CN203136323U - Metal core printed circuit board for LED installation - Google Patents
Metal core printed circuit board for LED installation Download PDFInfo
- Publication number
- CN203136323U CN203136323U CN 201320101348 CN201320101348U CN203136323U CN 203136323 U CN203136323 U CN 203136323U CN 201320101348 CN201320101348 CN 201320101348 CN 201320101348 U CN201320101348 U CN 201320101348U CN 203136323 U CN203136323 U CN 203136323U
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- Prior art keywords
- led
- printed circuit
- circuit board
- insulating layer
- heat conductive
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Abstract
The utility model provides a metal core printed circuit board for LED installation, comprising the components as following: a metal substrate; a heat conduction insulating layer arranged on the metal substrate; and a copper layer line and a solder mask arranged on the heat conduction insulating layer. The solder mask is provided with a window, the copper layer line at the window is exposed to form an anode pin and a cathode pin used for LED electric connection, and an LED welding pad used for LED thermal conduction, and the LED welding pad is insulated from the anode pin and the cathode pin. According to the metal core printed circuit board for LED installation, the heat generated when the LED works is conducted to the metal substrate through the LED welding pad and the heat conduction insulating layer, the heat radiation capability of the metal core printed circuit board is raised, the operating temperature of the LED is maintained at a low level, and the service life and reliability of the LED are raised.
Description
Technical field
The utility model relates to the LED technical field, is specifically related to a kind of metal base printed circuit board for the LED installation.
Background technology
In recent years, led light source is because the remarkable advantage that its life-span is long, light efficiency is high, radiation is low and low in energy consumption has obtained extensive use in various fields.
LED also produces a large amount of heats when high brightness output is provided, yet under high-temperature work environment, problems such as colour cast, brightness reduction, shortening in useful life can take place LED, even fault immediately can occur.For avoiding occurring the problems referred to above, require the substrate of carrying LED can derive the heat that produces when LED works in time, fully.
Yet the thermal conductivity of traditional FR-4 printed circuit board (PCB) only is about 0.40W/mK, can't satisfy the demand of the existing printed circuit plate hight of LED heat conduction.
The utility model content
In view of this, be necessary the problem mentioned at background technology, provide a kind of heat dispersion better to be used for the metal base printed circuit board that LED installs.
The purpose of this utility model is achieved through the following technical solutions:
A kind of metal base printed circuit board of installing for LED comprises:
Metal substrate;
Be arranged on the heat conductive insulating layer on the described metal substrate;
And be arranged on copper layer line road and solder mask on the described heat conductive insulating floor, offer window on the described solder mask, the copper layer line road that is positioned at described window place is exposed anodal pin, the negative pole pin that is formed for LED and is electrically connected and is used for the heat conducting LED weld pad of LED, all insulation between described LED weld pad and described anodal pin and the described negative pole pin.
Described metal substrate is aluminium base, copper base or steel substrate.
Described metal substrate is that thickness is the aluminium base of 0.5-5mm.
The thermal conductivity of described heat conductive insulating layer is the insulating barrier of 1-3W/mK.
The thickness of described heat conductive insulating layer is 70-200 μ m.
The thickness on described copper layer line road is 18-350 μ m.
The thermal conductivity of described solder mask is lower than the thermal conductivity of described heat conductive insulating layer.
Compared with prior art, the utility model possesses following advantage:
When metal base printed circuit board of the present utility model was used for LED is installed, the heat that produces in the LED course of work conducted to metal substrate by LED weld pad, heat conductive insulating layer; Because the thermal conductivity of heat conductive insulating layer is 1-3W/mK, thermal conductivity apparently higher than traditional FR-4 printed circuit board (PCB), therefore the technical solution of the utility model has improved the heat-sinking capability of printed circuit board (PCB), can make the working temperature of LED maintain reduced levels, and can improve useful life and the reliability of LED.
