CN105430870A - Metal-based copper-clad plate with low thermal resistance - Google Patents
Metal-based copper-clad plate with low thermal resistance Download PDFInfo
- Publication number
- CN105430870A CN105430870A CN201510870224.2A CN201510870224A CN105430870A CN 105430870 A CN105430870 A CN 105430870A CN 201510870224 A CN201510870224 A CN 201510870224A CN 105430870 A CN105430870 A CN 105430870A
- Authority
- CN
- China
- Prior art keywords
- metal
- heat
- clad plate
- based copper
- thermal resistance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000002184 metal Substances 0.000 title claims abstract description 32
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 32
- 239000003822 epoxy resin Substances 0.000 claims abstract description 15
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000011889 copper foil Substances 0.000 claims abstract description 8
- 238000010438 heat treatment Methods 0.000 claims description 14
- 238000003466 welding Methods 0.000 claims description 9
- 239000004411 aluminium Substances 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 abstract description 14
- 239000000463 material Substances 0.000 abstract description 3
- 239000006185 dispersion Substances 0.000 abstract description 2
- 238000001816 cooling Methods 0.000 abstract 2
- 239000012528 membrane Substances 0.000 abstract 2
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
- B32B15/017—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of aluminium or an aluminium alloy, another layer being formed of an alloy based on a non ferrous metal other than aluminium
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/06—Coating on the layer surface on metal layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/26—Polymeric coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2305/00—Condition, form or state of the layers or laminate
- B32B2305/02—Cellular or porous
- B32B2305/026—Porous
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/302—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/12—Copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/24—Aluminium
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2363/00—Epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a metal-based copper-clad plate with low thermal resistance. The metal-based copper-clad substrate comprises a metal substrate arranged at the bottom, wherein the upper surface of the metal substrate is rectangular; an electroconductive copper foil layer is arranged above the metal substrate; the upper surface of the copper foil layer is coated with a heat conducting epoxy resin layer; the upper surface of the heat conducting epoxy resin layer is coated with a weld membrane; a heat sink is pressed on and covers the weld membrane; and cooling holes are formed in the heat sink. Through arranging the heat conducting epoxy resin layer, the metal-based copper-clad plate has excellent peeling strength and heat resistance and the heat conductivity of the metal-based copper-clad plate can be improved; meanwhile, since a metalized circuit layer with heat conductivity and weldability is formed on the metal substrate, the metal-based copper-clad plate has good heat dispersion performance; through arrangement of the heat sink and the cooling holes, heat resistance can be reduced to the great extent and the use of a large quantity of material with low heat resistance is avoided.
Description
Technical field
The present invention relates to circuit board technology field, particularly relate to a kind of low thermal resistance metal-based copper-clad plate.
Background technology
Along with the develop rapidly of electronics industry, the volume size of electronic product is more and more less, and power density is increasing, and solving heat dissipation problem is to one of electronics industry design huge challenge.Metal-based copper-clad plate is one of effective means solving heat dissipation problem beyond doubt.Metal-based copper-clad plate is a kind of copper-clad plate having good heat radiating function, and it is made up of the three-decker of uniqueness, is circuit layer, thermally conductive insulating layer and metal-based layer respectively.The operation principle of metal-based copper-clad plate is: power device surface mount is at circuit layer, and the heat that device produces is transmitted to metal-based layer by insulating barrier, is then diffused into module-external by metal substrate, realizes the heat radiation to device.
Above-mentioned existing metal-based copper-clad plate, because the thermal resistance of its heat conductive insulating adhesive linkage or title composite layer is comparatively large, generally all more than 0.5.Due to its metal substrate and heat conductive insulating adhesive linkage heat dispersion not ideal enough, simultaneously because of metallic substrate surfaces and radiating insulating adhesive linkage resin-bonded firm not, easy generation metal substrate is separated with heat conductive insulating adhesive linkage, proof voltage is lower, and the problem such as easily to puncture, thus have a strong impact on its durable service behaviour, especially when being used as LED illumination substrate and high power converter circuit substrate, because substrate is overheated, light decay can be caused to exhaust and even to burn out LED luminescent diode.
