CN213280202U

CN213280202U - Heat dissipation sleeve for improving copper-clad plate

Info

Publication number: CN213280202U
Application number: CN202022089889.9U
Authority: CN
Inventors: 王刚; 蒋志俊; 蒋文; 施吉连; 朱德明; 向峰; 马忠雷
Original assignee: Taizhou Wangling Insulating Materials Factory
Current assignee: Taizhou Wangling Insulating Materials Factory
Priority date: 2020-09-22
Filing date: 2020-09-22
Publication date: 2021-05-25
Anticipated expiration: 2030-09-22

Abstract

A heat dissipation sleeve for improving a copper-clad plate is suitable for manufacturing a single-layer/multi-layer PCB or later processing of the copper-clad plate, and is arranged at a position on the PCB or the copper-clad plate, which is easy to generate heat or has large heat productivity; the utility model discloses a heat dissipation cover for covering copper foil board improvement can be rapidly with heat conduction to fin and heat dissipation through the heat dissipation cover, has improved the radiating efficiency, has better radiating effect.

Description

Heat dissipation sleeve for improving copper-clad plate

Technical Field

The utility model belongs to the technical field of the PCB, concretely relates to heat dissipation cover for covering copper foil board improvement.

Background

The circuit board of the electronic equipment can generate heat during working, so that the internal temperature of the equipment can rise rapidly, if the heat is not dissipated in time, the equipment can be heated continuously, and the service life and the reliability of the electronic element can be reduced due to overheating. Therefore, it is important to perform a heat dissipation process on a Printed Circuit Board (PCB).

The direct reason for causing the temperature rise of the PCB is that due to the existence of circuit power consumption devices, power consumption exists in all electronic devices to different degrees, the heating intensity changes along with the power consumption, and the temperature rise phenomenon in the PCB comprises local temperature rise or large-area temperature rise, and short-time temperature rise or long-time temperature rise.

The heat dissipation problem of the PCB is solved, and the heat dissipation of the PCB is mainly realized by optimizing the heat dissipation of components, reducing the power consumption of the components, optimizing the layout of a circuit and the components, adopting a radiator, strengthening the air cooling or water cooling and the like.

Because the currently widely used PCB boards are copper-clad/epoxy glass cloth substrates or phenolic resin glass cloth substrates, and paper-based copper-clad substrates (collectively referred to as copper-clad laminates), these substrates have excellent electrical properties and processability, but have poor heat dissipation, and for high-heat-generating components, it is difficult to form effective heat dissipation by means of the resin conduction heat of the PCB substrate, and the heat is dissipated to the surrounding environment mainly through the electronic components themselves in the form of heat conduction and heat radiation. Because of the use of a large number of small electronic elements, the surface heat dissipation area of the electronic elements is deficient, and more auxiliary heat dissipation means are needed for heat dissipation; if can improve the heat-sinking capability with the PCB self of the electronic component direct contact that generates heat, conduct the heat or distribute away through the PCB board, can reduce the input cost of PCB in the heat dissipation, let people have bigger degree of freedom when designing PCB.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a can improve the heat dissipation cover that covers copper foil board or PCB board radiating efficiency.

In order to solve the technical problem, the utility model discloses a heat dissipation cover for covering copper foil board improvement is applicable to the manufacturing of individual layer multilayer PCB board or covers the later stage processing of copper foil board, sets up the position that easily generates heat or calorific capacity is big on PCB board or covering copper foil board, the heat dissipation cover includes the heat dissipation cover body, and heat dissipation cover body inner wall evenly is equipped with a plurality of fin.

Preferably, the heat dissipation plate comprises a plurality of annular heat dissipation plates arranged above and below.

Preferably, the heat dissipation fins comprise a plurality of strip-shaped heat dissipation fins vertically arranged along the inner circumference of the heat dissipation sleeve body.

Preferably, the number of the heat radiating fins is not less than 3.

Preferably, the heat dissipation sleeve is a high heat conduction material.

