CN108878410B - Surface-mounted rectifying semiconductor device - Google Patents
Surface-mounted rectifying semiconductor device Download PDFInfo
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- CN108878410B CN108878410B CN201810425029.2A CN201810425029A CN108878410B CN 108878410 B CN108878410 B CN 108878410B CN 201810425029 A CN201810425029 A CN 201810425029A CN 108878410 B CN108878410 B CN 108878410B
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- metal substrate
- diode chip
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to a surface-mounted rectifying semiconductor device, wherein the positive end of a first diode chip is electrically connected with the upper surface of a first metal substrate, the two ends of a first connecting sheet are respectively electrically connected with the negative end of the first diode chip and the upper surface of a negative metal strip, the two ends of a third connecting sheet are respectively electrically connected with the negative end of a fourth diode chip and the upper surface of the negative metal strip, the first, second, third and fourth connecting sheets are arranged in parallel along the front-back direction, the front end of the negative metal strip, which is positioned between the first metal substrate and an E-shaped metal substrate, is provided with a bending part, and the bottom of the bending part and the bottoms of the first, second metal substrates and the E-shaped metal substrate are positioned on the same horizontal plane and are all exposed out of an epoxy packaging body. The surface-mounted rectifying semiconductor device avoids the convection heat dissipation of the existing product through the air in the case, the heat generated by the chip can be conducted to the outside air only through epoxy, the heat dissipation path between the chip and the PCB is shortest, and the heat conductivity coefficient is superior.
Description
Technical Field
The present disclosure relates to rectifying semiconductor devices, and particularly to a surface mount type rectifying semiconductor device.
Background
The rectifier is a bridge structure composed of four rectifier diodes, and rectifies alternating current by utilizing the unidirectional conductive characteristic of the diodes, and because the utilization efficiency of the bridge rectifier to input sine waves is twice higher than that of half-wave rectification, the bridge rectifier is a remarkable improvement of the half-wave rectification of the diodes, and is widely applied to circuits for converting alternating current into direct current.
On the one hand, the existing double-row laminated structure rectifier is simple in production process and easy to operate. However, the flatness of the supporting chip of each diode die affects each other, which results in unstable internal stress condition of the product during the manufacturing process, and sometimes causes the die to be damaged or have poor contact. On the other hand, the existing products are 4 independent diodes (figure 1) or plug-in bridge rectifier products (figure 2) or micro bridge rectifier products. The following disadvantages mainly exist: 4 independent diodes: the product has large thickness, occupies larger space of the PCB and is not suitable for being welded in a reflow soldering mode. In-line bridge product: the product has large thickness and poor heat dissipation performance, and is not suitable for being welded in a reflow soldering mode. The miniature bridge rectifier product is free of radiating fins, and customers expect that the product can have better radiating performance. In conclusion, the prior art has the defects of large product thickness, large occupied PCB space and unsuitability for the miniaturization requirement of a terminal product; the heat dissipation performance of the product is not good, so that the terminal product has large heat productivity and is not beneficial to energy conservation and environmental protection; the whole PCB needs to be heated for the second time when other products on the PCB need to be welded by a reflow soldering method, and the assembled device is damaged.
Disclosure of Invention
The invention aims to provide a surface-mounted rectifying semiconductor device which is thin, the heat dissipation path between a chip and a PCB is shortest, a heat dissipation sheet is made of metal, the heat conductivity coefficient is superior, the self heat dissipation capacity of the PCB is fully utilized, and the defects that the heat dissipation of the existing product is realized by air convection in a case, the chip is heated and can be conducted to the outside air through epoxy, the epoxy heat conduction capacity is poor and the like are overcome.