Therefore, a kind ofly can make that thermal conductivity is high, thermal resistance is little, durability is strong, the metal-based copper-clad plate of good stability urgently occurs.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art, providing a kind of low thermal resistance metal-based copper-clad plate.
The present invention is achieved through the following technical solutions:
A kind of low thermal resistance metal-based copper-clad plate, comprise the metallic plate being arranged at bottom, the rectangular shape of upper surface of this metallic plate, the copper foil layer of conduction is provided with above described metallic plate, heat-conduction epoxy resin layer is coated with at the upper surface of described copper foil layer, be coated with welding film at described heat-conduction epoxy resin layer upper surface, described welding film covered heating panel, described heating panel offers louvre.
As the preferred technical solution of the present invention, described metallic plate is aluminium sheet or copper coin.
As the preferred technical solution of the present invention, described heating panel is that metal material is made, and described louvre is evenly arranged on described heating panel, and described louvre is circular.
As the preferred technical solution of the present invention, the thickness of described heat-conduction epoxy resin layer is 60 μm-100 μm.
As the preferred technical solution of the present invention, the thickness of described welding film is 60 μm-100 μm.
Compared with prior art, the invention has the beneficial effects as follows: the present invention is by being provided with the epoxy resin layer of heat conduction, metal-based copper-clad plate is made to have good peel strength and thermal endurance, its heat-conducting effect can be improved, form the metallization circuit layer with thermal conductivity and solderability on metallic substrates, its perfect heat-dissipating simultaneously, by being provided with heating panel, and offer louvre, lowly to greatest extent decrease thermal resistance, without the need to using a large amount of low thermal resistance material.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
Refer to Fig. 1, Fig. 1 is structural representation of the present invention.
Described a kind of low thermal resistance metal-based copper-clad plate, comprise the metallic plate 1 being arranged at bottom, the rectangular shape of upper surface of this metallic plate 1, the copper foil layer 2 of conduction is provided with above described metallic plate 1, heat-conduction epoxy resin layer 3 is coated with at the upper surface of described copper foil layer 2, be coated with welding film 4 at described heat-conduction epoxy resin layer 3 upper surface, described welding film 4 covered heating panel 5, described heating panel 5 offers louvre 6.
Described metallic plate 1 is aluminium sheet or copper coin, and described heating panel 5 is made for metal material, and described louvre 6 is evenly arranged on described heating panel 5, and described louvre 6 is circular.
The thickness of described heat-conduction epoxy resin layer 3 is for being 100 μm-150 μm, and the thickness of described heat-conduction epoxy resin layer 3 is 60 μm-100 μm, and the thickness of described welding film 4 is 60 μm-100 μm.
By being provided with the epoxy resin layer of heat conduction, metal-based copper-clad plate is made to have good peel strength and thermal endurance, its heat-conducting effect can be improved, form the metallization circuit layer with thermal conductivity and solderability on metallic substrates simultaneously, its perfect heat-dissipating, by being provided with heating panel, and offers louvre, lowly to greatest extent decrease thermal resistance, without the need to using a large amount of low thermal resistance material.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments done within the spirit and principles in the present invention, equivalent replacement and improvement etc., all should be included within protection scope of the present invention.
Claims (5)
1. a low thermal resistance metal-based copper-clad plate, comprise the metallic plate (1) being arranged at bottom, the rectangular shape of upper surface of this metallic plate (1), the copper foil layer (2) of conduction is provided with in the top of described metallic plate (1), it is characterized in that: be coated with heat-conduction epoxy resin layer (3) at the upper surface of described copper foil layer (2), welding film (4) is coated with at described heat-conduction epoxy resin layer (3) upper surface, described welding film (4) covers heating panel (5), described heating panel (5) has offered louvre (6).
2. a kind of low thermal resistance metal-based copper-clad plate according to claim 1, is characterized in that: described metallic plate (1) is aluminium sheet or copper coin.
3. a kind of low thermal resistance metal-based copper-clad plate according to claim 1, it is characterized in that: described heating panel (5) is made for metal material, and described louvre (6) is evenly arranged on described heating panel (5), described louvre (6) is circular.
4. a kind of low thermal resistance metal-based copper-clad plate according to claim 1, is characterized in that: the thickness of described heat-conduction epoxy resin layer (3) is 60 μm-100 μm.
5. a kind of low thermal resistance metal-based copper-clad plate according to claim 1, is characterized in that: the thickness of described welding film (4) is 60 μm-100 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510870224.2A CN105430870A (en) | 2015-11-30 | 2015-11-30 | Metal-based copper-clad plate with low thermal resistance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510870224.2A CN105430870A (en) | 2015-11-30 | 2015-11-30 | Metal-based copper-clad plate with low thermal resistance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105430870A true CN105430870A (en) | 2016-03-23 |
Family
ID=55508717
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510870224.2A Withdrawn CN105430870A (en) | 2015-11-30 | 2015-11-30 | Metal-based copper-clad plate with low thermal resistance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105430870A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110116529A (en) * | 2019-04-28 | 2019-08-13 | 英鸿纳米科技股份有限公司 | A kind of composite nano fibre sheet material |
| CN113115510A (en) * | 2021-03-10 | 2021-07-13 | 深圳市宏杰兴业科技有限公司 | Printed circuit board heat dissipation system using high-thermal-conductivity substrate |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10173097A (en) * | 1996-10-09 | 1998-06-26 | Matsushita Electric Ind Co Ltd | Sheetlike substance for heat conductive substrate, its manufacture, heat conductive substrate using it and its manufacture |
| CN102516718A (en) * | 2011-12-01 | 2012-06-27 | 珠海全宝电子科技有限公司 | Resin composition and metal-based copper-clad plate using resin composition as heat conducting insulation layer |
| CN202998656U (en) * | 2012-11-09 | 2013-06-12 | 苏州赛伍应用技术有限公司 | Metal based copper clad plate |
| CN104610707A (en) * | 2015-01-19 | 2015-05-13 | 珠海全宝电子科技有限公司 | Metal-base copper clad laminate manufactured through high-performance RCC (resin coated copper foil) and applied to high-power LED |
| CN205124122U (en) * | 2015-11-30 | 2016-03-30 | 惠州市博宇科技有限公司 | Copper -clad plate of low thermal resistance metal base |
-
2015
- 2015-11-30 CN CN201510870224.2A patent/CN105430870A/en not_active Withdrawn
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10173097A (en) * | 1996-10-09 | 1998-06-26 | Matsushita Electric Ind Co Ltd | Sheetlike substance for heat conductive substrate, its manufacture, heat conductive substrate using it and its manufacture |
| CN102516718A (en) * | 2011-12-01 | 2012-06-27 | 珠海全宝电子科技有限公司 | Resin composition and metal-based copper-clad plate using resin composition as heat conducting insulation layer |
| CN202998656U (en) * | 2012-11-09 | 2013-06-12 | 苏州赛伍应用技术有限公司 | Metal based copper clad plate |
| CN104610707A (en) * | 2015-01-19 | 2015-05-13 | 珠海全宝电子科技有限公司 | Metal-base copper clad laminate manufactured through high-performance RCC (resin coated copper foil) and applied to high-power LED |
| CN205124122U (en) * | 2015-11-30 | 2016-03-30 | 惠州市博宇科技有限公司 | Copper -clad plate of low thermal resistance metal base |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110116529A (en) * | 2019-04-28 | 2019-08-13 | 英鸿纳米科技股份有限公司 | A kind of composite nano fibre sheet material |
| CN110116529B (en) * | 2019-04-28 | 2022-03-18 | 台州蓝锐机电科技有限公司 | Composite nanofiber sheet |
| CN113115510A (en) * | 2021-03-10 | 2021-07-13 | 深圳市宏杰兴业科技有限公司 | Printed circuit board heat dissipation system using high-thermal-conductivity substrate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20160323 |
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| WW01 | Invention patent application withdrawn after publication |