CN102123563A - Method for manufacturing ceramic PCB (Printed Circuit Board) - Google Patents
Method for manufacturing ceramic PCB (Printed Circuit Board) Download PDFInfo
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- CN102123563A CN102123563A CN 201110079000 CN201110079000A CN102123563A CN 102123563 A CN102123563 A CN 102123563A CN 201110079000 CN201110079000 CN 201110079000 CN 201110079000 A CN201110079000 A CN 201110079000A CN 102123563 A CN102123563 A CN 102123563A
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- ceramic
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- ceramic pcb
- pcb circuit
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- 239000000919 ceramic Substances 0.000 title claims abstract description 60
- 238000000034 method Methods 0.000 title claims abstract description 21
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 36
- 229910052751 metal Inorganic materials 0.000 claims abstract description 19
- 239000002184 metal Substances 0.000 claims abstract description 19
- 239000000758 substrate Substances 0.000 claims abstract description 19
- 239000000843 powder Substances 0.000 claims abstract description 18
- 239000000463 material Substances 0.000 claims abstract description 14
- 239000002994 raw material Substances 0.000 claims abstract description 11
- 238000005530 etching Methods 0.000 claims abstract description 10
- 238000013461 design Methods 0.000 claims abstract description 8
- 238000002360 preparation method Methods 0.000 claims abstract description 8
- 238000003756 stirring Methods 0.000 claims abstract description 8
- 239000002131 composite material Substances 0.000 claims abstract description 7
- 238000005498 polishing Methods 0.000 claims abstract description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 5
- 238000001035 drying Methods 0.000 claims abstract description 5
- 239000010433 feldspar Substances 0.000 claims abstract description 5
- 239000011261 inert gas Substances 0.000 claims abstract description 5
- 238000005245 sintering Methods 0.000 claims abstract description 5
- 238000007493 shaping process Methods 0.000 claims description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 17
- 239000010949 copper Substances 0.000 claims description 17
- 229910052802 copper Inorganic materials 0.000 claims description 17
- 239000000203 mixture Substances 0.000 claims description 17
- 230000005496 eutectics Effects 0.000 claims description 5
- 238000009792 diffusion process Methods 0.000 claims description 4
- 238000013467 fragmentation Methods 0.000 claims description 4
- 238000006062 fragmentation reaction Methods 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000007254 oxidation reaction Methods 0.000 claims description 4
- 239000011032 tourmaline Substances 0.000 claims description 4
- 229940070527 tourmaline Drugs 0.000 claims description 4
- 229910052613 tourmaline Inorganic materials 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 238000012545 processing Methods 0.000 claims description 3
- 229910052732 germanium Inorganic materials 0.000 claims description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 2
- 239000010438 granite Substances 0.000 claims description 2
- 239000010445 mica Substances 0.000 claims description 2
- 229910052618 mica group Inorganic materials 0.000 claims description 2
- 239000004575 stone Substances 0.000 claims description 2
- 238000002156 mixing Methods 0.000 abstract description 3
- 238000011900 installation process Methods 0.000 abstract description 2
- 238000000465 moulding Methods 0.000 abstract 2
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 238000000227 grinding Methods 0.000 abstract 1
- 230000005855 radiation Effects 0.000 description 12
- 230000017525 heat dissipation Effects 0.000 description 5
- 238000012546 transfer Methods 0.000 description 5
- 239000013078 crystal Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 238000011161 development Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000002277 temperature effect Effects 0.000 description 1
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- Compositions Of Oxide Ceramics (AREA)
Abstract
The invention relates to a method for manufacturing a ceramic PCB (Printed Circuit Board), comprising the following steps: preparing materials, grinding, mixing, molding, and baking to manufacture a ceramic board; then carrying out circuit design on a ceramic board; preparing a circuit on the ceramic board in an etching manner; and finishing the ceramic PCB. The method is characterized in that the preparation of the raw materials is as follows: preparing aluminium oxide, graphite powder and feldspar powder at the weight ratio of 100:(10-150:(26-30), mixing, and carrying out a magnetic component removal process before stirring; then carrying out molding; drying; baking; placing a molded and dried product in a high-temperature furnace, and sintering in the high-temperature furnace at high temperature in the presence of inert gases; carrying out polishing after baking; forming the ceramic composite metal substrate after copper-coating treatment; and finally, etching the circuit to manufacture the ceramic PCB. In the ceramic PCB, the heat conductivity is better, and the problem of light attenuation caused by heat resistance generated by an LED (Light-Emitting Diode) high-power light source in an installation process is solved.
