KR101309746B1 - Heatsink and method for manufacturing heatsink - Google Patents

Abstract

The present invention relates to a heat sink and a method for manufacturing the heat sink, and more particularly, to a heat sink and a method for manufacturing the heat sink having a very simple structure is improved. According to the present invention, there is provided a method of manufacturing a heat sink for dissipating heat generated from an electronic component by fixing to a substrate, the method comprising: attaching a heat dissipation tape to a surface of a metal plate, from a fixing plate to which the electronic component is fixed, and one side of the fixing plate. A method of manufacturing a heat dissipation plate is provided that includes a step of pressing the metal plate having the heat dissipation tape to be formed to be inclined and to support the substrate.

Description

Heat sink and method for manufacturing heatsink

The present invention relates to a heat sink and a method for manufacturing the heat sink, and more particularly, to a heat sink and a method for manufacturing the heat sink having a very simple structure is improved.

In general, when electrical, electronic devices, and components generate heat, a heat sink such as a heat sink is mounted on the components to prevent malfunction of the device due to heat. Heat dissipation devices, such as heat sinks, typically use metals with high thermal conductivity to allow for rapid heat dissipation in the device or component.

As illustrated in FIG. 1, in the related art, a heat sink having a structure in which a plurality of heat dissipation fins uniformly protrudes on the front surface is generally used. Such a conventional heat sink is manufactured by heating and melting aluminum, copper, and alloy materials thereof in a high temperature state, and then extruding them using a mold having a predetermined shape.

However, manufacturing a heat sink by a method of extrusion molding into a mold has a problem in that a manufacturing process is difficult and a processing cost increases because a separate mold corresponding to the heat sink has to be manufactured to manufacture a heat sink having various shapes.

In addition, in order to secure required properties such as electrical insulation and oxidation prevention, a separate process, such as anodizing, must be performed. In this process, a large amount of acid or basic waste is generated, resulting in additional treatment costs.

In addition, conventional heat sinks for cooling electronic devices made of metals such as aluminum, copper, iron, zinc, silver, and gold require a complicated structure to reduce heat generated per unit area to a desired level. As a result, the amount of metal used is high, and as a result, the weight and volume of the entire product increase and the price also increases significantly.

In addition, a device was developed to increase the cooling efficiency by forming a heat sink using a ceramic material rather than a metal material to increase the heat dissipation area by using capillary pores characteristic of the ceramic material. However, this is due to the nature of the ceramic material must be a high temperature treatment and the processing time is long, productivity is low. In addition, in the case of a heat sink having a variety of complex structures, workability, impact resistance is poor. It was also inefficient in terms of size and weight.

Therefore, in order to solve the above problems, a new manufacturing method for improving the structure and increasing the efficiency of the heat sink is required.

The present invention is to improve the above-described problems, the first problem to be solved by the present invention is to efficiently dissipate heat generated in the electrical and electronic equipment and components to excellent cooling performance, and to increase the height compared to the existing heat dissipation device It is possible to provide a heat sink that can be lowered and miniaturized and lightened.

The second problem to be solved by the present invention is to provide an efficient manufacturing method capable of manufacturing the heat sink at a low cost.

According to an aspect of the present invention, in the manufacturing method of the heat sink for fixing the heat generated from the electronic component is fixed to the substrate, the step of attaching the heat radiation tape on the surface of the metal plate, the fixed plate and the fixed plate to which the electronic component is fixed It is formed obliquely from one side of the manufacturing method of the heat sink is provided, comprising the step of pressing the metal plate with the heat-radiating tape is attached to form a support plate to be bonded to the substrate.

The pressing may include stamping the fixing plate to form a fixing protrusion around a position at which the electronic component is mounted, and forming heat dissipation fins formed to be inclined in the direction of the electronic component from opposite sides of the fixing plate. The method may further include forming a through hole in the fixing plate and the support plate.

In addition, there is provided a method for manufacturing a heat sink further comprising the step of inserting a pin into the through hole formed in the support plate.

According to another aspect of the present invention, a heat sink for dissipating heat generated from an electronic component, comprising a fixed plate to which the electronic component is fixed, a support plate inclined from one side of the fixed plate, and a heat dissipation tape attached to the fixed plate Provided is a heat sink characterized in that.

The fixing plate may include a first surface on which the electronic component is fixed and a second surface parallel to the first surface, and the heat dissipation tape is attached to the second surface.

In order to prevent the electronic component from moving in the fixing plate, the fixing plate may include a plurality of fixing protrusions protruding outward from the first surface and positioned around the electronic component. In addition, it is preferable to further include a heat dissipation fin formed inclined in the direction of the electronic component from opposite sides of the fixing plate.

The heat dissipation tape may include a base material, a heat conductive layer formed on one or both surfaces of the base material, and an adhesive layer formed on one side or a heat conductive layer of the base material.

