CN106304624A - A kind of PCB in integrated system and preparation method thereof - Google Patents
A kind of PCB in integrated system and preparation method thereof Download PDFInfo
- Publication number
- CN106304624A CN106304624A CN201610744360.1A CN201610744360A CN106304624A CN 106304624 A CN106304624 A CN 106304624A CN 201610744360 A CN201610744360 A CN 201610744360A CN 106304624 A CN106304624 A CN 106304624A
- Authority
- CN
- China
- Prior art keywords
- pcb
- powder
- molding
- aluminium oxide
- high temperature
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
Abstract
The present invention relates to the manufacture method of pcb board in a kind of integrated system, the making step including following: (1) weighs required each component respectively；(2) raw material that step (1) weighs mixed and carry out broken and grind into powder, the powder mixing that will obtain；(3) add water stirring by mixed powder, then forms；(4) baking molding makes it be dried；(5) polish after baking；(6) on the molding surface of polishing, after the single or double of the aluminium oxide ceramic substrate of high-insulativity is covered with copper metal；(7) finally etching circuit makes PCB.The invention has the beneficial effects as follows: by controlling the content of each raw material, making the collaborative promotion of performance of each raw material, the PCB good heat dissipation effect obtained, non-oxidizability are strong, excellent in mechanical performance.
Description
Technical field
The present invention relates to integrated system field, PCB being specifically related in a kind of integrated system and preparation method thereof.
Background technology
Integrated system is required to just control by PCB.The general thermal diffusivity of existing pcb board is the most bad,
During pcb board uses, often cause the damage of pcb board because of problems of excessive heat, the most currently on the market in the urgent need to
The pcb board structure that a kind of thermal diffusivity is stronger.
Summary of the invention
In sum, in order to overcome the deficiencies in the prior art, the technical problem to be solved is to provide a kind of collection
PCB in one-tenth system and preparation method thereof.
The technical scheme is that the PCB in a kind of integrated system, by as follows
The component of parts by weight is made: aluminium oxide 3-5 part, graphite powder 1-3 part, Muscovitum 5-10 part, tourmaline 3-5 part, cerium oxide 2-4
Part, barium tetratitanate 2-5 part, carbon fiber 3-7 part, phosphorus epoxy resin 1-3 part and filling aluminium hydrate 1-3 part.
A kind of manufacture method of the pcb board in integrated system, the making step including following:
(1) each component of following parts by weight is weighed respectively: aluminium oxide 3-5 part, graphite powder 1-3 part, Muscovitum 5-10 part, electricity
Gas stone 3-5 part, cerium oxide 2-4 part, barium tetratitanate 2-5 part, carbon fiber 3-7 part, phosphorus epoxy resin 1-3 part and filling aluminium hydrate
1-3 part；
(2) raw material that step (1) weighs mixed and carry out broken and grind into powder, the powder mixing that will obtain；
(3) add water stirring by mixed powder, then forms；
(4) baking molding makes it be dried；
(5) polish after baking；
(6) on the molding surface of polishing, the single or double of the aluminium oxide ceramic substrate of high-insulativity is covered with copper gold
After genus, heat via hot environment, make copper because of metal high-temperature oxydation, diffusion produce eutectic melt with aluminium oxide material, make copper gold
Belong to and binding with molding, form substrate；
(7) finally etching circuit makes PCB.
Further, step (4) make it be dried by following method baking molding: molding is positioned over high temperature furnace
In, it is full of in high temperature furnace under inert gas environment with 1000-1500 DEG C of high temperature sintering 30-50 minute.
Further, via the environment heating of high temperature 1000-1200 DEG C in step (6).
The invention has the beneficial effects as follows: by controlling the content of each raw material, make the collaborative promotion of performance of each raw material, obtain
PCB good heat dissipation effect, non-oxidizability strong, excellent in mechanical performance.
Detailed description of the invention
Being described principle and the feature of the present invention below in conjunction with instantiation, example is served only for explaining this
Bright, it is not intended to limit the scope of the present invention.
Embodiment one
A kind of manufacture method of the pcb board in integrated system, the making step including following:
(1) each component of following parts by weight is weighed respectively: aluminium oxide 3 parts, graphite powder 1 part, 5 parts of Muscovitum, tourmaline 3
Part, cerium oxide 2 parts, barium tetratitanate 2 parts, 3 parts of carbon fiber, phosphorus epoxy resin 1 part and filling aluminium hydrate 1 part；
(2) raw material that step (1) weighs mixed and carry out broken and grind into powder, the powder mixing that will obtain；
(3) add water stirring by mixed powder, then forms；
(4) baking molding makes it be dried, particularly as follows: be positioned in high temperature furnace by molding, is full of lazy in high temperature furnace
With 1000 DEG C of high temperature sinterings 30 minutes under property gaseous environment；
(5) polish after baking；
(6) on the molding surface of polishing, the single or double of the aluminium oxide ceramic substrate of high-insulativity is covered with copper gold
After genus, via 1000 DEG C of hot environment heating, copper because of metal high-temperature oxydation, diffusion is made to produce eutectic melt with aluminium oxide material,
Make copper metal bind with molding, form substrate；
(7) finally etching circuit makes PCB.
Embodiment two
A kind of manufacture method of the pcb board in integrated system, the making step including following:
(1) each component of following parts by weight is weighed respectively: aluminium oxide 4 parts, graphite powder 2 parts, 7 parts of Muscovitum, tourmaline 4
Part, cerium oxide 3 parts, barium tetratitanate 4 parts, 5 parts of carbon fiber, phosphorus epoxy resin 2 parts and filling aluminium hydrate 2 parts；
(2) raw material that step (1) weighs mixed and carry out broken and grind into powder, the powder mixing that will obtain；
(3) add water stirring by mixed powder, then forms；
(4) baking molding makes it be dried, particularly as follows: be positioned in high temperature furnace by molding, is full of lazy in high temperature furnace
With 1200 DEG C of high temperature sinterings 40 minutes under property gaseous environment；
(5) polish after baking；
(6) on the molding surface of polishing, the single or double of the aluminium oxide ceramic substrate of high-insulativity is covered with copper gold
After genus, via 1100 DEG C of hot environment heating, copper because of metal high-temperature oxydation, diffusion is made to produce eutectic melt with aluminium oxide material,
Make copper metal bind with molding, form substrate；
(7) finally etching circuit makes PCB.
Embodiment three
A kind of manufacture method of the pcb board in integrated system, the making step including following:
(1) each component of following parts by weight is weighed respectively: aluminium oxide 5 parts, graphite powder 3 parts, 10 parts of Muscovitum, tourmaline 5
Part, cerium oxide 4 parts, barium tetratitanate 5 parts, 7 parts of carbon fiber, phosphorus epoxy resin 3 parts and filling aluminium hydrate 3 parts；
(2) raw material that step (1) weighs mixed and carry out broken and grind into powder, the powder mixing that will obtain；
(3) add water stirring by mixed powder, then forms；
(4) baking molding makes it be dried, particularly as follows: be positioned in high temperature furnace by molding, is full of lazy in high temperature furnace
With 1500 DEG C of high temperature sinterings 30-50 minute under property gaseous environment；
(5) polish after baking；
(6) on the molding surface of polishing, the single or double of the aluminium oxide ceramic substrate of high-insulativity is covered with copper gold
After genus, via 1200 DEG C of hot environment heating, copper because of metal high-temperature oxydation, diffusion is made to produce eutectic melt with aluminium oxide material,
Make copper metal bind with molding, form substrate；
(7) finally etching circuit makes PCB.
The foregoing is only presently preferred embodiments of the present invention, not in order to limit the present invention, all spirit in the present invention and
Within principle, any modification, equivalent substitution and improvement etc. made, should be included within the scope of the present invention.