Description
[technical field]
The present invention relates to ceramic PCB circuit board, relate in particular to a kind of production program and technology of the ceramic PCB circuit board that dispels the heat by far infrared.
[background technology]
Along with global environmental consciousness is surging, energy saving has become a kind of inevitable trend, the LED industry is one of industry that this year, development potentiality preferably got most of the attention, and that the LED product has is energy-conservation, power saving, high efficiency, the reaction time is fast, life cycle is long, environmental protection and advantage such as not mercurous.But because the LED heat dissipation problem causes a potential technical problem " the serious light decay of LED street lamp " seriously to restrict the development of LED industry, the heat energy that is produced when LED is luminous is if can't in time derive, will make LED knot surface temperature too high, and then influence life cycle of the product, luminous efficiency, stability.And LED street lamp light decay problem is subjected to temperature effect exactly; for the design of heat-radiating substrate fin, radiating module painstakingly in the hope of obtaining better heat radiating effect; but because the outdoor occasion of LED street lamp common-use words; for corroding, weather protection need add the baking vanish protection; become the obstruction of heat radiation link so again; still cause the temperature heat radiation bad, and produced the light decay problem.The light decay problem of LED street lamp causes many installations can't check and accept by the authentication of applying unit less than the LED street lamp in 1 year.
Studies show that common LED high power products input power is about 20% and can converts light to, remaining 80% electric energy all is converted to heat energy.Therefore, promote the luminous efficiency of LED, the heat of LED system looses to manage with design just becomes an important topic.By the research to the LED heat dissipation problem, discovery will solve heat dissipation problem, must set about from the most basic material, fundamentally solves high-capacity LED thermal source problem from inside to outside.
[summary of the invention]
To provide a kind of be main material with the aluminium oxide in order to address the above problem in the present invention, adds material such as the good graphite powder of heat conductivility, feldspar powder and become good heat dissipation effect, pyroconductivity height, strong, relatively low, the simple ceramic led circuit plate of technical process of operating environment temperature of non-oxidizability.
Technical scheme of the present invention is: a kind of manufacture method of ceramic PCB circuit board, comprise the material preparation, grind, mix, be shaped, baking is made into ceramic wafer, design on the enterprising line of ceramic wafer road then, on ceramic wafer, prepare circuit in the etching mode and finish ceramic PCB wiring board, it is characterized in that, wherein said raw material are formulated as: component one, with aluminium oxide, graphite powder, with feldspar powder according to 100: 10-15: the 26-30 weight ratio is prepared, component two is a tourmaline, contain at least a composition of ore of rare element, the weight of adding is the 4%-6% of component one total weight; Mix: the raw material of above-mentioned preparation are positioned over grinder, carry out fragmentation and grind into powder, and mix uniformly; Before adding the water stirring, carry out removing together the magnetic components operation; Form then; Dry: that the shaping thing is placed shady and cool place automatic drying; Described baking: the dry shaping thing that will be shaped is positioned in the high temperature furnace, is full of in high temperature furnace under the inert gas environment with 1400～1700 ℃ of high temperature sintering 50-70 minutes; Polish after the baking; Covering copper handles: on the shaping thing surface of polishing, after the single or double of the aluminium oxide ceramic substrate of high-insulativity is covered with the copper metal, environment heating via 1065～1085 ℃ of high temperature, make the copper metal produce eutectic melt because of high-temperature oxydation, diffusion and aluminium oxide material, copper metal and ceramic substrate are binded, form the Ceramic Composite metal substrate; Last etching circuit is made ceramic PCB circuit board.
The described magnetic components operation of removing: be meant and utilize magnetic bodies in powder, to move that eliminate magnetic composition in the powder fully, the raw material powder that will have magnetic components all takes off magnetic treatment in magnet processing apparatus.
Described shaping is meant puts into the material that stirs in the shaping frame, creates the shaping thing of even size.
In the described roasting procedure, be below 0.2% with the moisture content control in the described shaping thing.
After having finished the ceramic PCB circuit board of preparation, online road surfaces is enclosed insulating oil.
The invention has the beneficial effects as follows: this method is selected for use and can be allowed ceramic PCB circuit board have thermal conductivity preferably, and additional copper is sintered to eutectic melt on ceramic wafer, forms the Ceramic Composite metal substrate.Led light source directly is encapsulated on the ceramic heat-dissipating substrate, dispels the heat to ceramic circuit board, solved the LED high power light source and in installation process, produced the problem that thermal resistance causes light decay via LED crystal grain.
[description of drawings]
Fig. 1 is a handling process schematic diagram of the present invention.
[embodiment]
In order to make purpose of the present invention, technical scheme and advantage clearer, following examples are further elaborated to the present invention.Should be appreciated that specific embodiment described herein only in order to explanation the present invention, and be not used in qualification the present invention.
The basic mode of conducting heat has three kinds of heat conduction, thermal convection and thermal radiations.
Heat conduction is meant that under the situation that does not relate to substance transfer the higher position of heat temperature from object passes to the lower position of adjacent temperature, or passes to the process of contacted cryogenic object from high temp objects, is called for short heat conduction.
Thermal convection is meant the exchange heat that the fluid at differing temperatures each several part is caused by relative motion.The heat convection that extensively runs on the engineering is meant the heat transfer process between the solid wall surface that fluid is in contact with it, and it is the result of heat conduction and thermal convection comprehensive function.The principal element of decision heat transfer intensity is the motion conditions of convection current, and convection current comes down to utilize mobile gas or the overheated conductive surface of flow of liquid that heat is taken away.
Thermal radiation is meant that object is because of self having the phenomenon that temperature gives off energy.It is the electromagnetic radiation of wavelength between 0.1～100 micron, and is therefore different with other heat transfer types, and heat can directly not transmit in having the vacuum of intermediate medium.The sun transmits huge energy with radiation mode to the earth.Each object all has and the proportional thermal radiation capability of the biquadratic of its absolute temperature, also can absorb the radiant heat of surrounding environment to it, and the transfer of heat that radiation and absorption are comprehensively caused is called heat loss through radiation.
Heat loss through radiation can be dispersed into the heat of interior of articles in the air rapidly, and pottery just has such thermal radiation function.The superior isolation of pottery and radiating efficiency impel to such an extent that the LED illumination has entered the new porcelain epoch.The LED heat dissipation technology is along with the application development of high-capacity LED product, become each tame dealer and sought the subject under discussion that solves in succession, and the selection of LED heat-radiating substrate is also along with line design, size, the luminous efficiency of LED ... etc. the difference of condition difference in the design is arranged, directly led light source is encapsulated in the radiating effect that can improve led light source on the ceramic substrate greatly, its mainly act on be the heat that produces of led chip can be directly by ceramic substrate with thermal energy conduction in atmosphere.This project is primarily aimed at ceramic LED combination new light sources and does deep discussion.
The ceramic PCB circuit board that described in the present invention production method is produced just can carry out thermal radiation in the mode of far infrared, finishes the effect of heat radiation.The manufacture method of described ceramic PCB circuit board comprises that material prepares, grinds, mixes, is shaped, toasts and be made into ceramic wafer, then in the design of the enterprising line of ceramic wafer road, on ceramic wafer, prepare circuit in the etching mode and finish ceramic PCB wiring board,
Wherein said raw material are formulated as: component one, with aluminium oxide, graphite powder and feldspar powder according to 100: 10-15: the 26-30 weight ratio is prepared, component two is tourmaline, contains at least a composition of ore of rare element that the weight of adding is the 4%-6% of component one total weight; Mix: the raw material of above-mentioned preparation are positioned over grinder, carry out fragmentation and grind into powder, and mix uniformly; Before adding the water stirring, carry out removing together the magnetic components operation; Form then; Dry: that the shaping thing is placed shady and cool place automatic drying; Described baking: the dry shaping thing that will be shaped is positioned in the high temperature furnace, is full of in high temperature furnace under the inert gas environment with 1400～1700 ℃ of high temperature sintering 50-70 minutes; Polish after the baking; Covering copper handles: on the shaping thing surface of polishing, after the single or double of the aluminium oxide ceramic substrate of high-insulativity is covered with the copper metal, environment heating via 1065～1085 ℃ of high temperature, make the copper metal produce eutectic melt because of high-temperature oxydation, diffusion and aluminium oxide material, copper metal and ceramic substrate are binded, form the Ceramic Composite metal substrate; Last etching circuit is made ceramic PCB circuit board.
At the tourmaline that adds or contain the natural crystal of rare element, can be that single component also can be two kinds of mixtures, mostly the natural crystal that contains rare element be to adopt in granite, medical stone, mica, the germanium ore one or several to produce anionic natural crystal material.
