CN202111938U - Double-face aluminum core circuit board - Google Patents
Double-face aluminum core circuit board Download PDFInfo
- Publication number
- CN202111938U CN202111938U CN2011202388348U CN201120238834U CN202111938U CN 202111938 U CN202111938 U CN 202111938U CN 2011202388348 U CN2011202388348 U CN 2011202388348U CN 201120238834 U CN201120238834 U CN 201120238834U CN 202111938 U CN202111938 U CN 202111938U
- Authority
- CN
- China
- Prior art keywords
- hole
- aluminum core
- layer
- circuit board
- layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
A double-face aluminum core circuit board designed in the utility model mainly includes an aluminum core plate. The aluminum core plate is provided with a through hole; the upper and lower surfaces of the aluminum core plate are respectively provided with an insulating layer; the outsides of the two insulating layers are provided with line layers; after all layers are connected by bonding film pressing, a through hole is provided on each bonded layer corresponding to the through hole on the aluminum core plate; and the inner wall of the through hole is provided with a metal layer connecting the upper and lower line layers. In the utility model, insulating layers and line layers are provided on the upper and lower surfaces of the aluminum core plate in consequence, the metal layer in the through hole is applied to connect the upper and lower line layers, simultaneous electronic components pasting or inserting on both side surfaces of the circuit board can be realized, and the double-face aluminum core circuit board can substitute the back-to-back combination use of two single-face circuit boards. Aluminum is used as the substrate in the circuit board, and the heat radiation performance is good. Simultaneously, all layers are connected by bonding film pressing, thereby the heat conduction coefficient is high, the heat radiation effect is good, and the anti-peeling intensity is raised.
Description
Technical field
The utility model relates to the integrated circuit board field, especially a kind of two-sided aluminum core line road plate.
Background technology
Metal base circuit board has excellent thermal diffusivity, electrical property, electromagnetic wave shielding and favorable mechanical processing characteristics and is widely used in power hybrid integrated circuit, Switching Power Supply, automobile, communication electronic equipment; LED illumination etc.; Particularly at the LED lighting field, owing to LED brightness height, energy-efficient, environmental protection; High speed development in recent years also is that emphasis encourages to help development energy-conserving and environment-protective industry during the country 12.Present stage, metal base circuit board all was single-sided structure; And can only use and show and mount components and parts; Particularly, when needing the two sides simultaneously luminous, all adopt the metal base circuit board of two single faces to use with back-to-back combining form like large-scale colored curtain wall, LED at the LED lighting field; Increased use cost, and security reliability is low.
The utility model content
The purpose of the utility model is to provide a kind of with low cost for the deficiency that solves above-mentioned technology, but the two-sided aluminum core line road plate that use simultaneously on the two sides.
In order to achieve the above object, the two-sided aluminum core line road plate that the utility model designed, it mainly comprises the aluminium central layer; On the aluminium central layer, be provided with through hole; Be equipped with insulating barrier at aluminium central layer upper and lower surfaces, be provided with line layer at the outer surface of two insulating barriers, each layer connects through the adhesive film pressing; On the adherend of each layer, be provided with the hole of perforation with respect to the through hole of aluminium central layer, the inwall in the hole is provided with and connects the metal level of line layer up and down.This design feature is: in through hole, be provided with the line layer that metal level is communicated with upper and lower surfaces, the wiring board two sides can be mounted or the plug-in mounting electronic devices and components simultaneously.
As optimization; The diameter of the through hole on the aluminium central layer is greater than the hole on the adherend of each layer; There is the gap between the inwall in the hole on metal level and the aluminium central layer, can better realizes the insulation between connection line layer metal level and the aluminium central layer like this, make the stability in use of wiring board better.
The resulting two-sided aluminum core line of the utility model road plate; Be provided with insulating barrier and line layer successively at aluminium central layer upper and lower surfaces; And connect two line layers through the inner metal level of through hole; Can realize that the wiring board two sides mount simultaneously or the plug-in mounting electronic devices and components, instead is used the combining form use back-to-back of two single face wiring boards.This wiring board adopts aluminium as matrix, perfect heat-dissipating.Connect through the adhesive film pressing between each structure sheaf simultaneously, make the conductive coefficient of wiring board high, good heat dissipation effect, and improved peel strength.In addition, produce and use this wiring board, cost is relatively low.
Description of drawings
Fig. 1 is the structural representation of the utility model.
1 aluminium central layer, 2 insulating barriers, 3 line layers, 4 metal levels, 5 through holes.
Embodiment
Combine accompanying drawing that the utility model is done further to describe through embodiment below.
