CN201657459U - Trigger module applied to electronic ballast - Google Patents
Trigger module applied to electronic ballast Download PDFInfo
- Publication number
- CN201657459U CN201657459U CN2010200033055U CN201020003305U CN201657459U CN 201657459 U CN201657459 U CN 201657459U CN 2010200033055 U CN2010200033055 U CN 2010200033055U CN 201020003305 U CN201020003305 U CN 201020003305U CN 201657459 U CN201657459 U CN 201657459U
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- CN
- China
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- trigger module
- metal lead
- electric ballast
- diode chip
- plastic
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Abstract
The utility model relates to an electronic element applied to an electronic ballast, in particular to a trigger module of the electronic ballast, which comprises a plastic package body, a metal lead frame and a semiconductor chip, wherein the semiconductor diode chip is arranged inside the plastic package body, and comprises a trigger diode chip and a rectifier diode chip which are respectively connected with two electronic terminals on the metal lead frame in arrangement; one part of the metal lead frame is arranged inside the plastic package body; and the other part of the metal lead frame is arranged outside the plastic package body to serve as an electronic terminal. The trigger module is specially designed for an integral energy-saving lamp electronic ballast or an independent electronic ballast, and can replace a trigger diode and a discharging diode to trigger a semi-bridge oscillation circuit in the integral energy-saving lamp or the independent electronic ballast.
Description
Technical field
The utility model relates to a kind of electronic device that is applied to electric ballast, especially relates to its trigger module.
Background technology
The considerable electric ballast of forming by discrete component, outstanding dactylus energy lamp electronic ballast, all adopted the half-bridge inverter circuit, its typical start-up circuit is formed (see figure 4) jointly by integrating circuit and discharge diode D1, diac D2 that resistance R 1, capacitor C constitute.In start-up course, when capacitor C charging reaches the breakover voltage of diac D2, the diac conducting, the electric charge on the capacitor C is injected into the base stage of the triode T2 that forms half-bridge inverter and makes its conducting through diac.At this moment, because the decline of this transistor collector voltage makes discharge diode D1 transfer positively biased to and conducting, the electric charge that stores on the electric capacity discharges rapidly by the triode T2 of discharge diode D1, conducting.The rapid reduction of the voltage on the electric capacity simultaneously causes diac to withdraw from conducting, has finished the concussion of half-bridge inverter and has set up process.Keeping by the transformer positive feedback of concussion realizes (not drawing among Fig. 4).The utility model is that diac is connected by the start-up circuit requirement with discharge diode, be integrated into one and be applied to the electric ballast of integral energy-saving lamp and the trigger module of electric ballast independently, can reduce packaging cost like this, reduce solder joint, reduce the plug-in mounting time, for use brings bigger convenience.
The utility model content
The purpose of this utility model is to provide a kind of and integrated triggers and these two kinds of functions of discharging the trigger module that is applied to electric ballast easy to use.
For achieving the above object, the technical solution of the utility model is:
Be applied to the trigger module of electric ballast, comprise plastic-sealed body, metal lead wire frame, semiconductor diode chip.Wherein the semiconductor diode chip places plastic-sealed body inside, comprises a diac chip and a rectifier diode chip, respectively with metal lead wire frame on two electrode terminals be connected setting; This metal lead wire frame part is located at plastic-sealed body inside, and a part is located at the plastic-sealed body outside and is done electrode terminal.
As further setting to technique scheme, be applied to electric ballast trigger module be shaped as plug-in type or SMD.
The connected mode of semiconductor diode chip and described metal lead wire frame is eutectic weldering, soldering, bonding, and carries out bonding by means of tinsel, more than one of several modes.
Diac chip and rectifier diode chip are in same plane.
The semiconductor diode chip is wherein a kind of of mesa passivation structure, planar structure or two-sided mesa passivation structure.
Pin number has 3 at least.
Metal lead wire frame comprises several unit, comprises 3 planar pads and corresponding 3 electrode terminals at least.
Three electrode terminals are from the middle part of described plastic-sealed body or the bottom is straight stretches out, and do not do any bending; Perhaps stretch out into gull wing type from the middle part of described plastic-sealed body.