In order to achieve the purpose, the invention adopts the technical scheme that: a surface mount rectifying semiconductor device comprising: the LED chip comprises a first diode chip, a second diode chip, a third diode chip, a fourth diode chip and a negative metal strip, wherein the first diode chip, the second diode chip, the third diode chip and the fourth diode chip are wrapped by an epoxy packaging body;
the anode end of the first diode chip is electrically connected with the upper surface of the first metal substrate, the cathode end of the second diode chip is electrically connected with the upper surface of one end of the E-shaped metal substrate, the cathode end of the third diode chip is electrically connected with the upper surface of the other end of the E-shaped metal substrate, and the anode end of the fourth diode chip is electrically connected with the upper surface of the second metal substrate;
two ends of the first connecting sheet are respectively and electrically connected with the negative end of the first diode chip and the upper surface of the negative metal strip, two ends of the second connecting sheet are respectively and electrically connected with the positive end of the second diode chip and the upper surface of the first metal substrate, the middle part of the second connecting sheet is provided with a bulge, and the bulge is isolated from the negative metal strip through an epoxy packaging body;
two ends of the third connecting sheet are respectively and electrically connected with the negative electrode end of the fourth diode chip and the upper surface of the negative electrode metal strip, and two ends of the fourth connecting sheet are respectively and electrically connected with the positive electrode end of the third diode chip and the upper surface of the second metal substrate;
the first connecting sheet, the second connecting sheet, the third connecting sheet and the fourth connecting sheet are arranged in parallel along the front-back direction, the front end of the negative metal strip, which is positioned between the first metal substrate and the E-shaped metal substrate, is provided with a bending part, and the bottom of the bending part and the bottoms of the first metal substrate, the second metal substrate and the E-shaped metal substrate are positioned on the same horizontal plane and are exposed out of the epoxy packaging body;
the first metal substrate and the second metal substrate are used as alternating current input ends, the bent part of the negative electrode metal strip is used as a direct current negative electrode end, and the E-shaped metal substrate is used as a direct current positive electrode end;
the thickness of the epoxy packaging body is smaller than 2mm, and the end faces, located at the edge of the epoxy packaging body, of the first metal substrate and the second metal substrate are respectively provided with at least 2 first pin outer convex parts.
Due to the application of the technical scheme, compared with the prior art, the invention has the following advantages and effects:
1. the invention relates to a surface-mounted rectifying semiconductor device, which is a double-sided package relative to the existing micro bridge stack product, and is a single-sided package in the thickness direction, the thickness of the product is thin, the thickness of the product is more than 5mm and is adjusted within 2mm, the product is used as a radiating fin and also used as a first metal substrate, a second metal substrate and an E-shaped metal substrate of an electric terminal, the upper surface of the product is connected with a chip, the lower surface of the product is connected with a PCB (printed circuit board) when a client uses the product, the chip is a heating component, the radiating path of the chip and the PCB is shortest, the radiating fin is made of metal materials, the heat conductivity coefficient is superior, the self heat dissipation capability of the PCB is fully utilized, the defects that the existing product can dissipate heat through air convection in a case, the heat generated.
2. The invention is a surface-mounted product, which is suitable for the welding of advanced reflow soldering mode, the product uses the original internal structure, four connecting sheets bridge across a lead, the layout makes the distance between 4 chips farthest, the four heating mutual accumulation effect minimum design and the brand-new pad appearance design, the first and second metal substrates and the E-shaped metal substrate adopt the E-shaped design, the proportion of the area of the radiating fin and the area of the long x width of the product reaches 50%, and the PCB heat-radiating capacity is utilized to the maximum extent.
Drawings
FIG. 1 is a schematic structural diagram of a conventional axial product;
FIG. 2 is a schematic diagram of a conventional in-line bridge stack;
FIG. 3 is a schematic structural view of a surface-mount rectifying semiconductor device according to the present invention;
FIG. 4 is a schematic view of the rotated structure of FIG. 3;
FIG. 5 is a schematic view of the cross-sectional structure A-A of FIG. 3;
fig. 6 is a schematic view of the sectional structure B-B of fig. 3.
In the above drawings: 1. an epoxy package; 2. a first diode chip; 3. a second diode chip; 4. a third diode chip; 5. a fourth diode chip; 6. a negative electrode metal strip; 7. a first metal substrate; 8. a second metal substrate; 9. an E-shaped metal substrate; 10. a first connecting piece; 11. a second connecting sheet; 111. a boss portion; 12. a third connecting sheet; 13. a fourth connecting sheet; 14. a bending part; 15. a first pin outer convex part; 16. and a second pin bulge.
