate 101 are bonded together.
When the preparation equipment of the embodiment is used, the heat conducting insulating layer 102 and the metal core substrate 101 are respectively placed on the first mounting plate 110 and the second mounting plate 111, the first punching cylinder 106 and the second punching cylinder 107 are operated at the same time to punch the heat conducting insulating layer 102 and the metal core substrate 101 respectively, the first punching cylinder 108 extrudes the heat conducting insulating layer 102 so as to compress the heat conducting insulating layer 102, under the action of the punching notch 112, the surface of the heat conducting insulating layer 102 forms the convex block 103, meanwhile, the second punching cylinder 109 punches the metal core substrate 101, under the action of the punching convex block 113, the first punching cylinder 106 and the second punching cylinder 107 respectively drive the first punching cylinder 108 and the second punching cylinder 109 to reset, the worker pushes the air cylinder 116 to push the heat conducting insulating layer 102 and the metal core substrate 101 to compress, and simultaneously pushes the heat conducting slide block 116 to move so as to enable the heat conducting insulating layer 102 and the second mounting plate 110 to rotate, and the second mounting plate 111 rotate, and the heat conducting slide block 118 rotates and the mounting plate 110.
The second embodiment of the application is as follows:
referring to fig. 3 and 4 on the basis of the first embodiment, fig. 3 is a structural cross-sectional view of a manufacturing apparatus according to a second embodiment of the present application, and fig. 4 is a cross-sectional view of the other side of a first mounting plate of a manufacturing apparatus according to a second embodiment of the present application. The heat dissipation substrate and the preparation device thereof in this embodiment further include two movable components, where the movable components include a movable plate 201, two supporting springs 202 and two toggle plates 204;
for the present embodiment, two movable components are respectively disposed inside the mounting cavities 114 of the first mounting plate 110 and the second mounting plate 111, and the movable components are used for pushing the heat-conducting insulating plate or the metal core substrate 101 out of the mounting cavities 114.
Specifically, the two sides of the mounting cavity 114 are respectively provided with a containing groove 203, the two supporting springs 202 are respectively arranged in the containing grooves 203 on the two sides of the mounting cavity 114 and support the movable piece 201, the movable piece 201 is movably arranged in the mounting cavity 114, the supporting springs 202 support the movable piece 201, so that the movable piece 201 is attached to the bottom of the mounting cavity 114, a worker can stir the movable piece 201, so that the movable piece 201 moves towards the outside of the mounting cavity 114, and the heat conducting insulating layer 102 or the metal core substrate 101 can be pushed out of the mounting cavity 114, so that the heat conducting insulating layer 102 or the metal core substrate 101 can be conveniently taken out.
In addition, the two poking pieces 204 are respectively and fixedly connected with two ends of the movable piece 201, and the poking pieces 204 are arranged on the side edges of the movable piece 201, so that a worker pokes the movable piece 201 through the poking pieces 204.
When the manufacturing apparatus of this embodiment is used, after the heat-conducting insulating layer 102 and the metal core substrate 101 are bonded together, the movable piece 201 may be moved by moving the moving piece 204, so as to push out the heat-conducting insulating layer 102 or the metal core substrate 101 from the mounting cavity 114.
The third embodiment of the application is as follows:
on the basis of the second embodiment, please refer to fig. 5 and 6, fig. 5 is a structural sectional view of a manufacturing apparatus of the third embodiment of the present application, and fig. 6 is a partially enlarged view of fig. 5 a of the third embodiment of the present application. The heat dissipation substrate and the preparation device thereof of the present embodiment further include a fixing component, where the fixing component includes a compression spring 301 and a fixing frame 302;
for this embodiment, the fixing components are disposed on two sides of the mounting cavity 114, and the fixing components are used to fix the metal core substrate 101 or the thermally conductive and insulating layer 102 in the mounting cavity 114.
Specifically, the two sides of the mounting cavity 114 are provided with accommodating cavities 303, the fixing frame 302 is movably disposed in the accommodating cavities 303, the compression spring 301 is disposed below the fixing frame 302, the fixing frame 302 can move in the accommodating cavities 303, and the compression spring 301 is in a compressed state to pull the fixing frame 302, so that the fixing frame 302 abuts against the heat-conducting insulating layer 102 or the metal core substrate 101 in the mounting cavity 114, and the heat-conducting insulating layer 102 or the metal core substrate 101 is fixed.
When the manufacturing apparatus of the present embodiment is used, the heat conductive insulating layer 102 or the metal core substrate 101 is fixed in the mounting cavity 114 by the mutual cooperation of the fixing frame 302 and the compression spring 301, so as to facilitate the punching.
The foregoing disclosure is only illustrative of one or more preferred embodiments of the present application, and it is not intended to limit the scope of the claims hereof, as persons of ordinary skill in the art will understand that all or part of the processes for practicing the embodiments described herein may be practiced with equivalent variations in the claims, which are within the scope of the application.

