CN204733507U - Radiator - Google Patents
Radiator Download PDFInfo
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- CN204733507U CN204733507U CN201520433456.7U CN201520433456U CN204733507U CN 204733507 U CN204733507 U CN 204733507U CN 201520433456 U CN201520433456 U CN 201520433456U CN 204733507 U CN204733507 U CN 204733507U
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- heat conduction
- conduction material
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Abstract
The utility model provides a kind of radiator, comprises body and heat conduction material.Body has bottom surface.Heat conduction material is configured at described bottom surface and has concavity district and surrounding zone.Described surrounding zone is around described concavity district.Described heat conduction material is less than the thickness of described heat conduction material in described surrounding zone at the thickness in described concavity district.The concavity district of the heat conduction material of the radiator that the utility model provides can contact chip and improve radiating efficiency really, therefore can adopt the body of cheap radiator and reduce costs.
Description
Technical field
The utility model relates to a kind of radiator, especially relates to a kind of radiator employing heat conduction material.
Background technology
Operation frequency at a high speed and the circuit line width constantly reduced can make the caloric value of electronic component relatively improve.Statistical result showed electronic product damage reason be mostly because temperature too high caused by, chip temperature reduces can promote operation efficiency, displays temperature is very huge for the performance of electronic correlation equipment, life-span and stability influence, therefore effective heat dissipation design can make electronic element apparatus have high-reliability, stability and the advantage in high workload life-span, also can overcome high-velocity electrons chip development restriction.The shaping radiating fin (Heat Sink) of radiator many employings aluminium extruded in past carries out heat exchange with electronic component pyrotoxin, but materials are many and processing charges is high and too expensive.
Utility model content
In view of this, the utility model provides a kind of radiator, and it can solve the problem of radiator high cost in the past.
The utility model proposes a kind of radiator, comprise body and heat conduction material.Body has bottom surface.Heat conduction material is configured at described bottom surface and has concavity district and surrounding zone.Described surrounding zone is around described concavity district.Described heat conduction material is less than the thickness of described heat conduction material in described surrounding zone at the thickness in described concavity district.
Based on above-mentioned, the concavity district of the heat conduction material of the radiator that the utility model provides can contact chip and improve radiating efficiency really, therefore can adopt the body of cheap radiator and reduce costs.
For above-mentioned feature and advantage of the present utility model can be become apparent, special embodiment below, and coordinate accompanying drawing to be described in detail below.
Accompanying drawing explanation
Fig. 1 is the top perspective view of the radiator of the utility model one embodiment;
Fig. 2 is the cutaway view of radiator when applying of Fig. 1;
Fig. 3 is the face upwarding stereogram of the radiator of Fig. 1;
Fig. 4 is the cutaway view of radiator when applying of another embodiment of the utility model.
Embodiment
Fig. 1 is the top perspective view of the radiator of the utility model one embodiment.Please refer to Fig. 1, the radiator 100 of the present embodiment comprises body 110 and heat conduction material 120.Body 110 has bottom surface S12.Heat conduction material 120 is configured at the bottom surface S12 of body 110, and heat conduction material 120 has concavity district R12 and surrounding zone R14.Surrounding zone R14 is around concavity district R12.Fig. 2 is the cutaway view of radiator when applying of Fig. 1.Please refer to Fig. 2, heat conduction material 120 is less than the thickness T2 of heat conduction material 120 in surrounding zone at the thickness T1 of concavity district R12.
From foregoing, the radiator 100 of the present embodiment have employed the heat conduction material 120 with concavity district R12.Therefore, not only the concavity district R12 of heat conduction material 120 can contact chip 52 and dispelling the heat to it really, the surrounding zone R14 of heat conduction material 120 also can the other loading plate 54 of contact chip 52 and dispelling the heat to it, improves the radiating efficiency of the entirety of radiator 100.Thus, radiator 100 just can adopt lower-cost body 110, and still meet the radiating requirements of chip 52 and promote operation efficiency, making chip 52 have high-reliability, stability and the advantage in high workload life-span, also can overcome high-velocity electrons chip development restriction.