Detailed Description
The invention is further described with reference to the following figures and examples:
example (b): a surface mount rectifying semiconductor device comprising: the LED chip comprises a first diode chip, a second diode chip, a third diode chip, a fourth diode chip and a cathode metal strip 6, wherein the first diode chip, the second diode chip, the third diode chip and the fourth diode chip are wrapped by an epoxy packaging body 1, the bottom of the epoxy packaging body 1, the left side and the right side of the epoxy packaging body are respectively fixedly provided with a first metal substrate 7, a second metal substrate 8 and an E-shaped metal substrate 9, and the cathode metal strip 6 is positioned between the first metal substrate 7, the second metal substrate 8 and the E-shaped metal substrate 9;
the anode end of the first diode chip 2 is electrically connected with the upper surface of the first metal substrate 7, the cathode end of the second diode chip 3 is electrically connected with the upper surface of one end of the E-shaped metal substrate 9, the cathode end of the third diode chip 4 is electrically connected with the upper surface of the other end of the E-shaped metal substrate 9, and the anode end of the fourth diode chip 5 is electrically connected with the upper surface of the second metal substrate 8;
two ends of the first connecting sheet 10 are respectively and electrically connected with the cathode end of the first diode chip 2 and the upper surface of the cathode metal strip 6, two ends of the second connecting sheet 11 are respectively and electrically connected with the anode end of the second diode chip 3 and the upper surface of the first metal substrate 7, the middle part of the second connecting sheet 11 is provided with a convex part 111, and the convex part 111 is isolated from the cathode metal strip 6 through the epoxy packaging body 1;
two ends of a third connecting sheet 12 are respectively and electrically connected with the cathode end of the fourth diode chip 5 and the upper surface of the cathode metal strip 6, and two ends of a fourth connecting sheet 13 are respectively and electrically connected with the anode end of the third diode chip 4 and the upper surface of the second metal substrate 8;
the first connecting sheet, the second connecting sheet, the third connecting sheet and the fourth connecting sheet 10, 11, 12 and 13 are arranged in parallel along the front-back direction, the front end of the negative metal strip 6, which is positioned between the first metal substrate 7 and the E-shaped metal substrate 9, is provided with a bending part 14, and the bottom of the bending part 14 and the bottoms of the first metal substrate 7, the second metal substrate 8 and the E-shaped metal substrate 9 are positioned on the same horizontal plane and are exposed out of the epoxy packaging body 1;
the first and second metal substrates 7 and 8 are used as alternating current input ends, the bent part 14 of the negative electrode metal strip 6 is used as a direct current negative electrode end, and the E-shaped metal substrate 9 is used as a direct current positive electrode end.
The thickness of the epoxy package 1 is less than 2 mm.
The end faces of the first and second metal substrates 7 and 8 at the edge of the epoxy package 1 are respectively provided with at least 2 first pin outward protrusions 15.
The end face of the E-shaped metal substrate 9 at the edge of the epoxy package 1 is provided with 4 second pin projections 16.
When the surface-mounted rectifying semiconductor device is adopted, the surface-mounted rectifying semiconductor device is packaged on two sides relative to the existing miniature bridge rectifier product, the surface-mounted rectifying semiconductor device is packaged on one side in the thickness direction, the thickness of the product is thin, the thickness of the product is adjusted to be within 2mm, the product is used as a radiating fin and also used as a first metal substrate, a second metal substrate and an E-shaped metal substrate of an electric terminal, the upper surface of the product is connected with a chip, the lower surface of the product is connected with a PCB (printed circuit board) used by a client, the chip is a heating component, the radiating path of the chip and the PCB is shortest, the radiating fin is made of metal materials, the heat conductivity coefficient is superior, the self heat dissipation capacity of the PCB is fully utilized, the defects that the existing product is subjected to heat dissipation through air convection in a case; secondly, the product is a surface mounting product and is suitable for welding in a more advanced reflow soldering mode, the product uses an original internal structure, four connecting sheets bridge across one lead to realize bridging, the layout enables the distance between 4 chips to be farthest, the four heating mutual accumulation effect is the lowest and the appearance of a brand new pad is designed, the first metal substrate, the second metal substrate and the E-shaped metal substrate adopt an E-shaped design, the proportion of the area of the radiating fin to the area of the product length x width reaches 50%, and the radiating capacity of the PCB is utilized to the maximum extent.
