CN102692000A - Graphite base plate for LED (light emitting diode) high-power illumination module and manufacturing technology of graphite base plate - Google Patents

Graphite base plate for LED (light emitting diode) high-power illumination module and manufacturing technology of graphite base plate Download PDF

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Publication number
CN102692000A
CN102692000A CN201210181319XA CN201210181319A CN102692000A CN 102692000 A CN102692000 A CN 102692000A CN 201210181319X A CN201210181319X A CN 201210181319XA CN 201210181319 A CN201210181319 A CN 201210181319A CN 102692000 A CN102692000 A CN 102692000A
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China
Prior art keywords
graphite
led
illumination module
heat
substrate
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CN201210181319XA
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Chinese (zh)
Inventor
杨诗毅
刘荣
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山西山地新源科技有限公司
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Priority to CN201210181319XA priority Critical patent/CN102692000A/en
Publication of CN102692000A publication Critical patent/CN102692000A/en

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Abstract

The invention discloses a graphite base plate for an LED (light emitting diode) high-power illumination module and a manufacturing technology of the graphite base plate. The graphite base plate comprises a high heat-conduction graphite base layer, a heat-conduction insulation layer and a circuit layer. The heat-conduction graphite base layer is formed by the steps of sintering WT70 % of fine graphite powder, WT5 % of copper powder, WT5% of aluminium powder, WT14 % of silane coupling agent, WT6 % of titanate coupling agent under the condition of high temperature of 1000-1200 DEG C to obtain a graphite composite, and manufacturing the graphite composite into a high heat-conduction graphite sheet-shaped base material by graphite coiled material production equipment. The heat-conduction insulation layer is made from a ceramic-filled polymer. The circuit layer is manufactured by a copper foil with thickness being 35-280 Mu m through a PCB (printed circuit board) technology. The main component of the graphite base plate is carbon material which is easy and convenient to obtain, and therefore the graphite base plate is low in cost and has strong resistance to corrosion, acid and alkali, oxidation and aging; and the waste does not pollute environment.

Description

The graphite substrate and the manufacture craft that are used for LED high-power illumination module

Technical field

The present invention relates to a kind of LED lamp field, relate in particular to a kind of graphite substrate and manufacture craft thereof of the LED of being used for high-power illumination module.

Background technology

Mostly the substrate of LED high-power illumination light fixture of the prior art generally is aluminium base or copper base, be used as high-power LED light source mount the circuit support plate and as the heat radiation of light source conduction.In fact this aluminium base or copper base are temperature-uniforming plate, fall the thermal source samming, are transmitted on other radiator that installs additional of substrate back again.One of function that substrate is main is a circuit, and another most important function is heat radiation.

Present baseplate material is main with aluminium, copper mainly.The thermal conductivity factor of copper is that (AL thermal conductivity factor: 200W/m*K, the Cu thermal conductivity factor: 380W/m*K), density then is 3 times of (AL density: 2.7g/cm approximately for about 1.8 times of aluminium 3, Cu density: 8.9g/cm 3), in other words, the fin of same volume, face (volume of timber), the weight of copper is 3 times of aluminium.With copper is that material is used as LED illumination module heat-radiating substrate, though the heat conduction is high, cost is high, and rare heat-radiating substrate adopts copper product.

With aluminium or copper is the substrate that material forms, and is that the substrate of material weighs 30% and 80% than the graphite of same size respectively, and weight is heavier, in transportation and installation process, can cause bigger burden.

With aluminium or copper is the substrate that material forms, and heat transfer type is identical to all direction heat transfer efficiencys, but because high contact resistance, they can not carry out conducting heat between the component effectively.

Metallic aluminium or copper price are high always on market, and for LED lamp processing manufacturing industry, technology has not been core competence of enterprises, and cost becomes the bottleneck of the many enterprises of restriction.

The high material of LED lamp active demand thermal conductivity factor that high heat gathers provides heat radiation, and metal substrate can't satisfy its demand.

Summary of the invention

It is the graphite substrate and the manufacture craft thereof of the LED high-power illumination module that forms of material with graphite that the technical problem that the present invention will solve has been to provide a kind of.