Description of drawings
Fig. 1 is the cross-sectional view of the utility model embodiment.
Embodiment
As shown in Figure 1, the metal base printed circuit board that LED installs that is used for of present embodiment comprises: metal substrate 10, be arranged on the heat conductive insulating floor 20 on the described metal substrate 10 and be arranged on copper layer line road and solder mask 40 on the described heat conductive insulating floor 20, offer window on the described solder mask 40, the copper layer line road that is positioned at the window place is exposed anodal pin 31, the negative pole pin 32 that is formed for LED and is electrically connected and is used for the heat conducting LED weld pad 33 of LED, all insulation between described LED weld pad 33 and described anodal pin 31 and the described negative pole pin 32.
Factors such as its thermal coefficient of expansion, capacity of heat transmission and cost are depended in the material of described metal substrate 10 and the selection of thickness, can be aluminium base, copper base or steel plate; Consider that from conditions such as cost and technical performances preferred thickness is the aluminium base of 0.5-5mm.
The thermal conductivity of described heat conductive insulating layer 20 is 1-3W/mK, is prepared from by high heat conduction inorganic filler and epoxy resin composite material.Described high heat conduction inorganic filler is selected the powder of inorganics such as aluminium oxide, aluminium nitride or boron nitride for use.The effect of described epoxy resin is to make electric insulation between described metal substrate 10 and the copper layer line road, and described inorganic powder is used for forming heat transfer path at described epoxy resin, improves the capacity of heat transmission of heat conductive insulating layer 20.
The thickness of heat conductive insulating layer has very big influence to the thermal conductivity of substrate, and its thickness is too big, and the thermal resistance of made metal base printed circuit board is big, heat conductivility is relatively poor; When its thickness is too small, although can improve the thermal conductivity of metal base printed circuit board, can produce the problem that the withstand voltage properties of the metal base printed circuit board that the attenuate owing to the heat conductive insulating layer brings descends.The thickness of the heat conductive insulating layer 20 that therefore, adopts in the present embodiment is between the 70-200 μ m.
Because the thickness on copper layer line road when to be 18 μ m following, is easy to generate the problems such as copper layer fold that cause in the operating process when the copper-clad plate of manufacturing Metal Substrate; The thickness on copper layer line road is not easy to make copper layer line road during greater than 350 μ m.Therefore, the thickness on the copper layer line road 30 of present embodiment is between the 18-350 μ m.
Consider from the angle of effectively utilizing the LED irradiates light, the visible-range of 40 couples of 400-800nm of described solder mask has the reflectivity more than 70%, preferably, 40 pairs of wavelength of solder mask are the 460nm(blueness), the 525nm(green) and the 620nm(redness) light have reflectivity more than 70%.
In addition, the thermal conductivity of preferred described solder mask 40 is lower than the thermal conductivity of described heat conductive insulating layer 20.Because if the thermal conductivity of solder mask is less than the thermal conductivity of heat conductive insulating layer, then the heat that produces of LED can be by the heat radiation of copper layer line road direction solder mask, and near the ambient temperature the LED is difficult for rising, thereby is conducive to prolong the life-span of LED.
Claims (7)
1. one kind is used for the metal base printed circuit board that LED installs, and it is characterized in that: it comprises:
Metal substrate;
Be arranged on the heat conductive insulating layer on the described metal substrate;
And be arranged on copper layer line road and solder mask on the described heat conductive insulating floor;
Offer window on the described solder mask, the copper layer line road that is positioned at described window place is exposed anodal pin, the negative pole pin that is formed for LED and is electrically connected and is used for the heat conducting LED weld pad of LED, all insulation between described LED weld pad and described anodal pin and the described negative pole pin.
2. the metal base printed circuit board of installing for LED according to claim 1, it is characterized in that: described metal substrate is aluminium base, copper base or steel substrate.