The above embodiments are merely illustrative of the technical ideas and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.
Claims (1)
1. A surface-mounted rectifying semiconductor device is characterized in that: the method comprises the following steps: the LED chip comprises a first diode chip, a second diode chip, a third diode chip, a fourth diode chip (2, 3, 4 and 5) and a negative electrode metal strip (6), wherein the first diode chip, the second diode chip, the third diode chip and the fourth diode chip are wrapped by an epoxy packaging body (1), the first metal substrate, the second metal substrate (7 and 8) and an E-shaped metal substrate (9) are respectively fixed at the bottom, the left side and the right side of the epoxy packaging body (1), and the negative electrode metal strip (6) is positioned between the first metal substrate, the second metal substrate (7 and 8) and the E-shaped metal substrate (9);
the anode end of the first diode chip (2) is electrically connected with the upper surface of the first metal substrate (7), the cathode end of the second diode chip (3) is electrically connected with the upper surface of one end of the E-shaped metal substrate (9), the cathode end of the third diode chip (4) is electrically connected with the upper surface of the other end of the E-shaped metal substrate (9), and the anode end of the fourth diode chip (5) is electrically connected with the upper surface of the second metal substrate (8);
two ends of the first connecting sheet (10) are respectively and electrically connected with the negative end of the first diode chip (2) and the upper surface of the negative metal strip (6), two ends of the second connecting sheet (11) are respectively and electrically connected with the positive end of the second diode chip (3) and the upper surface of the first metal substrate (7), the middle part of the second connecting sheet (11) is provided with a bulge part (111), and the bulge part (111) is isolated from the negative metal strip (6) through the epoxy packaging body (1);
two ends of a third connecting sheet (12) are respectively and electrically connected with the negative end of the fourth diode chip (5) and the upper surface of the negative metal strip (6), and two ends of a fourth connecting sheet (13) are respectively and electrically connected with the positive end of the third diode chip (4) and the upper surface of the second metal substrate (8);
the first connecting sheet, the second connecting sheet, the third connecting sheet and the fourth connecting sheet (10, 11, 12 and 13) are arranged in parallel along the front-back direction, the front end of the negative metal strip (6) between the first metal substrate (7) and the E-shaped metal substrate (9) is provided with a bending part (14), and the bottom of the bending part (14) and the bottoms of the first metal substrate, the second metal substrate (7 and 8) and the E-shaped metal substrate (9) are positioned on the same horizontal plane and are exposed out of the epoxy packaging body (1);
the first metal substrate and the second metal substrate (7 and 8) are used as alternating current input ends, the bent part (14) of the negative electrode metal strip (6) is used as a direct current negative electrode end, and the E-shaped metal substrate (9) is used as a direct current positive electrode end;
the thickness of the epoxy packaging body (1) is smaller than 2mm, and the end faces, located at the edge of the epoxy packaging body (1), of the first metal substrate and the second metal substrate (7 and 8) are respectively provided with at least 2 first pin outward-protruding parts (15).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810425029.2A CN108878410B (en) | 2015-10-08 | 2015-10-08 | Surface-mounted rectifying semiconductor device |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810425029.2A CN108878410B (en) | 2015-10-08 | 2015-10-08 | Surface-mounted rectifying semiconductor device |
| CN201510644442.4A CN105185757B (en) | 2015-10-08 | 2015-10-08 | Heat radiating fin structure surface mount rectifier bridge device |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510644442.4A Division CN105185757B (en) | 2015-10-08 | 2015-10-08 | Heat radiating fin structure surface mount rectifier bridge device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108878410A CN108878410A (en) | 2018-11-23 |
