CN102123563B - Method for manufacturing ceramic PCB (Printed Circuit Board) - Google Patents
Method for manufacturing ceramic PCB (Printed Circuit Board) Download PDFInfo
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- CN102123563B CN102123563B CN 201110079000 CN201110079000A CN102123563B CN 102123563 B CN102123563 B CN 102123563B CN 201110079000 CN201110079000 CN 201110079000 CN 201110079000 A CN201110079000 A CN 201110079000A CN 102123563 B CN102123563 B CN 102123563B
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Abstract
The invention relates to a method for manufacturing a ceramic PCB (Printed Circuit Board), comprising the following steps: preparing materials, grinding, mixing, molding, and baking to manufacture a ceramic board; then carrying out circuit design on a ceramic board; preparing a circuit on the ceramic board in an etching manner; and finishing the ceramic PCB. The method is characterized in that the preparation of the raw materials is as follows: preparing aluminium oxide, graphite powder and feldspar powder at the weight ratio of 100:(10-150:(26-30), mixing, and carrying out a magnetic component removal process before stirring; then carrying out molding; drying; baking; placing a molded and dried product in a high-temperature furnace, and sintering in the high-temperature furnace at high temperature in the presence of inert gases; carrying out polishing after baking; forming the ceramic composite metal substrate after copper-coating treatment; and finally, etching the circuit to manufacture the ceramic PCB. In the ceramic PCB, the heat conductivity is better, and the problem of light attenuation caused by heat resistance generated by an LED (Light-Emitting Diode) high-power light source in an installation process is solved.
Description
[technical field]
The present invention relates to ceramic PCB circuit board, relate in particular to a kind of production program and technique of the ceramic PCB circuit board that dispels the heat by far infrared.
[background technology]
Along with global environmental consciousness is surging, energy saving has become a kind of inevitable trend, the LED industry is one of industry that this year, development potentiality preferably got most of the attention, and that the LED product has is energy-conservation, power saving, high efficiency, the reaction time is fast, life cycle is long, environmental protection and the advantage such as not mercurous.But because causing a potential technical problem " the serious light decay of LED street lamp ", the LED heat dissipation problem seriously restricted the development of LED industry, if the heat energy that produces when LED is luminous can't in time be derived, will make LED knot surface temperature too high, and then affect life cycle of the product, luminous efficiency, stability.And LED street lamp light decay problem is subject to the temperature impact exactly; for the design of heat-radiating substrate fin, radiating module painstakingly to obtaining good radiating effect; but due to the outdoor occasion of LED street lamp common-use words; for corroding, weather protection need to add the baking vanish protection; become so again the obstruction of heat radiation link; still cause the temperature heat radiation bad, and produced the light decay problem.The light decay problem of LED street lamp causes many installations can't check and accept by the authentication of applying unit less than the LED street lamp of a year.
Studies show that, common LED high power products input power is about 20% and can converts light to, and remaining 80% electric energy all is converted to heat energy.Therefore, promote the luminous efficiency of LED, the loose management of the heat of LED system just becomes an important topic with design.By the research to the LED heat dissipation problem, discovery will solve heat dissipation problem, must set about from the most basic material, fundamentally solves from inside to outside the high-capacity LED heat source.
[summary of the invention]
The present invention provides a kind of take aluminium oxide as main material for addressing the above problem, and adds that the materials such as the good graphite powder of heat conductivility, feldspar powder are made into good heat dissipation effect, pyroconductivity is high, non-oxidizability is strong, the operating environment temperature is relatively low, the simple ceramic LED circuit plate of technical process.
technical scheme of the present invention is: a kind of manufacture method of ceramic PCB circuit board, comprise material formulation, grind, mix, be shaped, baking is made into ceramic wafer, then in the road design of the enterprising line of ceramic wafer, prepare circuit in the etching mode on ceramic wafer and complete ceramic PCB wiring board, it is characterized in that, wherein said raw material are formulated as: component one, with aluminium oxide, graphite powder, with feldspar powder according to 100: 10-15: the 26-30 weight ratio is prepared, component two is tourmaline, at least a composition of ore that contains rare element, the weight that adds is the 4%-6% of component one total weight, mix: the raw material of above-mentioned preparation are positioned over grinder, carry out fragmentation and grind into powder, and mix uniformly, carried out before adding the water stirring together except the magnetic components operation, then form, dry: that molding is placed shady and cool place automatic drying, described baking: the dry molding that will be shaped is positioned in high temperature furnace, is full of in high temperature furnace under inert gas environment with 1400～1700 ℃ of high temperature sintering 50-70 minutes, polish after baking, covering copper processes: on the molding surface of polishing, after the single or double of the aluminium oxide ceramic substrate of high-insulativity is covered with the copper metal, environment heating via 1065～1085 ℃ of high temperature, make copper because of metal high-temperature oxydation, diffusion and aluminium oxide material produce eutectic melt, copper metal and ceramic substrate are binded, form the ceramic-metal composite substrate, last etching circuit is made ceramic PCB circuit board.
