CN116940047A - Cooling fin of liquid immersion cooling heating source for improving surface structure - Google Patents

Abstract

The application relates to a radiating fin of a liquid immersion cooling heat generating source for improving a surface structure, which comprises a metal shell and a porous structure, wherein the metal shell is provided with a heating surface and a radiating surface formed at the back of the heating surface; the porous structure is arranged on the radiating surface and is provided with a gap, and the width of the gap is less than 0.2 millimeter. Therefore, waste heat generated by the electronic heating source can be quickly dissipated.

Description

Cooling fin of liquid immersion cooling heating source for improving surface structure

Technical Field

The present application relates to a heat sink, and more particularly to a heat sink with improved surface structure for liquid immersion cooling.

Background

With the rapid development and application of network technology, the requirement of users for the starting-up speed of computers, the reading speed of software and the playing speed of photos and films is continuously improved, so that the time can be effectively saved as one of conditions when consumers select products.

With the improvement of performance and reading speed, the heat productivity and temperature of the electronic components are continuously increased, and the high temperature can not only make most of the electronic components easy to be aged rapidly, but also reduce the reading and writing speed of the electronic components such as solid-state hard disk, so how to maintain the working temperature is the subject of the application.

The conventional heat sink for the electronic component mainly comprises a heat conducting plate and a plurality of heat radiating fins arranged on the heat conducting plate, wherein the heat radiating fins are in thermal contact with the electronic component through the heat conducting plate, and air is used as a heat conducting medium, so that a heat radiating effect is realized. However, the thermal conductivity of air is low, so that the efficiency of heat conduction is poor. Although submerged heat sinks have been developed, the heat dissipated by the heat sinks is limited by the structure, and the heat sinks cannot meet the current use requirements.

Disclosure of Invention

The application aims to provide a cooling fin of a liquid immersion cooling heat generating source, which is capable of rapidly dissipating waste heat generated by an electronic heat generating source.

In order to achieve the above-mentioned objective, the present application provides a heat sink for a liquid-immersed cooling heat source with improved surface structure, comprising a metal shell and a porous structure, wherein the metal shell has a heating surface and a heat dissipation surface formed at the back of the heating surface; the porous structure is arranged on the radiating surface and is provided with a plurality of gaps, and the width of each gap is less than 0.2 millimeter.

Optionally, the width of the gap is between 0.05 mm and 0.1 mm.

Optionally, the porous structure comprises a plurality of pins, each of the gaps being formed between any two adjacent pins.

Optionally, each pin is integrally formed with the metal housing and extends from the heat dissipation surface.

Optionally, each of the pins has a width or diameter of 0.2 mm or less.

Optionally, the porous structure is a metal mesh.

Optionally, the metal mesh is bonded to the heat dissipating surface by a diffusion weld.

Optionally, the metal mesh is a copper mesh, and the mesh value of the copper mesh is 120-300.

Optionally, the metal mesh comprises a plurality of mesh units, each of the mesh units being stacked on each other.

Optionally, a heat conducting plate is further included, and the heat conducting plate is interposed between the heat dissipating surface of the metal housing and the porous structure.

The application also has the following effects that by limiting the width of the gap within a specific range, not only the same unit area is provided with more heat dissipation surface area, but also the liquid can flow in or out easily. The needle posts and the metal shell are integrally formed, so that the heat conduction efficiency is excellent. By means of the arrangement of the heat conducting plate, the manufacturing process becomes simpler and easier.

Drawings

Fig. 1 is an external view of a combination of a heat sink and an electronic component according to the present application.

Fig. 2 is an enlarged view of a partial area of fig. 1.

Fig. 3 is a sectional view of a heat sink and electronic assembly combination according to the present application.

Fig. 4 is a sectional view of another embodiment of the application combined with an electronic assembly.

Fig. 5 is an external view showing a combination of an electronic component and another embodiment of the present application.

Fig. 6 is a sectional view of a combination of an electronic component and a further embodiment of the application.

In the figure:

10, a metal shell; 11, a substrate; 111, heating surface; 112, radiating surfaces; 12, a side plate; 20. 20A and 20B are porous structures; 21, needle column; 22, clearance; 23, a net unit; 30, a heat conducting plate; w is the width; 8, an electronic component; 81, a circuit board; 82, an electronic heating source.

Detailed Description

The present application will be further described with reference to the accompanying drawings and specific examples, which are not intended to limit the application, so that those skilled in the art may better understand the application and practice it.

Referring to fig. 1 to 3, the present application provides a heat sink for a liquid-immersed cooling heat source with improved surface structure, which mainly comprises a metal shell 10 and a porous structure 20.

The metal shell 10 is made of copper, aluminum, magnesium or alloy thereof, and mainly comprises a substrate 11 and a plurality of side plates 12 extending downwards from the periphery of the substrate 11, wherein the lower part of the substrate 11 is provided with a heating surface 111, the upper part of the substrate 11 is provided with a heat dissipation surface 112, and the heat dissipation surface 112 is formed behind the heating surface 111.

