CN203521463U - High-thermal conductivity LED-COB packaging substrate - Google Patents
High-thermal conductivity LED-COB packaging substrate Download PDFInfo
- Publication number
- CN203521463U CN203521463U CN201320632896.6U CN201320632896U CN203521463U CN 203521463 U CN203521463 U CN 203521463U CN 201320632896 U CN201320632896 U CN 201320632896U CN 203521463 U CN203521463 U CN 203521463U
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- Prior art keywords
- led
- packaging
- copper foil
- base plate
- heat conduction
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 26
- 239000000758 substrate Substances 0.000 title claims abstract description 25
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 32
- 239000000843 powder Substances 0.000 claims abstract description 31
- 239000011889 copper foil Substances 0.000 claims abstract description 27
- 229910003460 diamond Inorganic materials 0.000 claims abstract description 16
- 239000010432 diamond Substances 0.000 claims abstract description 16
- 239000000919 ceramic Substances 0.000 claims abstract description 7
- 230000004888 barrier function Effects 0.000 claims description 32
- 239000002245 particle Substances 0.000 claims description 18
- 239000000428 dust Substances 0.000 claims description 14
- 239000004593 Epoxy Substances 0.000 claims description 8
- 239000003822 epoxy resin Substances 0.000 claims description 8
- 229920000647 polyepoxide Polymers 0.000 claims description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- 239000004411 aluminium Substances 0.000 claims description 6
- 229920002050 silicone resin Polymers 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 4
- 238000009413 insulation Methods 0.000 abstract 3
- 238000001816 cooling Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 7
- 238000005538 encapsulation Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- -1 insulating barrier Substances 0.000 description 2
- 238000011031 large-scale manufacturing process Methods 0.000 description 2
- 238000001755 magnetron sputter deposition Methods 0.000 description 2
- ORILYTVJVMAKLC-UHFFFAOYSA-N adamantane Chemical compound C1C(C2)CC3CC1CC2C3 ORILYTVJVMAKLC-UHFFFAOYSA-N 0.000 description 1
- 229910001573 adamantine Inorganic materials 0.000 description 1
- 239000005030 aluminium foil Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000007766 curtain coating Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 235000021321 essential mineral Nutrition 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 125000001181 organosilyl group Chemical group [SiH3]* 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
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Abstract
The utility model relates to a high-thermal conductivity LED-COB packaging substrate (100) comprising a base (101) and a copper foil layer (103). The substrate is characterized in that an insulation layer (102) doped with diamond powders (105) is arranged between the base (101) and the copper foil layer (103). According to the scheme, because the diamond powders with the high heat conductivity coefficient are used for replacing the traditional ceramic powders and are doped into the insulation layer of the ED-COB packaging substrate, the heat conduction capability of the insulation layer is substantially improved and the cooling capacity of the packaging substrate is enhanced, so that the junction temperature of the LED chip is reduced; and the packaging substrate can be applied to high-power LED-COB packaging and the stability and the service life of the LED device are improved.
Description
Technical field
The utility model relates to LED lighting technical field, is a kind of LED-COB base plate for packaging of high heat conduction specifically.
Background technology
In recent years, white light LEDs development rapidly, with advantages such as its energy-saving and environmental protection, life-span length, will occupy whole illumination market gradually, be called as 21 century a new generation's light source.The life-span of LED is that the PN junction temperature by chip determines, and if LED junction temperature too high, also may produce look drift, the phenomenon such as bright dipping is inhomogeneous, affects its bright dipping.The key of improving this problem is to reduce LED junction temperature, and the radiator that the key of reduction junction temperature will have exactly, the heat that can in time LED be produced distribute.So can the heat dissipation problem of LED be to limit it obtain the more principal element of ten-strike on market.
Great power LED mainly adopts COB integration packaging mode at present, and this packaged type wants technique simple than SMD, and cost is lower, and it is better that light efficiency is also wanted.But because multi-chip is all integrated on a substrate, the requirement of heat radiation is wanted to high a lot of with regard to more conventional SMD encapsulation.