The beneficial effects of the utility model are to be integral energy-saving lamp electronic ballast or Design of Digital Ballast independently specially, can utilize this device can replace diac and discharge diode to trigger integral energy-saving lamp or the half-bridge oscillation circuit in the electric ballast independently.Save the space, improved the reliability of ballast work.
Description of drawings
Fig. 1 is a circuit diagram of the present utility model;
Fig. 2,3,4, the 5th, several profile schematic diagrames of several embodiment of the utility model;
Fig. 6, the 7th, the internal structure schematic diagram of the utility model embodiment and a kind of schematic diagram of distressed structure;
Fig. 8 uses oscillating circuit schematic diagram of the present utility model;
Fig. 9 is a kind of profile schematic diagram-vertical view of using technical solutions of the utility model;
Figure 10 is the end view of profile schematic diagram shown in Figure 9;
Figure 11 is another kind of profile schematic diagram-vertical view of using technical solutions of the utility model;
Figure 12 is the end view of profile schematic diagram shown in Figure 11.
Embodiment
The utility model is described in further detail below in conjunction with drawings and Examples.
Referring to figs. 1 to Fig. 7, a kind of preferred embodiment that this enforcement is novel, comprise the plastic-sealed body made from insulating material 1, metal lead wire frame 2 with alloy or other metals formation, 3, two semiconductor diode chip 5a, 5b, pin, wherein pin number has 3 at least, this semiconductor diode chip 5a, 5b places plastic-sealed body 1 inside, comprise and be in a conplane diac chip and a rectifier diode chip, respectively with metal lead wire frame 2, two electrode terminals on 3 weld by eutectic, soldering, bonding, and connect setting by means of the connected mode that tinsel carries out bonding.Metal lead wire frame 2,3 parts are located at plastic-sealed body inside, and a part is located at plastic-sealed body 1 outside and is done electrode terminal; Metal lead wire frame 2,3 comprises several unit, comprises 3 planar pads and corresponding 3 electrode terminals at least, and three electrode terminals can from the middle part of described plastic-sealed body or the bottom is straight stretch out, and do not do any bending; Also can stretch out into gull wing type from the middle part of described plastic-sealed body.
Wherein, the plug-in type or SMD that is shaped as of the present utility model. Semiconductor diode chip 5a, 5b can be mesa passivation structure, planar structure, two-sided mesa passivation structure.
In addition, the utmost point of semiconductor diode chip 5a, 5b tiling setting is connected on the metal lead wire frame 2,3 one of them or two pads, the setting that links to each other with the another one pad of another utmost point; Semiconductor diode chip 5a, 5b are any one in common rectification chip, the diac chip.
Extremely shown in Figure 7 as Fig. 2, the utility model is by eutectic weldering, soldering or adhesive technology, the face of semiconductor chip 5a, 5b is connected with the pad of metal lead wire frame 2, metal lead wire frame 3 respectively, utilize Wire Bonding Technology, be connected with the pad of metal lead wire frame 3, metal lead wire frame 2 respectively by metal lead wire 4 another face with semiconductor chip 5a, 5b, semiconductor chip 5a, 5b tiling is arranged on the pad of metal lead wire frame 2, metal lead wire frame 3.
To shown in Figure 8, the device of the utility model final molding is pressed A1 corresponding A 1 ' as Fig. 1, the corresponding B1 ' of B1, and the mode of the corresponding C1 ' of C1 is connected into circuit.In start-up course, when capacitor C charging reaches the breakover voltage of diac D2 (one of them of chip 5a or 5b), diac (one of them of chip 5a or 5b) conducting, the electric charge on the capacitor C is injected into the base stage of the triode T2 that forms half-bridge inverter and makes its conducting through diac (one of them of chip 5a or 5b).At this moment, because the decline of this transistor collector voltage makes discharge diode D1 (another of chip 5a or 5b) transfer positively biased to and conducting, the electric charge that stores on the electric capacity discharges rapidly by the triode T2 of discharge diode D1 (another of chip 5a or 5b), conducting.The rapid reduction of the voltage on the electric capacity simultaneously causes diac (one of them of chip 5a or 5b) to withdraw from conducting, has finished the concussion of half-bridge inverter and has set up process.Keeping by the transformer positive feedback of concussion realizes (not drawing among Fig. 8).
The foregoing description only is explanation technical conceive of the present utility model and characteristics, and its purpose is to allow the personnel that are familiar with this technology can understand content of the present utility model and enforcement in view of the above, can not limit protection range of the present utility model with this.All equivalences of doing according to spirit of the present utility model change or modify (as Fig. 9,10,11 and 12 etc.), all should be encompassed within the protection range of the present utility model.
Claims (8)
1. be applied to the trigger module of electric ballast, comprise plastic-sealed body, metal lead wire frame and the semiconductor diode chip made with insulating material, it is characterized in that: described semiconductor diode chip places plastic-sealed body inside, it has two, comprise a diac chip and a rectifier diode chip, respectively with described metal lead wire frame on two electrode terminals be connected setting; A described metal lead wire frame part is located at plastic-sealed body inside, and a part is located at the plastic-sealed body outside and is done electrode terminal.
2. according to the described trigger module that is applied to electric ballast of claim 1, what it is characterized in that the described trigger module that is applied to electric ballast is shaped as plug-in type or SMD.
3. according to the described trigger module that is applied to electric ballast of claim 1, the connected mode that it is characterized in that described semiconductor diode chip and described metal lead wire frame is eutectic weldering, soldering, bonding, perhaps carry out bonding and connect by means of tinsel, more than one of several modes.
4. according to the described trigger module that is applied to electric ballast of claim 1, it is characterized in that described diac chip and described rectifier diode chip are in same plane.
5. according to the described trigger module that is applied to electric ballast of claim 1, it is characterized in that described semiconductor diode chip is wherein a kind of of mesa passivation structure, planar structure or two-sided mesa passivation structure.
6. according to the described trigger module that is applied to electric ballast of claim 1, it is characterized in that described pin number has 3 at least.
7. according to the described trigger module that is applied to electric ballast of claim 1, it is characterized in that described metal lead wire frame comprises several unit, comprise 3 planar pads and corresponding 3 electrode terminals at least.
8. according to claim 1 or the 7 described trigger modules that are applied to electric ballast, it is characterized in that described three electrode terminals from the middle part of described plastic-sealed body or the bottom is straight stretches out, do not do any bending; Perhaps stretch out into gull wing type from the middle part of described plastic-sealed body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010200033055U CN201657459U (en) | 2010-01-01 | 2010-01-01 | Trigger module applied to electronic ballast |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010200033055U CN201657459U (en) | 2010-01-01 | 2010-01-01 | Trigger module applied to electronic ballast |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201657459U true CN201657459U (en) | 2010-11-24 |
Family
ID=43122686
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010200033055U Expired - Lifetime CN201657459U (en) | 2010-01-01 | 2010-01-01 | Trigger module applied to electronic ballast |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201657459U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101815395A (en) * | 2010-01-01 | 2010-08-25 | 绍兴科盛电子有限公司 | Trigger module applied to electronic ballast |
-
2010
- 2010-01-01 CN CN2010200033055U patent/CN201657459U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101815395A (en) * | 2010-01-01 | 2010-08-25 | 绍兴科盛电子有限公司 | Trigger module applied to electronic ballast |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20181022 Address after: 312300 Longshan Software Park, Shaoxing Economic Development Zone, Yuecheng District, Shaoxing, Zhejiang Patentee after: ZHEJIANG MINGDE MICROELECTRONIC CO., LTD. Address before: 312000 Zhejiang science and technology building 683, Shun Jiang Road, Shaoxing 2301-2306 Patentee before: Shaoxing Kesheng Electronic Co., Ltd. |
|
| TR01 | Transfer of patent right | ||
| CX01 | Expiry of patent term |
Granted publication date: 20101124 |
|
| CX01 | Expiry of patent term |