CN206879209U - A kind of 4G network lines plate - Google Patents
A kind of 4G network lines plate Download PDFInfo
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- CN206879209U CN206879209U CN201720862902.5U CN201720862902U CN206879209U CN 206879209 U CN206879209 U CN 206879209U CN 201720862902 U CN201720862902 U CN 201720862902U CN 206879209 U CN206879209 U CN 206879209U
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- heat
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- network lines
- copper sheet
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Abstract
The utility model discloses a kind of 4G network lines plate,Including substrate,The substrate is provided with multiple heat transfer holes,Heat transfer hole inner chamber is provided with heat-conducting layer,Heat dissipating layer is provided with the top of the substrate,Heat conductor is connected with the top of the heat dissipating layer,And the heat conductor bottom is through heat dissipating layer insertion heat transfer hole inner chamber,The heat conductor top is connected with radiating copper sheet,Core plate is provided with the top of the radiating copper sheet,And bonding sheet is provided between the radiating copper sheet and the core plate,Ceramic substrate is connected with by the bonding sheet at the top of the core plate,Line layer is connected with the top of the ceramic substrate,Insulating barrier is provided with the top of the line layer,And the insulating barrier is covered in the circuit layer surface,The substrate edges are provided with anti-briquetting,This kind of 4G network line plate,It is simple in construction,Anti-extrusion,High temperature resistant,Space-consuming is smaller,Radiating effect is good,Signal is propagated good,So this kind of 4G network line plate is with a wide range of applications.
Description
Technical field
Wiring board techniques field is the utility model is related to, specially a kind of 4G network lines plate.
Background technology
With data communication and the development of multimedia service demand, mobile data, mobile computing and mobile multimedia are adapted to
The forth generation mobile communication that running needs starts to rise, and this fourth generation mobile communication technology brings more preferable experience,
On the other hand, 4G is also because its ultra-high data transmissions speed for possessing, by alliance of Chinese Internet of Things school-run enterprise be described as between machine when
" talk with a high speed " had nothing to be ashamed of, as the raising of the rate of information throughput and the increase of transinformation content, electronic product volume are more next
Smaller, the density of integrated component arrangement is increasing, promotes wiring board to high density, highly integrated, miniaturization and multiple stratification
Direction is developed, and in particular with the fast development of society, 4G networks enter in the life of people, bring people and surf the Net faster
Experience, and want to use 4G networks, it must just use 4G network line plates.
And existing 4G network lines plate, when mounted, electronic device is easily expressed to, causes to damage, some presence lines
Road plate radiating effect is bad, and signal, which is propagated, the problem of interference, relatively slow, and some meetings correspond to electronic device in the circuit board
Partial surface installs a fin alloy additional, although improving radiating efficiency, fin alloy has certain volume,
Space-consuming is larger, is unfavorable for wiring board miniaturization, so can not much meet requirement of the current people to the product.
So how to design a kind of 4G network lines plate, turning into us will currently solve the problems, such as.
Utility model content
The purpose of this utility model is to provide a kind of 4G network lines plate, asked with solve to propose in above-mentioned background technology
Topic.
To achieve the above object, the utility model provides following technical scheme：A kind of 4G network lines plate, including substrate,
The substrate is provided with multiple heat transfer holes, and heat transfer hole inner chamber is provided with heat-conducting layer, heat dissipating layer is provided with the top of the substrate,
Heat conductor is connected with the top of the heat dissipating layer, and the heat conductor bottom is embedded in the heat transfer hole through the heat dissipating layer
Inner chamber, the heat conductor top are connected with radiating copper sheet, are provided with core plate at the top of the radiating copper sheet, and the radiating copper sheet and
Bonding sheet is provided between the core plate, the core plate top is connected with ceramic substrate, the ceramic substrate by the bonding sheet
Top is connected with line layer, is provided with insulating barrier at the top of the line layer, and the insulating barrier is covered in the circuit layer surface, institute
State substrate edges and be provided with anti-briquetting, be provided with some positioning holes on the inside of the anti-briquetting, and the positioning hole is arranged on the substrate
On.
Further, the heat-conducting layer, the heat dissipating layer and the heat conductor are copper material, and the radiating copper
Piece is connected by the heat conductor with the heat dissipating layer.
Further, the radiating copper sheet is arranged on the core plate heating position.
Further, the bonding sheet is made up of solidification silica gel.