The substrate is preferably selected from metal thin plates, polymer films or metal thin films coated with polymer films. The thermal conductive layer may include a binder, a metal powder of aluminum, zinc, nickel, copper, calcium, potassium, iron, silver, and gold, oxides and hydrates thereof, salts of the metals, carbon black, carbon nanotubes, graphite, It is preferable to include a filler selected from the group consisting of silicon carbide, boron nitride and aluminum nitride.

The heat sink according to the present invention is very simple in structure, but excellent in heat dissipation characteristics. In addition, it is possible to manufacture by a simple method of pressing a metal plate with a heat-radiating tape, so the productivity is very excellent. In addition, since a complicated heat dissipation fin structure is not required, the amount of metal used is reduced, thereby reducing manufacturing costs, and miniaturization and light weight are possible. In addition, since it is possible to manufacture by pressing a metal plate with a heat radiation tape instead of using a metal mold, it is very easy to change the structure of the heat sink in response to the type change of the electronic component.

1 is a perspective view showing the structure of a conventional heat sink.
Figure 2 is a perspective view of one embodiment of a heat sink according to the present invention.
3 is a cross-sectional view of the heat sink shown in FIG. 2.
4 is a cross-sectional view of a heat radiation tape of the heat sink shown in FIG. 2.
5 is a view for explaining an embodiment of the manufacturing method of the heat sink according to the present invention.
6 is a perspective view of another embodiment of a heat sink according to the present invention.
FIG. 7 is a cross-sectional view of the heat sink shown in FIG. 6.

Hereinafter, with reference to the accompanying drawings will be described in detail an embodiment of the present invention.

The following embodiments are provided by way of example so that those skilled in the art can fully understand the spirit of the present invention. Therefore, the present invention is not limited to the embodiments described below, but may be embodied in other forms. In the drawings, the width, length, thickness, and the like of the components may be exaggerated for convenience. Like numbers refer to like elements throughout.

Figure 2 is a perspective view of one embodiment of a heat sink according to the present invention, Figure 3 is a cross-sectional view of the heat sink shown in FIG.

2 and 3, one embodiment of a heat sink according to the present invention includes a heat dissipation structure including a fixing plate 10, a heat dissipation fin 20, and a support plate 30, and a heat dissipation tape 40.

The heat dissipation structure may be made of any one selected from the group consisting of aluminum, copper, zinc, silver, gold, iron, and alloys of the metals. The heat dissipation structure may be manufactured integrally by pressing a metal plate made of the metal. It is preferable that the thickness of a metal plate is 0.5-1.5 mm. If less than 0.5mm because the hardness of the heat dissipation structure is weak because it is easily deformed even in a small impact, if it exceeds 1.5mm, because the total volume and weight of the heat dissipation structure increases, it is difficult to reduce the heat sink.

The fixed plate 10 has a first surface 11 and a second surface 12 parallel to the first surface 11. Electronic components are fixed to the first surface 11, and the heat dissipation tape 40 is attached to the second surface 12. Electronic components attached to the first surface 11 include, for example, an IC package and a power converter.

The fixing plate 10 has a through hole 13 penetrating through the first surface 11 and the second surface 12. The through hole 13 is for fixing an electronic component such as a power converter to the fixing plate 10 by using a screw hole formed in an electronic component such as a power converter. The through hole 13 has a burring treatment to withstand a torque of 6 to 8 kgf / cm 2 when the electronic component is screwed to the fixing plate 10.

In addition, a plurality of fixing protrusions 14 protruding outward from the first surface 11 are formed around the electronic component in order to prevent the electronic component fixed through the screw from rotating. The fixing protrusion 14 may be formed by stamping.

The support plate 30 is a portion in contact with the printed circuit board, and is formed perpendicular to the fixed plate 10. The support plate 30 also functions to improve heat dissipation performance. The support plate 30 is formed with a pin 32 for coupling with the printed circuit board or a through hole 31 for inserting a screw. The pin 32 inserted into the through hole 31 may also serve as a ground.

The heat dissipation fin 20 is formed to be inclined with the fixing plate 10 on opposite sides of the fixing plate 10. It is preferable that the angle which the heat dissipation fin 20 makes with the fixing plate 10 is 90 to 150 degrees. If the angle formed by the fixing plate 10 and the heat dissipation fin 20 is an acute angle, the convection of air is difficult to occur because the distance between the fixing plate 10 and the heat dissipation fin 20 is too close, and if it exceeds 150 degrees, convection space is not secured. Therefore, heat emission is not easy.

The heat dissipation tape 40 is attached to the fixing plate 10 and serves to discharge heat generated from electronic components to the fixing plate 10 to the outside. It is preferable that the thickness of the heat radiation tape 40 is 70 micrometers or less. If the thickness exceeds 70 μm, the heat dissipation tape 40 may be crushed in the pressing process after the heat dissipation tape 40 is coated.