Described mixing: the raw material of above-mentioned preparation are positioned over grinder, carry out fragmentation and grind into powder, and mix uniformly; Remove magnetic components: be meant and utilize magnetic bodies in powder, to move that eliminate magnetic composition in the powder fully, the raw material powder that will have magnetic components all takes off magnetic treatment in magnet processing apparatus; Stir: add the water of 1 times of mixture weight, stir uniformly; Be shaped: even mixture after being mixed is put into the size framework of demand, evenly smooth; Dry: that the shaping thing is placed shady and cool place automatic drying; Baking: the dry shaping thing that will be shaped is positioned in the high temperature furnace, is full of in high temperature furnace under the inert gas environment with 1400～1700 ℃ of high temperature sintering 50-70 minutes; Polishing: in the thick potsherd surface finish of baking, up to smooth; Covering copper handles: after the shaping thing single or double of polishing is covered with the copper metal, environment heating via 1065～1085 ℃ of high temperature, make the copper metal because of high-temperature oxydation, diffusion and aluminium oxide material produce eutectic melt, copper metal and ceramic substrate are binded, form the Ceramic Composite metal substrate; The etching circuit: Ceramic Composite metal substrate circuit as required develops, and puts into chemical solution again and carries out etching, covers insulating oil: insulating oil is coated in semi-finished product pottery PCB circuit board surface; Packing: the ceramic PCB circuit board that will be covered with behind the insulating oil is packed.
In the described roasting procedure, be below 0.2% with the moisture content control in the described shaping thing.
The above only is preferred embodiment of the present invention, not in order to restriction the present invention, all any modifications of being done within the spirit and principles in the present invention, is equal to and replaces and improvement etc., all should be included within protection scope of the present invention.
Claims (6)
1. the manufacture method of a ceramic PCB circuit board, comprise that material prepares, grinds, mixes, is shaped, toasts and be made into ceramic wafer, then in the enterprising line of ceramic wafer road design, on ceramic wafer, prepare circuit in the etching mode and finish ceramic PCB wiring board, it is characterized in that, wherein said raw material are formulated as: component one, with aluminium oxide, graphite powder and feldspar powder according to 100: 10-15: the 26-30 weight ratio is prepared, component two is tourmaline, contains at least a composition of ore of rare element that the weight of adding is the 4%-6% of component one total weight; Mix: the raw material of above-mentioned preparation are positioned over grinder, carry out fragmentation and grind into powder, and mix uniformly; Before adding the water stirring, carry out removing together the magnetic components operation; Form then; Dry: that the shaping thing is placed shady and cool place automatic drying; Described baking: the dry shaping thing that will be shaped is positioned in the high temperature furnace, is full of in high temperature furnace under the inert gas environment with 1400～1700 ℃ of high temperature sintering 50-70 minutes; Polish after the baking; Covering copper handles: on the shaping thing surface of polishing, after the single or double of the aluminium oxide ceramic substrate of high-insulativity is covered with the copper metal, environment heating via 1065～1085 ℃ of high temperature, make the copper metal produce eutectic melt because of high-temperature oxydation, diffusion and aluminium oxide material, copper metal and ceramic substrate are binded, form the Ceramic Composite metal substrate; Last etching circuit is made ceramic PCB circuit board.
2. according to the manufacture method of the described ceramic PCB circuit board of claim 1, it is characterized in that the described ore that contains rare element is granite, medical stone, mica or germanium ore.
3. according to the manufacture method of the described ceramic PCB circuit board of claim 1, it is characterized in that, the described magnetic components operation of removing: be meant and utilize magnetic bodies in powder, to move, eliminate magnetic composition in the powder fully, the raw material powder that will have magnetic components all takes off magnetic treatment in magnet processing apparatus.
4. according to the manufacture method of the described ceramic PCB circuit board of claim 1, it is characterized in that described shaping is meant puts into the material that stirs in the shaping frame, creates shaping thing of uniform size.
5. according to the manufacture method of claim 1 or 4 described ceramic PCB circuit boards, it is characterized in that, in the described roasting procedure, is below 0.2% with the moisture content control in the described shaping thing.