Below illustrate that other selectivity of the present utility model design, but the utility model is not limited to this.Continue referring to Fig. 2, in the present embodiment, the degree of depth D of the concavity district R12 of heat conduction material 120 equals the height H of chip 52 on loading plate 54.Therefore, during the concavity district R12 contact chip 52 of heat conduction material 120, the surrounding zone R14 of heat conduction material 120 also just can the other loading plate 54 of contact chip 52.Heat conduction material 120 comprises phase-transition material (phase change material) layer 122 and soft heat conductive pad (softthermal pad) 124.Phase-change material layer 122 is configured at the bottom surface S12 of body 110 and is positioned at concavity district R12.Soft heat conductive pad 124 is configured at the bottom surface S12 of body 110 and is positioned at surrounding zone R14.The thickness of phase-change material layer 122 is T1, and the thickness of soft heat conductive pad 124 is T2, and phase-change material layer 122 equals the degree of depth D of concavity district R12 with the thickness difference (T2-T1) of soft heat conductive pad 124.The material behavior of phase-change material layer 122 makes phase-change material layer 122 below predetermined temperature for solid-state, and will present the state of shaping when the temperature of phase-change material layer 122 exceedes predetermined temperature Temporal variation material layer 122.Therefore, when the temperature of chip 52 is too high, the phase-change material layer 122 of the state of shaping will well fit in the surface of chip 52 and provide preferably radiating efficiency.On the other hand, the thickness being positioned at the soft heat conductive pad 124 of surrounding zone R14 also makes it just can the other loading plate 54 of contact chip 52.Even, even if the other loading plate 54 of chip 52 is provided with the passive component of electric capacity and so on and uneven, deformable soft heat conductive pad 124 still can well be fitted loading plate 54.Therefore, the heat conduction material 120 of the present embodiment can provide good radiating effect.In addition, continue referring to Fig. 2, in the present embodiment, the shape of the periphery of surrounding zone R14 and concavity district R12 is all roughly be square, and two diagonal L 14 of two diagonal L 12 corresponding overlapping perimeters district R14 of concavity district R12.In other words, the surrounding zone R14 of the present embodiment is roughly in " returning " font.
Fig. 3 is the face upwarding stereogram of the radiator of Fig. 1.Please refer to Fig. 3, in the present embodiment, body 110 is single piece of sheet metal of the homogeneous thickness through bending.In other words, as long as single piece of sheet metal just can form the body 110 of the present embodiment through suitable bending, aluminium extruded processing procedure or the higher processing procedure of other costs need not be used.The material of body 110 can be aluminium alloy, and quality is light and the coefficient of heat conduction is high.The body 110 of the present embodiment has base plate 112 and multiple side plate 114.Base plate 112 has bottom surface S12 (being marked on Fig. 1).Side plate 114 is vertically connected at the edge of base plate 112 and extends towards the direction away from bottom surface S12.Therefore, heat, after have received the heat of chip 52 of Fig. 2, can be taken to direction away from chip 52 and dissipation by side plate 114 by base plate 112.In addition, the side plate 114 of the present embodiment has multiple perforate 114A, and perforate 114A can reduce the electromagnetic wave that body 110 gives off, and reduces the electromagnetic interference (EMI) that when chip 52 operates, body 110 produces other assemblies.In addition, the surface of body 110 can be coated with thermal radiation paint, with further improving heat radiation efficiency.Such as, moreover heat conduction material 120 is between 0.2mm and 0.3mm at the thickness (the thickness T1 of the phase-change material layer 122 in such as Fig. 2) of concavity district R12,0.25mm.Heat conduction material 120 is between 0.8mm and 1.2mm at the thickness (the thickness T2 of the soft heat conductive pad 124 in such as Fig. 2) of surrounding zone R14, such as 1mm.The radiator 100 of the present embodiment also comprises night bolt 130, runs through body 110.Night bolt 130 in order to body 110 is fixed on other objects, be such as Fig. 2 the circuit board (not shown) at loading plate 54 place on.
