CN205202355U - Copper base copper -clad plate of ceramic film structure - Google Patents
Copper base copper -clad plate of ceramic film structure Download PDFInfo
- Publication number
- CN205202355U CN205202355U CN201521013706.8U CN201521013706U CN205202355U CN 205202355 U CN205202355 U CN 205202355U CN 201521013706 U CN201521013706 U CN 201521013706U CN 205202355 U CN205202355 U CN 205202355U
- Authority
- CN
- China
- Prior art keywords
- copper
- layer
- clad plate
- copper foil
- foil layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The utility model discloses a copper base copper -clad plate of ceramic film structure, including setting up in the copper layer of bottom, the upper surface on this copper layer is the rectangle describes the top on copper layer is provided with electrically conductive copper foil layer the copper layer with the coating has an insulating layer of being made by aluminium oxide and epoxy between the copper foil layer, and the insulating layer with be provided with anti oxidation thin film layer between the copper foil layer the upper surface of copper foil layer is provided with the heat dissipation sheet layer, and the louvre has evenly been offered to its lower surface to the upper surface of heat dissipation sheet layer. Through being provided with the insulating layer of making by aluminium oxide and epoxy, can satisfy the job requirement of copper base copper -clad plate under high temperature environment betterly, through being provided with anti oxidation thin film layer, can improve its antioxidant activity, through being provided with heat dissipation sheet layer and louvre, can improve its heat dispersion.
Description
Technical field
The utility model relates to circuit board technology field, particularly relates to a kind of copper base copper-clad plate of ceramic membrane structure.
Background technology
Along with the develop rapidly of electronics industry, the volume size of electronic product is more and more less, and power density is increasing, and solving heat dissipation problem is to one of electronics industry design huge challenge.Metal-based copper-clad plate is one of effective means solving heat dissipation problem beyond doubt.Metal-based copper-clad plate is a kind of copper-clad plate having good heat radiating function, and it is made up of the three-decker of uniqueness, is circuit layer, thermally conductive insulating layer and metal-based layer respectively.The operation principle of metal-based copper-clad plate is: power device surface mount is at circuit layer, and the heat that device produces is transmitted to metal-based layer by insulating barrier, is then diffused into module-external by metal substrate, realizes the heat radiation to device.High heat-conducting copper substrate is a kind of heat dissipation type high copper-clad plate of being made up after hot pressing of Copper Foil, high-heat-conductivity glue layer and copper coin, is widely used in the wiring board such as LED, igniter, power supply, backlight of high-power height heat radiation.Copper coin is the baseplate material during printed circuit board manufactures, and it mainly plays interconnection, insulation and support to printed circuit board, has a great impact the transmission speed of signal in circuit, energy loss and characteristic impedance etc.
Copper base copper-clad plate copper coin as matrix, by add heat filling to reach radiating effect.The key of current manufactured copper base copper-clad plate is insulating barrier, and existing insulating barrier mainly soaks with electronic glass-fiber cloth or other reinforcing material with resin, shaping through high-temperature baking semi-solid preparation; The weak point of this technical scheme is: obtained insulating barrier thermal resistance is large, poor radiation, is difficult to the needs meeting high-power, high radiating electronic product.The radiating effect of copper base copper-clad plate simultaneously needs to be improved further.
Utility model content
The purpose of this utility model is to overcome the deficiencies in the prior art, provides a kind of copper base copper-clad plate of ceramic membrane structure.
The utility model is achieved through the following technical solutions:
A kind of copper base copper-clad plate of ceramic membrane structure, comprise the copper plate layer being arranged at bottom, the rectangular shape of upper surface of this copper plate layer, the copper foil layer of conduction is provided with above described copper plate layer, the insulating barrier be made up of aluminium oxide and epoxy resin is coated with between described copper plate layer and described copper foil layer, and oxidation barrier film layer is provided with between described insulating barrier and described copper foil layer, the upper surface of described copper foil layer is provided with heat radiation flaggy, and evenly offers louvre at the upper surface of described heat radiation flaggy to its lower surface.
As optimal technical scheme of the present utility model, described insulating barrier and oxidation barrier film layer are flaky texture.
As optimal technical scheme of the present utility model, described copper plate layer and copper foil layer are film like structures.
As optimal technical scheme of the present utility model, the thickness of described insulating barrier is 50 μm-100 μm.
As optimal technical scheme of the present utility model, described heat radiation flaggy is arranged on the upper surface of copper foil layer in the mode of coating.
As optimal technical scheme of the present utility model, described louvre is circular.
Compared with prior art, the beneficial effects of the utility model are: the utility model, by being provided with the insulating barrier be made up of aluminium oxide and epoxy resin, can meet copper base copper-clad plate job requirement in high temperature environments preferably; By being provided with oxidation barrier film layer, its antioxygenic property can be improved; By being provided with heat radiation flaggy and louvre, its heat dispersion can be improved.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Detailed description of the invention
In order to make the purpose of this utility model, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the utility model, and be not used in restriction the utility model.
Refer to Fig. 1, Fig. 1 is structural representation of the present utility model.
The copper base copper-clad plate of described a kind of ceramic membrane structure, comprise the copper plate layer 1 being arranged at bottom, the rectangular shape of upper surface of this copper plate layer 1, the copper foil layer 2 of conduction is provided with above described copper plate layer 1, between described copper plate layer 1 and described copper foil layer 2, be coated with the insulating barrier 3 be made up of aluminium oxide and epoxy resin, the thickness of described insulating barrier 3 is 50 μm-100 μm.By being provided with the insulating barrier be made up of aluminium oxide and epoxy resin, copper base copper-clad plate job requirement in high temperature environments can be met preferably.