Conventionally the COB aluminium base adopting mainly contains the several parts in base material, insulating barrier, copper foil layer and reflector and forms, in above-mentioned several part, the conductive coefficient of base material aluminium and copper foil layer copper is all very high, and the conductive coefficient of insulating material epoxy (or organic siliconresin) is than poor several times of this two classes material, causing heat that LED chip sends to conduct to insulating barrier can not very fast spreading out, make heat all concentrate on insulating barrier, form a hot bottleneck.Cause the junction temperature of LED chip to reduce, the light decay of LED is speeded, useful life and reliability reduce.
In order to address this problem, on market, usual way is in epoxy (or organic siliconresin), to mix resistant to elevated temperatures special ceramics powder, this method can improve the coefficient of heat conduction of insulating barrier, improves its heat-sinking capability, and temperature can be conducted in base material and air.But the conductive coefficient of general pottery is much smaller than metallic aluminium, even high, lead ceramic conductive coefficient also only similar with metallic aluminium.In great power LED-COB encapsulation, the temperature of LED still can be higher.
Utility model content
For the problems referred to above, that the utility model provides is a kind of excellent radiation performance, the LED-COB base plate for packaging of high heat conduction, especially for the COB base plate for packaging of great power LED.
A LED-COB base plate for packaging for high heat conduction, it comprises: substrate and copper foil layer, it is characterized in that, between described substrate and described copper foil layer, be provided with the insulating barrier that is mixed with diamond dust.
Preferred embodiment described substrate is aluminium base, copper base or ceramic substrate according to one, and the shape of described substrate in vertical view is triangle, circle or polygon.
According to one preferred embodiment, the thickness of the described insulating barrier of being made by epoxy resin, organic siliconresin or epoxy modified silicone resin is 15～25 μ m.
According to one preferred embodiment, the thickness of described copper foil layer is 50～200 μ m.
Preferred embodiment described copper foil layer is provided with groove according to one, and described bottom portion of groove is provided with circuit, is furnished with and the described circuit LED chip being connected each other in an electrically conductive on described copper foil layer.
According to one preferred embodiment, on described copper foil layer, in the part not covered by described LED chip, be provided with reflector.
According to one preferred embodiment, on described reflector, be provided with phosphor powder layer.
According to one preferred embodiment, described diamond dust comprises bulky grain powder and small particle powder, wherein, the particle diameter of described small particle powder is 10～90nm, the particle diameter of described bulky grain powder is 1～5 μ m, and described bulky grain powder and described small particle powder are disperse shape and are evenly distributed in described insulating barrier.
The utility model has the advantage of:
1, perfect heat-dissipating.Owing to having mixed the very high diamond dust of conductive coefficient in insulating barrier, insulating barrier capacity of heat transmission is had significantly and promote, promoted base plate for packaging heat-sinking capability, LED chip junction temperature is reduced, can be applied to great power LED-COB encapsulation, promote stability and the useful life of LED device.
2, the thickness range of copper foil layer can be selected in very wide scope, can meet the requirement of high power LED device encapsulation conduction, heat radiation.
3, manufacture craft of the present utility model is simple, and production cost is lower, is applicable to large-scale production.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model;
Fig. 2 is the structural representation of insulating barrier of the present utility model.
Reference numerals list:
100: the LED-COB base plate for packaging of high heat conduction
101: substrate 102: insulating barrier 103: copper foil layer
104: reflector 105: diamond dust 106: white oil
201: bulky grain powder 202: small particle powder
301: groove
Embodiment
Below in conjunction with accompanying drawing, illustrate the utility model.But following examples are only illustrative, and protection range of the present utility model is not subject to the restriction of these embodiment.
Fig. 1 is structural representation of the present utility model.As shown in Figure 1, the LED-COB base plate for packaging 100 of high heat conduction of the present utility model, it comprises: substrate 101, insulating barrier 102 and copper foil layer 103.Insulating barrier 102 is covered in substrate 101.Copper foil layer 103 is arranged on insulating barrier 102.In insulating barrier 102, be mixed with diamond dust 105.