| CN108878410B true CN108878410B (en) | 2020-05-22 |
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Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810424994.8A Pending CN108807302A (en) | 2015-10-08 | 2015-10-08 | Rectifying bridge type semiconductor devices |
| CN201810425029.2A Active CN108878410B (en) | 2015-10-08 | 2015-10-08 | Surface-mounted rectifying semiconductor device |
| CN201510644442.4A Active CN105185757B (en) | 2015-10-08 | 2015-10-08 | Heat radiating fin structure surface mount rectifier bridge device |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201810424994.8A Pending CN108807302A (en) | 2015-10-08 | 2015-10-08 | Rectifying bridge type semiconductor devices |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510644442.4A Active CN105185757B (en) | 2015-10-08 | 2015-10-08 | Heat radiating fin structure surface mount rectifier bridge device |
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| Country | Link |
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| CN (3) | CN108807302A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106449537A (en) * | 2016-03-25 | 2017-02-22 | 苏州固锝电子股份有限公司 | Heat-radiation-fin-structured ultrathin surface-mounted rectifier bridge device |
| CN205911308U (en) * | 2016-08-05 | 2017-01-25 | 苏州固锝电子股份有限公司 | Compact design type rectifier bridge structure |
| CN108766947B (en) * | 2018-07-26 | 2024-01-26 | 苏州固锝电子股份有限公司 | Power device with heat dissipation function |
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| CN101373932A (en) * | 2007-08-25 | 2009-02-25 | 绍兴旭昌科技企业有限公司 | Miniature surface-pasted single-phase full wave bridge rectifier and manufacturing method thereof |
| CN201681826U (en) * | 2010-05-11 | 2010-12-22 | 苏州固锝电子股份有限公司 | Surface mounted rectifier applied in circuit board |
| CN102931174A (en) * | 2012-10-30 | 2013-02-13 | 南通康比电子有限公司 | Miniature type surface mounting single-phase full-wave bridge rectifier and manufacturing method of rectifier |
| CN103401438A (en) * | 2013-08-13 | 2013-11-20 | 苏州工业园区凯众通微电子技术有限公司 | Novel surface-mounted bridge-type rectifier and manufacturing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5339218A (en) * | 1993-05-20 | 1994-08-16 | Microsemi Corporation | Surface mount device |
| JP2006229030A (en) * | 2005-02-18 | 2006-08-31 | Rohm Co Ltd | Lead frame and semiconductor device using same |
| CN2901580Y (en) * | 2006-02-24 | 2007-05-16 | 梁锦荣 | Single row direct insert full wave rectifier bridge stack |
| CN201515315U (en) * | 2009-09-24 | 2010-06-23 | 南通康比电子有限公司 | DF framework of bridge rectifier |
| CN201752002U (en) * | 2010-07-02 | 2011-02-23 | 重庆平伟实业股份有限公司 | Thin type bridge rectifier |
| CN202406037U (en) * | 2011-12-01 | 2012-08-29 | 重庆平伟实业股份有限公司 | Novel SMD (surface-mounted device) type rectifier bridge without pins |
| CN203871317U (en) * | 2014-05-21 | 2014-10-08 | 常州银河世纪微电子有限公司 | Structure of bridge rectifier |
| CN204966478U (en) * | 2015-10-08 | 2016-01-13 | 苏州固锝电子股份有限公司 | Cooling fin structure surface mounting rectifier bridge device |
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2015
- 2015-10-08 CN CN201810424994.8A patent/CN108807302A/en active Pending
- 2015-10-08 CN CN201810425029.2A patent/CN108878410B/en active Active
- 2015-10-08 CN CN201510644442.4A patent/CN105185757B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101373932A (en) * | 2007-08-25 | 2009-02-25 | 绍兴旭昌科技企业有限公司 | Miniature surface-pasted single-phase full wave bridge rectifier and manufacturing method thereof |
| CN201681826U (en) * | 2010-05-11 | 2010-12-22 | 苏州固锝电子股份有限公司 | Surface mounted rectifier applied in circuit board |
| CN102931174A (en) * | 2012-10-30 | 2013-02-13 | 南通康比电子有限公司 | Miniature type surface mounting single-phase full-wave bridge rectifier and manufacturing method of rectifier |
| CN103401438A (en) * | 2013-08-13 | 2013-11-20 | 苏州工业园区凯众通微电子技术有限公司 | Novel surface-mounted bridge-type rectifier and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108807302A (en) | 2018-11-13 |
| CN105185757A (en) | 2015-12-23 |
| CN105185757B (en) | 2018-06-29 |
| CN108878410A (en) | 2018-11-23 |
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