CN204289426U - A kind of frequency converter IGBT radiator structure - Google Patents

Abstract

The utility model discloses a kind of frequency converter IGBT radiator structure, it comprises IGBT single tube, metal substrate, radiator, pcb board, heat-conducting interface material, described IGBT single tube has pin and single tube fin, metal substrate is three-decker, is followed successively by layers of copper, insulating barrier, metal-based layer from top to bottom; IGBT pin plug-in mounting is welded on pcb board, and single tube fin is welded in metal substrate layers of copper, and metal substrate is fixing on a heat sink, has heat-conducting interface material between metal substrate and radiator.The utility model makes greatly improve the useful life of IGBT single tube, and insulation heat-conducting property makes well IGBT single-pipe temp lifting speed and temperature greatly reduce, thus improves the reliability of frequency converter work.

Description

A heat dissipation structure of inverter IGBT

technical field

The utility model belongs to the technical field of frequency converters, in particular to a heat dissipation structure of a frequency converter IGBT.

Background technique

Heat is the biggest threat to silicon semiconductors. With the rapid development of the electronics industry, the size of electronic products is getting smaller and the power density is getting higher and higher. Solving the problem of heat dissipation is a huge challenge for the design of the electronics industry. The frequency converter is a high-power power electronic device, equipped with a large number of power semiconductor devices inside, which will generate a lot of heat during operation. The power semiconductor device IGBT tube is a temperature-sensitive device, and the power semiconductor device is burned due to excessive junction temperature, which is one of the most common reasons for inverter failure. In order to ensure the stable and reliable operation of the inverter equipment, the design of the heat dissipation system is a key link.

Practical experience shows that the design of the heat dissipation system directly affects whether the inverter can work safely and stably for a long time. The original inverter IGBT single tube is dissipated and insulated by thick film ceramic circuit or insulating paper or FR4 circuit board. Traditional glass is easy to break and has poor mechanical properties, and insulating paper has poor thermal conductivity. Traditional FR4 circuit boards generally have a three-layer structure. The upper and lower layers are copper layers, and the middle is an FR4 layer with poor thermal conductivity. The copper layer is thinner, generally 1~3oz, and the FR4 layer is thicker, generally 0.6mm. Above, the heat transfer from the upper surface of the circuit board to the lower surface of the circuit board has a large thermal resistance, and there will be a relatively large temperature difference.

Utility model content

The technical problem to be solved by the utility model is to provide a frequency converter IGBT heat dissipation structure to solve the problems of poor heat dissipation and easy breakage existing in the existing IGBT heat dissipation structure.

In order to solve the above-mentioned technical problems, the inverter IGBT cooling structure provided by the utility model includes an IGBT single tube, a metal substrate, a heat sink, a PCB board, and a heat-conducting interface material layer, and the IGBT single tube has pins and a single-tube heat sink , the metal substrate is a three-layer structure, from top to bottom are the copper layer of the metal substrate, the insulating layer of the metal substrate, and the metal substrate of the metal substrate; the IGBT pins are inserted and welded to the PCB board, and the single-tube heat sink is welded to the copper layer of the metal substrate Above, the metal substrate is fixed on the radiator, and there is a thermal interface material layer between the metal substrate and the radiator.

Preferably, the thermal interface material is a viscous thermal interface material, which is easy to install.

Preferably, the PCB board is an FR4 circuit board or a ceramic circuit board, which has good reliability and is cheap.

Preferably, the metal base material of the metal substrate is aluminum or copper, which is convenient for processing.

Preferably, the insulating layer of the metal substrate is an FR4 base material or a CEM3 base material, which is cheap and has good insulating performance.

Preferably, the single-tube heat sink is 4-10 mm long and 3-8 mm wide.

Preferably, the metal substrate is 20-40mm long and 15-30mm wide.

Preferably, the thickness of the copper layer on the metal substrate is 1-3 oz, which can have relatively good heat dissipation performance and is convenient for processing and production.

Preferably, the material of the heat sink is aluminum or copper, which has good heat dissipation performance and is relatively light.

After adopting the above structure, compared with the prior art, the IGBT heat dissipation structure of the frequency converter of the present invention has the following advantages:

1) Good thermal conductivity, electrical insulation performance and mechanical processing performance can reduce the operating temperature of the module, prolong the service life, and improve the power density and reliability. Compared with the traditional FR4 circuit board, the metal substrate can minimize the thermal resistance, so that the substrate has excellent thermal conductivity; compared with the thick film ceramic circuit, it can resist the mechanical and heat generated by the soldering and operation of the device stress;

2) The service life of the IGBT single tube is greatly improved, and the good insulation and heat conduction performance greatly reduces the temperature rise and temperature of the IGBT single tube, thereby improving the reliability of the inverter.