Embodiment 1:
Two-sided aluminum core line road plate as shown in Figure 1, that present embodiment is described, it mainly comprises aluminium central layer 1; On aluminium central layer 1, be provided with the hole of perforation; Be equipped with insulating barrier 2 at aluminium central layer 1 upper and lower surfaces, be provided with line layer 3 at the outer surface of two insulating barriers 2, each layer connects through the adhesive film pressing; On the adherend of each layer, be provided with through hole 5, be provided with at the inwall of through hole 5 and connect the metal level 4 of line layer up and down with respect to place, the hole of aluminium central layer 1.
There is the gap greater than the diameter of the through hole on the adherend of each layer 5 in the diameter in the hole on the aluminium central layer 1 between the inwall in the hole on metal level 4 and the aluminium central layer 1.
Claims (2)
1. two-sided aluminum core line road plate; It mainly comprises the aluminium central layer, it is characterized in that on the aluminium central layer, being provided with the hole of perforation, is equipped with insulating barrier at aluminium central layer upper and lower surfaces; Outer surface at two insulating barriers is provided with line layer; Each layer connects through the adhesive film pressing, and the through hole with respect to the aluminium central layer on the adherend of each layer is provided with through hole, is provided with at the inwall of through hole to connect the metal level of line layer up and down.
2. two-sided aluminum core line according to claim 1 road plate, there is the gap greater than the through hole on the adherend of each layer in the diameter that it is characterized in that the hole on the aluminium central layer between the inwall in the hole on metal level and the aluminium central layer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011202388348U CN202111938U (en) | 2011-07-07 | 2011-07-07 | Double-face aluminum core circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011202388348U CN202111938U (en) | 2011-07-07 | 2011-07-07 | Double-face aluminum core circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
CN202111938U true CN202111938U (en) | 2012-01-11 |
Family
ID=45437387
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2011202388348U Expired - Fee Related CN202111938U (en) | 2011-07-07 | 2011-07-07 | Double-face aluminum core circuit board |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN202111938U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103025066A (en) * | 2012-12-26 | 2013-04-03 | 景旺电子科技(龙川)有限公司 | Single-sided double-layer metal-base plate manufacture method |
CN106572596A (en) * | 2016-11-09 | 2017-04-19 | 广东科翔电子科技有限公司 | Double-sided circuit board and manufacturing method thereof |
-
2011
- 2011-07-07 CN CN2011202388348U patent/CN202111938U/en not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103025066A (en) * | 2012-12-26 | 2013-04-03 | 景旺电子科技(龙川)有限公司 | Single-sided double-layer metal-base plate manufacture method |
CN103025066B (en) * | 2012-12-26 | 2016-08-31 | 景旺电子科技(龙川)有限公司 | A kind of preparation method of metal base single-sided doubling plate |
CN106572596A (en) * | 2016-11-09 | 2017-04-19 | 广东科翔电子科技有限公司 | Double-sided circuit board and manufacturing method thereof |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2010108361A1 (en) | Pcb including heat radiating structure with heat conducting and heat radiating ink | |
CN202111936U (en) | Double-sided aluminum core circuit board with plughole resin | |
CN202111938U (en) | Double-face aluminum core circuit board | |
CN101657066A (en) | Clad copper foil printed circuit board laminating plate of radiator | |
CN102781164B (en) | Novel special circuit board for LED (light-emitting diode) lighting fixture | |
CN205005345U (en) | Circuit board that epoxy and metal base combine | |
CN202357536U (en) | Metal-based copper-clad plate used for light-emitting diode (LED) for lighting | |
CN206401355U (en) | A kind of anti-static LED aluminium substrate | |
CN210807783U (en) | LED multilayer flexible circuit board | |
CN203131523U (en) | Light-emitting diode (LED) light source module with heat conduction column | |
CN213638357U (en) | Double-sided aluminum substrate with high-precision embedded ultrahigh heat-conducting ceramic blocks | |
CN201869439U (en) | Metal-based circuit board with high heat radiation | |
CN203912327U (en) | Heat-radiation polyimides circuit board with metallic holes and copper core | |
CN200994224Y (en) | Printed circuit board medium structure | |
CN206329932U (en) | A kind of high and pressure-resistant LED aluminum base plate of electrical strength | |
CN201436832U (en) | Multilayer local composition aluminium-base copper-covering circuit board | |
CN203331493U (en) | High-heat-conductivity aluminum-based copper-clad plate | |
CN202065723U (en) | LED (light-emitting diode) lamp | |
CN202746997U (en) | LED (light-emitting diode) lamp | |
CN202535643U (en) | Aluminium printed circuit board | |
CN105472870A (en) | Composite PCB, LED photoelectric integrated module and manufacturing method for integrated module | |
CN201475950U (en) | Heat dissipation substrate of LED lamp | |
CN201903030U (en) | Radiating structure used for high power LED (light emitting diode) lamp | |
CN215682743U (en) | Copper-clad plate of environmental protection | |
CN201947543U (en) | Al-based circuit board with high heat emission property |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120111 Termination date: 20160707 |
|
CF01 | Termination of patent right due to non-payment of annual fee |