Described except the magnetic components operation: as to refer to utilize magnetic bodies to move in powder, eliminate magnetic composition in powder fully, will all take off magnetic treatment in magnet processing apparatus with the raw material powder of magnetic components.
Described shaping refers to the material that stirs is put in shaping frame, creates the molding of even size.
In described roasting procedure, be below 0.2% with the moisture content control in described molding.
After having completed the ceramic PCB circuit board of preparation, online road surfaces is enclosed insulating oil.
The invention has the beneficial effects as follows: the method is selected and can be allowed ceramic PCB circuit board have thermal conductivity preferably, and additional copper is sintered to eutectic melt on ceramic wafer, forms the ceramic-metal composite substrate.LED light source directly is encapsulated on ceramic heat-dissipating substrate, dispels the heat to ceramic circuit board via LED crystal grain, solved the LED high power light source and produce the problem that thermal resistance causes light decay in installation process.
[description of drawings]
Fig. 1 is handling process schematic diagram of the present invention.
[embodiment]
In order to make purpose of the present invention, technical scheme and advantage clearer, following examples are further elaborated to the present invention.Should be appreciated that specific embodiment described herein only in order to explain the present invention, is not intended to limit the present invention.
The basic mode of conducting heat has three kinds of hot conduction, thermal convection and thermal radiations.
Heat conduction refers in the situation that do not relate to substance transfer, and the position that heat temperature from object is higher passes to adjacent temperature lower position, or passes to the process of contacted cryogenic object from high temp objects, is called for short heat conduction.
Thermal convection refers to the exchange heat that the fluid each several part of different temperatures is caused by relative motion.The heat convection that extensively runs on engineering refers to the heat transfer process between solid wall surface that fluid is in contact with it, and it is the result of heat conduction and thermal convection comprehensive function.The principal element that determines heat transfer intensity is the motion conditions of convection current, and convection current is in fact to utilize the gas that flows or liquid to flow through the heat conductor surface heat is taken away.
Thermal radiation refers to that object gives off the phenomenon of energy because self having temperature.It is the electromagnetic radiation of wavelength between 0.1～100 micron, and is therefore different from other heat transfer types, and heat can directly not transmit in there is no the vacuum of intermediate medium.The sun transmits huge energy with radiation mode to the earth.Each object all has and the proportional thermal radiation capability of the biquadratic of its absolute temperature, also can absorb surrounding environment to its radiant heat, and the transfer of heat that radiation and absorption are comprehensively caused is called heat loss through radiation.
Heat loss through radiation can be rapidly the dissipation of heat of interior of articles in air, pottery just has such thermal radiation function.The superior isolation of pottery and radiating efficiency impel to such an extent that the LED illumination has entered the new porcelain epoch.The LED heat dissipation technology is along with the application development of high-capacity LED product, become the dealer of each family and in succession sought the subject under discussion that solves, and the selection of LED heat-radiating substrate is also along with line design, size, the luminous efficiency of LED ... etc. the difference of condition, difference in design is arranged, directly LED light source is encapsulated in the radiating effect that can greatly improve LED light source on ceramic substrate, its Main Function be the heat that produces of LED chip can be directly by ceramic substrate with thermal energy conduction in atmosphere.This project is done deep discussion mainly for ceramic LED combination new light sources.
The ceramic PCB circuit board produced of described production method, just can carry out thermal radiation in the mode of far infrared in the present invention, completes the effect of heat radiation.The manufacture method of described ceramic PCB circuit board comprises material formulation, grinds, mixes, is shaped, toasts and be made into ceramic wafer, then in the road design of the enterprising line of ceramic wafer, prepare circuit in the etching mode on ceramic wafer and complete ceramic PCB wiring board,
Wherein said raw material are formulated as: component one, with aluminium oxide, graphite powder and feldspar powder according to 100: 10-15: the 26-30 weight ratio is prepared, component two for tourmaline, contain at least a composition of ore of rare element, the weight that adds is the 4%-6% of component one total weight; Mix: the raw material of above-mentioned preparation are positioned over grinder, carry out fragmentation and grind into powder, and mix uniformly; Carried out before adding the water stirring together except the magnetic components operation; Then form; Dry: that molding is placed shady and cool place automatic drying; Described baking: the dry molding that will be shaped is positioned in high temperature furnace, is full of in high temperature furnace under inert gas environment with 1400～1700 ℃ of high temperature sintering 50-70 minutes; Polish after baking; Covering copper processes: on the molding surface of polishing, after the single or double of the aluminium oxide ceramic substrate of high-insulativity is covered with the copper metal, environment heating via 1065～1085 ℃ of high temperature, make copper because of metal high-temperature oxydation, diffusion and aluminium oxide material produce eutectic melt, copper metal and ceramic substrate are binded, form the ceramic-metal composite substrate; Last etching circuit is made ceramic PCB circuit board.
At the tourmaline that adds or contain the natural crystal of rare element, can be that single component can be also two kinds of mixtures, mostly the natural crystal that contains rare element be to adopt the natural crystal material of one or several generation anion in granite, medical stone, mica, germanium ore.
Described mixing: the raw material of above-mentioned preparation are positioned over grinder, carry out fragmentation and grind into powder, and mix uniformly; Remove magnetic components: refer to utilize magnetic bodies to move, eliminate magnetic composition in powder fully, will all take off magnetic treatment in magnet processing apparatus with the raw material powder of magnetic components in powder; Stir: add the water of 1 times of mixture weight, stir uniformly; Be shaped: the mixture after uniform stirring is put into the size framework of demand, evenly smoothed; Dry: that molding is placed shady and cool place automatic drying; Baking: the dry molding that will be shaped is positioned in high temperature furnace, is full of in high temperature furnace under inert gas environment with 1400～1700 ℃ of high temperature sintering 50-70 minutes; Polishing: in the thick potsherd surface finish of baking, until smooth; Covering copper processes: after the molding single or double of polishing is covered with the copper metal, environment heating via 1065～1085 ℃ of high temperature, make copper because of metal high-temperature oxydation, diffusion and aluminium oxide material produce eutectic melt, copper metal and ceramic substrate are binded, form the ceramic-metal composite substrate; The etching circuit: ceramic-metal composite substrate circuit as required develops, then puts into chemical solution and carry out etching, covers insulating oil: insulating oil is coated in semi-finished product pottery PCB circuit board surface; Packing: the ceramic PCB circuit board that will be covered with after insulating oil is packed.
In described roasting procedure, be below 0.2% with the moisture content control in described molding.
The above is only preferred embodiment of the present invention, not in order to limiting the present invention, all any modifications of doing within the spirit and principles in the present invention, is equal to and replaces and improvement etc., within all should being included in protection scope of the present invention.
Claims (6)
1. the manufacture method of a ceramic PCB circuit board, comprise material formulation, grind, mix, be shaped, toast and be made into ceramic wafer, then in the design of the enterprising line of ceramic wafer road, prepare circuit in the etching mode on ceramic wafer and complete ceramic PCB wiring board, it is characterized in that, wherein raw material are formulated as: component one, with aluminium oxide, graphite powder and feldspar powder according to 100: 10-15: the 26-30 weight ratio is prepared, component two for tourmaline, contain at least a composition of ore of rare element, the weight that adds is the 4%-6% of component one total weight; Mix: the raw material of above-mentioned preparation are positioned over grinder, carry out fragmentation and grind into powder, and mix uniformly; Carried out before adding the water stirring together except the magnetic components operation; Then form; Dry: that molding is placed shady and cool place automatic drying; Described baking: the dry molding that will be shaped is positioned in high temperature furnace, is full of in high temperature furnace under inert gas environment with 1400～1700 ℃ of high temperature sintering 50-70 minutes; Polish after baking; Covering copper processes: on the molding surface of polishing, after the single or double of the aluminium oxide ceramic substrate of high-insulativity is covered with the copper metal, environment heating via 1065～1085 ℃ of high temperature, make copper because of metal high-temperature oxydation, diffusion and aluminium oxide material produce eutectic melt, copper metal and ceramic substrate are binded, form the ceramic-metal composite substrate; Last etching circuit is made ceramic PCB circuit board.
2. the manufacture method of ceramic PCB circuit board according to claim 1, is characterized in that, the described ore that contains rare element is granite, medical stone, mica or germanium ore.
3. the manufacture method of ceramic PCB circuit board according to claim 1, it is characterized in that, described except the magnetic components operation: as to refer to utilize magnetic bodies to move in powder, eliminate magnetic composition in powder fully, will all take off magnetic treatment in magnet processing apparatus with the raw material powder of magnetic components.
4. the manufacture method of ceramic PCB circuit board according to claim 1, is characterized in that, described shaping refers to the material that stirs is put in shaping frame, creates molding of uniform size.
5. the manufacture method of according to claim 1 or 4 described ceramic PCB circuit boards, is characterized in that, in described roasting procedure, is below 0.2% with the moisture content control in described molding.
6. the manufacture method of ceramic PCB circuit board according to claim 1, is characterized in that, after having completed the ceramic PCB circuit board of preparation, online road surfaces is enclosed insulating oil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110079000 CN102123563B (en) | 2011-03-30 | 2011-03-30 | Method for manufacturing ceramic PCB (Printed Circuit Board) |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110079000 CN102123563B (en) | 2011-03-30 | 2011-03-30 | Method for manufacturing ceramic PCB (Printed Circuit Board) |
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| CN102123563A CN102123563A (en) | 2011-07-13 |
| CN102123563B true CN102123563B (en) | 2013-05-08 |
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| CN 201110079000 Expired - Fee Related CN102123563B (en) | 2011-03-30 | 2011-03-30 | Method for manufacturing ceramic PCB (Printed Circuit Board) |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106304624A (en) * | 2016-08-28 | 2017-01-04 | 广西小草信息产业有限责任公司 | A kind of PCB in integrated system and preparation method thereof |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102692000A (en) * | 2012-06-04 | 2012-09-26 | 山西山地新源科技有限公司 | Graphite base plate for LED (light emitting diode) high-power illumination module and manufacturing technology of graphite base plate |
| CN102883539B (en) * | 2012-10-17 | 2015-04-08 | 厦门爱谱生电子科技有限公司 | Manufacturing process improvement method for pluggable flexible printed circuit (FPC) |
| CN103025130B (en) * | 2012-12-06 | 2015-04-01 | 南京中江新材料科技有限公司 | Integrated multifunctional alumina ceramic electronic refrigeration radiator and production method thereof |
| CN105820557B (en) * | 2016-04-25 | 2019-02-01 | 惠州市环美盛新材料有限公司 | A kind of flame-retarded heat-conducting nylon and preparation method thereof |
| CN106587970A (en) * | 2016-12-16 | 2017-04-26 | 东莞市翔龙能源科技有限公司 | Radiation radiating LED (Light-Emitting Diode) ceramic substrate and preparation method thereof |
| CN108257922A (en) * | 2016-12-29 | 2018-07-06 | 比亚迪股份有限公司 | A kind of heat-radiating substrate and its preparation method and application and electronic component |
| CN108257923A (en) * | 2016-12-29 | 2018-07-06 | 比亚迪股份有限公司 | A kind of heat-radiating substrate and its preparation method and application and electronic component |
| CN110586935B (en) * | 2019-10-29 | 2021-12-17 | 常州品睿电子科技有限公司 | Method for manufacturing copper-tourmaline composite heat dissipation material for CPU heat dissipation |
| CN115172571B (en) * | 2022-07-15 | 2023-04-07 | 广州市明电照明科技有限公司 | Circular super-uniform light LED chip and cutting and packaging method thereof |
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| JP2009292683A (en) * | 2008-06-05 | 2009-12-17 | Wicera Co Ltd | Electromagnetic wave shielding ceramic and production method thereof |
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| CN101130461A (en) * | 2006-08-22 | 2008-02-27 | 于深 | Underlay substrate semiconductor material for illuminating and heat radiating |
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| CN102123563A (en) | 2011-07-13 |
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