CN206042505U - Novel PCB (printed circuit board) - Google Patents
Novel PCB (printed circuit board) Download PDFInfo
- Publication number
- CN206042505U CN206042505U CN201620824453.0U CN201620824453U CN206042505U CN 206042505 U CN206042505 U CN 206042505U CN 201620824453 U CN201620824453 U CN 201620824453U CN 206042505 U CN206042505 U CN 206042505U
- Authority
- CN
- China
- Prior art keywords
- layer
- heat dissipating
- pcb board
- novel pcb
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Laminated Bodies (AREA)
Abstract
The utility model discloses a novel PCB (printed circuit board), including conducting layer, insulating layer, heat dissipation layer and bond line to go up the four layers according to from last order stack to down, the more than one cavity has been arranged to the lower surface of conducting layer, and two above vertically and horizontally staggered's circulation of air groove is arranged to the upper surface of insulating layer, laminates each other in cavity and circulation of air groove, sets up the heat dissipation through -hole on heat dissipation layer and the bond line, and the through -hole that dispels the heat runs through and dispels the heat layer and the bond line. The utility model discloses higher radiating efficiency has, and easy preparation.
Description
Technical field
This utility model is related to a kind of printed circuit board (PCB), especially a kind of Novel PCB board.
Background technology
PCB（Printed Circuit Board）, Chinese is printed circuit board, also known as printed circuit board (PCB), track
Road plate, is important electronic unit, is the supporter of electronic devices and components, is the supplier of electronic devices and components electrical connection.In print
Before circuit board processed occurs, the interconnection between electronic component is all to be directly connected to by electric wire and constitute complete circuit.
In prior art, pcb board is widely used, it is commonly known that electronic component can produce heat in the course of the work,
So the thermal diffusivity of pcb board is an important index.
Prior art pcb board generally comprises conductive layer, insulating barrier, heat dissipating layer and adhesive layer, and wherein insulating barrier is covered in scattered
On thermosphere, conductive layer is covered on the insulating layer.Above-mentioned three ply board typically passes through pressing and forming.Three layers of effect is respectively：The
One layer is used for cloth circuits and lays components and parts, and the second layer is then that the heat that components and parts are produced quickly is passed to third layer, while
The circuit of ground floor is not affected, so adopting insulating barrier, the effect of third layer is that the heat of the second layer further is dissipated out
And pass to the external world.
Pcb board is widely used in the electronic device, but electronic equipment easily produces substantial amounts of heat during use
Amount, if heat can not be distributed in time may result in damage electronic equipment, affects the service life of sheet material and equipment.It is above-mentioned
The pcb board radiating efficiency of version has many weak points：1st, the material of heat dissipating layer is generally aluminum or ceramics, its horizontal heat conduction
Poor performance, the heat dissipating layer temperature that this frequently results in corresponding region immediately below components and parts are high, but the temperature outside this region is low, especially
Be multiple components and parts with array distribution when, therefore the heat of the several components and parts of most that middle often cannot distribute well
Out, cause components and parts cisco unity malfunction.2nd, the surface roughness of the heat dissipating layer that these materials are made is big, and burr is more, while
Metal and ceramics belong to the crisp structure of comparison, protuberance easily occur or be recessed in pressing process.3rd, heat dissipating layer is plastic
Envelope property is poor because their quality are all very hard, it is difficult to being directed to different products makes different shapes, typically all with square or
It is circular slab, and the shape of many products is irregular, user needs using stud is installed to be supported better installation.
Utility model content
The technical problems to be solved in the utility model is to provide a kind of Novel PCB board, and there is the pcb board higher radiating to imitate
Rate, and easily make.