3. the metal base printed circuit board of installing for LED according to claim 2, it is characterized in that: described metal substrate is that thickness is the aluminium base of 0.5-5mm.
4. the metal base printed circuit board of installing for LED according to claim 1, it is characterized in that: the thermal conductivity of described heat conductive insulating layer is 1-3W/mK.
5. the metal base printed circuit board of installing for LED according to claim 4, it is characterized in that: the thickness of described heat conductive insulating layer is 70-200 μ m.
6. according to the arbitrary described metal base printed circuit board for the LED installation of claim 1 to 5, it is characterized in that: the thickness on described copper layer line road is 18-350 μ m.
7. according to claim 1,4 or 5 described metal base printed circuit boards for the LED installation, it is characterized in that: the thermal conductivity of described solder mask is lower than the thermal conductivity of described heat conductive insulating layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320101348 CN203136323U (en) | 2013-03-06 | 2013-03-06 | Metal core printed circuit board for LED installation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320101348 CN203136323U (en) | 2013-03-06 | 2013-03-06 | Metal core printed circuit board for LED installation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203136323U true CN203136323U (en) | 2013-08-14 |
Family
ID=48944253
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320101348 Expired - Fee Related CN203136323U (en) | 2013-03-06 | 2013-03-06 | Metal core printed circuit board for LED installation |
Country Status (1)
| Country | Link |
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| CN (1) | CN203136323U (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104576908A (en) * | 2014-12-23 | 2015-04-29 | 苏州汉克山姆照明科技有限公司 | LED package substrate |
| CN105744728A (en) * | 2016-03-28 | 2016-07-06 | 常州鼎润电子科技有限公司 | Cleaning-type printed circuit board |
| CN105744727A (en) * | 2016-03-28 | 2016-07-06 | 常州鼎润电子科技有限公司 | Hole-protecting printed circuit board |
| CN105744734A (en) * | 2016-03-28 | 2016-07-06 | 常州鼎润电子科技有限公司 | High-frequency mixed-compression printed circuit board |
| US10273022B2 (en) | 2015-07-17 | 2019-04-30 | Goodrich Lighting Systems Gmbh | Aircraft LED light unit |
| CN111065203A (en) * | 2020-01-06 | 2020-04-24 | 东莞市五株电子科技有限公司 | High-end LED circuit board with good heat dissipation performance and preparation method thereof |
| CN113473698A (en) * | 2021-07-15 | 2021-10-01 | 重庆御光新材料股份有限公司 | Strippable circuit board and manufacturing method thereof |
-
2013
- 2013-03-06 CN CN 201320101348 patent/CN203136323U/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104576908A (en) * | 2014-12-23 | 2015-04-29 | 苏州汉克山姆照明科技有限公司 | LED package substrate |
| US10273022B2 (en) | 2015-07-17 | 2019-04-30 | Goodrich Lighting Systems Gmbh | Aircraft LED light unit |
| CN105744728A (en) * | 2016-03-28 | 2016-07-06 | 常州鼎润电子科技有限公司 | Cleaning-type printed circuit board |
| CN105744727A (en) * | 2016-03-28 | 2016-07-06 | 常州鼎润电子科技有限公司 | Hole-protecting printed circuit board |
| CN105744734A (en) * | 2016-03-28 | 2016-07-06 | 常州鼎润电子科技有限公司 | High-frequency mixed-compression printed circuit board |
| CN111065203A (en) * | 2020-01-06 | 2020-04-24 | 东莞市五株电子科技有限公司 | High-end LED circuit board with good heat dissipation performance and preparation method thereof |
| CN111065203B (en) * | 2020-01-06 | 2022-04-26 | 东莞市五株电子科技有限公司 | High-end LED circuit board with good heat dissipation performance and preparation method thereof |
| CN113473698A (en) * | 2021-07-15 | 2021-10-01 | 重庆御光新材料股份有限公司 | Strippable circuit board and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130814 Termination date: 20190306 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |