CN217904913U - Liquid immersion type radiator - Google Patents

Abstract

The utility model relates to a liquid immersion radiator, which comprises a metal shell, a welding layer, a heat conduction layer and a porous structure, wherein the metal shell is provided with a heating surface and a radiating surface formed at the back of the heating surface; the welding layer is laid on the heat dissipation surface; the heat conduction layer is laid on the welding layer; the porous structure is laid on the heat conduction layer. Therefore, the waste heat generated by the electronic heating source can be quickly dissipated.

Description

Liquid immersion type radiator

Technical Field

The present invention relates to a heat sink, and more particularly to a liquid immersion heat sink.

Background

With the vigorous development and application of network technologies, the requirements of users on the starting speed of computers, the reading speed of software and the playing speed of photos and films are continuously improved, and the time can be effectively saved, so that the method becomes one of the conditions for consumers to select products.

Along with the improvement of efficiency and reading speed, the heat productivity and temperature of the electronic components are also continuously increased, and the high temperature not only makes most of the electronic components easily and rapidly aged, but also reduces the reading and writing speed of the electronic components such as the solid state disk, so how to maintain the working temperature becomes the research subject of the present application.

The existing heat radiator for the electronic component mainly comprises a heat conducting plate and a plurality of heat radiating fins arranged on the heat conducting plate, and the heat conducting plate is in thermal contact with the electronic component and utilizes air as a heat conducting medium to further realize the heat radiating effect. However, the thermal conductivity of air is low, so that the efficiency of heat conduction is not good. Although the industry has developed liquid-immersed heat sinks, the amount of heat dissipated is limited by the structure of the heat sink, and it is obvious that the heat sink cannot meet the requirements of the prior art.

In view of this, the inventor of the present invention is therefore interested in studying the above-mentioned shortcomings of the prior art and cooperating with the application of the theory to solve the above-mentioned problems as much as possible, so as to achieve the improved objective of the inventor.

SUMMERY OF THE UTILITY MODEL

An object of the present invention is to provide a liquid-immersed heat sink, which can rapidly dissipate the waste heat generated by an electronic heat source.

In order to achieve the above object, the present invention provides a liquid-immersed heat sink, which includes a metal casing, a welding layer, a heat conducting layer and a porous structure, wherein the metal casing has a heating surface and a heat dissipating surface formed behind the heating surface; the welding layer is laid on the heat dissipation surface; the heat conduction layer is laid on the welding layer; the porous structure is laid on the heat conduction layer.

The utility model discloses still have following efficiency, borrow by the setting of heat-conducting layer, can ensure in the manufacture process that the pore of porous structure can not blockked up by welding material. By limiting the aperture to a specific range, the heat sink has more heat dissipation surface area and allows liquid to flow in or out easily, not only in the same unit area.

Drawings

Fig. 1 is an external view of the liquid-immersed heat sink and the electronic component assembly of the present invention.

Fig. 2 is an enlarged view of a partial region of fig. 1.

Fig. 3 is a combined cross-sectional view of the liquid-immersed heat sink and the electronic component according to the present invention.

Symbolic illustration in the drawings:

10, a metal shell;

11, a substrate;

111 heating surface;

112, a heat dissipation surface;

12, side plates;

20, welding layer;

30, a heat conduction layer;

40, a porous structure;

41, a net unit;

42, pores;

8, an electronic component;

81, a circuit board;

and 82, an electronic heating source.

Detailed Description

The following detailed description and technical contents of the present invention are described with reference to the drawings, but the drawings are only for reference and illustration and are not intended to limit the present invention.

Referring to fig. 1 to 3, the present invention provides a liquid-immersed heat sink, which mainly includes a metal housing 10, a welding layer 20, a heat conducting layer 30 and a porous structure 40.

The metal housing 10 is made of copper, aluminum, magnesium or alloy thereof, and mainly includes a substrate 11 and a plurality of side plates 12 extending downward from the periphery of the substrate 11, wherein the lower surface of the substrate 11 has a heat receiving surface 111, the upper surface of the substrate 11 has a heat dissipating surface 112, and the heat dissipating surface 112 is formed behind the heat receiving surface 111.