For solving above-mentioned technical problem, technical solution adopted in the utility model is：A kind of Novel PCB board, including leading
Electric layer, insulating barrier, heat dissipating layer and adhesive layer, four layers of the above is by laminated structure from top to bottom, it is characterised in that：Described conduction
The upper surface that the lower surface arrangement of layer has more than one cavity, described insulating barrier is disposed with more than two crisscross skies
Air-flow groove, described cavity and air flow channel it is bonded to each other, thermal vias, institute are set on described heat dissipating layer and adhesive layer
The thermal vias stated run through heat dissipating layer and adhesive layer.
Said structure is further qualified, described cavity is rectangular cavities, and the depth of its rectangular cavities is conductive layer
0.2-0.3 times of thickness.
Said structure is further qualified, described air flow channel is arcuate groove, and its transverse groove and cannelure are mutual
Vertically, and transverse groove is uniformly distributed on the width of insulating barrier, cannelure is uniformly distributed in the length of insulating barrier.
Said structure is further qualified, described heat dissipating layer is the thin plate of aluminum alloy material, and in the upper of thin plate
Lower surface is coated with heat radiation film.
Said structure is further qualified, in described latex of the heat radiation film comprising silicones, merges silicon oxide powder
With the compositionss of alumina powder, said composition has infra-red radiation effect.
Said structure is further qualified, described heat dissipating layer is carbon-coating, and carbon-coating is by the compressing plate of material with carbon element
Shape structure, carbon-coating are provided with the reserved thermal vias of compacting.
Using the beneficial effect produced by above-mentioned technical proposal it is：This utility model is for PCB of the prior art
The not high problem of plate radiating efficiency is improved, and has conductive layer, insulating barrier, heat dissipating layer and bonding stacking in original pcb board
Plus on the basis of forming, per layer of structure is improved, on the contact surface of conductive layer and insulating barrier, air circulation is set
Groove and cavity, arrange thermal vias on heat dissipating layer and adhesive layer, so that the heat that pcb board is operationally produced, on the one hand
Thermal diffusion is carried out by insulating barrier and air circulation, conduction of heat and diffusion are carried out by thermal insulation layer on the other hand；In addition, sharp
With the thermal vias on heat dissipating layer and adhesive layer, it is easy to the diffusion of heat in insulating barrier, maintains the temperature of insulating radiation layer
Appropriate scope, to further speed up the radiating effect of PCB plates；Meanwhile, there is infra-red radiation using being formed in radiating layer surface
The heat radiation film of effect, thermal diffusivity is good, and easily makes.To sum up, this utility model simple structure, it is easy to assembly, produce into
This is low, with preferably conduction of heat and radiating effect.
Description of the drawings
Fig. 1 is the appearance schematic diagram that the stacking of this utility model four adds；
Fig. 2 is the structural representation of insulating barrier upper surface in this utility model；
Fig. 3 is the structural representation of heat dissipating layer upper surface in this utility model；
Fig. 4 is the sectional view after the stacking of this utility model four adds；
Fig. 5 is the structural representation of heat dissipating layer surface-coated heat radiation film in this utility model；
Wherein：1st, conductive layer, 2, insulating barrier, 3, heat dissipating layer, 4, adhesive layer, 5, air flow channel, 6, thermal vias, 7, recessed
Chamber, 8, heat radiation film.
Specific embodiment
With reference to the accompanying drawings and detailed description this utility model is described in further detail.
1 understand with reference to the accompanying drawings, this utility model is specifically related to a kind of Novel PCB board, including conductive layer 1, insulating barrier 2, dissipate
Thermosphere 3 and adhesive layer 4, four layers of the above is by laminated structure from top to bottom.There is radiating efficiency not in this pro forma pcb board
High problem, this utility model are improved to which.
Embodiment one
On the basis of the stacking of original pcb board four adds, following change, the following table of conductive layer 1 has been carried out to per layer of structure
Face is disposed with more than one cavity 7, and the upper surface of insulating barrier 2 is disposed with more than two crisscross air flow channel 5, recessed
Chamber 7 and air flow channel 5 are bonded to each other, can just form air communication channel so between conductor layer 1 and insulating barrier 2, real
1 lower surface quick heat radiating of existing conductive layer, while cavity 7 increased the area of dissipation of 1 lower surface of conductive layer.