Between described insulating barrier 3 and described copper foil layer 2, be provided with oxidation barrier film layer 4, the upper surface of described copper foil layer 2 be provided with heat radiation flaggy 5, and evenly offer louvre 6 at the upper surface of described heat radiation flaggy 5 to its lower surface, described louvre 6 is circular.By being provided with oxidation barrier film layer, its antioxygenic property can be improved; By being provided with heat radiation flaggy and louvre, its heat dispersion can be improved.
Described insulating barrier 3 and oxidation barrier film layer 4 are flaky texture, and described copper plate layer 1 and copper foil layer 2 are film like structures.
Described heat radiation flaggy 5 is arranged on the upper surface of copper foil layer 2 in the mode of coating.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all do within spirit of the present utility model and principle any amendment, equivalent to replace and improvement etc., all should be included within protection domain of the present utility model.
Claims (6)
1. the copper base copper-clad plate of a ceramic membrane structure, it is characterized in that: comprise the copper plate layer (1) being arranged at bottom, the rectangular shape of upper surface of this copper plate layer (1), the copper foil layer (2) of conduction is provided with in the top of described copper plate layer (1), the insulating barrier (3) be made up of aluminium oxide and epoxy resin is coated with between described copper plate layer (1) and described copper foil layer (2), and oxidation barrier film layer (4) is provided with between described insulating barrier (3) and described copper foil layer (2), the upper surface of described copper foil layer (2) is provided with heat radiation flaggy (5), and evenly offer louvre (6) at the upper surface of described heat radiation flaggy (5) to its lower surface.
2. the copper base copper-clad plate of ceramic membrane structure according to claim 1, is characterized in that: described insulating barrier (3) and oxidation barrier film layer (4) are flaky texture.
3. the copper base copper-clad plate of ceramic membrane structure according to claim 2, is characterized in that: described copper plate layer (1) and copper foil layer (2) are film like structures.
4. the copper base copper-clad plate of ceramic membrane structure according to claim 1, is characterized in that: the thickness of described insulating barrier (3) is 50 μm-100 μm.
5. the copper base copper-clad plate of ceramic membrane structure according to claim 1, is characterized in that: described heat radiation flaggy (5) is arranged on the upper surface of copper foil layer (2) in the mode be coated with.
6. the copper base copper-clad plate of ceramic membrane structure according to claim 1, is characterized in that: described louvre (6) is for circular.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521013706.8U CN205202355U (en) | 2015-12-08 | 2015-12-08 | Copper base copper -clad plate of ceramic film structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521013706.8U CN205202355U (en) | 2015-12-08 | 2015-12-08 | Copper base copper -clad plate of ceramic film structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205202355U true CN205202355U (en) | 2016-05-04 |
Family
ID=55840092
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521013706.8U Active CN205202355U (en) | 2015-12-08 | 2015-12-08 | Copper base copper -clad plate of ceramic film structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205202355U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108565253A (en) * | 2018-01-23 | 2018-09-21 | 维沃移动通信有限公司 | A kind of conductive structure and preparation method thereof, mobile terminal |
-
2015
- 2015-12-08 CN CN201521013706.8U patent/CN205202355U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108565253A (en) * | 2018-01-23 | 2018-09-21 | 维沃移动通信有限公司 | A kind of conductive structure and preparation method thereof, mobile terminal |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102692000A (en) | Graphite base plate for LED (light emitting diode) high-power illumination module and manufacturing technology of graphite base plate | |
| CN203446104U (en) | Insulating thermal conductive substrate | |
| CN205202355U (en) | Copper base copper -clad plate of ceramic film structure | |
| CN106783753A (en) | Semiconductor devices | |
| CN207011077U (en) | A kind of multilayer circuit board that can improve heat-sinking capability | |
| CN203219607U (en) | High-heat-conduction flexible LED lead plate | |
| CN205364691U (en) | Good copper -clad plate of heat dissipation function | |
| CN204046918U (en) | One heat dissipation type circuit board | |
| CN205124122U (en) | Copper -clad plate of low thermal resistance metal base | |
| CN204131823U (en) | Novel high heat-conduction circuit board | |
| CN207766651U (en) | A kind of low thermal resistance metal-based copper-clad plate | |
| CN205124123U (en) | Copper -clad plate of high heat conduction copper of high proof voltage base | |
| CN203968561U (en) | A kind of heat abstractor and electronic equipment | |
| CN206446211U (en) | A kind of high proof voltage aluminum-based copper-clad plate | |
| CN200994224Y (en) | Printed circuit board medium structure | |
| CN105430870A (en) | Metal-based copper-clad plate with low thermal resistance | |
| CN210928144U (en) | Radiating circuit board with enlarged radiating surface | |
| CN207283915U (en) | A kind of wiring board of perfect heat-dissipating | |
| CN206932463U (en) | A kind of high-temp resistant type circuit board | |
| CN206932465U (en) | A kind of porous heat dissipation type circuit board | |
| CN202308070U (en) | Light-emitting diode (LED) device with heat conductivity, heat dissipation, insulation and pressure resistance | |
| CN206042505U (en) | Novel PCB (printed circuit board) | |
| CN203697602U (en) | Aluminum-based copper-clad plate with ceramic thin film structure | |
| CN206302629U (en) | Silver paste cross-line printed wiring board | |
| CN203482488U (en) | Circuit board with good thermal conductivity |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |