CN201681826U - Surface mounted rectifier applied in circuit board - Google Patents
Surface mounted rectifier applied in circuit board Download PDFInfo
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- CN201681826U CN201681826U CN2010201852557U CN201020185255U CN201681826U CN 201681826 U CN201681826 U CN 201681826U CN 2010201852557 U CN2010201852557 U CN 2010201852557U CN 201020185255 U CN201020185255 U CN 201020185255U CN 201681826 U CN201681826 U CN 201681826U
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- lead frame
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- diode chip
- rectifier
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Abstract
A surface mounted rectifier applied in a circuit board comprises a first lead frame, a second lead frame, a connecting piece and a diode chip, wherein one end of the first lead frame is a supporting area connected with the diode chip, a Z-shaped first pin is arranged at the other end of the first lead frame, the high mesa end of the Z-shaped first pin is connected with one end of the supporting area, the low mesa end of the Z-shaped first pin serves as the current transfer terminal of the rectifier; one end of the second lead frame is a L-shaped contact area, and the L-shaped contact area and the supporting area of the first lead frame are distributed in an embedded way; the connecting piece spans between the L-shaped contact area end and the diode chip. The utility model improves the insulating property of the rectifier and reduces the usage amount of epoxy resin and copper material.
Description
Technical field
The utility model relates to a kind of rectifier, relates in particular to a kind of surface-adhered type rectifier that is applied to circuit board.
Background technology
The surface-adhered type rectifier utilizes the unilateal conduction characteristic of diode that alternating current is carried out rectification, is widely used in alternating current and converts in the galvanic circuit.Along with electronic devices and components develop towards light, thin, short, little direction, especially the extensive use of integrated circuit, the surface-adhered type rectifier more and more possesses competitive advantage, specifically can be summarized as follows: 1, packaging density height, electronic product volume are little, in light weight, and the volume and weight of surface mount elements has only about 1/10 of traditional inserting element; 2, reliability height, shock resistance are strong.The welding point defect rate is low; 3, high frequency characteristics is good.Electromagnetism and radio frequency interference have been reduced; 4, can realize full-automatic production, product with stable quality.
Owing to during rectifier work, can produce a large amount of heats.And if rectifier diode chip itself is overheated, can influence the performance of its rectification efficiency.Therefore, when designing new rectifying device, will be towards the direction effort of slimming.But consider simultaneously rectifying device and circuit board again, i.e. pcb board, insulation property.When insulation property are relatively poor, rectifying device and circuit board can appear, i.e. pcb board, the possibility of a discharge.And the pin of existing surface-adhered type rectifier is positioned at the bottom of packaging body, direct and circuit board, and promptly pcb board contacts, and insulation property are relatively poor.There are rectifying device and circuit board, i.e. pcb board, the possibility of discharge.So novel design will be put forth effort on this, avoid the generation of this type of thing.
Secondly, the use amount of surface-adhered type rectifier copper material and epoxy resin is bigger, causes the waste of a large amount of copper materials and epoxy resin, is unfavorable for the protection of environment.
Therefore improve the insulation property of existing surface-adhered type rectifier and reduce epoxy resin and the use amount of copper material is the problem of the utility model research.
Summary of the invention
The utility model provides a kind of surface-adhered type rectifier that is applied to circuit board, and this surface-adhered type rectifier has improved the insulation property of rectifier and reduced the use amount of epoxy resin and copper material.
For achieving the above object, the technical solution adopted in the utility model is: a kind of surface-adhered type rectifier that is applied to circuit board, comprise: first lead frame, second lead frame, brace, a diode chip for backlight unit are formed, this first lead frame, one end is the Support that is connected with diode chip for backlight unit, the first lead frame other end is provided with " Z " shape first pin, high table top one end that is somebody's turn to do " Z " shape first pin is connected with an end of described Support, and low table one end of " Z " shape first pin is as the current delivery end of described rectifier; Described second lead frame, one end is " L " shape contact zone, arranges in the mode of embedding mutually with the Support of first lead frame in " L " shape contact zone, and brace is inclined cross between " L " shape contact zone one end and the diode chip for backlight unit other end; The described second lead frame other end is provided with " Z " shape second pin, and high table top one end that is somebody's turn to do " Z " shape second pin is connected with an end of described " L " shape contact zone, and low table one end of " Z " shape second pin is as the current delivery end of described rectifier; Described Support, brace, diode chip for backlight unit and " L " shape contact zone are positioned at epoxy packages body inside.
Because the technique scheme utilization, the utility model compared with prior art has following advantage:
The utility model has overcome shortcomings such as existing surface-adhered type rectifier insulation property are relatively poor, volume is big, raw material consumption height.Arrange in the mode of embedding mutually with the Support of first lead frame in the utility model " L " shape contact zone, brace is inclined cross between " L " shape contact zone one end and diode chip for backlight unit, thereby the use amount that has reduced surface-adhered type rectifier volume and copper material and epoxy resin significantly reduces; The use amount that next adopts " Z " shape pin to improve the insulation property of rectifier and reduced solder(ing) paste, more environmental protection; Once more, this rectifier does not change existing installation method, and therefore need not circuit board is that pcb board is done any change.
