CN207869492U - Graphene heat-radiating substrate - Google Patents
Graphene heat-radiating substrate Download PDFInfo
- Publication number
- CN207869492U CN207869492U CN201721900645.6U CN201721900645U CN207869492U CN 207869492 U CN207869492 U CN 207869492U CN 201721900645 U CN201721900645 U CN 201721900645U CN 207869492 U CN207869492 U CN 207869492U
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- Prior art keywords
- copper foil
- foil layer
- glue
- graphene
- film layers
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a kind of graphene heat-radiating substrates comprising copper foil layer, AD glue-lines, PI film layers and graphene thermal dispersant coatings, the copper foil layer, AD glue-lines, PI film layers and graphene thermal dispersant coatings are bonded successively according to sequence from top to bottom；The utility model smart structural design, rationally, efficiently use the high thermal conductivity energy of graphene thermal dispersant coatings and good mechanical performance, pass through copper foil layer, the heat transfer successively of AD glue-lines and PI film layers, the thermal energy generated when the electronic component on copper foil layer can work rapidly transfers out rapidly to come and distribute, heat-conducting substrate volume, which need not be increased, can be substantially reduced the operating temperature of electronic component or electronic product, good heat dissipation effect, PI film layers and copper foil layer are fitted with by AD glue-lines simultaneously, effectively promote thermal stability and overall construction intensity, good combination property, electronic component micromation can be met, miniaturization of electronic products and cooling requirements, conducive to wide popularization and application.
Description
Technical field
The utility model is related to wiring board technology field, more particularly to a kind of graphene heat-radiating substrate.
Background technology
Heat conductive circuit base board is widely used in the fields such as computer, LED illumination, communication, medical treatment, industrial equipment and space flight,
Three layers of heat conductive circuit base board point, bottom is heat dissipating layer, and centre is dielectric insulation layer, and upper layer is conductive layer, conventional thermal conductive circuit base
The heat dissipating layer of plate generally uses the metal materials such as aluminium sheet, aluminium alloy plate, copper coin to be made, and metallic radiating layer is due to material and technique
Limitation, there are many defects, metal material density is excessive, for high-power equipment, needs to solve weight and heat dissipation performance
Contradiction needs to occupy larger space, it is small-sized to be unfavorable for electronic product because of the limitation of metal material itself heat conduction and heat radiation performance
The requirement of change limits its application in the fields such as chemical industry and environmental protection in addition, the corrosion resistance of metal material is bad, now electricity
Sub- product and component have developed rapidly, and especially the heat conduction governing in miniature electronic component and heat conductive design are increasingly strict, right
The requirement of heat conductive circuit base board is higher and higher, or even has arrived harsh degree, therefore, in order to improve electronic component and its system
Performance and stability, prolong the service life, it is extremely urgent to develop new and effective heat conductive circuit base board.
Graphene is a kind of arranged according to hexagon by carbon atom and carbon molecules made of being connected with each other, structure are non-
Often stablize, graphene has extraordinary heat-conductive characteristic.The thermal coefficient of pure flawless single-layer graphene is up to
5300W/mK is the highest carbon material of thermal coefficient so far, is received higher than single-walled carbon nanotube (3500W/mK) and multi wall carbon
Mitron (3000W/mK).When it is as carrier, its thermal coefficient is also up to 600W/mK.For this purpose, with grapheme material
Develop a kind of graphene heat-radiating substrate of high-efficiency heat conduction be it is when generation needed for.
Utility model content
Against the above deficiency, the utility model aim is to provide a kind of smart structural design, rationally, good heat dissipation effect
Graphene heat-radiating substrate.
To achieve the above object, the technical solution provided is the utility model：
A kind of graphene heat-radiating substrate comprising copper foil layer, AD glue-lines, PI film layers and graphene thermal dispersant coatings, the copper
Layers of foil, AD glue-lines, PI film layers and graphene thermal dispersant coatings are bonded successively according to sequence from top to bottom, the graphene heat-radiation coating
The thickness of layer is 5~25 microns.
As a kind of improvement of the utility model, the thickness of the copper foil layer is 12~36 microns.
As a kind of improvement of the utility model, the thickness of the AD glue-lines is 15~35 microns.
As a kind of improvement of the utility model, the thickness of the PI film layers is 12.5~35 microns.
As a kind of improvement of the utility model, it is coated with black ink layer on the copper foil layer, and in black ink layer
It is equipped with hollow out solder joint vacancy.
The beneficial effects of the utility model are：The utility model smart structural design, rationally, efficiently use graphene heat dissipation
The high thermal conductivity energy of coating and good mechanical performance pass through the heat transfer successively of copper foil layer, AD glue-lines and PI film layers, energy
The thermal energy generated when the electronic component on copper foil layer being worked rapidly transfers out rapidly to come and distribute, and need not increase and lead
Hot radical plate bulk can be substantially reduced the operating temperature of electronic component or electronic product, good heat dissipation effect, while pass through AD
Glue-line is fitted with PI film layers and copper foil layer, and electronics can be met by effectively promoting thermal stability and overall construction intensity, good combination property
Component micromation, miniaturization of electronic products and cooling requirements, are conducive to wide popularization and application.
Description of the drawings
Fig. 1 is the structural schematic diagram of the utility model.
Specific implementation mode
Embodiment：Referring to Fig. 1, a kind of graphene heat-radiating substrate of the utility model embodiment offer comprising copper foil layer
1, AD glue-lines 2, PI film layers 3 and graphene thermal dispersant coatings 4, the copper foil layer 1, AD glue-lines 2, PI film layers 3 and graphene heat-radiation coating
Layer 4 is bonded successively according to sequence from top to bottom, and the thickness of the graphene thermal dispersant coatings 4 is 5~25 microns.