Insulating barrier 102 can be that epoxy resin is made.Insulating barrier 102 can be also that organic siliconresin is made.Insulating barrier 102 can also be that epoxy modified silicone resin is made.Epoxy modified silicone resin had both had the oil resistant of epoxy resin, corrosion-resistant, strong adhesion, feature that mechanical strength is good, had again that organosilicon is heat-resisting, water-fast, the feature of good electrical property, was the good resin of a kind of combination property.Its blend by epoxy resin and organic siliconresin, copolymerization or graft reaction reach and reduce epoxy resin internal stress, formation molecule intrinsic toughening, raising resistance to elevated temperatures, also improve organosilyl waterproof, grease proofing, oxidation resistant performance simultaneously.It is a kind of good electronic package material.
The thickness of insulating barrier 102 is 15～25 μ m.In insulating barrier 102, be mixed with diamond dust 105.Diamond dust 105 can comprise bulky grain powder 201 and small particle powder 202.Wherein, the particle diameter of small particle powder 202 can be 10～90nm.The particle diameter of bulky grain powder 201 can be 1～5 μ m.The bulky grain powder 201 of diamond dust (105) and small particle powder 202 sizes respectively, be disperse shape evenly divide ground cloth in insulating barrier (102).As shown in Figure 2.
Adamantine conductive coefficient is 900～2320W/ (mK), more high than the coefficient of heat conduction of general heat-stable ceramic powder, is the highest material of thermal conductivity in essential mineral.With diamond dust, be filled in insulating barrier as heat transfer medium, can greatly improve the radiating efficiency of LED-COB base plate for packaging.In addition, the mode that adopts large particle diameter powder to match with small particle diameter powder can make diamond dust 105 more be distributed in epoxy resin, organic siliconresin or the epoxy modified silicone resin of insulating barrier 102 even compact.Make the heat transfer of insulating barrier 102 more even, arrive best radiating effect.Thereby reduce the actual serviceability temperature of LED device, improve the life-span of LED, increase reliability.
The part not covered by LED chip on copper foil layer 103 can be provided with reflector 104.The light that LED chip sends can be reflected in reflector 104.
The phosphor powder layer that a layer thickness is 0.1～1000 μ m can also be set on reflector 104.Can improve the optical efficiency of LED.
The technological process of preparing the LED-COB base plate for packaging 100 of high heat conduction of the present utility model specifically comprises:
1) by the slurry of diamond dust 105 epoxy resin, organic siliconresin or epoxy modified silicone resin, fully stir, it is mixed;
2) substrate 101 is after cleaning, drying, and the mode by curtain coating or sputter forms a complete even and fine and close layer insulating 102 in substrate 101;
3) again by adopting the techniques such as magnetron sputtering directly at insulating barrier 102 copper-depositing on surface conductive films;
4) design circuit diagram, adopt etch process to produce required circuit diagram, then clean, be dried, apply reflector layer 104 and phosphor powder layer etc.
The utility model has the advantage of:
1, perfect heat-dissipating.Owing to having mixed the very high diamond dust of conductive coefficient in insulating barrier, insulating barrier capacity of heat transmission is had significantly and promote, promoted base plate for packaging heat-sinking capability, LED chip junction temperature is reduced, can be applied to great power LED-COB encapsulation, promote stability and the useful life of LED device.
2, the thickness range of copper foil layer can be selected in very wide scope, can meet the requirement of high power LED device encapsulation conduction, heat radiation.
3, manufacture craft of the present utility model is simple, and production cost is lower, is applicable to large-scale production.
It should be noted that; above-mentioned specific embodiment is exemplary; under above-mentioned instruction of the present utility model, those skilled in the art can carry out various improvement and distortion on the basis of above-described embodiment, and these improvement or distortion drop in protection range of the present utility model.It will be understood by those skilled in the art that specific descriptions are above in order to explain the purpose of this utility model, not for limiting the utility model.Protection range of the present utility model is limited by claim and equivalent thereof.
