CN201531852U - High heat conductivity LED lighting device - Google Patents

High heat conductivity LED lighting device Download PDF

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Publication number
CN201531852U
CN201531852U CN2009201788810U CN200920178881U CN201531852U CN 201531852 U CN201531852 U CN 201531852U CN 2009201788810 U CN2009201788810 U CN 2009201788810U CN 200920178881 U CN200920178881 U CN 200920178881U CN 201531852 U CN201531852 U CN 201531852U
Authority
CN
China
Prior art keywords
led
lighting device
led lighting
radiating piece
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2009201788810U
Other languages
Chinese (zh)
Inventor
熊毅伟
游之东
卢少鹏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHENZHEN BOLAITE OPTOELECTRONICS TECHNOLOGY Co Ltd
Original Assignee
SHENZHEN BOLAITE OPTOELECTRONICS TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SHENZHEN BOLAITE OPTOELECTRONICS TECHNOLOGY Co Ltd filed Critical SHENZHEN BOLAITE OPTOELECTRONICS TECHNOLOGY Co Ltd
Priority to CN2009201788810U priority Critical patent/CN201531852U/en
Application granted granted Critical
Publication of CN201531852U publication Critical patent/CN201531852U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model is suitable for the lighting field, and provides an LED lighting device. The high heat conductivity LED lighting device comprises an LED packaging body and a heat radiating piece, wherein the chassis of the LED packaging body is connected with the heat radiating piece through a metal connecting body. Since metal with better heat conductivity is used for replacing original insulators or insulation paste with bad heat conductivity, heat of LED can be transmitted outside better, and the heat radiation effect of systems is improved.

Description

A kind of high-termal conductivity LED lighting device
Technical field
The utility model belongs to lighting field, relates in particular to a kind of high-termal conductivity LED lighting device.
Background technology
The brightness of LED, power all get a promotion in recent years, begin to be used for application such as backlight and electrical lighting, and the package cooling problem of LED is also quietly appeared in one's mind.When traditional LED is fixed on the pcb board, be provided with an insulating barrier between its base and the radiating piece, be subject to the relatively poor heat conductivility of insulating barrier, the heat of LED can't be conducted well, cause the integral heat sink weak effect.
The utility model content
The purpose of this utility model is to provide a kind of LED lighting device, is intended to the problem of resolution system radiating effect difference.
The utility model is achieved in that a kind of LED lighting device, comprises LED packaging body and radiating piece, and the base of described LED packaging body is connected with described radiating piece by metal connector.
Further, described LED packaging body comprises:
Substrate;
Be fixed on the LED luminescence chip on the described substrate;
The positive and negative electrode that is connected with described LED luminescence chip;
Cover on the heat conductive silica gel package on the described LED luminescence chip;
Be positioned at the plastic stent of described substrate below;
The LED metal heat-conducting electrode that be positioned at described plastic stent below, contacts with described metal connector.
Further, described LED luminescence chip is fixed on the described substrate by silver slurry glue.
Further, described metal connector is a tin.
Further, described radiating piece is connected by pin with described metal connector.
Further, described radiating piece is connected by screw with described metal connector.
Further, described radiating piece is a metal material.
In the utility model,, make the heat of LED can better conduct to radiating piece, improved the radiating effect of system owing to use the better metal connector of heat conductivility to replace the insulator or the insulating cement of original heat conductivility difference.
Description of drawings
Fig. 1 is the structure principle chart of the LED lighting device that provides of the utility model embodiment.
The specific embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearer,, the utility model is further elaborated below in conjunction with drawings and Examples.Should be appreciated that specific embodiment described herein only in order to explanation the utility model, and be not used in qualification the utility model.
Among the utility model embodiment, a metal level is set between LED packaging body base and radiating piece, LED conducts heat by this heat conductivility preferred metal.
Fig. 1 shows the structural principle of the LED lighting device that the utility model embodiment provides, and for convenience of description, only shows the part relevant with the utility model.
With reference to Fig. 1, this LED lighting device comprises LED packaging body and the radiating piece 1 that is connected with the LED packaging body, and wherein the LED packaging body is connected with radiating piece 1 by metal connector 2.
This LED packaging body comprises LED metal heat-conducting electrode 3, silver slurry glue 4, plastic stent 5, LED luminescence chip 6, the positive electrode 7 that is connected with the LED luminescence chip, negative electrode 8, copper-foil conducting electricity 9, insulating barrier 10, heat conductive silica gel package 11 and substrate 12.Wherein LED luminescence chip 6 is fixed on the substrate 12 by silver slurry glue 4, heat conductive silica gel package 11 covers on the LED luminescence chip 6, it is indoor to make the LED luminescence chip be in an enclosed cavity, and plastic stent 5 is positioned at the below of substrate 12, and contacts with metal connector 2 by LED metal heat-conducting electrode 3.
Structure shown in Figure 1 is with respect to traditional structure, the part that insulating barrier 9 is positioned at metal heat-conducting electrode 3 belows hollows out, and adopt heat conductivility good metal connector 2 to replace, when above-mentioned LED luminescence chip 6 owing to work long hours and adstante febre, its heat can conduct to radiating piece 1 by plastic stent 5, LED metal heat-conducting electrode 3, metal connector 2 successively, and the use of metal connector 2 has promoted the radiating effect of system greatly.
Further, this metal connector 2 is the tin layer.
Further, radiating piece 1 is also selected metal material for use.
The above only is preferred embodiment of the present utility model; not in order to restriction the utility model; all any modifications of within spirit of the present utility model and principle, being done, be equal to and replace and improvement etc., all should be included within the protection domain of the present utility model.