Further, the bonding sheet, and the ceramic substrate are provided between the ceramic substrate and the line layer
For LTCC (LTCC) substrate.
Further, line layer upper surface spray printing has indication character, and the insulating barrier is resin film.
Further, the positioning hole is uniformly and symmetrically distributed on the substrate.
Compared with prior art, the beneficial effects of the utility model are：This kind of 4G network line plate, by device body
Many-sided improvement, it is simple in construction, occupy little space, prevent from extruding, each laminate is bonded by using silicone adhesive piece so that
The stability and thermal diffusivity of wiring board are improved, by setting radiating copper sheet precise positioning and radiating, by heat dissipating layer,
Heat-conducting layer increases area of dissipation so that heat dispersion greatly improves, and passes through ceramic substrate so that whole wiring board has good
High frequency characteristics and high-speed transfer characteristic, can adapt to the requirement of high current and high-temperature stability, so this kind of 4G network line plate
With wide application market.
Brief description of the drawings
Fig. 1 is vertical section structural representation of the present utility model；
Fig. 2 is overlooking the structure diagram of the present utility model；
Fig. 3 is heat conductor structural representation of the present utility model.
In figure：1- substrates；2- heat transfer hole；3- heat-conducting layers；4- heat dissipating layers；5- heat conductors；6- radiating copper sheets；7- cores
Plate；8- bonding sheets；9- ceramic substrates；10- line layers；11- insulating barriers；The anti-briquettings of 12-；13- positioning holes.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the embodiment of the utility model is carried out
Clearly and completely describing, it is clear that described embodiment is only the utility model part of the embodiment, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made
The every other embodiment obtained, belong to the scope of the utility model protection.
Fig. 1-Fig. 3 is referred to, the utility model provides a kind of technical scheme：A kind of 4G network lines plate, including substrate 1,
The substrate 1 is provided with multiple heat transfer holes 2, and the inner chamber of heat transfer hole 2 is provided with heat-conducting layer 3, and the top of substrate 1, which is provided with, to be dissipated
Thermosphere 4, the top of heat dissipating layer 4 is connected with heat conductor 5, and the bottom of the heat conductor 5 is through the heat dissipating layer 4 insertion institute
The inner chamber of heat transfer hole 2 is stated, the top of heat conductor 5 is connected with radiating copper sheet 6, and the top of radiating copper sheet 6 is provided with core plate 7,
And bonding sheet 8 is provided between the radiating copper sheet 6 and the core plate 7, the top of core plate 7 is connected with by the bonding sheet 8
Ceramic substrate 9, the top of ceramic substrate 9 are connected with line layer 10, and the top of line layer 10 is provided with insulating barrier 11, and described
Insulating barrier 11 is covered in the surface of line layer 10, and the edge of substrate 1 is provided with anti-briquetting 12, and the anti-inner side of briquetting 12 is provided with
Some positioning holes 13, and the positioning hole 13 is arranged on the substrate 1.Composition the utility model basic structure described above.
More specifically, the heat-conducting layer 3, the heat dissipating layer 4 and the heat conductor 5 are copper material, and described
Radiating copper sheet 6 is connected by the heat conductor 5 with the heat dissipating layer 4, is added by the heat dissipating layer 4, the heat-conducting layer 3
Area of dissipation so that heat dispersion greatly improves, and the radiating copper sheet 6 is arranged on the heating position of core plate 7, by setting
Radiating copper sheet 6 is stated, being capable of precise positioning and radiating so that and radiating effect is more preferable, and the bonding sheet 8 is made up of solidification silica gel,
Each laminate is conveniently bonded by using solidification silicone adhesive piece so that the stability and thermal diffusivity of wiring board are improved, institute
State and the bonding sheet 8 is provided between ceramic substrate 9 and the line layer 10, and the ceramic substrate 9 is LTCC
(LTCC) substrate, the bonding sheet 8 is passed through so that the ceramic substrate 9 radiates faster, by being embedded in the ceramic substrate 9
Passive integration element so that whole wiring board has good high frequency characteristics and high-speed transfer characteristic, additionally it is possible to adapts to high current
And the requirement of high-temperature stability, the upper surface spray printing of line layer 10 have indication character, the insulating barrier 11 is resin film, is led to
The indication character crossed on the line layer 10, can understand wiring board, convenient use exactly, pass through the insulating barrier
The 11 covering surfaces of line layer 10, can play protection, dust-proof effect, the positioning hole 13 is uniformly and symmetrically distributed described
On substrate 1, and the positioning hole 13 extends vertically through whole wiring board, is easy to location and installation, by setting the anti-briquetting 12, energy
Enough extruding for effectively preventing installation process.