3) The metal substrate circuit layer (using electrolytic copper foil) is used to realize the assembly and connection of the IGBT single tube. Compared with the traditional FR4 circuit board, it adopts the same line width and the same thickness, but the metal substrate can carry higher current. This is because the heat loss of P=I2R generated by the copper foil circuit can be diffused faster by the metal substrate. The thickness of the copper foil can affect the thermal conductivity of the metal substrate, and increasing the thickness of the copper foil can improve the thermal conductivity of the metal substrate.

Description of drawings

Fig. 1 is the structural representation of the utility model;

Fig. 2 is the structural front view of the present utility model;

Fig. 3 is a cross-sectional view at A-A in Fig. 2;

Figure 4 is an enlarged view at B in Figure 3;

Among them: 1. IGBT single tube, 2. Metal substrate, 3. Radiator, 4. PCB board, 5. Thermal interface material layer, 11. IGBT heat sink, 12. IGBT pins, 21. Metal substrate copper layer, 22 . Metal substrate insulation layer, 23. Metal substrate metal layer.

Detailed ways

Below by embodiment in conjunction with accompanying drawing, the utility model is further described.

As shown in Figures 1-3, the inverter IGBT cooling structure provided by the utility model includes an IGBT single tube 1, a metal substrate 2, a radiator 3, and a PCB board 4. The IGBT single tube 1 has a pin 12 and a single tube heat sink 11. The pin 12 is welded on the PCB board 4 as a plug-in to provide electrical connection. The PCB board 4 is an FR4 circuit board with copper on both sides. The single-pipe heat sink 11 is welded on the metal substrate by patch technology. As shown in FIG. 4 , the metal substrate has a three-layer structure, which is a copper layer 21 , an insulating layer 22 , and a metal base layer 23 from top to bottom. The material of the metal base layer is aluminum. The heat sinks 11 of the six IGBT single tubes are welded on the metal substrate copper layer 21 of the metal substrate 2 by a patch process. The metal base layer 23 of the metal substrate 2 is bonded to the heat sink 3 with an adhesive thermal interface material. The thickness of the copper layer 21 of the metal substrate is 2 oz; the material of the insulating layer 22 is FR4, and the thickness is 1 oz; the thickness of the metal base layer 23 is 0.95-1.05 mm. Radiator 3 is 47mm long, 33mm wide, and 31mm high, with a bottom plate thickness of 2.5mm, a fin thickness of 1.6mm, and a fin pitch of 7mm.

The metal substrate 2 can also be fixed on the heat sink 3 by screws, and the thermally conductive interface material can be a non-adhesive thermally conductive interface material.

Claims (9)

1. a frequency converter IGBT radiator structure, it comprises IGBT single tube (1), metal substrate (2), radiator (3), pcb board (4), heat-conducting interface material layer (5), described IGBT single tube (1) has IGBT pin (12) and single tube fin (11), described IGBT pin (12) plug-in mounting is welded on pcb board (4), it is characterized in that: described metal substrate (2) is three-decker, be followed successively by metal substrate layers of copper (21), metal substrate insulating barrier (22), metal substrate metal-based layer (23) from top to bottom; Single tube fin (11) is welded in metal substrate layers of copper (21), and metal substrate (2) is fixed on radiator (3), has heat-conducting interface material layer (5) between metal substrate (2) and radiator (3).

2. frequency converter IGBT radiator structure as claimed in claim 1, is characterized in that described heat-conducting interface material is adhesive heat-conducting interface material.

3. frequency converter IGBT radiator structure as claimed in claim 1 or 2, is characterized in that described pcb board (4) is for FR4 wiring board or ceramic circuit-board.

4. frequency converter IGBT radiator structure as claimed in claim 1 or 2, is characterized in that metal-based layer (23) material of described metal substrate (2) is copper or aluminium.

5. frequency converter IGBT radiator structure as claimed in claim 1 or 2, is characterized in that the material of described metal substrate insulating barrier (22) is FR4 base material or CEM3 base material.

6. frequency converter IGBT radiator structure as claimed in claim 1 or 2, is characterized in that described single tube fin (11) long 4 ~ 10mm, wide 3 ~ 8mm.

7. frequency converter IGBT radiator structure as claimed in claim 1 or 2, is characterized in that described metal substrate (2) long 20 ~ 40mm, wide 15 ~ 30mm.

8. frequency converter IGBT radiator structure as claimed in claim 1 or 2, is characterized in that the thickness of described metal substrate layers of copper (21) is 1 ~ 3oz.

9. frequency converter IGBT radiator structure as claimed in claim 1 or 2, is characterized in that described radiator (3) material is aluminium or copper.