Fig. 4 is the cutaway view of radiator when applying of another embodiment of the utility model.Please refer to Fig. 4, the radiator 200 of the present embodiment is similar to the radiator 100 of Fig. 2, and with same reference numerals mark same components, only introduces both difference places at this.The heat conduction material 220 of the radiator 200 of the present embodiment comprises the first soft heat conductive pad 222 and the second soft heat conductive pad 224.First soft heat conductive pad 222 is configured at bottom surface S12 and is positioned at concavity district R12 and surrounding zone R14.Second soft heat conductive pad 224 to be configured on the first soft heat conductive pad 222 and to be positioned at surrounding zone R14.The thickness T3 of the second soft heat conductive pad 224 equals the degree of depth D in concavity district.The heat conduction material 220 of the present embodiment has concavity district R12 equally, can contact chip 52 is other with chip 52 really loading plate 54 and dispelling the heat to it, the radiating efficiency of the entirety of heat radiation device 200.
To sum up, in radiator of the present utility model, heat conduction material being provided with has concavity district and the surrounding zone of offset, can contact chip and chip are other really loading plate and improve radiating efficiency.Therefore, radiator does not need use expensive body and can reduce costs.
Last it is noted that above each example is only in order to illustrate the technical solution of the utility model, be not intended to limit; Although be described in detail the utility model with reference to aforementioned each example, those of ordinary skill in the art is to be understood that: it still can be modified to the technical scheme described in aforementioned each example, or carries out equivalent replacement to wherein some or all of technical characteristic; And these amendments or replacement, do not make the essence of appropriate technical solution depart from the scope of each case technology scheme of the utility model.
Claims (10)
1. a radiator, is characterized in that, comprising:
Body, has bottom surface; And
Heat conduction material, is configured at described bottom surface and has concavity district and surrounding zone, and wherein said surrounding zone is around described concavity district, and described heat conduction material is less than the thickness of described heat conduction material in described surrounding zone at the thickness in described concavity district.
2. radiator according to claim 1, is characterized in that, described heat conduction material comprises:
Phase-change material layer, is configured at described bottom surface and is positioned at described concavity district; And
Soft heat conductive pad, is configured at described bottom surface and is positioned at described surrounding zone, and the thickness difference of wherein said phase-change material layer and described soft heat conductive pad equals the degree of depth in described concavity district.
3. radiator according to claim 1, is characterized in that, described heat conduction material comprises:
First soft heat conductive pad, is configured at described bottom surface and is positioned at described concavity district and described surrounding zone; And
Second soft heat conductive pad, being configured on described first soft heat conductive pad and being positioned at described surrounding zone, the thickness of wherein said second soft heat conductive pad equals the degree of depth in described concavity district.
4. radiator according to claim 1, is characterized in that, described body is the single piece of sheet metal of the homogeneous thickness through bending.
5. radiator according to claim 4, is characterized in that, described body has base plate and multiple side plate, and wherein said base plate has described bottom surface, and described side plate is vertically connected at the edge of described base plate and extends towards the direction away from described bottom surface.
6. radiator according to claim 5, is characterized in that, described side plate has multiple perforate.
7. radiator according to claim 1, is characterized in that, also comprises night bolt, runs through described body.
8. radiator according to claim 1, is characterized in that, the surface coverage of described body has thermal radiation paint.
9. radiator according to claim 1, is characterized in that, described heat conduction material is between 0.2mm and 0.3mm at the thickness in described concavity district, and described heat conduction material is between 0.8mm and 1.2mm at the thickness of described surrounding zone.
10. radiator according to claim 1, is characterized in that, the shape of the periphery in described surrounding zone and described concavity district is all square, and two diagonal of the corresponding overlapping described surrounding zone of two diagonal in described concavity district.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520433456.7U CN204733507U (en) | 2015-06-23 | 2015-06-23 | Radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520433456.7U CN204733507U (en) | 2015-06-23 | 2015-06-23 | Radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204733507U true CN204733507U (en) | 2015-10-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520433456.7U Active CN204733507U (en) | 2015-06-23 | 2015-06-23 | Radiator |
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| Country | Link |
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| CN (1) | CN204733507U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108075531A (en) * | 2016-11-18 | 2018-05-25 | 天津嘉深保科技发展有限公司 | A kind of conference service charger |
-
2015
- 2015-06-23 CN CN201520433456.7U patent/CN204733507U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108075531A (en) * | 2016-11-18 | 2018-05-25 | 天津嘉深保科技发展有限公司 | A kind of conference service charger |
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| C14 | Grant of patent or utility model | ||
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