The porous structure 20 of the present embodiment includes a plurality of pins 21, each pin 21 is integrally formed with the metal housing 10 and extends from the heat dissipation surface 112, a gap 22 is formed between any two adjacent pins 21, and a width of each gap 22 is less than 0.2 millimeters (mm), wherein a width of each gap 22 is preferably between 0.05 and 0.1 millimeters (mm).

In one embodiment, the spike 21 may be a copper spike with a cross-sectional shape that may be circular or rectangular, wherein the diameter of the circular spike 21 is less than 0.2 millimeters (mm). The rectangular spike 21 has a width of 0.2 millimeters (mm) or less.

Referring to fig. 3 again, the fin of the liquid-immersed cooling heat source with improved surface structure of the present application can be applied to an electronic component 8, the electronic component 8 mainly includes a circuit board 81 and an electronic heat source 82 disposed on the circuit board 81, when combined, the metal housing 10 is covered on the electronic heat source 82, each side plate 12 is attached to the circuit board 81, the top surface of the electronic heat source 82 is attached to the heating surface 111, or a heat conducting medium (not shown in the drawings) is filled between the electronic heat source 82 and the heating surface 111.

In use, the above-mentioned combined structure is placed in a liquid container (not shown in the drawings), the liquid used in the liquid container is a low-boiling point nonconductive liquid, and when the electronic heat-generating source 82 is operated, the waste heat generated by the operation of the electronic heat-generating source is directly conducted to the heat-dissipating surface 112 and each pin 21 via the heat-receiving surface 111, and the waste heat is rapidly dissipated by flowing the nonconductive liquid through the gap 22 between the heat-dissipating surface 112 and each pin 21.

Referring to fig. 4, the fin of the liquid-immersed cooling heat source with improved surface structure according to the present application may be other than the above embodiment, wherein the porous structure 20A may be a metal mesh, specifically a copper mesh, with a mesh number greater than 65 (i.e. the gap is less than 0.2 mm), and preferably the mesh number is between 120 and 300. The metal mesh is bonded to the heat dissipating surface 112 by a diffusion welding technique (Diffusion Bonding Technology).

In one embodiment, the metal mesh grid comprises a plurality of mesh units 23, each mesh unit 23 is stacked layer by layer above the radiating surface 112, the material of each mesh unit 23 is C1100 copper mesh, the wire diameter is 0.05 millimeter (mm), the thickness is 0.1 millimeter (mm), the porosity is 50%, and the thermal conductivity is greater than 390W/mk.

Referring to fig. 5 and 6, the difference between the heat sink of the liquid-immersed cooling heat source with improved surface structure of the present embodiment and the previous embodiments is that it further includes a heat conducting plate 30 interposed between the heat dissipating surface 112 of the metal housing 10 and the porous structure 20B, wherein the heat conducting plate 30 is made of copper, aluminum, magnesium or alloys thereof. When in manufacture, the net units of the porous structure 20B are stacked layer by layer on the heat conducting plate 30, and then the heat conducting plate 30 and the porous structure 20B are combined together on the heat dissipating surface 112 of the metal housing 10.

In summary, the cooling fin of the liquid immersion cooling heat generating source with improved surface structure of the present application can achieve the expected purpose of use, and solve the defects existing in the prior art. The above-described embodiments are merely preferred embodiments for fully explaining the present application, and the scope of the present application is not limited thereto. Equivalent substitutions and modifications will occur to those skilled in the art based on the present application, and are intended to be within the scope of the present application. The protection scope of the application is subject to the claims.

Claims (10)

1. A fin for a liquid-immersed cooling heat generating source for improving a surface structure, comprising:

the metal shell is provided with a heating surface and a radiating surface formed at the back of the heating surface; and

the porous structure is arranged on the radiating surface and is provided with a plurality of gaps, and the width of each gap is less than 0.2 millimeter.

2. The fin of claim 1, wherein the gap has a width of 0.05 mm to 0.1 mm.

3. The fin for a liquid-submerged cooling heat generating source of claim 1, wherein the porous structure comprises a plurality of pins, each of the gaps being formed between any two adjacent pins.

4. A fin for a liquid-submerged cooling heat source with improved surface structure as recited in claim 3, wherein each of said pins is integrally formed with said metal shell and extends from said heat dissipating surface.

5. The surface structure-improving liquid immersion cooling heat generating source fin as claimed in claim 4, wherein each of said pins has a width or diameter of 0.2 mm or less.

6. The fin of claim 1, wherein the porous structure is a metal mesh.

7. The fin of claim 6, wherein the metal mesh is bonded to the heat dissipating surface by diffusion welding.

8. The fin of claim 6, wherein the metal mesh is a copper mesh with mesh number between 120 and 300.

9. The fin for a surface structure-modified liquid-submerged cooling heat generating source of claim 6, wherein the metal mesh comprises a plurality of mesh units, each of the mesh units being stacked on each other.

10. The fin of claim 1, further comprising a thermally conductive plate interposed between the heat dissipating surface of the metal shell and the porous structure.