CN207053869U - A kind of layer-stepping wiring board - Google Patents
A kind of layer-stepping wiring board Download PDFInfo
- Publication number
- CN207053869U CN207053869U CN201720637648.9U CN201720637648U CN207053869U CN 207053869 U CN207053869 U CN 207053869U CN 201720637648 U CN201720637648 U CN 201720637648U CN 207053869 U CN207053869 U CN 207053869U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- main circuit
- layer
- wiring board
- fpc
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Structure Of Printed Boards (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
The utility model discloses a kind of layer-stepping wiring board, belongs to circuit board technology field, including main circuit board and secondary circuit board, it is characterized in that：The both sides of the main circuit board are equipped with positioning hole, the bottom of the main circuit board is provided with heat dissipating layer, the bottom of the heat dissipating layer is provided with some equally distributed fin, control chip is provided among the top of the main circuit board, the outside of the control chip is provided with some elements being evenly distributed, the upper left-hand of the main circuit board is provided with FPC connector one, the subbreadboard is arranged on the top of main circuit board, support column is provided between the main circuit board and subbreadboard, the support column is internally threaded through hole, the main circuit board and subbreadboard are fixedly connected by screw with support column.The utility model has the advantages that simple in construction, reasonable in design, the perfect heat-dissipating of wiring board, the temperature of wiring board normal work can be substantially reduced.
Description
Technical field
The utility model discloses a kind of layer-stepping wiring board, belongs to circuit board technology field.
Background technology
With the development of electronics industry technology, the production of wiring board and technology make constant progress, in some heatings
Larger electronic applications, substrate of the generally use aluminium base as circuit, the heat conduction of aluminium base, perfect heat-dissipating, can drop significantly
The temperature of low component, ensure that circuit runs well.But wiring board mechanism is excessively simple at present, generally by all electronics member devices
Part is arranged on on a piece of wiring board, once wherein some component is damaged, then monoblock wiring board will all be scrapped；Simultaneously
Different elements heat condition is different on wiring board, and required radiating mode is also different, and temperature occurs mutual between different components
Interference, influences thermally sensitive component normal work.
Utility model content
In view of the deficienciess of the prior art, the purpose of this utility model is to provide for a kind of layer-stepping wiring board, with
Solve the problems, such as to propose in above-mentioned background technology.
To achieve the above object, the utility model provides following technical scheme to realize：
A kind of layer-stepping wiring board, including main circuit board and secondary circuit board, it is characterized in that：The both sides of the main circuit board are equal
Provided with positioning hole, the bottom of the main circuit board is provided with heat dissipating layer, and the bottom of the heat dissipating layer is provided with some equally distributed scattered
Backing, is provided with control chip among the top of the main circuit board, and the outside of the control chip is evenly distributed provided with some
Element, the upper left-hand of the main circuit board are provided with FPC connector one, and the subbreadboard is arranged on the top of main circuit board,
Support column is provided between the main circuit board and subbreadboard, the upper and lower ends of the support bar are equipped with protection pad, described
Support column is internally threaded through hole, and the main circuit board and subbreadboard are fixedly connected by screw with support column, institute
The top for stating subbreadboard is provided with some equally distributed LED lamp bead pads, and it is logical to be provided with radiating between the LED lamp bead pad
Hole, the upper left-hand of the subbreadboard are provided with FPC connector two, and the left side of the FPC connector two is connected with flexible circuitry
Plate, the other end connection FPC connector one of the FPC.
As preferred：The material of the main circuit board and subbreadboard is aluminium alloy.
As preferred：The material of the FPC is Kapton.
As preferred：The surface coating of the LED lamp bead pad helps welding coat.
The beneficial effects of the utility model：
1. main circuit board and subbreadboard are fixedly connected by screw with support column, main circuit board and subbreadboard pass through
FPC is connected, and main circuit board is separated with subbreadboard, disperseed wiring board work caused by heat, can substantially reduce
Temperature when wiring board works.
2. the material of FPC is Kapton, Kapton have prominent high temperature resistant, radiation hardness,
Resistant to chemical etching and electrical insulation capability, the normal work of wiring board is not influenceed, while Kapton can bend, wind,
It can arbitrarily be arranged according to space requirement, substantially increase the flexibility of circuit board.