Claims (8)
1. the LED-COB base plate for packaging (100) of a high heat conduction, it comprises: substrate (101) and copper foil layer (103), it is characterized in that,
Between described substrate (101) and described copper foil layer (103), be provided with the insulating barrier (102) that is mixed with diamond dust (105).
2. the LED-COB base plate for packaging (100) of high heat conduction according to claim 1, is characterized in that,
Described substrate (101) is aluminium base, copper base or ceramic substrate,
The shape of described substrate (101) in vertical view is triangle, circle or polygon.
3. the LED-COB base plate for packaging (100) of high heat conduction according to claim 1, is characterized in that,
The thickness of the described insulating barrier (102) of being made by epoxy resin, organic siliconresin or epoxy modified silicone resin is 15～25 μ m.
4. the LED-COB base plate for packaging (100) of high heat conduction according to claim 1, is characterized in that, the thickness of described copper foil layer (103) is 50～200 μ m.
5. the LED-COB base plate for packaging (100) of high heat conduction according to claim 4, is characterized in that,
Described copper foil layer (103) is provided with groove (301), and described groove (301) bottom is provided with circuit,
On described copper foil layer (103), be furnished with and the described circuit LED chip being connected each other in an electrically conductive.
6. the LED-COB base plate for packaging (100) of high heat conduction according to claim 5, is characterized in that, in the upper reflector (104) that is provided with in the part not covered by described LED chip of described copper foil layer (103).
7. the LED-COB base plate for packaging (100) of high heat conduction according to claim 6, is characterized in that, described reflector is provided with phosphor powder layer on (104).
8. according to the LED-COB base plate for packaging (100) of the high heat conduction one of claim 1 to 7 Suo Shu, it is characterized in that, described diamond dust (105) comprises bulky grain powder (201) and small particle powder (202),
Wherein, the particle diameter of described small particle powder (202) is 10～90nm, and the particle diameter of described bulky grain powder (201) is 1～5 μ m,
And described bulky grain powder (201) and described small particle powder (202) are disperse shape and are evenly distributed in described insulating barrier (102).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320632896.6U CN203521463U (en) | 2013-10-14 | 2013-10-14 | High-thermal conductivity LED-COB packaging substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320632896.6U CN203521463U (en) | 2013-10-14 | 2013-10-14 | High-thermal conductivity LED-COB packaging substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203521463U true CN203521463U (en) | 2014-04-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320632896.6U Expired - Fee Related CN203521463U (en) | 2013-10-14 | 2013-10-14 | High-thermal conductivity LED-COB packaging substrate |
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| Country | Link |
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| CN (1) | CN203521463U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104576908A (en) * | 2014-12-23 | 2015-04-29 | 苏州汉克山姆照明科技有限公司 | LED package substrate |
| CN109065529A (en) * | 2018-09-27 | 2018-12-21 | 武汉华星光电技术有限公司 | Area source, preparation method and the display device using the area source |
| CN110099508A (en) * | 2018-01-29 | 2019-08-06 | 铨威技研股份有限公司 | Printed circuit board base board and its preparation method |
-
2013
- 2013-10-14 CN CN201320632896.6U patent/CN203521463U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104576908A (en) * | 2014-12-23 | 2015-04-29 | 苏州汉克山姆照明科技有限公司 | LED package substrate |
| CN110099508A (en) * | 2018-01-29 | 2019-08-06 | 铨威技研股份有限公司 | Printed circuit board base board and its preparation method |
| CN109065529A (en) * | 2018-09-27 | 2018-12-21 | 武汉华星光电技术有限公司 | Area source, preparation method and the display device using the area source |
| WO2020062525A1 (en) * | 2018-09-27 | 2020-04-02 | 武汉华星光电技术有限公司 | Panel light source, preparation method therefor and display apparatus using panel light source |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140402 Termination date: 20181014 |