Thermal vias 6 are set on heat dissipating layer 3 and adhesive layer 4, and thermal vias 6 run through heat dissipating layer 3 and adhesive layer 4.Due to
, mainly by heat conducting and radiating, its radiating efficiency is relevant with its material for heat dissipating layer 3, in the case where material determines, area of dissipation
Increase can also improve radiating efficiency, therefore thermal vias 6 are handed over outer gas stream directly 4 insertion of heat dissipating layer 3 and adhesive layer
Mutually, two kinds of forms of conduction of heat and heat radiation are realized to radiate jointly, radiating efficiency is improve.
This utility model is processed for convenience, and cavity 7 is designed as rectangular cavities, only need to be capable of achieving by compacting, together
When in order to not affect the intensity of pcb board, it is desirable to 0.2-0.3 times for 1 thickness of conductive layer of the depth of rectangular cavities.
In this utility model, the air flow channel 5 on 3 surface of heat dissipating layer is designed as arcuate groove, and its radian can not be too big, utilizes
Arc scraper can make, and the transverse groove and cannelure of air flow channel 5 are typically mutually perpendicular to, and transverse groove is in insulating barrier 2
Width on be uniformly distributed, cannelure is uniformly distributed in the length of insulating barrier 2.
Embodiment two
The present embodiment is thin plate of the heat dissipating layer 3 using aluminum alloy material on the basis of embodiment one, and in thin plate
Upper and lower surface is coated with heat radiation film 8, and heat radiation film 8 merges silicon oxide powder and alumina powder in the latex comprising silicones
Compositionss, said composition has infra-red radiation effect.The hot spoke with infra-red radiation effect is formed using in radiating layer surface
Film is penetrated, thermal diffusivity is good, and easily makes.
Embodiment three
The present embodiment is that the material to heat dissipating layer 3 is improved, and using carbon-coating, carbon-coating is by the compressing plate of material with carbon element
Shape structure, carbon-coating are provided with the reserved thermal vias 6 of compacting, and carbon-coating heat conduction efficiency is high, can suppress any as requested
Shape, it is convenient to process, while retaining thermal vias, can further expand the area of dissipation of carbon-coating, improve radiating efficiency.
Above this utility model specific embodiment is described, this description is directed to of the present utility model optimal
Embodiment, its not restrictive, shown in accompanying drawing is also one of embodiment of the present utility model, and actual structure is simultaneously
It is not limited to this.If generally speaking one of ordinary skill in the art is enlightened by which, ancestor is being created without departing from this utility model
In the case of purport, the frame mode similar to the technical scheme and embodiment is designed without creative, all should belong to this reality
With new protection domain.
Claims (5)
1. a kind of Novel PCB board, including conductive layer（1）, insulating barrier（2）, heat dissipating layer（3）And adhesive layer（4）, four layers of the above by from
Laminated structure under up to, it is characterised in that：Described conductive layer（1）Lower surface arrangement have more than one cavity（7）, institute
The insulating barrier stated（2）Upper surface be disposed with more than two crisscross air flow channel（5）, described cavity（7）And sky
Air-flow groove（5）Heat dissipating layer bonded to each other, described（3）And adhesive layer（4）Upper setting thermal vias（6）, described radiating leads to
Hole（6）Through heat dissipating layer（3）And adhesive layer（4）.
2. a kind of Novel PCB board according to claim 1, it is characterised in that：Described cavity（7）For rectangular cavities, its
The depth of rectangular cavities is conductive layer（1）0.2-0.3 times of thickness.
3. a kind of Novel PCB board according to claim 1, it is characterised in that：Described air flow channel（5）For arc
Groove, its transverse groove and cannelure are mutually perpendicular to, and transverse groove is in insulating barrier（2）Width on be uniformly distributed, cannelure is exhausted
Edge layer（2）Length on be uniformly distributed.