3. the material of main circuit board and subbreadboard is aluminium alloy, aluminium alloy has good thermal conductivity and machining property
Can, compared with traditional circuit plate material, higher electric current can be carried, substantially increases the reliability of wiring board.
Brief description of the drawings
Fig. 1 is a kind of layer-stepping circuit board structure schematic diagram of the utility model.
Reference：1st, main circuit board；2nd, positioning hole；3rd, heat dissipating layer；4th, fin；5th, control chip；6th, element；7、
FPC connector one；8th, subbreadboard；9th, support column；10th, pad is protected；11st, LED lamp bead pad；12nd, thermal vias；13、FPC
Connector two；14th, FPC；15th, tapped through hole；16th, screw.
Embodiment
Reference picture 1 is described further to a kind of layer-stepping wiring board of the utility model.
A kind of layer-stepping wiring board, including main circuit board 1 and secondary circuit board 8, it is characterized in that：The two of the main circuit board 1
Side is equipped with positioning hole 2, and the bottom of the main circuit board 1 is provided with heat dissipating layer 3, and the bottom of the heat dissipating layer 3 is provided with some uniform
The fin 4 of distribution, the top centre of the main circuit board 1 is provided with control chip 5, if the outside of the control chip 5 is provided with
The dry element 6 being evenly distributed, the upper left-hand of the main circuit board 1 are provided with FPC connector 1, and the subbreadboard 8 is arranged on
The top of main circuit board 1, support column 9, the upper and lower ends of the support bar 9 are provided between the main circuit board 1 and subbreadboard 8
Protection pad 10 is equipped with, the support column 9 is internally threaded through hole 15, and the main circuit board 1 and subbreadboard 8 are logical
Screw 16 to be crossed to be fixedly connected with support column 9, the top of the subbreadboard 8 is provided with some equally distributed LED lamp bead pads 11,
Thermal vias 12 is provided between the LED lamp bead pad 11, the upper left-hand of the subbreadboard 8 is provided with FPC connector 2 13,
The left side of the FPC connector 2 13 is connected with FPC 14, the other end connection FPC connections of the FPC 14
Device 1, the material of the main circuit board 1 and subbreadboard 8 is aluminium alloy, and the material of the FPC 14 is sub- for polyamides
Amine film, the surface coating of the LED lamp bead pad 11 help welding coat.
Main circuit board 1 and subbreadboard 8 are fixedly connected by screw with support column 9, main circuit board 1 and subbreadboard 8
It is connected by FPC 14, main circuit board 1 is separated with subbreadboard 8, has disperseed heat caused by wiring board work, energy
Substantially reduce temperature during wiring board work.
The material of FPC 14 is Kapton, Kapton have prominent high temperature resistant, radiation hardness,
Resistant to chemical etching and electrical insulation capability, the normal work of wiring board is not influenceed, while Kapton can bend, wind,
It can arbitrarily be arranged according to space requirement, substantially increase the flexibility of circuit board.
The material of main circuit board 1 and subbreadboard 8 is aluminium alloy, and aluminium alloy has good thermal conductivity and machining property
Can, compared with traditional circuit plate material, higher electric current can be carried, substantially increases the reliability of wiring board.
Described above is only preferred embodiment of the present utility model, and the scope of protection of the utility model is not limited merely to
Above-described embodiment, all technical schemes belonged under the utility model thinking belong to the scope of protection of the utility model.It should refer to
Go out, for those skilled in the art, some improvement under the premise of the utility model principle is not departed from and
Retouching, these improvements and modifications also should be regarded as the scope of protection of the utility model.
Claims (4)
1. a kind of layer-stepping wiring board, including main circuit board and secondary circuit board, it is characterized in that：The both sides of the main circuit board are all provided with
There is positioning hole, the bottom of the main circuit board is provided with heat dissipating layer, and the bottom of the heat dissipating layer is provided with some equally distributed radiatings
Piece, the top centre of the main circuit board are provided with control chip, and the outside of the control chip is provided with some members being evenly distributed
Part, the upper left-hand of the main circuit board are provided with FPC connector one, and the secondary circuit board is arranged on the top of main circuit board, institute
State and support column is provided between main circuit board and secondary circuit board, the upper and lower ends of the support bar are equipped with protection pad, the branch
Dagger is internally threaded through hole, and the main circuit board and secondary circuit board are fixedly connected by screw with support column, described
The top of secondary circuit board is provided with some equally distributed LED lamp bead pads, and thermal vias is provided between the LED lamp bead pad,
The upper left-hand of the secondary circuit board is provided with FPC connector two, and the left side of the connector two is connected with FPC, described
The other end connection FPC connector one of FPC.