Operation principle：This kind of 4G network line plate, first wiring board carry out location and installation by positioning hole 13, and wiring board exists
It is convenient to bond by setting bonding sheet 8 between line layer 10, ceramic substrate 9, core plate 7 and radiating copper sheet 6 during work so that
Arriving for the stability of whole wiring board improves, and the use of radiating copper sheet 6, realizes the precise positioning to wiring board heating position,
Heat dispersion is improved well, and heat is radiated by heat dissipating layer 4, while heat-conducting layer 3 is arranged in heat transfer hole 2, more
Heat is distributed during use beneficial to wiring board, the use of wiring board will not be influenceed because heat is too high, is led to
To cross in ceramic substrate 9 and be embedded passive integration element so that whole wiring board has good high frequency characteristics and high-speed transfer characteristic,
The rapidity of communication is ensure that, allows people to may feel that being obviously improved for communication speed in use, with resin film system
Into insulating barrier 11 can also lift the thermal diffusivity and stability of wiring board, there is certain protection, dust-proof effect.
While there has been shown and described that embodiment of the present utility model, for the ordinary skill in the art,
It is appreciated that these embodiments can be carried out with a variety of changes in the case where not departing from principle of the present utility model and spirit, repaiied
Change, replace and modification, the scope of the utility model are defined by the appended claims and the equivalents thereof.
Claims (7)
1. a kind of 4G network lines plate, including substrate (1), it is characterised in that：The substrate (1) is provided with multiple heat transfer holes
(2), heat transfer hole (2) inner chamber is provided with heat-conducting layer (3), and heat dissipating layer (4), the heat dissipating layer are provided with the top of the substrate (1)
(4) top is connected with heat conductor (5), and the heat conductor (5) bottom is through the embedded heat transfer of the heat dissipating layer (4)
Hole (2) inner chamber, heat conductor (5) top are connected with radiating copper sheet (6), core plate are provided with the top of the radiating copper sheet (6)
(7) bonding sheet (8), and between the radiating copper sheet (6) and the core plate (7) is provided with, is glued at the top of the core plate (7) by described
Sheeting (8) is connected with ceramic substrate (9), and line layer (10), line layer (10) top are connected with the top of the ceramic substrate (9)
Portion is provided with insulating barrier (11), and the insulating barrier (11) is covered in the line layer (10) surface, and substrate (1) edge is provided with
Anti- briquetting (12), anti-briquetting (12) inner side is provided with some positioning holes (13), and the positioning hole (13) is arranged on the base
On plate (1).
A kind of 2. 4G network lines plate according to claim 1, it is characterised in that：The heat-conducting layer (3), the heat dissipating layer
(4) with the heat conductor (5) it is copper material, and the radiating copper sheet (6) is dissipated by the heat conductor (5) with described
Thermosphere (4) connects.
A kind of 3. 4G network lines plate according to claim 1, it is characterised in that：The radiating copper sheet (6) is arranged on institute
State core plate (7) heating position.
A kind of 4. 4G network lines plate according to claim 1, it is characterised in that：The bonding sheet (8) is by solidification silica gel
It is made.
A kind of 5. 4G network lines plate according to claim 1, it is characterised in that：The ceramic substrate (9) and the line
The bonding sheet (8) is provided between road floor (10), and the ceramic substrate (9) is LTCC (LTCC) substrate.
A kind of 6. 4G network lines plate according to claim 1, it is characterised in that：Line layer (10) upper surface spray printing
There is indication character, the insulating barrier (11) is resin film.
A kind of 7. 4G network lines plate according to claim 1, it is characterised in that：The positioning hole (13) is symmetrically divided
Cloth is on the substrate (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720862902.5U CN206879209U (en) | 2017-07-14 | 2017-07-14 | A kind of 4G network lines plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720862902.5U CN206879209U (en) | 2017-07-14 | 2017-07-14 | A kind of 4G network lines plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206879209U true CN206879209U (en) | 2018-01-12 |
Family
ID=61330367
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720862902.5U Active CN206879209U (en) | 2017-07-14 | 2017-07-14 | A kind of 4G network lines plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206879209U (en) |
-
2017
- 2017-07-14 CN CN201720862902.5U patent/CN206879209U/en active Active
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