Claims (4)
1. the PCB in an integrated system, it is characterised in that be made up of the component of following parts by weight: aluminium oxide 3-5
Part, graphite powder 1-3 part, Muscovitum 5-10 part, tourmaline 3-5 part, cerium oxide 2-4 part, barium tetratitanate 2-5 part, carbon fiber 3-7 part,
Phosphorus epoxy resin 1-3 part and filling aluminium hydrate 1-3 part.
2. a manufacture method for the pcb board in integrated system, the making step including following:
(1) each component of following parts by weight is weighed respectively: aluminium oxide 3-5 part, graphite powder 1-3 part, Muscovitum 5-10 part, tourmaline
3-5 part, cerium oxide 2-4 part, barium tetratitanate 2-5 part, carbon fiber 3-7 part, phosphorus epoxy resin 1-3 part and filling aluminium hydrate 1-3
Part；
(2) raw material that step (1) weighs mixed and carry out broken and grind into powder, the powder mixing that will obtain；
(3) add water stirring by mixed powder, then forms；
(4) baking molding makes it be dried；
(5) polish after baking；
(6) on the molding surface of polishing, after the single or double of the aluminium oxide ceramic substrate of high-insulativity is covered with copper metal,
Heat via hot environment, make copper because of metal high-temperature oxydation, diffusion produce eutectic melt with aluminium oxide material, make copper metal and become
Shape thing binds, and forms substrate；
(7) finally etching circuit makes PCB.
Manufacture method the most according to claim 2, it is characterised in that toast molding by following method in step (4)
Make it be dried: to be positioned in high temperature furnace by molding, be full of under inert gas environment with 1000-1500 DEG C of high temperature in high temperature furnace
Sinter 30-50 minute.
Manufacture method the most according to claim 2, it is characterised in that via the ring of high temperature 1000-1200 DEG C in step (6)
Border is heated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610744360.1A CN106304624A (en) | 2016-08-28 | 2016-08-28 | A kind of PCB in integrated system and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610744360.1A CN106304624A (en) | 2016-08-28 | 2016-08-28 | A kind of PCB in integrated system and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106304624A true CN106304624A (en) | 2017-01-04 |
Family
ID=57676404
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610744360.1A Pending CN106304624A (en) | 2016-08-28 | 2016-08-28 | A kind of PCB in integrated system and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106304624A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3538549B2 (en) * | 1998-08-31 | 2004-06-14 | 京セラ株式会社 | Wiring board and method of manufacturing the same |
| CN102123563B (en) * | 2011-03-30 | 2013-05-08 | 江西华烨节能照明股份有限公司 | Method for manufacturing ceramic PCB (Printed Circuit Board) |
| CN103897406A (en) * | 2012-12-24 | 2014-07-02 | 三星电机株式会社 | Insulating film for printed circuit board having improved thermal conductivity, manufacturing method thereof, and printed circuit board using the same |
| CN105307391A (en) * | 2015-10-25 | 2016-02-03 | 淄博夸克医药技术有限公司 | Ceramic material specially for PCB |
-
2016
- 2016-08-28 CN CN201610744360.1A patent/CN106304624A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3538549B2 (en) * | 1998-08-31 | 2004-06-14 | 京セラ株式会社 | Wiring board and method of manufacturing the same |
| CN102123563B (en) * | 2011-03-30 | 2013-05-08 | 江西华烨节能照明股份有限公司 | Method for manufacturing ceramic PCB (Printed Circuit Board) |
| CN103897406A (en) * | 2012-12-24 | 2014-07-02 | 三星电机株式会社 | Insulating film for printed circuit board having improved thermal conductivity, manufacturing method thereof, and printed circuit board using the same |
| CN105307391A (en) * | 2015-10-25 | 2016-02-03 | 淄博夸克医药技术有限公司 | Ceramic material specially for PCB |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170104 |
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| RJ01 | Rejection of invention patent application after publication |