The welding layer 20 is laid on the heat dissipation surface 112; in one embodiment, the solder layer 20 may be a solder paste, specifically Sn42Bi58, having a melting temperature of about 138 ℃, a thickness of less than 0.05 millimeters (mm), and a thermal conductivity of 19W/mk.

The heat conduction layer 30 is laid on the welding layer 20; in one embodiment, the material of the heat conductive layer 30 may be C1100 copper foil with a thickness of 0.5 millimeters (mm) and a thermal conductivity greater than 390W/mk.

The porous structure 40 is laid on the heat conduction layer 30, and the porous structure 40 may be a metal mesh grid, specifically a copper mesh, and has a mesh value larger than 65 (i.e. the gap is less than 0.2 mm), wherein the mesh value is preferably between 120 to 300. The woven metal mesh is bonded to the aforementioned heat conductive layer 30 by Diffusion Bonding Technology.

In one embodiment, the metal mesh grid includes a plurality of mesh units 41, each mesh unit 41 is stacked and assembled on top of the heat dissipating surface 112, the material of each mesh unit 41 may be C1100 copper mesh, the wire diameter is 0.05 mm, the thickness is 0.1 mm, the porosity is 50%, and the thermal conductivity is greater than 390W/mk.

Referring to fig. 3, the liquid-immersed heat sink of the present invention can be applied to an electronic component 8, the electronic component 8 mainly includes a circuit board 81 and an electronic heat source 82 disposed on the circuit board 81, when the liquid-immersed heat sink is assembled, the metal casing 10 covers the electronic heat source 82, each side plate 12 is attached to the circuit board 81, and the top surface of the electronic heat source 82 is attached to the heat receiving surface 111, or a heat conducting medium (not shown) is filled between the electronic heat source 82 and the heat receiving surface 111.

When the combined structure is used, the combined structure is placed into a liquid container (not shown), the liquid used in the liquid container is a low-boiling point non-conductive liquid, and waste heat generated after the electronic heating source 82 operates is directly conducted to the heat dissipation surface 112, the heat conduction layer 30 and the porous structure 40 through the heat receiving surface 111, and flows through the heat conduction layer 30 and the pores 42 of each net unit 41 through the non-conductive liquid, so that the waste heat is rapidly dissipated.

The above description is only a preferred and practical embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent structural changes made by applying the contents of the specification and drawings of the present invention are reasonably included in the scope of the present invention.

Claims (10)

1. A liquid-impregnated heat sink, comprising:

a metal shell having a heating surface and a heat dissipating surface formed at the back of the heating surface;

a welding layer laid on the heat dissipation surface;

a heat conduction layer, laid on the welding layer; and

a porous structure laid on the heat conduction layer.

2. The liquid-immersed heat sink according to claim 1, wherein the porous structure is a metal mesh.

3. The liquid-immersed heat sink according to claim 2, wherein the mesh number of the metal mesh grid is greater than 65.

4. The liquid-filled radiator according to claim 3, wherein the mesh value of the metal mesh grid is between 120 and 300.

5. The liquid-immersed heat sink according to claim 2, wherein the metal mesh is a copper mesh.

6. The liquid-immersed heat sink according to claim 2, wherein the metal mesh comprises a plurality of mesh units, and the mesh units are stacked one on another.

7. The liquid-immersed heat sink according to claim 2, wherein the metal mesh grid is bonded to the heat conductive layer by diffusion welding.

8. The liquid-immersed heat sink according to claim 1, wherein the solder layer is a solder paste.

9. The liquid-immersed heat sink according to claim 1, wherein the heat conducting layer is a copper foil.

10. The liquid-immersed heat sink according to claim 1, wherein the metal housing comprises a base plate and a plurality of side plates extending downward from a periphery of the base plate, the heat receiving surface is formed on a lower surface of the base plate, and the heat dissipating surface is formed on an upper surface of the base plate.

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