Description of drawings
Accompanying drawing 3 is the right view of accompanying drawing 2.
In the above accompanying drawing: 1, first lead frame; 2, second lead frame; 3, brace; 4, diode chip for backlight unit; 5, Support; 6, " Z " shape first pin; 7, " L " shape contact zone; 8, " Z " shape second pin.
Embodiment
Below in conjunction with drawings and Examples the utility model is further described:
Embodiment: a kind of surface-adhered type rectifier that is applied to circuit board, comprise: first lead frame 1, second lead frame 2, brace 3, a diode chip for backlight unit 4 are formed, these first lead frame, 1 one ends are the Support 5 that are connected with diode chip for backlight unit 4, first lead frame, 1 other end is provided with " Z " shape first pin 6, high table top one end that is somebody's turn to do " Z " shape first pin 6 is connected with an end of described Support 5, and low table one end of " Z " shape first pin 6 is as the current delivery end of described rectifier; Described second lead frame, 2 one ends are " L " shape contact zones 7, arrange in the mode of embedding mutually with the Support 5 of first lead frame 1 in " L " shape contact zone 7, and brace 3 is inclined cross between " L " shape contact zone 7 one ends and diode chip for backlight unit 4 other ends; Described second lead frame, 2 other ends are provided with " Z " shape second pin 8, and high table top one end that is somebody's turn to do " Z " shape second pin 8 is connected with an end of described " L " shape contact zone 7, and low table one end of " Z " shape second pin 8 is as the current delivery end of described rectifier;
Described Support 5, brace 3, diode chip for backlight unit 4 and " L " shape contact zone 7 are positioned at epoxy packages body inside.
The foregoing description only is explanation technical conceive of the present utility model and characteristics, and its purpose is to allow the personage who is familiar with this technology can understand content of the present utility model and enforcement according to this, can not limit protection range of the present utility model with this.All equivalences of being done according to the utility model spirit change or modify, and all should be encompassed within the protection range of the present utility model.
Claims (1)
1. surface-adhered type rectifier that is applied to circuit board, comprise: first lead frame (1), second lead frame (2), a diode chip for backlight unit (4) are formed, this first lead frame (1) one end is the Support (5) that is connected with diode chip for backlight unit (4), it is characterized in that: first lead frame (1) other end is provided with " Z " shape first pin (6), high table top one end that is somebody's turn to do " Z " shape first pin (6) is connected with an end of described Support (5), and low table one end of " Z " shape first pin (6) is as the current delivery end of described rectifier; Described second lead frame (2) one ends are " L " shape contact zones (7), arrange in the mode of embedding mutually with the Support (5) of first lead frame (1) in " L " shape contact zone (7), a brace (3) is inclined cross between " L " shape contact zone (7) one ends and diode chip for backlight unit (4) other end; Described second lead frame (2) other end is provided with " Z " shape second pin (8), high table top one end that is somebody's turn to do " Z " shape second pin (8) is connected with an end of described " L " shape contact zone (7), and low table one end of " Z " shape second pin (8) is as the current delivery end of described rectifier; Described Support (5), brace (3), diode chip for backlight unit (4) and " L " shape contact zone (7) are positioned at epoxy packages body inside.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN2010201852557U CN201681826U (en) | 2010-05-11 | 2010-05-11 | Surface mounted rectifier applied in circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN2010201852557U CN201681826U (en) | 2010-05-11 | 2010-05-11 | Surface mounted rectifier applied in circuit board |
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CN201681826U true CN201681826U (en) | 2010-12-22 |
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CN2010201852557U Expired - Fee Related CN201681826U (en) | 2010-05-11 | 2010-05-11 | Surface mounted rectifier applied in circuit board |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107887367A (en) * | 2015-10-08 | 2018-04-06 | 苏州固锝电子股份有限公司 | Miniature bridge heap rectifier |
CN108878410A (en) * | 2015-10-08 | 2018-11-23 | 苏州固锝电子股份有限公司 | Mounted type rectified semiconductor device |
-
2010
- 2010-05-11 CN CN2010201852557U patent/CN201681826U/en not_active Expired - Fee Related
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107887367A (en) * | 2015-10-08 | 2018-04-06 | 苏州固锝电子股份有限公司 | Miniature bridge heap rectifier |
CN107887353A (en) * | 2015-10-08 | 2018-04-06 | 苏州固锝电子股份有限公司 | High reliability rectifier bridge stack device |
CN108878410A (en) * | 2015-10-08 | 2018-11-23 | 苏州固锝电子股份有限公司 | Mounted type rectified semiconductor device |
CN107887353B (en) * | 2015-10-08 | 2020-03-24 | 苏州固锝电子股份有限公司 | High-reliability rectifier bridge stack device |
CN108878410B (en) * | 2015-10-08 | 2020-05-22 | 苏州固锝电子股份有限公司 | Surface-mounted rectifying semiconductor device |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101222 Termination date: 20180511 |
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CF01 | Termination of patent right due to non-payment of annual fee |