Further, the heat dissipation sleeve is made of copper or copper alloy.

The utility model discloses a heat dissipation cover for covering copper foil board improvement has following advantage at least:

the utility model discloses a heat dissipation cover for covering copper foil board improvement can be rapidly with heat conduction to fin and heat dissipation through the heat dissipation cover, has improved the radiating efficiency, has better radiating effect.

Drawings

Fig. 1 is a schematic structural diagram of a heat dissipation sleeve for improving a copper-clad plate.

FIG. 2 is a schematic structural diagram of another heat dissipation sleeve for improving a copper-clad laminate.

The reference numbers in the figures are: 1-radiating sleeve body, 2-annular radiating fin and 3-strip radiating fin.

Detailed Description

The present invention is further described in detail below with reference to examples so that those skilled in the art can implement the invention with reference to the description.

It will be understood that terms such as "having," "including," and "comprising," when used herein, do not preclude the presence or addition of one or more other elements or groups thereof.

As shown in fig. 1, a heat dissipation sleeve for improving a copper-clad plate is suitable for manufacturing a single-layer/multi-layer PCB or post processing of the copper-clad plate, and is arranged at a position on the PCB or the copper-clad plate where heat is easily generated or the heat is generated greatly, and the heat dissipation sleeve comprises a heat dissipation sleeve body 1, wherein a plurality of heat dissipation fins are arranged on the inner wall of the heat dissipation sleeve body.

The radiating fins comprise a plurality of annular radiating fins 2 which are arranged up and down.

The number of the radiating fins is not less than 3.

The heat dissipation sleeve is made of high heat conduction material.

The heat dissipation sleeve is made of copper or copper alloy.

The through hole is punched at the position of easily generating heat or having large calorific capacity on the single layer/multilayer PCB board or the copper clad laminate (the copper clad laminate can be used as the substrate of PCB board to carry out pre-punching), then the radiating sleeve is directly put into or is fixed in the through hole through heat conducting glue and the like, the PCB board preparation later stage makes radiating sleeve one end and the contact of the electronic component that generates heat form heat conduction, the radiating sleeve conducts the partial heat that the electronic component produced to the fin on to this assists the heat dissipation, prevents local overheat.

Example 2

As shown in fig. 2, similarly to embodiment 1, the difference is that the heat radiating fins include a plurality of strip-shaped heat radiating fins 3 vertically arranged along the inner circumference of the heat radiating jacket body.

While the embodiments of the invention have been disclosed above, it is not limited to the applications listed in the description and the embodiments, which are fully applicable in all kinds of fields suitable for the invention, and further modifications may be readily made by those skilled in the art, and the invention is therefore not limited to the specific details and embodiments shown and described herein, without departing from the general concept defined by the claims and their equivalents.

Claims

1. The utility model provides a heat dissipation cover for covering copper foil board improvement, is applicable to the manufacturing of individual layer/multilayer PCB board or covers in the post processing of copper foil board, sets up easily generate heat or give out heat big position on PCB board or covering copper foil board, its characterized in that, the heat dissipation cover includes the heat dissipation cover body, and heat dissipation cover body inner wall evenly is equipped with a plurality of fin.

2. The improved heat dissipation sleeve for the copper clad laminate as recited in claim 1, wherein the heat dissipation fins comprise a plurality of annular heat dissipation fins arranged above one another.

3. The improved heat sink sleeve as recited in claim 1, wherein the fins comprise a plurality of strip fins vertically arranged along an inner circumference of the heat sink sleeve body.

4. The improved heat dissipation sleeve for the copper clad laminate as recited in claim 2 or 3, wherein the number of the heat dissipation fins is not less than 3.

5. The improved heat dissipation sleeve for the copper clad laminate as recited in claim 1, wherein the heat dissipation sleeve is a high thermal conductivity material.

6. The improved heat dissipation sleeve for the copper clad laminate as recited in claim 5, wherein the material of the heat dissipation sleeve is copper or copper alloy.