In the present embodiment, the thickness of the copper foil layer 1 is 12~36 microns.Preferably 12 microns, 20 microns, 30 microns or
36 microns.The thickness of the AD glue-lines 2 is 15~35 microns.Preferably 15 microns, 22 microns, 28 microns or 35 microns.It is described
The thickness of PI film layers 3 is 12.5~35 microns.Preferably 12.5 microns, 18 microns, 20 microns or 35 microns.
Preferably, being coated with black ink layer on the copper foil layer 1, make copper foil layer 1 that there is preferable high temperature resistant, resistance to spoke
It penetrates, resistant to chemical etching and electrical insulation capability, good combination property is easy to process, highly practical.Hollow out is equipped in black ink layer
The welding sequence in solder joint vacancy, electron component is brought convenience.Preferably, also passing through on the graphene thermal dispersant coatings 4
Epoxy adhesive layer is fitted with aluminium foil layer, to promote shielding properties, avoids interfering.The thickness of the copper foil layer 1 is 15~30 microns, preferably
It it is 15 microns, 18 microns, 20 microns or 28 microns, to have shielded effect.
In use, efficiently using the high thermal conductivity energy of graphene thermal dispersant coatings 4 and good mechanical performance, pass through copper
The heat transfer successively of layers of foil 1, AD glue-lines 2 and PI film layers 3 generates when the electronic component on copper foil layer 1 can work rapidly
Thermal energy, which transfers out rapidly, to be come and distributes, and need not increase heat-conducting substrate volume can be substantially reduced electronic component or electricity
The operating temperature of sub- product, good heat dissipation effect, while PI film layers 3 and copper foil layer 1 are fitted with by AD glue-lines 2, effectively promote heat
Stability and overall construction intensity, good combination property can meet electronic component micromation, miniaturization of electronic products and heat dissipation and want
It asks.
According to the disclosure and teachings of the above specification, the utility model those skilled in the art can also be to above-mentioned reality
The mode of applying is changed and is changed.Therefore, the utility model is not limited to specific implementation mode disclosed and described above, right
Some modifications and changes of the utility model should also be as falling into the protection scope of the claims of the present utility model.In addition, to the greatest extent
Some specific terms are used in pipe this specification, these terms are merely for convenience of description, not to the utility model
Any restrictions are constituted, using same or similar other substrates, in scope of protection of the utility model.
Claims (5)
1. a kind of graphene heat-radiating substrate, which is characterized in that it includes copper foil layer, AD glue-lines, PI film layers and graphene heat-radiation coating
Layer, the copper foil layer, AD glue-lines, PI film layers and graphene thermal dispersant coatings are bonded successively according to sequence from top to bottom, the stone
The thickness of black alkene thermal dispersant coatings is 5~25 microns.
2. graphene heat-radiating substrate according to claim 1, which is characterized in that the thickness of the copper foil layer is 12~36 micro-
Rice.
3. graphene heat-radiating substrate according to claim 1, which is characterized in that the thickness of the AD glue-lines is 15~35 micro-
Rice.
4. graphene heat-radiating substrate according to claim 1, which is characterized in that the thickness of the PI film layers is 12.5~35
Micron.
5. the graphene heat-radiating substrate according to any one of claim 1-4, which is characterized in that applied on the copper foil layer
It is covered with black ink layer, and is equipped with hollow out solder joint vacancy in black ink layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721900645.6U CN207869492U (en) | 2017-12-29 | 2017-12-29 | Graphene heat-radiating substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721900645.6U CN207869492U (en) | 2017-12-29 | 2017-12-29 | Graphene heat-radiating substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207869492U true CN207869492U (en) | 2018-09-14 |
Family
ID=63464085
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721900645.6U Expired - Fee Related CN207869492U (en) | 2017-12-29 | 2017-12-29 | Graphene heat-radiating substrate |
Country Status (1)
| Country | Link |
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| CN (1) | CN207869492U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109177383A (en) * | 2018-10-31 | 2019-01-11 | 嘉兴立新材料有限公司 | A kind of heat radiating type self-lubricating bearing plate |
| CN112696952A (en) * | 2020-12-24 | 2021-04-23 | 苏州高松野冈石墨烯新材料有限公司 | Graphene VC soaking plate and processing method thereof |
| CN112751298A (en) * | 2019-10-31 | 2021-05-04 | 罗克韦尔自动化技术公司 | Heat dissipation cladding |
| CN116171009A (en) * | 2022-12-30 | 2023-05-26 | 常州富烯科技股份有限公司 | Enhanced heat conducting fin based on graphene and preparation method |
-
2017
- 2017-12-29 CN CN201721900645.6U patent/CN207869492U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109177383A (en) * | 2018-10-31 | 2019-01-11 | 嘉兴立新材料有限公司 | A kind of heat radiating type self-lubricating bearing plate |
| CN112751298A (en) * | 2019-10-31 | 2021-05-04 | 罗克韦尔自动化技术公司 | Heat dissipation cladding |
| CN112696952A (en) * | 2020-12-24 | 2021-04-23 | 苏州高松野冈石墨烯新材料有限公司 | Graphene VC soaking plate and processing method thereof |
| CN116171009A (en) * | 2022-12-30 | 2023-05-26 | 常州富烯科技股份有限公司 | Enhanced heat conducting fin based on graphene and preparation method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180914 Termination date: 20201229 |