Claims (5)

1. The preparation equipment is used for preparing a heat dissipation substrate, the heat dissipation substrate comprises a metal core substrate and a heat conduction insulating layer, the metal core substrate is adhered with the heat conduction insulating layer, the heat conduction insulating layer is provided with a plurality of protruding blocks at intervals, the metal core substrate is provided with a plurality of notches corresponding to the protruding blocks, each protruding block is correspondingly positioned in each notch, the heat conduction insulating layer is formed by mixing epoxy resin and heat conduction filler, the epoxy resin is linear epoxy resin, the heat conduction filler is one of alumina, silicon carbide or aluminum nitride,
including mount pad, first punching press cylinder, second punching press cylinder, first punching press template, second punching press template, first mounting panel, second mounting panel and two promotion subassemblies, first mounting panel with the second mounting panel rotates to be connected, and all is located the top of mount pad, two the promotion subassembly sets up respectively first mounting panel with the below of second mounting panel, first punching press cylinder sets up the top of first mounting panel, first punching press template with the output fixed connection of first punching press cylinder, the bottom interval of first punching press template is provided with a plurality of punching press notch, the setting of second punching press cylinder is in the top of second mounting panel, the second punching press template with the output fixed connection of second punching press cylinder, the bottom interval of second punching press template is provided with a plurality of punching press lugs.
2. The manufacturing apparatus according to claim 1, wherein,
the top of first mounting panel with the second mounting panel all is provided with the installation cavity that is used for placing metal core base plate or heat conduction insulating layer.
3. The manufacturing apparatus as claimed in claim 2, wherein,
the top of mount pad is provided with L shape mounting panel, first punching press cylinder with the second punching press cylinder all with L shape mounting panel fixed connection.
4. The manufacturing apparatus according to claim 3, wherein,
the pushing assembly comprises a pushing air cylinder, a connecting block and a sliding block, wherein sliding grooves are formed in the bottoms of the first mounting plate and the second mounting plate, the sliding block is movably arranged in the sliding grooves, the pushing air cylinder is arranged in the mounting seat, the connecting block is fixedly connected with the output end of the pushing air cylinder, and the connecting block is hinged to the sliding block.
5. The manufacturing apparatus according to claim 4,
the preparation equipment further comprises two movable components, wherein the two movable components are respectively arranged in the first mounting plate and the second mounting plate in the mounting cavity.
CN202210488577.6A 2022-05-06 2022-05-06 Heat dissipation substrate and preparation equipment thereof Active CN114771038B (en)

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Application Number Priority Date Filing Date Title
CN202210488577.6A CN114771038B (en) 2022-05-06 2022-05-06 Heat dissipation substrate and preparation equipment thereof

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Application Number Priority Date Filing Date Title
CN202210488577.6A CN114771038B (en) 2022-05-06 2022-05-06 Heat dissipation substrate and preparation equipment thereof

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CN114771038A CN114771038A (en) 2022-07-22
CN114771038B true CN114771038B (en) 2023-12-08

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