2. a kind of layer-stepping wiring board according to claim 1, it is characterized in that：The material of the main circuit board and secondary circuit board
Material is aluminium alloy.
3. a kind of layer-stepping wiring board according to claim 1, it is characterized in that：The material of the FPC is polyamides
Imines film.
4. a kind of layer-stepping wiring board according to claim 1, it is characterized in that：The surface coating of the LED lamp bead pad
Help welding coat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720637648.9U CN207053869U (en) | 2017-06-05 | 2017-06-05 | A kind of layer-stepping wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720637648.9U CN207053869U (en) | 2017-06-05 | 2017-06-05 | A kind of layer-stepping wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207053869U true CN207053869U (en) | 2018-02-27 |
Family
ID=61490541
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720637648.9U Expired - Fee Related CN207053869U (en) | 2017-06-05 | 2017-06-05 | A kind of layer-stepping wiring board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207053869U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108566729A (en) * | 2018-06-25 | 2018-09-21 | Oppo广东移动通信有限公司 | Circuit board assemblies and electronic equipment with it |
| WO2019183979A1 (en) * | 2018-03-31 | 2019-10-03 | Intel Corporation | Cooling system assembly for compute devices |
| CN114501791A (en) * | 2020-11-12 | 2022-05-13 | 荣耀终端有限公司 | Circuit board assembly and electronic equipment |
-
2017
- 2017-06-05 CN CN201720637648.9U patent/CN207053869U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019183979A1 (en) * | 2018-03-31 | 2019-10-03 | Intel Corporation | Cooling system assembly for compute devices |
| CN108566729A (en) * | 2018-06-25 | 2018-09-21 | Oppo广东移动通信有限公司 | Circuit board assemblies and electronic equipment with it |
| CN108566729B (en) * | 2018-06-25 | 2020-12-15 | Oppo广东移动通信有限公司 | Circuit board assembly and electronic equipment with same |
| CN114501791A (en) * | 2020-11-12 | 2022-05-13 | 荣耀终端有限公司 | Circuit board assembly and electronic equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN207053869U (en) | A kind of layer-stepping wiring board | |
| WO2009094829A1 (en) | A high heat dissipation led light source module and a high heat dissipation and high power led light source assembly | |
| CN205082059U (en) | heat dissipation circuit board | |
| CN207612462U (en) | A kind of high heat conduction type printed wiring board | |
| CN207869492U (en) | Graphene heat-radiating substrate | |
| CN206042519U (en) | Circuit board capable of fast radiating heat | |
| CN108575046A (en) | A kind of high heat conduction composite base material multilayer printed circuit board | |
| CN209729888U (en) | High reliablity heat radiation module | |
| CN107396618A (en) | A kind of fin of good insulating | |
| CN206401355U (en) | A kind of anti-static LED aluminium substrate | |
| CN208317104U (en) | The two-sided PCB circuit board radiator structure of multi-layered high-density | |
| CN206272950U (en) | It is a kind of to concentrate the high-performance circuit board for radiating | |
| CN207053866U (en) | A kind of round LED wiring board | |
| CN105744724B (en) | Radiator structure, wearable electronic equipment and its heat dissipating method of electronic device | |
| CN210381441U (en) | High-temperature-resistant circuit board | |
| CN207884962U (en) | A kind of high heat conduction printed circuit board | |
| CN207053864U (en) | A kind of flange-cooled aluminium base | |
| CN207766645U (en) | A kind of radiator structure of pcb board | |
| CN207692149U (en) | A kind of multi-layer PCB board with conductive structure | |
| CN207811649U (en) | A kind of novel heat-conducting piece | |
| CN202738247U (en) | Circuit board provided with improved heat dissipation performance | |
| CN108135075A (en) | A kind of high heat conduction printed circuit board | |
| CN205179511U (en) | Power electronic component circuit board of high heat dissipating ability | |
| CN205755047U (en) | The pcb board that a kind of thermal diffusivity is strong | |
| CN206024228U (en) | High radiating thickness copper coin |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180227 |