Be to realize above-mentioned purpose, the present invention realizes through following scheme: the graphite substrate of the described LED of being used for high-power illumination module comprises high conductive graphite basic unit, heat conductive insulating layer, circuit layer; The fine graphite powder of the described conductive graphite employing WT70% of basic unit, the copper powder of WT5%, the aluminium powder of WT5%, the silane coupler of WT14%, titanate coupling agent sintering under 1000 ℃-1200 ℃ hot conditions of WT6% obtain graphite composite, and graphite composite is processed high conductive graphite flat substrates through graphite coiled material production equipment; The material that described heat conductive insulating layer adopts is ceramic filled polymer; The Copper Foil that described circuit layer used thickness is 35um-280um is processed circuit layer through PCB printed substrate technology.

Further, described high conductive graphite basic unit places bottom, and heat conductive insulating is placed on the intermediate layer, and circuit layer brings to Front.

Further, described high conductive graphite basic unit can make board substrate and uses.

Further, described heat conductive insulating layer has heat conduction, makes the effect of upper strata circuit insulation.

Further, described circuit layer can transship big electric current, mount single light source of great power LED.

Further, described high conductive graphite groundwork thickness is 5mm.

Further, described heat conductive insulating layer thickness is between the 0.3mm-0.8mm.

Further, the about 0.6mm of described circuit layer thickness.

For realizing above-mentioned purpose, the present invention gives the manufacturing process of the graphite substrate that is used for LED high-power illumination module, and this manufacturing process may further comprise the steps and condition:

(1) acid treatment: (particle diameter≤0.9mm) is put into the pickling agent (pickling agent that is mixed by sulfuric acid and hydrogen peroxide solution at the levigate graphite powder more than 99% with phosphorus content; Sulfuric acid: hydrogen peroxide solution=30%: 70%; Weight ratio) in, under 100 ± 5 ℃ hot environment, soaked 120 minutes;

(2) washing: will pass through acid-treated graphite powder and wash PH=5-6.5;

(3) high temperature puffing: the graphite powder that will pass through washing is put into the graphite expansion stove, and high temperature puffing is 4 hours under 800-1000 ℃ condition, slowly cools to room temperature again;

(4) batch mixing: the graphite powder of high temperature gained is got 70%, add 5% copper powder, 5% aluminium powder, 14% silane coupler, 6% titanate coupling agent, mechanical mixture 15-20 minute, heat was mixed and is pinched 15-20 minute (temperature: 80 ± 5 ℃) again, is made into thickener;

(5) fragmentation: with the cooling of gained thickener, fragmentation, the graphite compound of fragmentation is put into the graphite expansion stove, high temperature puffing is 1 hour under 1000-1200 ℃ condition, slowly cools to room temperature again;

(6) mold pressing: pack into mould or to process thickness through graphite coiled material machine be 5MM graphite flat substrates of the graphite compound after will be more expanded;

(7) aluminize: the surface of the graphite flat substrates of gained is used electroplate or spraying plating plates the aluminium lamination of 5-15um, more than for making the technology of conductive graphite basic unit;

(8) make the heat conductive insulating layer: insulating barrier is pasted on the graphite substrate surface after the aluminium plating; Insulating layer material is constituted by the polymer (mainly being epoxy resin) that high heat conduction, the ceramic powder filled of high insulation form; Such insulating barrier has good heat-conductive characteristic (thermal conductivity factor is up to 2.0/m-K), and insulating barrier has very high dielectric strength, good adhesive property;

(9) copper-clad laminate: the phenol an aromatic plant metioned in ancient books resin that will contain Copper Foil (thickness is 35um-280um) covers on the insulating barrier;

(10) lamination: cover the copper laminating machine with the above-mentioned material lamination of accomplishing through paper substrate, become graphite substrate;

(11) make circuit: will pass through the graphite substrate process PCB production process that above-mentioned operation is accomplished: open material → boring → dry film photoimaging → inspection plate → etching → erosion inspection → green oil → character → green inspection → spray tin → graphite processing base level → punching → inspection at end, promptly obtain can be used for the graphite substrate of LED high-power illumination module.

Advantage of the present invention is: with regard to heat conductivility, the material of heat radiation is undoubtedly most important factor, and its price also compares metallic copper aluminium will be cheaply, and manufacturing technology steps is simple, and working condition is convenient to control.The main component of graphite substrate is a material with carbon element, conveniently is easy to get, and is with low cost, anticorrosive, and acid and alkali-resistance is anti-oxidant, and ageing resistance is strong, and its discarded object does not pollute the environment yet.Graphite substrate is compared with aluminium base and copper base, dispels the heat faster, in light weight, convenient and other radiator applying assembling.Simultaneously; Graphite has anisotropic heat-transfer character; Can directed conduct heat, better to other component (radiator) heat-transfer effect, the heat that produces high-power LED light source sooner, more fully conduct away on other radiator; Thereby reduce the junction temperature of LED luminescence chip, improve the light efficiency of LED, the life-span of prolongation LED light fixture.