6. according to the manufacture method of the described ceramic PCB circuit board of claim 1, it is characterized in that after having finished the ceramic PCB circuit board of preparation, online road surfaces is enclosed insulating oil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110079000 CN102123563B (en) | 2011-03-30 | 2011-03-30 | Method for manufacturing ceramic PCB (Printed Circuit Board) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110079000 CN102123563B (en) | 2011-03-30 | 2011-03-30 | Method for manufacturing ceramic PCB (Printed Circuit Board) |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102123563A true CN102123563A (en) | 2011-07-13 |
| CN102123563B CN102123563B (en) | 2013-05-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110079000 Expired - Fee Related CN102123563B (en) | 2011-03-30 | 2011-03-30 | Method for manufacturing ceramic PCB (Printed Circuit Board) |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102692000A (en) * | 2012-06-04 | 2012-09-26 | 山西山地新源科技有限公司 | Graphite base plate for LED (light emitting diode) high-power illumination module and manufacturing technology of graphite base plate |
| CN102883539A (en) * | 2012-10-17 | 2013-01-16 | 厦门爱谱生电子科技有限公司 | Manufacturing process improvement method for pluggable flexible printed circuit (FPC) |
| CN103025130A (en) * | 2012-12-06 | 2013-04-03 | 赵建光 | Integrated multifunctional alumina ceramic electronic refrigeration radiator and production method thereof |
| CN105820557A (en) * | 2016-04-25 | 2016-08-03 | 惠州市环美盛新材料有限公司 | Flame-retardant heat-conducting nylon and preparation method thereof |
| CN106587970A (en) * | 2016-12-16 | 2017-04-26 | 东莞市翔龙能源科技有限公司 | Radiation radiating LED (Light-Emitting Diode) ceramic substrate and preparation method thereof |
| WO2018121217A1 (en) * | 2016-12-29 | 2018-07-05 | 比亚迪股份有限公司 | Heat dissipation substrate, preparation method and application thereof, and electronic component |
| WO2018121216A1 (en) * | 2016-12-29 | 2018-07-05 | 比亚迪股份有限公司 | Heat-dissipating substrate, preparation method and application thereof, and electronic component |
| CN110586935A (en) * | 2019-10-29 | 2019-12-20 | 追信数字科技有限公司 | Method for manufacturing copper-tourmaline composite heat dissipation material for CPU heat dissipation |
| CN115172571A (en) * | 2022-07-15 | 2022-10-11 | 广州市明电照明科技有限公司 | Circular super-uniform light LED chip and cutting and packaging method thereof |
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| CN106304624A (en) * | 2016-08-28 | 2017-01-04 | 广西小草信息产业有限责任公司 | A kind of PCB in integrated system and preparation method thereof |
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102692000A (en) * | 2012-06-04 | 2012-09-26 | 山西山地新源科技有限公司 | Graphite base plate for LED (light emitting diode) high-power illumination module and manufacturing technology of graphite base plate |
| CN102883539A (en) * | 2012-10-17 | 2013-01-16 | 厦门爱谱生电子科技有限公司 | Manufacturing process improvement method for pluggable flexible printed circuit (FPC) |
| CN102883539B (en) * | 2012-10-17 | 2015-04-08 | 厦门爱谱生电子科技有限公司 | Manufacturing process improvement method for pluggable flexible printed circuit (FPC) |
| CN103025130A (en) * | 2012-12-06 | 2013-04-03 | 赵建光 | Integrated multifunctional alumina ceramic electronic refrigeration radiator and production method thereof |
| CN103025130B (en) * | 2012-12-06 | 2015-04-01 | 南京中江新材料科技有限公司 | Integrated multifunctional alumina ceramic electronic refrigeration radiator and production method thereof |
| CN105820557B (en) * | 2016-04-25 | 2019-02-01 | 惠州市环美盛新材料有限公司 | A kind of flame-retarded heat-conducting nylon and preparation method thereof |
| CN105820557A (en) * | 2016-04-25 | 2016-08-03 | 惠州市环美盛新材料有限公司 | Flame-retardant heat-conducting nylon and preparation method thereof |
| CN106587970A (en) * | 2016-12-16 | 2017-04-26 | 东莞市翔龙能源科技有限公司 | Radiation radiating LED (Light-Emitting Diode) ceramic substrate and preparation method thereof |
| WO2018121217A1 (en) * | 2016-12-29 | 2018-07-05 | 比亚迪股份有限公司 | Heat dissipation substrate, preparation method and application thereof, and electronic component |
| WO2018121216A1 (en) * | 2016-12-29 | 2018-07-05 | 比亚迪股份有限公司 | Heat-dissipating substrate, preparation method and application thereof, and electronic component |
| CN110586935A (en) * | 2019-10-29 | 2019-12-20 | 追信数字科技有限公司 | Method for manufacturing copper-tourmaline composite heat dissipation material for CPU heat dissipation |
| CN110586935B (en) * | 2019-10-29 | 2021-12-17 | 常州品睿电子科技有限公司 | Method for manufacturing copper-tourmaline composite heat dissipation material for CPU heat dissipation |
| CN115172571A (en) * | 2022-07-15 | 2022-10-11 | 广州市明电照明科技有限公司 | Circular super-uniform light LED chip and cutting and packaging method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102123563B (en) | 2013-05-08 |
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