Claims (7)

1. a LED lighting device comprises LED packaging body and radiating piece, it is characterized in that, the base of described LED packaging body is connected with described radiating piece by metal connector.
2. LED lighting device as claimed in claim 1 is characterized in that, described LED packaging body comprises:
Substrate;
Be fixed on the LED luminescence chip on the described substrate;
The positive and negative electrode that is connected with described LED luminescence chip;
Cover on the heat conductive silica gel package on the described LED luminescence chip;
Be positioned at the plastic stent of described substrate below;
The LED metal heat-conducting electrode that be positioned at described plastic stent below, contacts with described metal connector.
3. LED lighting device as claimed in claim 2 is characterized in that, described LED luminescence chip is fixed on the described substrate by silver slurry glue.
4. LED lighting device as claimed in claim 1 is characterized in that, described metal connector is a tin.
5. LED lighting device as claimed in claim 1 is characterized in that, described radiating piece is connected by pin with described metal connector.
6. LED lighting device as claimed in claim 1 is characterized in that, described radiating piece is connected by screw with described metal connector.
7. LED lighting device as claimed in claim 1 is characterized in that, described radiating piece is a metal material.
CN2009201788810U 2009-04-08 2009-09-23 High heat conductivity LED lighting device Expired - Fee Related CN201531852U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2009201788810U CN201531852U (en) 2009-04-08 2009-09-23 High heat conductivity LED lighting device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN200910106712.0 2009-04-08
CN2009201788810U CN201531852U (en) 2009-04-08 2009-09-23 High heat conductivity LED lighting device

Publications (1)

Publication Number Publication Date
CN201531852U true CN201531852U (en) 2010-07-21

Family

ID=42527256

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009201788810U Expired - Fee Related CN201531852U (en) 2009-04-08 2009-09-23 High heat conductivity LED lighting device

Country Status (1)

Country Link
CN (1) CN201531852U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103363361A (en) * 2013-08-06 2013-10-23 敦南科技(无锡)有限公司 Light source light emitting module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103363361A (en) * 2013-08-06 2013-10-23 敦南科技(无锡)有限公司 Light source light emitting module

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20100721

Termination date: 20100923