4. a kind of Novel PCB board according to claim 1, it is characterised in that：Described heat dissipating layer（3）For aluminum alloy material
Thin plate, and the upper and lower surface in thin plate is coated with heat radiation film（8）.
5. a kind of Novel PCB board according to claim 1, it is characterised in that：Described heat dissipating layer（3）For carbon-coating, carbon-coating
It is that, by the compressing platy structure of material with carbon element, carbon-coating is provided with the reserved thermal vias of compacting（6）.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620824453.0U CN206042505U (en) | 2016-08-02 | 2016-08-02 | Novel PCB (printed circuit board) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620824453.0U CN206042505U (en) | 2016-08-02 | 2016-08-02 | Novel PCB (printed circuit board) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206042505U true CN206042505U (en) | 2017-03-22 |
Family
ID=58307691
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620824453.0U Active CN206042505U (en) | 2016-08-02 | 2016-08-02 | Novel PCB (printed circuit board) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206042505U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107770966A (en) * | 2017-10-31 | 2018-03-06 | 广东骏亚电子科技股份有限公司 | A kind of outer layer manufacturing method thereof of pcb board |
-
2016
- 2016-08-02 CN CN201620824453.0U patent/CN206042505U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107770966A (en) * | 2017-10-31 | 2018-03-06 | 广东骏亚电子科技股份有限公司 | A kind of outer layer manufacturing method thereof of pcb board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN203289746U (en) | Copper substrate structure with direct radiating copper-based boss | |
| CN206042505U (en) | Novel PCB (printed circuit board) | |
| JP2023112686A5 (en) | ||
| CN206977798U (en) | Heat radiating type thickness copper coin | |
| CN106783753A (en) | Semiconductor devices | |
| CN206446211U (en) | A kind of high proof voltage aluminum-based copper-clad plate | |
| CN206365131U (en) | A kind of circuit board of quick heat radiating | |
| CN103107275B (en) | Device for light emitting diode (LED) heat conduction and dissipation and insulation and voltage resistance | |
| CN206932465U (en) | A kind of porous heat dissipation type circuit board | |
| CN205202355U (en) | Copper base copper -clad plate of ceramic film structure | |
| CN207617230U (en) | A kind of copper-clad plate | |
| CN207283915U (en) | A kind of wiring board of perfect heat-dissipating | |
| CN209448963U (en) | The pcb board that a kind of thermal diffusivity is good and intensity is high | |
| CN209693140U (en) | A kind of high impedance multilayer insulation metal base circuit board | |
| CN207491303U (en) | A kind of multilayer printed wiring board of high uniformity | |
| CN207692149U (en) | A kind of multi-layer PCB board with conductive structure | |
| CN205124123U (en) | Copper -clad plate of high heat conduction copper of high proof voltage base | |
| CN205105453U (en) | LED multilayer circuit board | |
| CN206932463U (en) | A kind of high-temp resistant type circuit board | |
| CN207766643U (en) | A kind of high-speed high frequency circuit board with SHD figure layers | |
| CN206380169U (en) | A kind of radiator structure of pcb board | |
| CN206226825U (en) | Halogen insulation copper-clad plate | |
| CN207369391U (en) | A kind of two-sided paper tinsel base circuit board of super-high heat-conductive | |
| CN206575660U (en) | A kind of printed wiring board for improving radiating effect | |
| CN209151421U (en) | A kind of circuit board conductive double sided adhesive tape |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 511468, No. 41, Rong Dong Road, Tam Industrial East District, Dagang Town, Guangzhou, Guangdong, Nansha District Patentee after: Guangzhou hi tech Limited by Share Ltd Address before: 511468, No. 41, Rong Dong Road, Tam Industrial East District, Dagang Town, Guangzhou, Guangdong, Nansha District Patentee before: GUANGZHOU PANYU YUNSHENG PCB CO., LTD. |