Description of drawings

Below in conjunction with accompanying drawing the present invention is elaborated.

Fig. 1 is used for the graphite substrate structural representation of LED high-power illumination module for the present invention.

In the accompanying drawing: the 1st, high conductive graphite basic unit, the 2nd, heat conductive insulating layer, the 3rd, circuit layer.

The specific embodiment

As shown in Figure 1, the graphite substrate that is used for LED high-power illumination module comprises high conductive graphite basic unit 1, heat conductive insulating layer 2, circuit layer 3; The fine graphite powder of the described conductive graphite 1 employing WT70% of basic unit, the copper powder of WT5%, the aluminium powder of WT5%, the silane coupler of WT14%, titanate coupling agent sintering under 1000 ℃-1200 ℃ hot conditions of WT6% obtain graphite composite, and graphite composite is processed high conductive graphite flat substrates through graphite coiled material production equipment; The material that described heat conductive insulating layer 2 adopts is ceramic filled polymer; The Copper Foil that described circuit layer 3 used thicknesses are 35um-280um is processed circuit layer through PCB printed substrate technology.Described high conductive graphite basic unit 1 places bottom, and heat conductive insulating layer 2 places the intermediate layer, and circuit layer 3 brings to Front.

Embodiment 1:

(particle diameter≤0.9mm) 100KG puts into the pickling agent that is mixed by sulfuric acid 50KG and hydrogen peroxide solution 117KG, under 100 ± 5 ℃ hot environment, soaks 120 minutes at the levigate graphite powder more than 99% with phosphorus content.To pass through acid-treated graphite powder then and wash PH=5-6.5, and put into the graphite expansion stove, high temperature puffing is 4 hours under 800-1000 ℃ condition, slowly cools to room temperature again.The graphite powder of high temperature gained is got 70KG, add the copper powder of 5KG, the aluminium powder of 5KG, the silane coupler of 14KG, the titanate coupling agent of 6KG, mechanical mixture 15-20 minute, heat was mixed and was pinched 15-20 minute again, and temperature is controlled at 80 ± 5 ℃, is made into thickener.With the cooling of gained thickener, fragmentation, the graphite compound of fragmentation is put into the graphite expansion stove, high temperature puffing is 1 hour under 1000-1200 ℃ condition, slowly cools to room temperature again.With the graphite compound after expanded again pack into mould or through graphite coiled material machine process thickness be 5MM graphite flat substrates several.At last the surface of the graphite flat substrates of gained is used and electroplates or spraying plating plates the aluminium lamination of 5-15um, obtain required conductive graphite basic unit 1 several.Paste heat conductive insulating layer 2 in each conductive graphite basic unit 1, the phenol an aromatic plant metioned in ancient books resin that will contain Copper Foil (thickness is 35um-280um) covers on the heat conductive insulating layer 2, covers the copper laminating machine with the above-mentioned material lamination of accomplishing through paper substrate, becomes band heat conductive insulating layer graphite substrate.To pass through band heat conductive insulating layer graphite substrate that above-mentioned operation accomplishes through the PCB production process: open material → boring → dry film photoimaging → inspection plate → etching → erosion inspection → green oil → character → green inspection → spray tin → graphite processing base level → punching → end and examine, promptly obtain the present invention be used for LED high-power illumination module graphite substrate several.

Through test, more than adopting the thermal conductivity factor of the graphite substrate that is used for LED high-power illumination module of technology making of the present invention is 760W/mK.

Statistics finds that graphite is best Heat Conduction Material, and this material has bidimensional heat conductivity in the plane, can produce up to 800W/mK, and in the scope of third dimension conductibility at 6-10W/mK of thickness direction.

The above is merely preferred embodiment of the present invention; Be not so limit claim of the present invention; Every equivalent structure or equivalent flow process conversion that utilizes specification of the present invention and accompanying drawing content to be done; Or directly or indirectly be used in other relevant technical field, all in like manner be included in the scope of patent protection of the present invention.