Referring to FIG. 4, the heat dissipation tape 40 includes a substrate 41 and an adhesive layer 47 formed on a surface opposite to the thermal conductive layer 44 formed on one surface of the substrate. The heat conductive layer 44 of the heat dissipation tape 40 may be formed on both sides of the substrate 41, and in this case, the adhesive layer 47 is formed on the heat conductive layer 44.

The base 41 may be a metal thin plate, a polymer film or a metal thin plate coated with a polymer film. The metal thin plate coated with the metal thin film or the polymer film is advantageous in that it is easy to attach in that it does not stretch. In this embodiment, the metal thin plate 42 coated with the polymer film 43 is used.

It is preferable to use the aluminum or copper thin plate with high thermal conductivity as the metal thin plate 42.

The polymer film 43 may be at least one selected from the group consisting of polyethylene terephthalate, stretched polypropylene, polystyrene, and acrylonitrile butadiene-styrene copolymer.

The thermal conductive layer 44 includes a binder 45 and a filler 46 having high thermal conductivity.

The binder furnace 45 may be at least one selected from the group consisting of polyester resins, epoxy resins, polyolefin resins, polyurethane resins, fluorocarbon resins, phenol resins, acrylic resins, and polycarbonate resins.

As the filler 46, metal powders of aluminum, zinc, nickel, copper, calcium, potassium, iron, silver, and gold, oxides and hydrates thereof, or salts of the metals, carbon black, carbon nanotubes, graphite, silicon carbide and boron nitride It may include particles selected from one or more selected from the group consisting of aluminum nitride.

Other additives such as dispersants, antifoams, sedimentation inhibitors, dilution solution may be further included.

Although the adhesive layer 47 can be suitably selected from the well-known adhesive used for the use of a tape and the same kind, it is preferable to use an acrylic adhesive especially from a viewpoint of adhesive performance or versatility.

Hereinafter, with reference to the accompanying drawings, it will be described in detail an embodiment of the manufacturing method of the heat sink according to the present invention.

First, as shown in FIG. 5, while supplying the metal plate 1 wound in the form of a roll, the heat radiation tape 2 is attached to one surface of the metal plate 1. After removing the release film 4 attached to the adhesive layer of the heat dissipation tape 2 wound in a roll shape, and placing the adhesive layer of the heat dissipation tape 2 close to one surface of the metal plate 1, the heat dissipation tape 2 And the metal plate 1 through the roller, the heat-radiating tape 2 is attached to one surface of the metal plate 1.

Next, the metal plate 1 with the heat dissipation tape 2 is put into the press working apparatus 3, cut into the required shape through shearing, and the through-holes for fixing the electronic components and coupling with the printed circuit board. To form. And forming a portion corresponding to the support plate and the heat radiation fin through the bending process.

If necessary, the fixing projections are formed by stamping. Stamping processing refers to a processing method in which the sheet metal is placed between the upper and lower molds of which the unevenness is processed, and a shock pressure is applied to imprint the uneven shape on the surface of the sheet metal. Stamping also takes place in a press machine.

Finally, the pin is inserted into the through hole formed in the support plate. The pin is intended to facilitate the coupling with the printed circuit board and also serves as a ground.

As described above, according to the present invention, a heat dissipation plate having excellent heat dissipation characteristics can be manufactured through a simple process of attaching a heat dissipation tape and pressing. In addition, since the heat radiation tape is attached to the metal plate before the press working, it is very easy to attach the heat radiation tape.

In order to confirm the excellent heat dissipation characteristics of the heat sink according to the present invention, after the power converter was mounted in the embodiments of the heat sink according to the present invention, the temperature was measured after driving for the same time.

Example 1

Example 1 is a heat sink shown in FIG. The heat dissipation structure is composed of a fixed plate having a width of 20 mm, a length of 27 mm, and a thickness of 1 mm, a support plate having a width of 20 mm, a length of 8 mm, and a thickness of 1 mm, and a pair of heat dissipation fins having a width of 5 mm, length of 27 mm, and thickness of 1 mm. It is made of aluminum with a weight of 2.78g and a heat dissipation surface area of about 15.1cm2, and a heat dissipation tape is attached to the back of the fixing plate and the heat dissipation fin.

The heat dissipation tape was coated on both sides of the aluminum foil and coated with a paste containing a polyurethane resin 120g, carbon black 8g, calcium carbonate 90g, aluminum hydroxide 70g, a dispersant, an antifoaming agent, and toluene 100, followed by drying. The formed heat conductive layer was formed, and the other side used the heat-radiating tape in which the adhesion layer was formed.

After 0.1 g of thermal grease was applied to the fixed plate, the power converter was fixed with screws using a torque of 6 kgf / cm 2.