Claims (9)

1. be used for the graphite substrate of LED high-power illumination module, it is characterized in that: the graphite substrate of the described LED of being used for high-power illumination module comprises high conductive graphite basic unit (1), heat conductive insulating layer (2), circuit layer (3); Described conductive graphite basic unit (1) adopts the fine graphite powder of WT70%, the copper powder of WT5%, the aluminium powder of WT5%, the silane coupler of WT14%, titanate coupling agent sintering under 1000 ℃-1200 ℃ hot conditions of WT6% to obtain graphite composite, and graphite composite is processed high conductive graphite flat substrates through graphite coiled material production equipment; The material that described heat conductive insulating layer (2) adopts is ceramic filled polymer; Described circuit layer (3) used thickness is that the Copper Foil of 35um-280um is processed circuit layer through PCB printed substrate technology.
2. according to the described graphite substrate that is used for LED high-power illumination module of claim 1, it is characterized in that: described high conductive graphite basic unit (1) places bottom, and heat conductive insulating layer (2) places the intermediate layer, and circuit layer (3) brings to Front.
3. according to claim 1 or the 2 described graphite substrates that are used for LED high-power illumination module, it is characterized in that: described high conductive graphite basic unit (1) can make board substrate and use.
4. according to claim 1 or the 2 described graphite substrates that are used for LED high-power illumination module, it is characterized in that: described heat conductive insulating layer (2) has heat conduction, makes the effect of upper strata circuit insulation.
5. according to claim 1 or the 2 described graphite substrates that are used for LED high-power illumination module, it is characterized in that: described circuit layer (3) can transship big electric current, mount single light source of great power LED.
6. according to claim 1 or the 2 or 3 described graphite substrates that are used for LED high-power illumination module, it is characterized in that: described high conductive graphite basic unit (1) thickness is 5mm.
7. according to claim 1 or the 2 or 4 described graphite substrates that are used for LED high-power illumination module, it is characterized in that: described heat conductive insulating layer (2) thickness is between the 0.3mm-0.8mm.
8. according to claim 1 or the 2 or 5 described graphite substrates that are used for LED high-power illumination module, it is characterized in that: the about 0.6mm of described circuit layer (3) thickness.
9. be used for the manufacturing process of the graphite substrate of LED high-power illumination module, it is characterized in that: this manufacturing process may further comprise the steps and condition:
(1) acid treatment: (particle diameter≤0.9mm) is put into the pickling agent (pickling agent that is mixed by sulfuric acid and hydrogen peroxide solution at the levigate graphite powder more than 99% with phosphorus content; Sulfuric acid: hydrogen peroxide solution=30%: 70%; Weight ratio) in, under 100 ± 5 ℃ hot environment, soaked 120 minutes;
(2) washing: will pass through acid-treated graphite powder and wash PH=5-6.5;
(3) high temperature puffing: the graphite powder that will pass through washing is put into the graphite expansion stove, and high temperature puffing is 4 hours under 800-1000 ℃ condition, slowly cools to room temperature again;
(4) batch mixing: the graphite powder of high temperature gained is got 70%, add 5% copper powder, 5% aluminium powder, 14% silane coupler, 6% titanate coupling agent, mechanical mixture 15-20 minute, heat was mixed and is pinched 15-20 minute (temperature: 80 ± 5 ℃) again, is made into thickener;
(5) fragmentation: with the cooling of gained thickener, fragmentation, the graphite compound of fragmentation is put into the graphite expansion stove, high temperature puffing is 1 hour under 1000-1200 ℃ condition, slowly cools to room temperature again;
(6) mold pressing: pack into mould or to process thickness through graphite coiled material machine be 5MM graphite flat substrates of the graphite compound after will be more expanded;
(7) aluminize: the surface of the graphite flat substrates of gained is used electroplate or spraying plating plates the aluminium lamination of 5-15um, more than for making the technology of conductive graphite basic unit (1);
(8) make heat conductive insulating layer (2): insulating barrier is pasted on the graphite substrate surface after the aluminium plating; Insulating layer material is constituted by the polymer (mainly being epoxy resin) that high heat conduction, the ceramic powder filled of high insulation form; Such insulating barrier has good heat-conductive characteristic (thermal conductivity factor is up to 2.0/m-K), and insulating barrier has very high dielectric strength, good adhesive property;
(9) copper-clad laminate: the phenol an aromatic plant metioned in ancient books resin that will contain Copper Foil (thickness is 35um-280um) covers on the insulating barrier;
(10) lamination: cover the copper laminating machine with the above-mentioned material lamination of accomplishing through paper substrate, become graphite substrate;
(11) make circuit: will pass through the graphite substrate process PCB production process that above-mentioned operation is accomplished: open material → boring → dry film photoimaging → inspection plate → etching → erosion inspection → green oil → character → green inspection → spray tin → graphite processing base level → punching → inspection at end, promptly obtain being used for the graphite substrate of LED high-power illumination module.
CN201210181319XA 2012-06-04 2012-06-04 Graphite base plate for LED (light emitting diode) high-power illumination module and manufacturing technology of graphite base plate CN102692000A (en)

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Cited By (7)

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Publication number Priority date Publication date Assignee Title
CN103075719A (en) * 2013-02-04 2013-05-01 山西山地新源科技有限公司 Graphite coated aluminum radiator and manufacturing process thereof
CN105392031A (en) * 2015-10-21 2016-03-09 东莞市兆信电子科技有限公司 Manufacturing method for graphite radiating plate of intelligent set-top box
CN105822917A (en) * 2016-05-24 2016-08-03 江苏天楹之光光电科技有限公司 Heat-dissipation LED lamp
CN108155280A (en) * 2017-12-15 2018-06-12 广东昭信照明科技有限公司 A kind of LED filament and its manufacturing method
WO2018121162A1 (en) * 2016-12-30 2018-07-05 华为技术有限公司 Chip packaging structure and manufacturing method therefor
CN110112263A (en) * 2019-05-13 2019-08-09 电子科技大学中山学院 A kind of high-power LED encapsulation substrate, method for preparing substrate and its encapsulating structure
CN110265537A (en) * 2019-05-17 2019-09-20 电子科技大学中山学院 Substrate, substrate production method and encapsulating structure

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CN102123563A (en) * 2011-03-30 2011-07-13 余建平 Method for manufacturing ceramic PCB (Printed Circuit Board)
CN102213404A (en) * 2011-04-19 2011-10-12 梁胜光 High-efficiency heat-radiation LED heat radiator and manufacture method thereof
CN102339943A (en) * 2010-07-22 2012-02-01 上海卓凯电子科技有限公司 Heat-radiating structure for polycrystalline metal base-type light-emitting diode (LED) and method for manufacturing same

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CN101661977A (en) * 2008-08-27 2010-03-03 北京盘天新技术有限公司 Preparation method of insulating metal substrate for high-power LED packaging
CN101652020A (en) * 2009-09-04 2010-02-17 大连九久光电科技有限公司 High heat radiating circuit substrate and manufacturing method thereof
CN101775213A (en) * 2010-02-01 2010-07-14 黄晓峰 High thermal conducting composite material and preparation method thereof
CN102339943A (en) * 2010-07-22 2012-02-01 上海卓凯电子科技有限公司 Heat-radiating structure for polycrystalline metal base-type light-emitting diode (LED) and method for manufacturing same
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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103075719A (en) * 2013-02-04 2013-05-01 山西山地新源科技有限公司 Graphite coated aluminum radiator and manufacturing process thereof
CN105392031A (en) * 2015-10-21 2016-03-09 东莞市兆信电子科技有限公司 Manufacturing method for graphite radiating plate of intelligent set-top box
CN105822917A (en) * 2016-05-24 2016-08-03 江苏天楹之光光电科技有限公司 Heat-dissipation LED lamp
WO2018121162A1 (en) * 2016-12-30 2018-07-05 华为技术有限公司 Chip packaging structure and manufacturing method therefor
TWI663695B (en) * 2016-12-30 2019-06-21 大陸商華為技術有限公司 Chip package structure and manufacturing method thereof
CN108155280A (en) * 2017-12-15 2018-06-12 广东昭信照明科技有限公司 A kind of LED filament and its manufacturing method
CN110112263A (en) * 2019-05-13 2019-08-09 电子科技大学中山学院 A kind of high-power LED encapsulation substrate, method for preparing substrate and its encapsulating structure
CN110265537A (en) * 2019-05-17 2019-09-20 电子科技大学中山学院 Substrate, substrate production method and encapsulating structure

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Application publication date: 20120926