[Example 2]

As shown in Figures 6 and 7, Example 2 has no heat dissipation fins, and is the same as Example 1 except that the weight is 2.2 g and the heat dissipation surface area is about 9.7 cm 2.

[Example 3]

It consists of a fixed plate having a width of 14 mm, a length of 27 mm, and a thickness of 1 mm, and a support plate having a width of 14 mm, a length of 8 mm, and a thickness of 1 mm, except that the weight is 1.29 g and the heat dissipation area is about 4.8 cm 2. same.

Comparative Example 1

0.1 g of a thermal grease is formed on an extruded aluminum heat sink having a shape as shown in FIG. 1A and having a width of 23 mm, a length of 17 mm, a height of 25 mm, a weight of 8.92 g, and a heat dissipation surface area of about 34.25 cm 2. After application, the power converter was fixed by applying a torque of 6 kgf / cm 2 through the through hole.

Comparative Example 2

It has the shape as shown in (b) of FIG. 1, and is the same as Comparative Example 1 except that the width 29mm, length 10mm, height 20mm, weight 7.69g, the heat radiation surface area of about 21.6cm2.

[Comparative Example 3]

It has the shape as shown in (c) of FIG. 1, and is the same as the comparative example 1 except that it is 15 mm, 10 mm in height, 25 mm in height, thickness 1 mm, weight 4 g, and a heat radiation surface area of about 15 cm2.

Table 1 shows the heat radiation characteristics of the Examples and Comparative Examples. As can be seen from Table 1, the weight of the heat sink of Example 1 is about 31% of the weight of the heat sink of Comparative Example 1, but the heat dissipation surface area is less than half, but in terms of heat dissipation performance, the heat dissipation performance is equal to or higher. Similarly, the weight of the heat sink of Example 2 is about 28% of the weight of the heat sink of Comparative Example 2, but shows an equivalent heat dissipation performance, even in the comparison of Example 3 and Comparative Example 3, the heat sink of Example 3 weighs about 32% It shows more than equivalent heat dissipation performance.

The heat sink of the present invention exhibits heat dissipation performance equal to or higher than about 30% of the metal of the conventional heat sink. In addition, the heat sink of the present invention has the advantage that it can be manufactured by a very simple method of attaching and pressing the heat radiation tape because the structure is simple.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be construed as limiting the scope of the invention as defined by the appended claims. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present invention.

10: fixing plate 14: fixing protrusion
20: heat dissipation fin 30: support plate
40: heat dissipation tape

Claims (12)

In the manufacturing method of the heat sink for dissipating heat generated in the electronic component fixed to the substrate,
Attaching a heat radiation tape to the surface of the metal plate;
And pressing the metal plate to which the heat dissipation tape is attached so as to form a fixing plate to which the electronic component is fixed and a support plate which is formed to be inclined from one side of the fixing plate and is coupled to the substrate.
The press working step is a manufacturing method of the heat sink, characterized in that for pressing the surface opposite to the surface on which the electronic component of the fixing plate is fixed to the surface attached to the heat radiation tape layer. The method of claim 1,
The press working step,
And stamping the fixing plate to form a fixing protrusion around a position at which the electronic component is mounted. The method of claim 1,
The press working step,
And forming a heat dissipation fin inclined in the direction of the electronic component from opposite sides of the fixing plate. The method of claim 1,
The press working step,
And forming a through hole in the fixing plate and the support plate. 5. The method of claim 4,
And inserting a pin into a through hole formed in the support plate. In the heat sink for dissipating heat generated from the electronic components,
A fixing plate to which the electronic component is fixed,
A support plate formed to be inclined from one side of the fixing plate and coupled to the substrate;
It includes a heat dissipation tape attached to the fixing plate,
The fixing plate has a first surface on which the electronic component is fixed and a second surface parallel to the first surface, and the heat dissipation tape is attached to the second surface. delete The method according to claim 6,
And a plurality of fixing protrusions protruding outward from the first surface and positioned around the electronic component to prevent the electronic component from moving in the fixing plate. The method according to claim 6,
And a heat dissipation fin formed to be inclined in the direction of the electronic component from opposite sides of the fixing plate. The method according to claim 6,
The heat-
A heat sink comprising a substrate, a heat conductive layer formed on one or both surfaces of the substrate, and an adhesive layer formed on one surface or the heat conductive layer of the substrate. The method of claim 10,
The substrate is a heat sink, characterized in that selected from a metal thin plate, a polymer film or a metal thin film coated polymer film. The method of claim 10,
The thermal conductive layer,
With a binder,
Consists of metal powders of aluminum, zinc, nickel, copper, calcium, potassium, iron, silver and gold, oxides and hydrates thereof, salts of these metals, carbon black, carbon nanotubes, graphite, silicon carbide, boron nitride and aluminum nitride A heat sink comprising at least one filler selected from the group consisting of.

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